JPH0510826A - Array sensor - Google Patents
Array sensorInfo
- Publication number
- JPH0510826A JPH0510826A JP16156791A JP16156791A JPH0510826A JP H0510826 A JPH0510826 A JP H0510826A JP 16156791 A JP16156791 A JP 16156791A JP 16156791 A JP16156791 A JP 16156791A JP H0510826 A JPH0510826 A JP H0510826A
- Authority
- JP
- Japan
- Prior art keywords
- array sensor
- electrode pairs
- wiring
- substrate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Measuring And Recording Apparatus For Diagnosis (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】 本発明は、温度、湿度等の分布
を検知するためのアレイセンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array sensor for detecting distribution of temperature, humidity and the like.
【０００２】[0002]
【従来の技術】従来、体温、発汗より健康状態を診断す
る場合、正確な温度測定、発汗（湿度）測定が必要であ
り、測定手段として体温計、発汗計その他が広く用いら
れている。最も広く体温計に用いられている温度センサ
は水銀体温計であるが、サーミスタ、白金測温抵抗体そ
の他の素子を用いた電子式体温計も普及してきている。
また、発汗状態を測定するには、湿度センサを用いるの
が有効である。2. Description of the Related Art Conventionally, when diagnosing a health condition based on body temperature and perspiration, accurate temperature measurement and perspiration (humidity) measurement are required, and a thermometer, a perspiration meter, etc. are widely used as measuring means. The most widely used temperature sensor for a thermometer is a mercury thermometer, but electronic thermometers using a thermistor, a platinum resistance thermometer, and other elements have also become popular.
Further, it is effective to use a humidity sensor to measure the sweating state.
【０００３】また、体温の分布を測定しようとする場
合、多数のセンサを密に配設して多点の情報をとる必要
がある。このような場合、センサの大きさ、情報処理上
の問題等から水銀体温計よりも熱電対、サーミスタのよ
うなセンサにより電気的に体温測定を行なう方が有利で
ある。Further, in order to measure the distribution of body temperature, it is necessary to arrange a large number of sensors densely to obtain information on multiple points. In such a case, it is more advantageous to electrically measure the body temperature with a sensor such as a thermocouple or thermistor than the mercury thermometer because of the size of the sensor, problems in information processing, and the like.
【０００４】ところで、体温、発汗等の分布を電気的素
子によって測定する場合、測定装置から個別に各測定素
子まで配線するのが常であった。例えば、従来温熱生理
学の実験に最も多用されてきた方法は、複数の熱電対を
皮膚表面にテープ等で貼付して皮膚温の分布を測定する
ものであった。By the way, when the distribution of body temperature, perspiration and the like is measured by an electric element, it has always been necessary to individually wire from the measuring device to each measuring element. For example, the most frequently used method in the conventional thermophysiology experiment has been to measure the skin temperature distribution by attaching a plurality of thermocouples to the skin surface with tape or the like.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、この方
法では、センサの数が多い場合、配線が非常に複雑にな
り、測定上の様々な混乱を招きやすく、不便であった。However, in this method, when the number of sensors is large, the wiring becomes very complicated, and various measurement confusion is likely to occur, which is inconvenient.
【０００６】本発明は、体温などの生理状態測定におい
て、上記問題点を解消することを目的とする。An object of the present invention is to solve the above problems in measuring physiological conditions such as body temperature.
【０００７】[0007]
【課題を解決するための手段】この課題を解決するため
に、フレキシブル基板上にフォトリソグラフィー技術を
用いて配線パタ−ン、電極、外部引出端子を形成し、電
極上に複数の温度または湿度検知素子を装着し、アレイ
センサを作製することを特徴とする。In order to solve this problem, a wiring pattern, electrodes, and external lead terminals are formed on a flexible substrate by photolithography, and a plurality of temperature or humidity detections are formed on the electrodes. It is characterized in that an element is mounted and an array sensor is manufactured.
【０００８】また、配線パタ−ンがＵ字形に曲げて形成
され、配線パタ−ンの湾曲部を折曲げて全体がライン状
となるよう変形して使用することを特徴とする。Further, the wiring pattern is formed by bending it into a U shape, and the curved portion of the wiring pattern is bent to be deformed so that the whole becomes a line shape.
【０００９】[0009]
【作用】前述のように、フレキシブル基板に複数の検知
部を配しているので、複雑な曲面である人体にうまく適
合するセンサを製作することができる。As described above, since the plurality of detecting portions are arranged on the flexible substrate, it is possible to manufacture a sensor that is suitable for a human body having a complicated curved surface.
【００１０】また、複数の電極対や検知素子を形成した
フレキシブル基板を折曲する構造にしているので、通常
のフォトリソグラフィでは形成できない長尺のセンサを
簡単に製造できる。Further, since the flexible substrate on which a plurality of electrode pairs and sensing elements are formed is bent, a long sensor that cannot be formed by ordinary photolithography can be easily manufactured.
【００１１】[0011]
【実施例】以下、図面とともに異なる実施例について説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Different embodiments will be described below with reference to the drawings.
【００１２】（実施例１）図１に示すように厚さ５０μ
ｍのポリイミドフィルムに厚さ３０μｍの銅箔を接着し
た銅箔ポリイミドフィルム１０を基板として用いて、外
部引出端子２０、センサ用電極対４０および外部引出端
子と電極対を接続する配線部３０をフォトリソグラフィ
ーによりパターン化し、Ｆｅ2Ｃｌ3水溶液を用いてエッ
チングして回路を形成した。配線パタ−ンの線幅および
線間幅、いわゆるラインアンドスペースを１００μｍと
し、配線長は最大５０ｃｍとしたが、このときの配線抵
抗は約５オームであった。次に、図２に示すように電極
対４０上にチップサーミスタ５０をリフローハンダ付け
により接続した。本実施例で用いたチップサーミスタの
２５℃における公称抵抗値は１０キロオームであり、前
述の配線抵抗はこれに比して遥かに小さく、測定上何等
不都合はなかった。(Embodiment 1) As shown in FIG. 1, the thickness is 50 μm.
Using the copper foil polyimide film 10 in which a copper foil having a thickness of 30 μm is bonded to a polyimide film of m as a substrate, the external lead terminal 20, the sensor electrode pair 40, and the wiring portion 30 connecting the external lead terminal and the electrode pair are used as a photo. A circuit was formed by patterning by lithography and etching with an aqueous Fe 2 Cl 3 solution. The line width and line width of the wiring pattern, so-called line-and-space, was 100 μm, and the maximum wiring length was 50 cm, but the wiring resistance at this time was about 5 ohms. Next, as shown in FIG. 2, the chip thermistor 50 was connected to the electrode pair 40 by reflow soldering. The chip thermistor used in this example has a nominal resistance value of 10 kΩ at 25 ° C., and the above-mentioned wiring resistance is much smaller than this, and there was no inconvenience in measurement.
【００１３】なお、特に配線抵抗を嫌う測定の場合には
基板材料として厚い銅箔を接着したポリイミドフィルム
を使用したり、抵抗値の高いセンサを使用することによ
って配線抵抗の影響の少ない測定系を得ることが可能で
ある。本回路基板の外部引出端子を測定装置と接続し、
温度分布測定用アレイセンサとして用いた。In particular, in the case of the measurement in which the wiring resistance is disliked, a polyimide film to which a thick copper foil is adhered is used as a substrate material, or a sensor having a high resistance value is used, so that a measurement system less affected by the wiring resistance can be obtained. It is possible to obtain. Connect the external lead terminal of this circuit board to the measuring device,
It was used as an array sensor for temperature distribution measurement.
【００１４】本センサを人体表面温度分布測定用に供し
たところ、複雑な曲面より構成されている人体表面に良
く密着する優れた可撓性を示し、従来の人体表面温度測
定法に比べて遜色ない実験結果を得ることができた。When this sensor is used for measuring the temperature distribution on the human body surface, it exhibits excellent flexibility that it adheres well to the human body surface composed of complicated curved surfaces, and is comparable to conventional human body surface temperature measuring methods. No experimental results could be obtained.
【００１５】（実施例２）温度と湿度を同時に測定する
ことを目的として、図３に示す様に、サーミスタ用電極
対４１および湿度センサ用電極対４２を有する回路を、
実施例１と同様の材料、手段を用いて製作した。この回
路に、チップサーミスタを実施例１と同様に回路に接続
し、その後高分子膜湿度センサを個別に電極対にハンダ
付けして、温湿度分布測定用アレイセンサとして用い
た。湿度センサの感湿特性は大きな温度依存性を持つた
め、湿度測定においては湿度センサの正確な温度補償が
前提となる。本実施例では、湿度センサの近傍にサーミ
スタを配置し、サーミスタに湿度センサの温度補償用温
度計としての機能も持たせることにより、正確な温湿度
分布を測定することが可能であった。(Embodiment 2) A circuit having an electrode pair 41 for a thermistor and an electrode pair 42 for a humidity sensor, as shown in FIG. 3, for the purpose of simultaneously measuring temperature and humidity,
It was manufactured using the same materials and means as in Example 1. A chip thermistor was connected to this circuit in the same manner as in Example 1, and then a polymer film humidity sensor was individually soldered to the electrode pairs and used as an array sensor for measuring temperature and humidity distribution. Since the humidity sensitivity characteristic of the humidity sensor has a large temperature dependency, accurate temperature compensation of the humidity sensor is a prerequisite for humidity measurement. In this embodiment, a thermistor is arranged in the vicinity of the humidity sensor, and the thermistor also has a function as a temperature compensating thermometer of the humidity sensor, so that it is possible to accurately measure the temperature and humidity distribution.
【００１６】（実施例３）アレイセンサの基板幅を減少
させて可撓性を向上させる目的で、第４図に示すように
全てのセンサの片側の電極は１本の共通配線パタ−ン２
に、他方の電極は個別配線部３に接続する形式の回路を
形成し、実施例１と同様にチップサーミスタを接続して
温度分布測定用アレイセンサを製作した。この操作によ
り配線数は約半減し、アレイセンサ基板幅を大幅に減少
させることができた。さらに、基板幅減少による材料費
の削減に加え、外部引出端子数の減少に伴う測定機器と
の接続の簡単化により、低コスト化が可能になった。配
線幅を減少させて基板幅の減少を図るのは一般的な手段
であるが、この操作は配線抵抗の増大を招くため、精密
測定を目的とする場合には測定上有害であることが多
い。これを防止するため、共通配線を比較的太く設計
し、個別配線幅を減少しながらも全体の配線抵抗を低下
させることは、基板幅減少と配線抵抗増大防止を両立す
る有効な手段である。本実施例では、個別配線の線幅を
５０μｍ、共通配線のそれを２５０μｍとし配線長を５
０ｃｍとしたが、このとき配線抵抗は約６オームであ
り、実施例１と比較して配線パタ−ン幅を半分以下に抑
えながらもほぼ同等の配線抵抗を実現した。(Embodiment 3) For the purpose of reducing the substrate width of the array sensor and improving the flexibility, as shown in FIG. 4, the electrodes on one side of all the sensors have one common wiring pattern 2.
Then, a circuit of the type in which the other electrode is connected to the individual wiring part 3 is formed, and a chip thermistor is connected in the same manner as in Example 1 to manufacture an array sensor for temperature distribution measurement. By this operation, the number of wires was halved, and the array sensor substrate width could be greatly reduced. Furthermore, in addition to reducing the material cost by reducing the board width, the cost can be reduced due to the simplification of the connection with the measuring equipment due to the decrease in the number of external lead terminals. Although it is a general means to reduce the wiring width to reduce the substrate width, this operation often causes an increase in wiring resistance, and is often harmful in precision measurement for the purpose of precise measurement. . In order to prevent this, the common wiring is designed to be relatively thick, and the overall wiring resistance is reduced while reducing the individual wiring width, which is an effective means for achieving both the reduction of the board width and the prevention of the increase of the wiring resistance. In this embodiment, the line width of the individual wiring is 50 μm, that of the common wiring is 250 μm, and the wiring length is 5 μm.
Although the wiring resistance was set to 0 cm, the wiring resistance was about 6 ohms at this time, and almost the same wiring resistance was realized while suppressing the wiring pattern width to less than half as compared with the first embodiment.
【００１７】（実施例４）基板上の無駄なスペースを減
らすことを目的として、図５に示すように、各電極対を
線幅と線間幅の合計分だけ基板短尺方向にずらしながら
配置し、個別配線部を平行に各電極対まで配置し、共通
配線部を電極対配置に合わせて斜めになるように配置す
ることにより、全体として三角形状の基板を作成した。
この基板形状によると、第６図に示す通り、長方形の基
板形状に比べ同じ面積からほぼ２倍の数の基板を取るこ
とができるため、低コスト化に貢献した。なお、共通配
線パタ−ンを電極配置に合わせて階段上に配置するなど
しても、同様の効果が得られる。(Embodiment 4) For the purpose of reducing the wasted space on the substrate, as shown in FIG. 5, each electrode pair is arranged while being shifted in the short direction of the substrate by the total of the line width and the line width. By arranging the individual wiring portions up to each electrode pair in parallel, and arranging the common wiring portion so as to be inclined according to the arrangement of the electrode pairs, a triangular substrate as a whole was created.
According to this substrate shape, as shown in FIG. 6, it is possible to take almost twice as many substrates from the same area as the rectangular substrate shape, which contributes to cost reduction. The same effect can be obtained by arranging the common wiring pattern on the stairs according to the electrode arrangement.
【００１８】（実施例５）基板作成の手法としてフォト
リソグラフィーを用いる場合、作成できる基板の大きさ
は露光装置の能力に依存し、普通１ｍを越える長尺のも
のは作れない。従って、例えばベッド表面上に配置し
て、被験者の体温分布を測定することを目的とした長尺
のアレイセンサなどは製作が困難であった。そこで、図
７に示す様にＵ字形の配線を作成した後図中Ａ部を切除
し、続いて点線Ｂ−Ｂで基板を谷折りにし、その後点線
Ｃ−Ｃ’で山折りとして、図８に示すような長尺の基板
を得た。この操作１回につき約２倍の長さの基板が得ら
れる。この操作を数回繰り返すことによって、従来より
はるかに長尺のアレイセンサを作成することが可能であ
り、例えば、長さ５０ｃｍ、幅３０ｃｍの基板材料から
長さ３ｍ以上のアレイセンサを作成することができた。
本センサは１次元方向に長い被測定物の温度分布測定に
使用することはもちろん、管状の被測定物に巻き付けて
用いて温度分布を計測する用途にも使えた。(Embodiment 5) When photolithography is used as a method for producing a substrate, the size of the substrate that can be produced depends on the capability of the exposure apparatus, and it is usually impossible to make a substrate longer than 1 m. Therefore, for example, it is difficult to manufacture a long array sensor or the like which is placed on the bed surface to measure the body temperature distribution of the subject. Therefore, after forming a U-shaped wiring as shown in FIG. 7, the portion A in the figure is cut off, the substrate is then valley-folded along the dotted line BB, and then the mountain fold is formed along the dotted line CC ′. A long substrate as shown in (1) was obtained. A substrate having a length twice that of each operation is obtained. By repeating this operation several times, it is possible to make an array sensor much longer than the conventional one, for example, to make an array sensor having a length of 3 m or more from a substrate material having a length of 50 cm and a width of 30 cm. I was able to.
This sensor can be used not only for measuring the temperature distribution of an object to be measured which is long in the one-dimensional direction, but also for measuring temperature distribution by winding it around a tubular object to be measured.
【００１９】[0019]
【発明の効果】本発明によれば、従来の温熱生理実験に
おける測定精度を維持しながら、測定者の感じていた実
験上の煩雑さを解消することができ、また被験者の皮膚
に直接センサ−を貼付することもないので被験者にに対
する負担を従来よりはるかに少なくすることができる。EFFECTS OF THE INVENTION According to the present invention, it is possible to eliminate the complication of the experimenter's feeling in the experiment while maintaining the measurement accuracy in the conventional thermophysiological experiment, and to measure the sensor directly on the skin of the subject. Since it does not have to be attached, the burden on the subject can be made much smaller than before.
【００２０】また、通常のフォトリソグラフィでは形成
できない長尺のセンサを簡単に製造できる。Further, a long sensor which cannot be formed by ordinary photolithography can be easily manufactured.
【図１】本発明の一実施例における基板形状及び配線を
説明する平面図FIG. 1 is a plan view illustrating a substrate shape and wiring according to an embodiment of the present invention.
【図２】基板上電極対へのセンサの接続法を説明する断
面図FIG. 2 is a cross-sectional view illustrating a method of connecting a sensor to an electrode pair on a substrate.
【図３】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 3 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
【図４】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 4 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
【図５】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 5 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
【図６】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 6 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
【図７】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 7 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
【図８】本発明の異なる実施例のアレイセンサにおける
基板形状および配線を説明する平面図FIG. 8 is a plan view illustrating a substrate shape and wiring in an array sensor according to another embodiment of the present invention.
１０ 基板 ２０ 外部引出端子 ３０ 配線パタ−ン ３１ 共通配線パタ−ン ３２ 個別配線部パタ−ン ４０ センサ用電極対 ４１ サーミスタ用電極対 ４２ 湿度センサ用電極対 ５０ サーミスタ ５１ サーミスタ電極 10 substrates 20 External lead terminal 30 wiring pattern 31 common wiring pattern 32 Individual wiring pattern 40 sensor electrode pair 41 Thermistor electrode pair 42 Humidity sensor electrode pair 50 thermistor 51 Thermistor electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河栗 真理子 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Mariko Kawaguri 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd.
Claims (5)
と、電極対間に配した温度または湿度検知素子と、前記
電極対に電気的に接続された外部引出端子と、前記外部
引出端子と電極対間を電気的接続する配線パタ−ンを形
成したことを特徴とするアレイセンサ。1. A plurality of electrode pairs, a temperature or humidity detecting element arranged between the electrode pairs, an external lead terminal electrically connected to the electrode pair, and the external lead terminal and electrodes on a flexible substrate. An array sensor characterized in that a wiring pattern for electrically connecting the pair is formed.
素子対を複数設けたことを特徴とする請求項１記載のア
レイセンサ。2. The array sensor according to claim 1, wherein a plurality of pairs of a humidity detecting element and a temperature detecting element which are arranged close to each other are provided.
して外部引出端子に電気的に接続され、前記電極対の他
方が共通の配線パタ−ンを介して外部引出端子に電気的
に接続されることを特徴とする請求項１記載のアレイセ
ンサ。3. One of the electrode pairs is electrically connected to an external lead terminal through an individual wiring pattern, and the other of the electrode pair is electrically connected to an external lead terminal through a common wiring pattern. The array sensor according to claim 1, wherein the array sensor is connected to.
個別の配線パタ−ンが平行に配置されて前記電極対に接
続されていることを特徴とする請求項３記載のアレイセ
ンサ。4. The electrode pairs are arranged so as to be displaced in a specific direction,
The array sensor according to claim 3, wherein individual wiring patterns are arranged in parallel and connected to the electrode pairs.
前記Ｕ字形の低部には配線パタ−ンのみとし、前記低部
を折曲して全体がライン状となるよう変形して使用する
ことを特徴とする請求項１記載のアレイセンサ。5. The flexible substrate is U-shaped,
2. The array sensor according to claim 1, wherein only the wiring pattern is provided in the lower portion of the U-shape, and the lower portion is bent and deformed so as to have a line shape as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156791A JPH0510826A (en) | 1991-07-02 | 1991-07-02 | Array sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156791A JPH0510826A (en) | 1991-07-02 | 1991-07-02 | Array sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0510826A true JPH0510826A (en) | 1993-01-19 |
Family
ID=15737569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16156791A Pending JPH0510826A (en) | 1991-07-02 | 1991-07-02 | Array sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510826A (en) |
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|---|---|---|---|---|
| JP2001221696A (en) * | 2000-02-10 | 2001-08-17 | Res Inst Electric Magnetic Alloys | Temperature-sensitive and strain-sensitive composite sensor |
| JP2002200049A (en) * | 2000-12-28 | 2002-07-16 | Tasada Kosakusho:Kk | Method and system for evaluating play machine |
| US6676289B2 (en) * | 2000-08-22 | 2004-01-13 | Kabushiki Kaisha Toshiba | Temperature measuring method in pattern drawing apparatus |
| JP2006258520A (en) * | 2005-03-16 | 2006-09-28 | Ishizuka Electronics Corp | Probe for electronic clinical thermometer |
| JP2007057448A (en) * | 2005-08-26 | 2007-03-08 | Hitachi Ltd | Flaw monitoring device |
| FR2901118A1 (en) | 2006-05-16 | 2007-11-23 | France Etat | DEVICE FOR MEASURING TEMPERATURE AND / OR MOISTURE AND DEVICE FOR MEASURING THE SUB-VESTIAL CLIMATE AND CLOTHING THEREOF. |
| JP2011117971A (en) * | 2011-02-07 | 2011-06-16 | Res Inst Electric Magnetic Alloys | Temperature-sensitive strain-sensitive composite sensor |
| US8360656B2 (en) | 2007-12-04 | 2013-01-29 | Jtekt Corporation | Bearing apparatus |
| WO2016084342A1 (en) * | 2014-11-28 | 2016-06-02 | タツタ電線株式会社 | Conductive paste and thermocouple using same |
| WO2019026737A1 (en) * | 2017-08-02 | 2019-02-07 | ニッタ株式会社 | Sensor sheet |
| CN110770556A (en) * | 2017-07-25 | 2020-02-07 | 贺利氏先进传感器技术有限公司 | Sensor unit for detecting a spatial temperature distribution and method for producing a sensor unit |
| JP2020524008A (en) * | 2017-05-15 | 2020-08-13 | バイエルスドルフ・アクチエンゲゼルシヤフトＢｅｉｅｒｓｄｏｒｆ ＡＧ | Device for measuring perspiration |
| JP2020524009A (en) * | 2017-05-15 | 2020-08-13 | バイエルスドルフ・アクチエンゲゼルシヤフトＢｅｉｅｒｓｄｏｒｆ ＡＧ | Device for measuring perspiration |
-
1991
- 1991-07-02 JP JP16156791A patent/JPH0510826A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001221696A (en) * | 2000-02-10 | 2001-08-17 | Res Inst Electric Magnetic Alloys | Temperature-sensitive and strain-sensitive composite sensor |
| US6676289B2 (en) * | 2000-08-22 | 2004-01-13 | Kabushiki Kaisha Toshiba | Temperature measuring method in pattern drawing apparatus |
| JP2002200049A (en) * | 2000-12-28 | 2002-07-16 | Tasada Kosakusho:Kk | Method and system for evaluating play machine |
| JP2006258520A (en) * | 2005-03-16 | 2006-09-28 | Ishizuka Electronics Corp | Probe for electronic clinical thermometer |
| JP2007057448A (en) * | 2005-08-26 | 2007-03-08 | Hitachi Ltd | Flaw monitoring device |
| FR2901118A1 (en) | 2006-05-16 | 2007-11-23 | France Etat | DEVICE FOR MEASURING TEMPERATURE AND / OR MOISTURE AND DEVICE FOR MEASURING THE SUB-VESTIAL CLIMATE AND CLOTHING THEREOF. |
| US8360656B2 (en) | 2007-12-04 | 2013-01-29 | Jtekt Corporation | Bearing apparatus |
| JP2011117971A (en) * | 2011-02-07 | 2011-06-16 | Res Inst Electric Magnetic Alloys | Temperature-sensitive strain-sensitive composite sensor |
| WO2016084342A1 (en) * | 2014-11-28 | 2016-06-02 | タツタ電線株式会社 | Conductive paste and thermocouple using same |
| JP2020524008A (en) * | 2017-05-15 | 2020-08-13 | バイエルスドルフ・アクチエンゲゼルシヤフトＢｅｉｅｒｓｄｏｒｆ ＡＧ | Device for measuring perspiration |
| JP2020524009A (en) * | 2017-05-15 | 2020-08-13 | バイエルスドルフ・アクチエンゲゼルシヤフトＢｅｉｅｒｓｄｏｒｆ ＡＧ | Device for measuring perspiration |
| CN110770556A (en) * | 2017-07-25 | 2020-02-07 | 贺利氏先进传感器技术有限公司 | Sensor unit for detecting a spatial temperature distribution and method for producing a sensor unit |
| US11268864B2 (en) | 2017-07-25 | 2022-03-08 | Heraeus Nexensos Gmbh | Sensor unit for detecting a spatial temperature profile and method for producing a sensor unit |
| EP3615903B1 (en) * | 2017-07-25 | 2023-12-27 | Yageo Nexensos GmbH | Sensor for measuring a spatial temperature profile and method for producing a sensor unit |
| WO2019026737A1 (en) * | 2017-08-02 | 2019-02-07 | ニッタ株式会社 | Sensor sheet |
| JP2019028005A (en) * | 2017-08-02 | 2019-02-21 | ニッタ株式会社 | Sensor sheet |
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