KR20170057535A - Temperature sensing array and device - Google Patents
Temperature sensing array and device Download PDFInfo
- Publication number
- KR20170057535A KR20170057535A KR1020150160779A KR20150160779A KR20170057535A KR 20170057535 A KR20170057535 A KR 20170057535A KR 1020150160779 A KR1020150160779 A KR 1020150160779A KR 20150160779 A KR20150160779 A KR 20150160779A KR 20170057535 A KR20170057535 A KR 20170057535A
- Authority
- KR
- South Korea
- Prior art keywords
- temperature sensing
- temperature
- island
- resistance value
- island networks
- Prior art date
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
-
- G01K13/002—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0271—Thermal or temperature sensors
Abstract
Description
The present invention relates to a temperature sensing array and apparatus, and more particularly, to a temperature sensing array and apparatus, and more particularly to a temperature sensing array and apparatus using a temperature sensing array comprising a plurality of island networks formed in a plurality of multi-channels and a terminal for measuring a resistance value for an object Values of the temperature sensor array and apparatus.
The normal body temperature of the body is maintained in the range of 36.5 ~ 37.0 ℃, and it has a protective mechanism to protect the body against heat or cold.
However, since temperature-related diseases such as thermal fatigue, heat stroke and hypothermia that are caused by various factors are prevented, there is a demand for a flexible-based multi-measurement sensor for preventing or treating such temperature-related diseases.
However, since the conventional multi-measurement sensor includes a plurality of sensors in combination to obtain body temperature (temperature) data of an object (skin surface of the body) as well as various bio-information, There was a limit to the measurement.
In addition, since the conventional multi-measurement sensor can measure only the temperature of a certain portion (area) of the object corresponding to the size (area) of the single temperature sensor by measuring the temperature of the object mainly using only a single temperature sensor, There is a problem that it varies depending on the attachment position or area of the object, and there is a limitation that the first place of the temperature can not be measured accurately.
In addition, since the conventional multi-measurement sensor including a single temperature sensor is measured by one temperature sensor, there is a problem that the temperature can not be measured for various parts of the object, There was a limit that reliability was low.
An object of the present invention is to provide a temperature sensing array and an apparatus for measuring an average temperature of an object to be measured based on a resistance value of a plurality of island networks, thereby reducing errors in resistance values measured from the island network.
It is another object of the present invention to provide a temperature sensing array and an apparatus capable of measuring a precise temperature of a contact area of an object by manufacturing a temperature sensing array including a plurality of island networks in a patch shape.
It is another object of the present invention to provide a temperature sensing array and apparatus capable of measuring a wide contact area of an object and an average temperature with respect to various parts and interlocking with external terminals and servers in real time.
A temperature sensing apparatus according to an embodiment of the present invention includes a plurality of island networks formed by a plurality of multi-channels connected to nodes, wherein each of the plurality of island networks includes a terminal for measuring a resistance value for an object And an average temperature measuring unit for measuring an average temperature for the temperature sensing array based on the resistance value measured from the terminal.
The temperature sensing array may be formed by patterning the multi-channel formed of a platinum (Pt) thin film on a film made of a polyimide solution through a photolithography process, And transferred onto the substrate.
The temperature sensing array may be connected to an IC circuit formed on the substrate to form a patch-like structure.
The plurality of island networks may have a plurality of multi-channels formed in a meander pattern connected to the nodes and arranged in a matrix form on the substrate.
The plurality of multi-channels may be a thermistor, and each of the plurality of multi-channels may have a ratio of the vertical length and the horizontal length to less than 100. [
In addition, each of the multi-channels may be formed at an angle of at least one of 0 °, 90 °, 45 °, -45 °, and -90 ° with respect to the horizontal direction with respect to the substrate, Can be minimized.
The temperature sensing device according to an embodiment of the present invention includes a communication module for transmitting the measured average temperature to the outside, at least one of the plurality of island networks selected from the plurality of island networks corresponding to a command received from the communication module, A control unit for controlling the average temperature measurement unit from the average temperature measurement unit based on the resistance value measured from the network, and a power supply unit for supplying the driving power.
The substrate may be formed of at least one of a paper, a polymer, a woven fabric, and an insulated metal foil.
Also, the temperature sensing array according to an embodiment of the present invention includes a plurality of island networks formed by a plurality of multi-channels connected to nodes, wherein the multi-channels are formed in a meander pattern, Each of the island networks includes a terminal for measuring a resistance value for an object.
According to an embodiment of the present invention, an average temperature for an object to be measured based on a resistance value of a plurality of island networks can be measured to reduce an error with respect to different resistance values measured from an island network.
Also, according to an embodiment of the present invention, a temperature sensing array including a plurality of island networks may be manufactured in a patch shape to measure an accurate temperature of a contact area of an object.
In addition, according to the embodiment of the present invention, it is possible to interoperate with an external terminal and a server in real time by measuring a wide contact area of an object and an average temperature with respect to various parts.
1 is a block diagram illustrating a configuration of a temperature sensing apparatus according to an embodiment of the present invention.
Figure 2 shows a schematic plan view of an island network according to an embodiment of the present invention.
Figures 3A-3E illustrate an embodiment of a temperature sensing array included in a temperature sensing device in accordance with an embodiment of the present invention.
4A and 4B are graphs showing resistance values of a temperature sensing device including one island network according to an embodiment of the present invention.
5A and 5B are graphs showing average values of the temperature sensing apparatus according to the embodiment of the present invention, according to temperature changes.
FIG. 6 is a graph showing a deviation of a temperature sensing apparatus according to an embodiment of the present invention with temperature variation.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and accompanying drawings, but the present invention is not limited to or limited by the embodiments.
The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.
As used herein, the terms "embodiment," "example," "side," "example," and the like should be construed as advantageous or advantageous over any other aspect or design It does not.
Also, the term 'or' implies an inclusive or 'inclusive' rather than an exclusive or 'exclusive'. That is, unless expressly stated otherwise or clear from the context, the expression 'x uses a or b' means any of the natural inclusive permutations.
Also, the phrase "a" or "an ", as used in the specification and claims, unless the context clearly dictates otherwise, or to the singular form, .
Furthermore, the terms first, second, etc. used in the specification and claims may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.
In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The terminology used herein is a term used for appropriately expressing an embodiment of the present invention, which may vary depending on the user, the intent of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.
1 is a block diagram illustrating a configuration of a temperature sensing apparatus according to an embodiment of the present invention.
1, a
For this, a
The
According to an embodiment, the
The
Here, an object may refer to the skin surface of the body, and in some embodiments may be an object for which temperature is to be measured.
The
According to an embodiment, the multi-channel may be a meander pattern with a helical, rectangular loop, a pair of intermeshed meander patterns, a pair of separate, A meander pattern having a small rectangular loop formed in a large loop, a meander pattern having a small circular or tapered loop formed in a large loop, and a spiral pattern in a row having a common central axis And the patterns of the above-described types may be arranged in the form of a series or a parallel matrix. Therefore, the present invention is not limited to the pattern.
In addition, the
For example, a plurality of island networks may be of the form that four multi-channels are connected in series by nodes, formed in the shape of '∩', and terminals are connected to each end of '∩' have.
According to an embodiment, the multi-channel may be formed by tilting at an angle of at least one of 0 °, 90 °, 180 ° and 270 ° in the form of '∩' The parallel connection may be formed as a mixed connection.
Also, according to an embodiment, a plurality of island networks may be formed of at least one multi-channel, and at least one of serial and parallel connection, multi-channel pattern, number of multi-channels, number of nodes, But the present invention is not limited thereto.
In addition, the
The
For example, the multi-channel may be formed by forming a conductive layer containing platinum on a film made of a polyimide solution, performing a patterning and etching process through a photolithography process, and the conductive layer may be formed by a sputtering deposition method sputtering, electron beam (E-beam), evaporation, or the like.
According to an embodiment, the multi-channel may be formed using a resistor of at least one of gold (Au), tungsten (W), palladium (Pd), silicon (Si), silicon alloy and conductive metal oxide.
In addition, the
The IC circuit can process signal filtering, amplification, digitization and processing functions by using an integration technique. Depending on the embodiment, the IC circuit may be an integrated circuit and an integrated circuit sensor that processes signals in the
In addition, the patch-type structure may be implemented in various sizes and shapes depending on the area and characteristics of the adhesive portion of the body surface, and may include a medical skin contact adhesive suitable for application to the skin. The patch- Rectangular, rectangular, rhombic, cruciform, curved, and alphabet X-shaped.
The average
The average
Depending on the embodiment, the average
The
The
The
In addition, the average temperature measured through the
According to an embodiment, the average temperature measured from the
Also, according to an embodiment, the integration server may manage the average temperature for the objects received from the
The
For example, the
The
The
For example, the
According to an embodiment, the
Any one of the average
According to an embodiment, the
Figure 2 shows a schematic plan view of an island network according to an embodiment of the present invention.
2, the
2, a plurality of
The plurality of
The island shape is formed in a 2 x 2 structure using the plurality of
In addition, the multi-channel 122 may be formed in a meander pattern in a meandering shape to cover a large area, and may be formed of at least one of 0 °, 90 °, 45 °, -45 °, and -90 ° As shown in Fig.
For example, the multi-channel 122 may be configured to have an angle of 0 °, 90 °, 45 °, -45 °, and -90 ° to minimize changes in resistance as the skin expands and contracts, And may be formed to be inclined at least at any one angle.
According to an embodiment, the multi-channel may be a meander pattern with a helical, rectangular loop, a pair of intermeshed meander patterns, a pair of separate, A meander pattern having a small rectangular loop formed in a large loop, a meander pattern having a small circular or tapered loop formed in a large loop, and a spiral pattern in a row having a common central axis The pattern may be formed in one pattern, and the patterns of the above-described types may be arranged in the form of a series or a parallel matrix,
In addition, the multi-channel 122 may be a negative temperature coefficient thermistor.
For example, multi-channel 122 may use a printing negative temperature coefficient (NTC) thermistor, but is not limited to printed NTC thermistors, and may be any flexible temperature sensor whose resistance varies with temperature And may be formed of at least one of a positive temperature coefficient (PTC) thermistor, a resistance temperature device (RTD), and any device fabricated on a flexible substrate material.
In addition, each of the multi-channels 122 may have a ratio of the vertical length to the horizontal length of less than 100. That is, since the ratio of the vertical length to the horizontal length of the multi-channel 122 is less than 100, it is possible to solve the problem of multi-channel breakage when patterning in the photolithography process.
The resistance across any multi-channel 122 two
In addition, the terminal 124 constituting the
The terminal 124 may be formed in each of the
2, the number of the multi-channels 122 constituting the
In addition, depending on the embodiment, the
Hereinafter, the
Figures 3A-3E illustrate an embodiment of a temperature sensing array included in a temperature sensing device in accordance with an embodiment of the present invention.
Referring to FIG. 3A, a
The
According to the embodiment, the
3B, a
3C, a
Here, each of the
Referring to FIG. 3C, the two
In addition, each of the multi-channels constituting the four
The
Referring to FIG. 3D, a
Referring to FIG. 3E, a
Here, the four
The
Here, the total resistance value of the
[Equation 1]
Here, Rt is a resistance value,
Each at 20 ℃ Figure 3b to the four Irish
The
4A and 4B are graphs showing resistance values of a temperature sensing device including one island network according to an embodiment of the present invention.
4A is a graph showing a resistance value for an object at intervals of 10 DEG C from 30 DEG C to 80 DEG C using a temperature sensing device including one island network, And the resistance value of the object is measured at intervals of 0.5 占 폚 from 36 占 폚 to 38 占 폚.
4A and 4B, the temperature sensing apparatus including one island network confirms that the accuracy of the temperature varies depending on the attachment position or area of the object, and thus limits the accuracy of the temperature measurement on the object to be measured .
5A and 5B are graphs showing average values of the temperature sensing apparatus according to the embodiment of the present invention, according to temperature changes.
FIG. 5A is a graph showing a resistance value for an object according to a temperature change using a temperature sensing device including one island network, and FIG. 5B is a graph showing a resistance of the object using a temperature sensing device including four island networks , And a graph showing a resistance value for an object according to a temperature change.
5A and 5B, it can be seen that the accuracy and reliability of the average value calculated from the temperature sensing apparatus constituted by four island networks is higher than that of the temperature sensing apparatus constituted by one island network, as in FIG. 5A .
FIG. 6 is a graph showing a deviation of a temperature sensing apparatus according to an embodiment of the present invention with temperature variation.
6 is a graph showing the variation with temperature change from 0 ° C to 50 ° C using a temperature sensing device including one island network and a temperature sensing device including four island networks.
Referring to FIG. 6, it can be seen that the temperature sensing device for measuring the average temperature based on the resistance value measured from the four island networks has a smaller deviation than the temperature sensing device including one island network.
This is because, compared with the temperature sensing apparatus including one island network, the temperature sensing apparatus constituted by a plurality of island networks has a small error due to external factors in the average temperature measurement, Can be measured.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.
Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.
100: Temperature sensing device
110: substrate
120: Temperature sensing array
130: average temperature measuring unit
140: Communication module
150:
160: Power supply
Claims (10)
An average temperature measurement unit for measuring an average temperature for the temperature sensing array based on the resistance value measured from the terminal,
/ RTI >
The temperature sensing array
The multi-channel formed of a platinum (Pt) thin film on a film made of a polyimide solution is patterned through a photolithography process, and then the patterned multi-channel is transferred to the substrate And the temperature sensing device.
The temperature sensing array
And connected to an IC circuit formed on the substrate to form a patch-like structure.
The plurality of island networks
A plurality of multichannels formed in a meander pattern are connected to the nodes and arranged in a matrix form on the substrate.
The plurality of multi-
Wherein the temperature sensing device is a thermistor.
Each of the plurality of multi-
Wherein the ratio of the longitudinal length to the lateral length is less than 100.
Each of the multi-channels is formed at an angle of at least one of 0 °, 90 °, 45 °, -45 °, and -90 ° with respect to the horizontal direction with respect to the substrate to minimize a change in the resistance value with respect to the object Wherein the temperature sensing device is a temperature sensor.
A communication module for transmitting the measured average temperature to the outside;
A controller for controlling an average temperature from the average temperature measuring unit based on a resistance value measured from at least one of the plurality of island networks corresponding to a command received from the communication module; And
A power supply unit for supplying driving power
Lt; / RTI >
The substrate
And is formed of a material of at least one of paper, polymer, woven fabric, and insulated metal foil.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150160779A KR101762022B1 (en) | 2015-11-17 | 2015-11-17 | Temperature sensing array and device |
| CN201680079251.0A CN108770336B (en) | 2015-11-17 | 2016-01-08 | Biological information measuring apparatus and method using sensor array |
| US15/777,057 US11129555B2 (en) | 2015-11-17 | 2016-01-08 | Device for measuring biological information including sensor array and method of measuring biological information using device |
| PCT/KR2016/000160 WO2017086537A1 (en) | 2015-11-17 | 2016-01-08 | Device and method for measuring biological information by using sensor array |
| US17/089,273 US11911153B2 (en) | 2015-11-17 | 2020-11-04 | Device for measuring biological information including sensor array and method of measuring biological information using device |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020150160779A KR101762022B1 (en) | 2015-11-17 | 2015-11-17 | Temperature sensing array and device |
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| Publication Number | Publication Date |
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| KR20170057535A true KR20170057535A (en) | 2017-05-25 |
| KR101762022B1 KR101762022B1 (en) | 2017-08-04 |
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| KR1020150160779A KR101762022B1 (en) | 2015-11-17 | 2015-11-17 | Temperature sensing array and device |
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| CN111050581A (en) * | 2017-10-30 | 2020-04-21 | 韩国烟草人参公社 | Aerosol generating device with heater |
| WO2022108060A1 (en) * | 2020-11-19 | 2022-05-27 | 한국표준과학연구원 | Stacked thin film temperature sensor array |
| US11622580B2 (en) | 2017-10-30 | 2023-04-11 | Kt&G Corporation | Aerosol generation device and generation method |
| US11700886B2 (en) | 2017-10-30 | 2023-07-18 | Kt&G Corporation | Aerosol generating device and heater assembly for aerosol generating device |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180867B1 (en) * | 1996-04-17 | 2001-01-30 | General Electric Company | Thermal sensor array and methods of fabrication and use |
| KR100455286B1 (en) * | 2002-01-11 | 2004-11-06 | 삼성전자주식회사 | Method and apparatus for understanding the condition of animal using acquisition and analysis of physiological signal of the animal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050581A (en) * | 2017-10-30 | 2020-04-21 | 韩国烟草人参公社 | Aerosol generating device with heater |
| US11622579B2 (en) | 2017-10-30 | 2023-04-11 | Kt&G Corporation | Aerosol generating device having heater |
| US11622580B2 (en) | 2017-10-30 | 2023-04-11 | Kt&G Corporation | Aerosol generation device and generation method |
| US11696600B2 (en) | 2017-10-30 | 2023-07-11 | Kt&G Corporation | Aerosol generating device having heater |
| US11700886B2 (en) | 2017-10-30 | 2023-07-18 | Kt&G Corporation | Aerosol generating device and heater assembly for aerosol generating device |
| US11700884B2 (en) | 2017-10-30 | 2023-07-18 | Kt&G Corporation | Aerosol generation device and heater for aerosol generation device |
| US11700885B2 (en) | 2017-10-30 | 2023-07-18 | Kt&G Corporation | Aerosol generation device including mainstream smoke passage and pressure detection passage |
| US11744287B2 (en) | 2017-10-30 | 2023-09-05 | Kt&G Corporation | Aerosol generating device and method for controlling same |
| CN111050581B (en) * | 2017-10-30 | 2023-09-22 | 韩国烟草人参公社 | Aerosol generating device with heater |
| US11974611B2 (en) | 2017-10-30 | 2024-05-07 | Kt&G Corporation | Method for controlling temperature of heater included in aerosol generation device according to type of cigarette, and aerosol generation device for controlling temperature of heater according to type of cigarette |
| WO2022108060A1 (en) * | 2020-11-19 | 2022-05-27 | 한국표준과학연구원 | Stacked thin film temperature sensor array |
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| KR101762022B1 (en) | 2017-08-04 |
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