KR20170075556A - Conducting substrate, touch panel comprising the same and display device comprising the same - Google Patents
Conducting substrate, touch panel comprising the same and display device comprising the same Download PDFInfo
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- KR20170075556A KR20170075556A KR1020150185366A KR20150185366A KR20170075556A KR 20170075556 A KR20170075556 A KR 20170075556A KR 1020150185366 A KR1020150185366 A KR 1020150185366A KR 20150185366 A KR20150185366 A KR 20150185366A KR 20170075556 A KR20170075556 A KR 20170075556A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The present invention relates to a conductive substrate, a touch panel including the same, and a display device.
Description
TECHNICAL FIELD [0001] The present invention relates to a conductive substrate, a touch panel including the same, and a display device including the same.
The term " display device " refers to a television or a computer monitor, and includes a display element for forming an image and a case for supporting the display element.
As the spread of smart phones, tablet PCs, IPTV, and the like is accelerated in connection with display devices, there is a growing need for a touch function in which a human hand becomes a direct input device without a separate input device such as a keyboard or a remote control. In addition, there is a demand for a multi-touch function capable of not only a specific point recognition but also writing.
The touch panel used in such a display is generally constituted by forming conductive patterns on upper and lower substrates and laminating them with an insulating layer interposed therebetween. Although ITO-based conductive films are widely used as the conductive pattern, the ITO has a low recognition speed due to its own RC delay when applied to a large area touch panel.
In order to overcome this problem, an attempt has been made to introduce an additional compensation chip, but this raises the problem that the price is increased.
Therefore, attempts have been made to replace conventional ITO patterns with metal patterns. However, when a metal pattern is used, it is difficult to form a fine pattern with high accuracy that is inconspicuous in terms of visibility. In the case of using a photolithography method, There is a problem that it is very complicated and the process cost becomes very high.
It is an object of the present invention to provide a conductive substrate, a touch panel including the conductive substrate, and a display device including the same.
One embodiment of the present disclosure
materials;
A first conductive pattern including at least two conductive pattern columns including a first trench provided on the substrate and a first conductive layer provided in the first trench; And
A second conductive layer provided on the same surface as the surface of the base material on which the first conductive pattern is provided and the second conductive layer provided in the second conductive pattern, And a second conductive pattern comprising at least two conductive pattern regions sandwiching the at least one conductive pattern column of the first conductive pattern,
Wherein the first conductive pattern comprises a first conductive pattern and a conductive bridge disposed between the first conductive pattern and the first conductive pattern, wherein the first conductive pattern comprises a conductive bridge, Thereby providing a substrate.
In addition, one embodiment of the present disclosure provides a single-sided single-piece touch panel including the conductive substrate.
Further, one embodiment of the present invention provides a display device including the conductive substrate.
In addition, one embodiment of the present disclosure
Forming a first conductive pattern on the substrate, the conductive pattern including two or more conductive pattern columns including a first groove portion and a first conductive layer provided in the first groove portion;
And a second conductive layer provided in the second groove portion and on the same surface of the substrate as the surface on which the first conductive pattern is provided, the second conductive layer being provided apart from the first conductive pattern, Forming a second conductive pattern comprising at least two conductive pattern regions with at least one conductive pattern column of the first conductive pattern interposed therebetween; And
Electrically connecting the conductive pattern regions of the second conductive pattern across the at least one conductive pattern column of the first conductive pattern, forming a conductive bridge spaced from the first conductive layer of the first conductive pattern The present invention also provides a method of manufacturing a conductive substrate.
According to one embodiment of the present invention, compared with the existing two-piece touch panel, the manufacturing cost can be reduced as it is reduced to one piece.
According to one embodiment of the present invention, there is no need for a process of aligning the Tx film and the Rx film required in the case of the existing two-piece type touch panel, and therefore, the process is easy and the yield is increased.
In addition, according to the embodiment of the present invention, the insulation process can be eliminated as compared with the existing one-piece touch screen, thereby reducing the cost.
1 is a schematic diagram showing the arrangement of a first conductive pattern and a second conductive pattern according to an embodiment of the present invention.
Figure 2 illustrates the placement of a first conductive pattern and a second conductive pattern in accordance with one embodiment of the present disclosure.
3 is a diagram schematically showing a second conductive pattern according to an embodiment of the present invention.
4 is a diagram schematically showing a first conductive pattern according to an embodiment of the present invention.
FIG. 5 illustrates a structure of a conductive substrate according to an embodiment of the present invention, wherein a groove of the first conductive pattern is deeper than a groove of the second conductive pattern.
Brief Description of the Drawings The advantages and features of the present application, and how to accomplish them, will be apparent with reference to the embodiments described below in conjunction with the accompanying drawings. The present application, however, is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles of the invention as defined in the appended claims. Is provided to fully convey the scope of the invention to those skilled in the art, and this application is only defined by the scope of the claims.
Unless defined otherwise, all terms, including technical and scientific terms used herein, may be used in a manner that is commonly understood by one of ordinary skill in the art to which this application belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.
Hereinafter, the present invention will be described in detail.
One embodiment of the present disclosure
materials;
A first conductive pattern including at least two conductive pattern columns including a first trench provided on the substrate and a first conductive layer provided in the first trench; And
A second conductive layer provided on the same surface as the surface of the base material on which the first conductive pattern is provided and the second conductive layer provided in the second conductive pattern, And a second conductive pattern comprising at least two conductive pattern regions sandwiching the at least one conductive pattern column of the first conductive pattern,
Wherein the first conductive pattern comprises a first conductive pattern and a conductive bridge disposed between the first conductive pattern and the first conductive pattern, wherein the first conductive pattern comprises a conductive bridge, Thereby providing a substrate.
Conventional two-piece type touch panels require more steps than a single-piece type touch panel and require a separate process for aligning the Tx film and the Rx film, resulting in complicated processes and high production costs. In addition, in the conventional one-piece single touch panel, since an insulating layer is provided to insulate the first conductive pattern from the second conductive pattern, there is a problem that an insulating process is required and the process becomes complicated.
Accordingly, the inventors of the present invention have developed a single-sided single-sided touch panel and a conductive substrate to be used therefor, which have a reduction in production cost as compared with the existing two-piece type touch panel. Further, Layer touch panel and a conductive substrate used thereon.
Specifically, according to the embodiments of the present invention, the manufacturing cost can be reduced as compared with the existing two-piece touch panel by reducing it to one piece, and the Tx film and Rx film necessary for the conventional two- There is an effect of facilitating the process and increasing the yield.
In addition, since the single-sided single-sided touch panel according to the embodiments of the present invention can exclude the existing insulation process, the effect of cost reduction can be expected.
In the present specification, the expression 'conductive pattern' includes a groove and a conductive layer provided in the groove, and includes a case in which the pattern is formed in a specific form rather than a front layer. The conductive pattern may include two or more conductive pattern regions described later, or may include two or more conductive pattern columns. In the present invention, a metal pattern may be applied as the conductive pattern. Herein, the metal pattern is interpreted to include not only the conductive layer formed of a metal but also an additive in addition to the metal in the structure including the groove and the conductive layer provided in the groove. The first conductive pattern includes a structure in which two or more conductive pattern columns are disposed, and the second conductive pattern means that two or more conductive pattern regions described below are arranged in a certain direction.
In the present specification, a description such as the first or second expression is not used together and only the description as the conductive pattern can be applied to both the first conductive pattern and the second conductive pattern. In the present specification, 1 A conductive pattern formed of a first trench and a first conductive layer has a shape of a row extending in one direction and a structure in which conductive patterns included in the column are electrically connected to each other . The conductive pattern lines may be disposed parallel to each other on the substrate.
In this specification, the conductive pattern region is a unit constituting the second conductive pattern, and includes a case where a conductive pattern composed of the second groove portion and the second conductive layer is formed with a certain area, and a conductive pattern Are electrically connected to each other. At least two conductive pattern regions are disposed with at least one conductive pattern column of the first conductive pattern therebetween. The shape of the area having the predetermined area is not particularly limited, and may have a shape such as a circle, a polygon, or the like, but the shape may be designed as necessary. The regions having the predetermined area do not necessarily have to be arranged in a straight line, but they may be arranged in a specific direction so that they can be electrically connected by the conductive bridge.
Also, according to one embodiment of the present invention, the conductive pattern may be electrically connected to an external power source by a lead wire through a printed circuit board.
The arrangement of the conductive pattern according to one embodiment of the present disclosure is shown in Fig. That is, the first
According to an embodiment of the present invention, an insulating layer may not be provided between the conductive bridge and the first conductive pattern and the second conductive pattern. According to an embodiment of the present invention, an insulating layer may not be provided between the conductive bridge and the first conductive pattern.
That is, according to an embodiment of the present invention, the conductive bridge and the first conductive pattern may be disposed apart from each other without being physically contacted with each other. According to an embodiment of the present invention, the conductive bridge and the first conductive pattern are spaced apart from each other and may not be electrically connected.
According to one embodiment of the present disclosure, an air layer may be included between the conductive bridge and the first conductive pattern. That is, the air layer may not include a separate insulating layer but may include a layer containing only air.
Specifically, according to one embodiment of the present disclosure, the conductive bridge may be provided on the first conductive pattern and the second conductive pattern.
That is, according to an embodiment of the present disclosure, the conductive bridge is provided on the first conductive pattern and the second conductive pattern to electrically connect the conductive pattern regions of the second conductive pattern, And may be spaced apart from the first conductive layer.
Specifically, according to an embodiment of the present disclosure, the conductive bridge is provided on the first conductive pattern and the second conductive pattern, and electrically connects the second conductive layers of the second conductive pattern, Spaced apart from the first conductive layers of the pattern.
According to one embodiment of the present disclosure, the conductive bridge provided on the first conductive pattern may contact only at least one edge of the first groove portion located below the conductive bridge, and may not contact the first conductive layer .
In contrast, according to an embodiment of the present invention, the conductive bridge provided on the second conductive pattern contacts the second conductive layer provided in the second groove to electrically connect the two or more conductive pattern regions.
According to one embodiment of the present disclosure, the conductive pattern columns of the first conductive pattern can be arranged in the longitudinal direction, and the conductive pattern regions of the second conductive pattern connected by the conductive bridge can be arranged in the lateral direction. The longitudinal direction and the transverse direction are expressions for expressing directions relative to each other. If any one direction is determined, the other direction with respect to the direction can be determined. This is because the horizontal and vertical directions are not absolute when the touch panel is rotated. For example, the longitudinal direction may mean a left-right direction, a vertical direction, a diagonal line or a direction having a specific angle other than the diagonal line. The longitudinal and transverse directions do not necessarily have to be at right angles to each other, and can be of the order of degrees permitted in the art. For example, the angle between the longitudinal direction and the transverse direction may be 80 degrees to 100 degrees. Specifically, the angle formed by the conductive pattern region of the first conductive pattern and the conductive pattern region of the second conductive pattern connected by the conductive bridge is not particularly limited as long as the touch panel can be driven, but may be between 80 degrees and 100 degrees, 90 degrees.
According to one embodiment of the present invention, the entire conductive pattern including the first conductive pattern and the second conductive pattern can be designed in a range in which the touch panel can be driven, and a conductive pattern .
According to one embodiment of the present invention, the material of the substrate may be appropriately selected according to the field to which the conductive pattern is to be applied. Specific examples thereof include a glass or inorganic material substrate, a plastic substrate, a film, or other flexible substrate , But is not limited thereto. As the plastic substrate or film, materials known in the art can be used. For example, materials such as polyethylene terephthalate (PET), polyvinyl butyral (PVB), polyethylene naphthalate (PEN), polyethersulfon (PES), polycarbonate A film having a visible light transmittance of 80% or more can be used.
According to one embodiment of the present disclosure, the thickness of the plastic film may be between 12.5 μm and 500 μm and between 50 μm and 250 μm. According to one embodiment of the present disclosure, the conductive pattern may be formed directly on the tempered glass, or may be attached to the tempered glass formed on the glass or film.
According to an embodiment of the present invention, the first and second conductive patterns may be formed by forming a resin pattern layer and then forming a conductive layer, respectively. At this time, the resin pattern layer can be formed by forming a resin composition layer and then patterning a plurality of grooves by using a resin patterning method known in the art, and the forming method is not particularly limited. Considering the simplicity of the process and the manufacturing cost, it is preferable to use the imprinting method.
According to an embodiment of the present invention, the first conductive pattern and the second conductive pattern may each further include an adhesive layer provided on a surface including a groove portion of the resin pattern layer.
According to one embodiment of the present disclosure, the adhesive layer comprises an optical clear adhesive (OCA).
According to one embodiment of the present disclosure, the adhesive layer is an optical transparent adhesive (OCA).
According to one embodiment of the present invention, the conductive pattern may further include a cover layer provided in contact with the adhesive layer on a surface including the groove portion of the resin pattern layer, and the cover layer may be glass or plastic.
According to one embodiment of the present disclosure, the groove portion is a space for forming the conductive layer, and includes a depressed structure in the form of a stripe including side and bottom surfaces.
According to one embodiment of the present invention, the resin pattern layer may include two or more grooves, and preferably, a plurality of grooves extending in one direction and a plurality of grooves extending in the other direction are intersected in a lattice pattern . The plurality of grooves may be the same or different from each other. In the present specification, the description in which only the first or second expression is not used together but is described as a groove is applicable to both the first groove portion and the second groove portion.
According to one embodiment of the present invention, the shape of the cross section (hereinafter referred to as a vertical cross section) obtained by cutting the groove portion in the direction perpendicular to the plane of the resin pattern layer is not particularly limited and may be rectangular, inverted trapezoid, , An ellipse, a polygon, and combinations thereof.
According to one embodiment of the present invention, although the shape of the groove portion is not particularly limited, it is difficult to form the pattern when the width of the upper region of the groove portion is smaller than the width of the lower region. It is preferable that the width is not smaller than the width of the lower portion. That is, the width of the uppermost surface of the groove portion is preferably equal to or greater than the width of the lowermost portion.
According to one embodiment of the present invention, the maximum depth H of the groove portion may be 0.2 to 2 times, and preferably 0.7 to 1 times the maximum width of the groove portion, but is not limited thereto. The maximum depth of the groove portion may be selected, for example, in the range of 50 to 2 micrometers.
In the present specification, the maximum width of the groove portion means the longest width of the groove portion measured in the horizontal direction with respect to the plane of the resin pattern layer, and the maximum depth of the groove portion is a direction perpendicular to the plane of the resin pattern layer Means the longest depth of the measured groove.
In one embodiment of the present invention, when the maximum depth H of the trenches satisfies the above-described numerical range, pattern formation is easy, and conductive layers in the trenches are removed together in the process of removing the conductive layer in regions other than the trenches The phenomenon can be prevented.
According to another embodiment, the groove may have a maximum width of 0.1 mu m to 3 mu m, but the present invention is not limited thereto.
According to one embodiment of the present invention, when the maximum width of the groove portion is 0.1 m or more, there is an effect that the problem of decrease in conductivity due to resistance when the line width of the conductive layer is too small can be prevented. , There is an effect that it is possible to prevent the problem that the metal line is recognized due to the reflection of the conductive layer and the appearance quality of the product is deteriorated.
According to one embodiment of the present invention, the groove has a maximum width of 0.1 mu m to 3 mu m, and the maximum depth (H) of the groove is 0.2 to 2 times the maximum width of the groove.
According to one embodiment of the present invention, the side surface of the groove portion has an inclination angle of 0 to 15 degrees from a vertical line with respect to a vertical line to the bottom surface of the groove portion, preferably 0 to 10 degrees, more preferably 1 But the present invention is not limited thereto. In this specification, the groove portion has two side surfaces, and the two side surfaces have the same or different inclination angles. When the inclination angle of the side surface is less than 0 degree, the width of the bottom surface of the groove becomes larger than the width of the upper surface. As a result, the adhesion between the mold and the resin increases in the pattern formation step, If the thickness of the conductive layer is more than 15 degrees, the amount of metal deposited on the side surface of the trench increases during the conductive layer deposition process, so that when the conductive layer is physically removed, the conductive layer in the trench may be removed together. The inclination angle of the side surface of the groove portion is not particularly limited.
According to one embodiment of the present invention, the radius of curvature of the upper edge of the side surface of the groove portion is 0.3 times or less of the maximum depth H of the first groove portion. If the radius of curvature of the upper edge exceeds 0.3 times the maximum depth H of the groove, the cracking of the conductive layer during removal of the deposited conductive layer in addition to the groove may be reduced to reduce the removal rate and uniformity, The radius of curvature is not particularly limited.
According to one embodiment of the present invention, the total area of the bottom surface areas of the grooves may be 0.1% to 5% or less of the total cross-sectional area of the resin pattern layer, but is not particularly limited. If the total sum of the bottom surface area of the groove portion exceeds 5%, transparency may be impaired by the conductive layer. If the total sum of the bottom surface area of the groove portion is less than 0.1%, sufficient conductivity may not be ensured.
According to one embodiment of the present invention, the average height of the conductive layer may be 5% to 60%, preferably 10% to 50%, of the groove depth, for example, about 0.01 μm to 2 μm, specifically 50 To 300 nm, but is not particularly limited. The average height of the conductive layer means an average of the maximum height in the vertical direction of the conductive layer provided in the trench.
In the present specification, the description such as the first or second expression is not used together and only the description as the conductive layer can be applied to both the first conductive layer and the second conductive layer.
According to another embodiment, the line width of the conductive layer may be in the range of 0.1 to 3 μm, but is not limited thereto.
According to one embodiment of the present invention, when the line width of the conductive layer is 0.1 m or more, the line width of the conductive layer is too small to increase the resistance and decrease the conductivity. When the line width is 3 m or less There is an effect that it is possible to prevent the problem that the metal line is recognized due to the reflection of the conductive layer and the appearance quality of the product is reduced.
According to one embodiment of the present invention, the conductive layer has two directions of the longitudinal direction and the width direction, and the line width of the conductive layer means the maximum line width in the width direction of the conductive layer provided in the groove portion.
According to an embodiment of the present invention, the line width of the first conductive layer may be 0.1 mu m to 3 mu m, and the line width of the second conductive layer may be 0.1 mu m to 3 mu m.
According to an embodiment of the present invention, the line width of the second conductive layer may be greater than or equal to the line width of the first conductive layer, and the line width of the second conductive layer may be larger than the line width of the first conductive layer. According to Fig. 2, the line width of the second conductive layer is larger than the line width of the first conductive layer. Thus, the conductive material of the conductive bridge is in contact with the second conductive layer, but not in contact with the first conductive layer.
Specifically, according to one embodiment of the present invention, the line width of the first conductive layer may preferably be 0.1 m or more and 1 m or less, and the line width of the second conductive layer may be 110% or more μm or less.
The sizes of the first and second trenches and the first and second conductive layers are determined by first setting a desired sheet resistance value in the conductive substrate and setting the line width of the conductive layer and the design of the conductive pattern and then setting the thickness of the conductive layer , And determining the line width and thickness of the groove according to the line width and thickness of the desired conductive layer. A person skilled in the art can set the scale of the groove and the conductive layer in this way.
According to an embodiment of the present invention, the thickness of the second conductive layer may be greater than or equal to the thickness of the first conductive layer, and the thickness of the second conductive layer is larger than the thickness of the first conductive layer It is possible.
According to an embodiment of the present invention, the line width of the second conductive layer may be greater than or equal to the line width of the first conductive layer, and the thickness of the second conductive layer is greater than the thickness of the first conductive layer Can be the same.
According to an embodiment of the present invention, the line width of the second conductive layer may be larger than the line width of the first conductive layer, and the thickness of the second conductive layer may be greater than or equal to the thickness of the first conductive layer. have.
According to an embodiment of the present invention, the line width of the second conductive layer may be greater than or equal to the line width of the first conductive layer, and the thickness of the second conductive layer may be greater than the thickness of the first conductive layer. have.
According to an embodiment of the present invention, the line width of the second conductive layer may be larger than the line width of the first conductive layer, and the thickness of the second conductive layer may be larger than the thickness of the first conductive layer.
According to an embodiment of the present invention, when the line width of the second conductive layer is equal to the line width of the first conductive layer, the thickness of the second conductive layer may be greater than the thickness of the first conductive layer.
That is, according to an embodiment of the present invention, even if the line width of the first conductive layer is equal to the line width of the second conductive layer, when the thickness of the second conductive layer is larger than the thickness of the first conductive layer, Is not in contact with the first conductive layer but can be in contact with only the second conductive layer.
In this specification, the thicknesses of the first conductive layer and the second conductive layer mean the maximum depth in the vertical direction of the conductive layer provided on the bottom surface of the groove portion.
According to an embodiment of the present invention, the widths of the first groove portion and the second groove portion may be 0.1 mu m to 3 mu m, but the present invention is not limited thereto.
According to one embodiment of the present invention, when the widths of the first and second grooves are 0.1 μm or more, the width of the grooves is too small to increase the resistance and decrease the conductivity. When the width is 3 μm or less, there is an effect that the metal line is recognized due to the reflection of the conductive layer provided in the groove, thereby preventing the appearance quality of the product from being reduced.
In this specification, the width of the groove means the maximum width in the horizontal direction of the resin pattern layer.
According to an embodiment of the present invention, the width of the second groove portion may be greater than or equal to the width of the first groove portion, and the width of the second groove portion may be larger than the width of the first groove portion.
According to an embodiment of the present invention, the width of the first groove part may be 0.1 to 3 m, and the width of the second groove part may be 110% or more and 3 m or less of the width of the first groove part.
According to an embodiment of the present invention, the depth of the first groove portion may be greater than or equal to the depth of the second groove portion, and the depth of the first groove portion may be greater than the depth of the second groove portion.
According to an embodiment of the present invention, the width of the second groove portion may be greater than or equal to the width of the first groove portion, and the depth of the first groove portion may be greater than or equal to the depth of the second groove portion.
According to an embodiment of the present invention, the width of the second groove portion may be greater than the width of the first groove portion, and the depth of the first groove portion may be greater than or equal to the depth of the second groove portion.
According to an embodiment of the present invention, the width of the second groove portion may be greater than or equal to the line width of the first groove portion, and the depth of the first groove portion may be greater than the depth of the second groove portion.
According to an embodiment of the present invention, the width of the second groove portion may be greater than the width of the first groove portion, and the depth of the first groove portion may be larger than the depth of the second groove portion.
According to an embodiment of the present invention, when the width of the second groove portion is equal to the width of the first groove portion, the depth of the first groove portion may be greater than the depth of the second groove portion.
That is, according to one embodiment of the present invention, even when the width of the first groove portion is equal to the width of the second groove portion, the depth of the first groove portion is larger than the depth of the second groove portion, It can be in contact with only the second conductive layer provided in the second trench without touching the provided first conductive layer. 5 illustrates a structure in which the depth of the first groove portion is larger than the depth of the second groove portion. In such a structure, the conductive material of the conductive bridge may be in contact with the second conductive layer in the second trench, but not in contact with the first conductive layer in the first trench.
According to one embodiment of the present disclosure, the aperture ratio of the conductive pattern is 95% to 99.9%. That is, it is excellent in transparency. (The cross-sectional area of the transparent substrate surface - the sum of the areas of the areas where the conductive layer is formed) / the cross-sectional area of the transparent substrate surface} x (x) is the ratio of the surface area of the conductive pattern to the area of the area where the conductive layer is not formed. 100. ≪ / RTI >
According to another embodiment, the sheet resistance of the conductive pattern may be 0.01? /? To 100? /?, And when the above range is satisfied, the transparency may be excellent, but the present invention is not limited thereto.
According to one embodiment of the present disclosure, the conductive layer comprises a metal layer.
According to one embodiment of the present invention, it is preferable to use at least one metal, metal alloy, metal oxide, metal nitride, metal oxynitride, or the like having excellent electric conductivity as a material of the metal layer included in the conductive layer. The specific resistance value of the metal layer material is preferably from 1 microohm 占 cm m to 100 microohm 占 cm m, more preferably from 1 microohm 占 cm m to 5 microohm 占 cm m. Specific examples of the metal layer material include aluminum, copper, silver, gold, iron, molybdenum, nickel, carbon nanotubes (CNT), titanium, alloys thereof, oxides thereof, And oxynitride of these may be used, and aluminum is most preferable in terms of price and conductivity.
According to an embodiment of the present invention, an adhesion control layer may further be provided under the metal layer. The adhesion controlling layer is for separating the resin pattern layer from the conductive layer to prevent the oxidation of the conductive layer by the resin and to facilitate the peeling by controlling the adhesive force between the resin pattern layer and the conductive layer. For example, silicon oxide, Metal oxides, molybdenum, carbon, tin, chromium, nickel and cobalt.
The thickness of the adhesion-controlling layer may be 0.005 탆 to 0.2 탆, preferably 0.005 탆 to 0.1 탆, more preferably 0.01 탆 to 0.06 탆. When the thickness is 0.005 탆 or less, the thin film may not be formed properly, and when the thickness is 0.2 탆 or less, sufficient thin film characteristics can be obtained.
The adhesion-controlling layer may be formed by chemical vapor deposition or physical vapor deposition.
According to one embodiment of the present disclosure, the conductive layer may further include a blackening layer on at least one of the upper and lower portions of the metal layer. The blackening layer may include at least one selected from the group consisting of silicon oxide, metal oxide, molybdenum, carbon, tin, chromium, nickel and cobalt.
Further, the thickness of the blackening layer may be 0.005 탆 to 0.2 탆, preferably 0.005 탆 to 1 탆, and more preferably 0.01 탆 to 0.06 탆. When the thickness is 0.005 탆 or less, the thin film may not be formed properly, and when the thickness is 0.2 탆 or less, sufficient thin film characteristics can be obtained.
The composition and thickness of the blackening layer may be variously adjusted according to the desired degree of blackening. When a blackening layer is formed on both the upper and lower portions of the conductive layer, the blackening layer on the upper side and the blackening layer on the lower side may have a composition and / Or the thicknesses may be the same or different. For example, when the upper blackening layer and the lower blackening layer forming material are different, the thickness of the upper blackening layer and the thickness of the lower blackening layer may be different because the degree of blackening varies depending on the thickness.
The blackening layer may be performed by chemical vapor deposition or physical vapor deposition.
According to one embodiment of the present disclosure, a planarization layer may further be provided on top of the conductive layer and the conductive bridge. The conductive layer is prevented from being oxidized by the planarization layer, the scratch resistance is improved, and the light scattering due to the resin shape is reduced.
The planarization layer forming material may be the same as or different from the resin pattern layer forming material. The planarizing layer may be formed of a material having a refractive index difference of 0.3 or less from the resin pattern layer forming material. When the difference in refractive index between the planarization layer and the resin pattern layer increases, light is refracted, reflected or scattered while being transmitted, and haze is generated. As a result, transparency may be deteriorated.
According to one embodiment of the present disclosure, the resin pattern layer may comprise one or more resins selected from the group consisting of resins known in the art, for example, active energy ray-curable resins, thermosetting resins, conductive polymer resins, Includes more than species. More specifically, it may include, but is not limited to, urethane acrylate, epoxy acrylate, ester acrylate, polydimethylsiloxane, polyacetylene, polyparaphenylene, polyaniline, polypyrrole and the like.
In addition, one embodiment of the present disclosure
Forming a first conductive pattern on the substrate, the conductive pattern including two or more conductive pattern columns including a first groove portion and a first conductive layer provided in the first groove portion;
And a second conductive layer provided in the second groove portion and on the same surface of the substrate as the surface on which the first conductive pattern is provided, the second conductive layer being provided apart from the first conductive pattern, Forming a second conductive pattern comprising at least two conductive pattern regions with at least one conductive pattern column of the first conductive pattern interposed therebetween; And
Electrically connecting the conductive pattern regions of the second conductive pattern across the at least one conductive pattern column of the first conductive pattern, forming a conductive bridge spaced from the first conductive layer of the first conductive pattern The present invention also provides a method of manufacturing a conductive substrate.
In the above manufacturing method, the above description can be applied to the conductive substrate.
According to an embodiment of the present invention, a method of manufacturing a conductive pattern includes: forming a resin pattern layer including a first groove and a second groove on at least one surface; Depositing a metal on the resin pattern layer to form a conductive layer; And physically removing the conductive layer existing in the region excluding the groove portion of the resin pattern layer.
The physical method means removal of the conductive layer through physical force, and is distinguished from a method of removing the conductive layer through a chemical reaction such as etching. More specifically, the step of physically removing the conductive layer may be performed by a scratch method, a detaching method, or a combination thereof.
The scratching method refers to a method of scratching and removing the conductive layer, and the detaching method refers to a method of peeling the conductive layer from the resin pattern layer by applying tension from one end of the conductive layer. In the case of the scratching method, it can be used when the adhesive strength between the conductive layer and the resin pattern layer is high, and in the case of the dithering method, it can be used when the adhesive strength between the conductive layer and the resin pattern layer is low. In addition, by performing the scratching method and the dequantizing method together in one step, the conductive layer in a portion where the adhesive force with respect to the resin pattern layer is relatively high can be removed by a scratching method, and the portion where the adhesive force is relatively low can be removed by a dithering method. For example, a fabric having a melamine foam or roughened surface is rubbed from one edge of the opening to the other edge portion, thereby scraping the edge portion having a relatively high adhesive force, and the central portion of the opening having a relatively low adhesive force is generated when the fabric is rubbed Can be removed by using a tensile force.
When the conductive layer is removed using the physical method as described above, the process is simpler and more environmentally friendly than the conductive layer removing method using the conventional chemical method. When the conductive layer is removed by a chemical method, in order to selectively remove the conductive layer in a region other than the trench, a method of inserting an additional etch resistant material over the conductive layer formed in the trench, . In this case, an etch resistant material inserting process may be added to affect process cost and yield of the product. In contrast, in the case of the present invention in which the conductive layer is removed by using a physical method, no additional process is required, and it is environmentally friendly since it does not use toxic chemicals such as an etchant and an etch resistant material. In addition, when the physical method is used as described above, since the conductive layer can be removed by a continuous process, the productivity is improved and the manufacturing time can be shortened.
The deposition height of the conductive layer can be controlled by controlling the speed of the film and the like. For example, when metal evaporation is performed at the same power, that is, when the evaporation amount per unit time is constant, the deposition height can be controlled by changing the film advance rate. Increasing the speed of the film will reduce the time to exposure to the vapor, thus increasing the deposition height.
According to one embodiment of the present invention, the step of forming the conductive layer may further include, when necessary, forming an adhesion-controlling layer on the resin pattern layer before the metal deposition. The description and formation method of the adhesion control layer are the same as those described above.
According to an embodiment of the present invention, the step of forming the conductive layer may further include the step of forming a blackening layer before and / or after the metal deposition, if necessary. The description and formation method of the blackening layer are the same as those described above.
According to an embodiment of the present invention, the step of forming the resin pattern layer including the groove portion may be performed by one or more methods selected from the group consisting of imprinting, photolithography, and electron beam lithography.
According to one embodiment of the present disclosure, the step of physically removing the conductive layer may be performed by one or more methods selected from the group consisting of a scratching method, a detaching method, and a combination thereof, The conductive layer may be removed by rubbing the conductive layer with a melamine foam or a smooth surface having a roughened surface.
According to one embodiment of the present disclosure, the conductive bridge may connect a second conductive pattern comprising two or more conductive pattern regions that are not electrically connected.
That is, according to one embodiment of the present invention, the conductive bridge satisfies conductivity so as to electrically connect the second conductive patterns, and does not particularly limit the material and the shape thereof.
According to one embodiment of the present disclosure, the thickness and area (width) of the conductive bridge can be appropriately selected according to the end use.
According to one embodiment of the present invention, the shape, thickness, width, etc. of the conductive bridge are not particularly limited. Specifically, the conductive bridge according to one embodiment of the present disclosure may have various shapes such as a triangle, a polygon such as a square, a sphere, a cylinder, and the like.
According to one embodiment of the present disclosure, the conductive bridge may comprise conductive particles.
Specifically, according to an embodiment of the present invention, the particle size of the conductive particles may be larger than the line width of the first conductive layer and smaller than or equal to the line width of the second conductive layer.
According to one embodiment of the present invention, the particle size of the conductive particles may be larger than the line width of the first conductive layer and smaller than the line width of the second conductive layer.
According to one embodiment of the present invention, the particle size of the conductive particles may be 0.3 μm or more and 5 μm or less.
Specifically, according to one embodiment of the present disclosure, the conductive particles of the conductive bridge may be spherical. When the conductive particles of the conductive bridge are spherical, the particle size of the conductive particles may be larger than the width of the first groove and less than or equal to the width of the second groove.
That is, according to one embodiment of the present invention, since the particle size of the conductive particles included in the conductive bridge is larger than the width of the first groove, the conductive particles can not enter the groove of the first conductive pattern, Since the conductive particles of the conductive bridge are smaller than or equal to the width of the second groove, the conductive particles enter the groove of the second conductive pattern and physically contact the second conductive layer to electrically connect the conductive regions . Fig. 3 shows an example in which the conductive particles are in contact with the second conductive layer, and Fig. 4 shows an example in which the conductive particles are not in contact with the first conductive layer.
According to an embodiment of the present invention, a protective layer may be additionally provided on a surface provided with the first conductive pattern, the second conductive pattern, and the conductive bridge. The protective layer may be a pressure-sensitive adhesive film including a pressure-sensitive adhesive layer, a glass or hard coating layer including a pressure-sensitive adhesive layer.
According to an embodiment of the present invention, when the protective layer is a glass including an adhesive film or an adhesive layer, the difference between the refractive index of the adhesive layer and the refractive index of the conductive bridge may be 0.05 or less. When the refractive index difference is within the difference range, it is advantageous to achieve the improvement of the hiding ability and the uniform light transmittance of the conductive pattern.
In addition, one embodiment of the present disclosure provides a single-sided single-piece touch panel including the conductive substrate. According to one example, the touch panel may further include a wiring portion and a printed circuit board bonding portion in addition to the first conductive pattern and the second conductive pattern. And may be connected to an external power source through the wiring portion and the printed circuit board bonding portion. Other configurations of the touch panel may be adopted as those known in the art.
Further, one embodiment of the present invention provides a display device including the conductive substrate. The conductive substrate may be included as an electrode or a touch panel of a display device.
According to one embodiment of the present invention, since a single-sided single-sided touch screen can be provided, the thickness of the touch screen can be minimized, and the manufacturing method is easy since all of the conductive patterns are formed on the end surface . In addition, since it is one piece, there is an advantage that the lamination is not required in comparison with the conventional technique in which two or more substrates are used. Further, since the single-sheet type is used, the light transmittance is excellent as compared with the two-sheet type.
100: Conductive particles of conductive bridge
101: first conductive pattern
102: second conductive pattern
200: second conductive layer
201: second groove
300: first conductive layer
301: first groove
Claims (17)
A first conductive pattern including at least two conductive pattern columns including a first trench provided on the substrate and a first conductive layer provided in the first trench; And
A second conductive layer provided on the same surface as the surface of the base material on which the first conductive pattern is provided and the second conductive layer provided in the second conductive pattern, And a second conductive pattern comprising at least two conductive pattern regions sandwiching the at least one conductive pattern column of the first conductive pattern,
Wherein the first conductive pattern comprises a first conductive pattern and a conductive bridge disposed between the first conductive pattern and the first conductive pattern, wherein the first conductive pattern comprises a conductive bridge, Board.
And a second conductive layer provided in the second groove portion and on the same surface of the substrate as the surface on which the first conductive pattern is provided, the second conductive layer being provided apart from the first conductive pattern, Forming a second conductive pattern comprising at least two conductive pattern regions with at least one conductive pattern column of the first conductive pattern interposed therebetween; And
Electrically connecting the conductive pattern regions of the second conductive pattern across the at least one conductive pattern column of the first conductive pattern, forming a conductive bridge spaced from the first conductive layer of the first conductive pattern ≪ / RTI >
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| KR1020150185366A KR102042874B1 (en) | 2015-12-23 | 2015-12-23 | Conducting substrate, touch panel comprising the same and display device comprising the same |
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| KR1020150185366A KR102042874B1 (en) | 2015-12-23 | 2015-12-23 | Conducting substrate, touch panel comprising the same and display device comprising the same |
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| KR102042874B1 KR102042874B1 (en) | 2019-11-08 |
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| JP2008529053A (en) * | 2005-06-13 | 2008-07-31 | エルジー・ケム・リミテッド | Conductive layer patterning method, polarizing element manufacturing method using the same, and polarizing element manufactured by the method |
| KR20100007605A (en) | 2008-07-14 | 2010-01-22 | 주식회사 엘지화학 | Conductive laminate and manufacturing method thereof |
| JP2011054055A (en) * | 2009-09-03 | 2011-03-17 | Hosiden Corp | Touch panel and manufacturing method for touch panel |
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| KR20150009846A (en) * | 2013-07-17 | 2015-01-27 | 삼성디스플레이 주식회사 | Touch Screen Panel and Fabricating Method Thereof |
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| JP2008529053A (en) * | 2005-06-13 | 2008-07-31 | エルジー・ケム・リミテッド | Conductive layer patterning method, polarizing element manufacturing method using the same, and polarizing element manufactured by the method |
| KR20100007605A (en) | 2008-07-14 | 2010-01-22 | 주식회사 엘지화학 | Conductive laminate and manufacturing method thereof |
| JP2011054055A (en) * | 2009-09-03 | 2011-03-17 | Hosiden Corp | Touch panel and manufacturing method for touch panel |
| KR20140131479A (en) * | 2013-03-01 | 2014-11-13 | 난창 오-필름 테크 컴퍼니 리미티드 | Conductive glass substrate and preparation method thereof |
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