KR20170044407A - Manufacturing method of PCB for mounting gas sensor chip - Google Patents

Manufacturing method of PCB for mounting gas sensor chip Download PDF

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Publication number
KR20170044407A
KR20170044407A KR1020150144067A KR20150144067A KR20170044407A KR 20170044407 A KR20170044407 A KR 20170044407A KR 1020150144067 A KR1020150144067 A KR 1020150144067A KR 20150144067 A KR20150144067 A KR 20150144067A KR 20170044407 A KR20170044407 A KR 20170044407A
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KR
South Korea
Prior art keywords
sensor chip
gas sensor
base substrate
forming
recess
Prior art date
Application number
KR1020150144067A
Other languages
Korean (ko)
Inventor
서호철
조용준
장지상
Original Assignee
세종공업 주식회사
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Filing date
Publication date
Application filed by 세종공업 주식회사 filed Critical 세종공업 주식회사
Priority to KR1020150144067A priority Critical patent/KR20170044407A/en
Publication of KR20170044407A publication Critical patent/KR20170044407A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

The present invention relates to a method for manufacturing a printed circuit board for mounting a gas sensor chip. According to the present invention, the method for manufacturing a printed circuit board for mounting a gas sensor chip comprising: a first step of forming a metal layer on a base substrate; a second step of forming a first mask pattern for forming a circuit pattern on the base substrate where the metal layer is formed; a third step of forming a circuit pattern on the base substrate by etching the metal layer to allow an upper surface of the base substrate to be exposed through an etching process using the first mask pattern; a fourth step of removing the first mask pattern and forming a solder resist layer for insulation on the entire base substrate where the circuit pattern is formed; a fifth step of manufacturing a printed circuit board by forming a recess having a predetermined depth on a predetermined part for mounting a gas sensor of the base substrate, on which the solder resist layer is formed, to expose the upper surface of the base substrate.

Description

Technical Field [0001] The present invention relates to a method for manufacturing a printed circuit board for mounting a gas sensor chip,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board for mounting a gas sensor chip and, more particularly, to a printed circuit board for mounting a gas sensor chip, which can improve reliability of a gas sensor having a membrane structure, And a method of manufacturing a substrate.

At present, interest in hydrogen as an environmentally friendly alternative energy is steadily increasing. As a result, research has been conducted in various fields such as automobiles, fuel cells, and internal combustion engines, and the trend is rapidly replacing existing fossil fuels. However, due to the high diffusibility of hydrogen, there is a risk of leakage and explosion. Therefore, it is essential to take measures for safety against hydrogen leakage. Therefore, safety measures are taken by using various hydrogen sensors around the hydrogen storage and hydrogen related devices, and research and development related to hydrogen sensors are being actively carried out.

Generally, a hydrogen sensor is classified into a semiconductor type, a contact combustion type, a FET (Field Effect Transistor) type, an electrolytic type (electrical chemical formula), an optical fiber type, a thermoelectric type, Has been confirmed to have an effect on selectivity and stability by using a platinum group catalyst which is stable to external environment such as change in external temperature and humidity and has high selectivity to hydrogen.

The structure of such a conventional contact combustion type hydrogen sensor and its manufacturing method are disclosed in Korean Patent Laid-Open Publication No. 10-2010-0026810.

The gas sensor including the hydrogen sensor is manufactured in the form of a sensor chip using a MEMS (Micro Electro Mechanical System) manufacturing technology, and has a membrane (thin film) and an opening that opens downward under the membrane.

The gas sensor chip is configured to apply an adhesive material to the lower bonding surface around the opening and adhere to the base chip mounted on the printed circuit board. At this time, in the gas sensor chip, the entire lower surface of the gas sensor chip is adhered to the base chip with the opening filled with air or moisture, so that the opening is closed.

Generally, a gas sensor including a hydrogen sensor has a built-in heater for maintaining a high-temperature environment for catalytic activation inside or adjacent to a membrane that performs a sensing function. The heater is heated to a temperature of hundreds of degrees. When the exothermic reaction is added due to the gas reaction, the temperature of the membrane rises to several hundred degrees.

When the temperature of the membrane rises to several hundreds or more, the air / moisture in the closed opening thermally expands, and the membrane may be bent due to over-expanded air or moisture. If the membrane serving as a sensing element is damaged in the gas sensor chip, the durability of the chip is reduced and the reliability is lowered.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a printed circuit board for mounting a gas sensor chip, which can overcome the above-described problems.

It is another object of the present invention to provide a method of manufacturing a printed circuit board for mounting a gas sensor chip, which can directly mount a gas sensor chip on a printed circuit board without having a separate base chip.

It is still another object of the present invention to provide a method of manufacturing a printed circuit board for mounting a gas sensor chip, which can improve reliability and minimize damage of the gas sensor.

According to an embodiment of the present invention, there is provided a method of manufacturing a printed circuit board for mounting a gas sensor chip, the method comprising: a first step of forming a metal layer on a base substrate; A second step of forming a first mask pattern for forming a circuit pattern on the base substrate on which the metal layer is formed; A third step of forming a circuit pattern on the base substrate by etching the metal layer to expose an upper surface of the base substrate through an etching process using the first mask pattern; A fourth step of removing the first mask pattern and forming a solder resist layer for insulation on the entire base substrate on which the circuit pattern is formed; And a fifth step of forming a recess in a predetermined depth so that the upper surface of the base substrate is exposed on the predefined gas sensor chip mounting portion on the base substrate on which the solder resist layer is formed, do.

The recess may be formed by forming a second mask pattern exposing a recess forming portion and etching the solder resist layer using the second mask pattern as an etching mask.

The gas sensor chip having a membrane structure having a membrane and an opening opened downward below the membrane, the gas sensor chip having a recess and an opening overlapping with each other, So that the air of the gas sensor chip can communicate with the outside of the gas sensor chip.

The width of the recess may be smaller than the width of the gas sensor chip and the length of the recess may be longer than the length of the gas sensor chip.

The gas sensor chip may be a contact-fired gas sensor chip.

According to the present invention, it is possible to manufacture a printed circuit board so that a gas sensor chip can be directly mounted on a printed circuit board without having a base chip, and the airflow can be smoothly flowed through the recess, Thereby improving the reliability and minimizing the damage of the gas sensor.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a manufacturing process of a printed circuit board for mounting a gas sensor chip according to an embodiment of the present invention,
FIG. 2 is a cross-sectional view illustrating a state where the gas sensor chip is mounted on the printed circuit board manufactured according to FIG. 1,
3 is a plan view of the printed circuit board manufactured according to FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings without intending to intend to provide a thorough understanding of the present invention to a person having ordinary skill in the art to which the present invention belongs.

1 (a) to 1 (f) are cross-sectional views illustrating a manufacturing process of a printed circuit board for mounting a gas sensor chip according to an embodiment of the present invention.

As shown in FIG. 1 (a), in order to manufacture a printed circuit board for mounting a gas sensor chip according to an embodiment of the present invention, a base substrate 110 having a material such as plastic is prepared, A metal layer 120 is formed on the substrate 110 using a laminating process or the like. The metal layer 120 may have a thickness of 1 to 2 탆. The metal layer 120 may be made of copper.

2B, a first mask pattern 130 for forming a circuit pattern is formed on a base substrate 110 on which the metal layer 120 is formed.

The first mask pattern 130 is formed by forming a photoresist layer on the metal layer 120 and performing a photo process. The first mask pattern 130 is for forming a circuit pattern necessary for the operation of the gas sensor chip 200 when the gas sensor chip 200 is mounted. A portion may be exposed.

1C, an etching process is performed on the metal layer 120 using the first mask pattern 130 as an etching mask, thereby forming a circuit pattern 120a on the base substrate 110 ).

1D, the first mask pattern 130 is removed and the upper surface of the base substrate 110 on which the circuit pattern 120a is formed, as shown in FIG. 1E, A solder resist layer 140 for insulation is formed on the entire surface. The solder resist layer 140 may be formed by a screen printing process or a deposition process.

Next, as shown in FIG. 1 (f), the upper surface of the base substrate 110 is exposed on a predetermined gas sensor chip mounting portion on the base substrate 110 on which the solder resist layer 140 is formed A recess 150 having a predetermined depth is formed to manufacture the printed circuit board 100 for mounting the gas sensor chip.

The recess 150 may be formed by forming a second mask pattern (not shown) exposing a recess forming region in the same manner as the first mask pattern 130, And may be formed by etching the solder resist layer 140.

The width and length of the recess 150 can be varied as needed. For example, the width of the recess 150 may be smaller than the width of the mounted gas sensor chip 200, and the length of the recess 150 may be longer than the length of the gas sensor chip 20, Can be smoothly performed.

When the printed circuit board 100 for mounting a gas sensor chip is manufactured by the above-described process, the gas sensor chip 200 is mounted as shown in FIG.

The gas sensor chip 200 is manufactured to detect the local temperature difference due to the heat generated from the oxidation reaction of the gas such as hydrogen and the catalyst layer and to measure the absolute concentration of the gas such as hydrogen gas from the sensed temperature difference.

The gas sensor chip 200 may be manufactured using MEMS (Micro Electro Mechanical System) manufacturing technology, and may include a membrane and a sensor chip having a membrane structure having an opening that opens downward in a lower portion of the membrane. In other words, the sensor chip may include all of the sensor chips in which the opening is formed in the downward direction and the membrane is formed on the opening. Most of the openings have a rectangular structure, and may have a circular or polygonal structure. The gas sensor chip 200 may be a contact-assisted gas sensor chip.

As an example of the gas sensor chip 200, the hydrogen sensor chip may have the following structure. A platinum heater in the form of a coil for sensing the upper hydrogen of the laminated film and performing a heating function; and a platinum heater (not shown) except for the portion where the electrode layer is deposited. An electrode layer formed on both ends of the platinum heater, and a ceramic catalyst formed by dispersing a platinum group catalyst in a ceramic carrier on the insulating layer, A catalyst layer, and an opening formed on the lower surface of the silicon substrate and a membrane.

The gas sensor chip 200 is mounted or mounted on the printed circuit board 100 by overlapping the recess 150 and the opening so that the air of the opening communicates with the outside .

The air inside the opening of the gas sensor chip 200 is made to communicate with the outside through the recess 150 so that the air inside the opening of the gas sensor chip 200 can communicate with the outside of the gas sensor chip 200 The membrane is not damaged even if the air or moisture inside the opening is excessively expanded by the heat.

3 is a plan view of the printed circuit board manufactured according to FIG.

As shown in FIG. 3, generally, two gas sensor chips 200 are mounted on the printed circuit board 100 together.

That is, a sensor chip having a catalyst layer and a compensation sensor chip having no catalyst layer different from the detection sensor chip can be mounted on one printed circuit board 100 to form one package.

Generally, a gas sensor is composed of a detecting element for detecting a gas and a compensating element for canceling a changing element due to the external environment of the detecting element. As the heat shielding between the sensing element and the compensating element becomes worse, the reaction heat generated from the sensing element during the reaction with the hydrogen gas is transmitted to the compensating element, which causes instability and sensitivity of the sensor.

Accordingly, when one gas sensor package is implemented by using the detection sensor chip formed with the catalyst layer and the compensation sensor chip having the same structure but without the catalyst layer as compensation elements and two chips are formed in one package, The heat shielding efficiency between the sensor chip and the compensation sensor chip is increased, the change factor due to the external environment change can be canceled, the gas sensor is stabilized, and the sensitivity characteristic is improved.

As shown in FIG. 3, when the sensing sensor chip and the compensating sensor chip are mounted at a predetermined distance on one printed circuit board 100 of the two gas sensor chips 200, the recess 150 And may extend in the longitudinal direction to overlap with the two gas sensor chips 200. For example, the recess 150 may be elongated in the longitudinal direction so as to extend from the left end of the left sensor chip to the right end of the right sensor chip to smooth air flow.

In the present invention, a method of manufacturing a printed circuit board for mounting a gas sensor chip is described, but the gas sensor chip mounted on the printed circuit board may include both a hydrogen sensor chip and a sensor heated by a high temperature. It is also apparent that a package can be implemented including a gas sensor chip having a membrane structure or other sensor chips which are heated by high temperature and perform sensing.

The foregoing description of the embodiments is merely illustrative of the present invention with reference to the drawings for a more thorough understanding of the present invention, and thus should not be construed as limiting the present invention. It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the basic principles of the present invention.

110: base substrate 120: metal layer
130: first mask pattern 140: solder resist layer
150: recess 200: gas sensor chip

Claims (5)

A first step of forming a metal layer on the base substrate;
A second step of forming a first mask pattern for forming a circuit pattern on the base substrate on which the metal layer is formed;
A third step of forming a circuit pattern on the base substrate by etching the metal layer to expose an upper surface of the base substrate through an etching process using the first mask pattern;
A fourth step of removing the first mask pattern and forming a solder resist layer for insulation on the entire base substrate on which the circuit pattern is formed;
And a fifth step of forming a recess in a predetermined depth so that the upper surface of the base substrate is exposed on the predefined gas sensor chip mounting portion on the base substrate on which the solder resist layer is formed, Wherein the gas sensor chip is mounted on the printed circuit board. The method according to claim 1,
Wherein the recess is formed by forming a second mask pattern exposing a recess forming portion and etching the solder resist layer using the second mask pattern as an etching mask. / RTI > The method according to claim 1, further comprising, after the fifth step,
The gas sensor chip having a membrane structure having a membrane and an opening opened downward below the membrane, wherein the recess and the opening are overlapped with each other so that the gas sensor chip is mounted, The method further comprising the step of: communicating with the gas sensor chip. The method of claim 3,
Wherein the width of the recess is smaller than the width of the gas sensor chip and the length of the recess is longer than the length of the gas sensor chip. The method of claim 3,
Wherein the gas sensor chip is a contact-fired gas sensor chip.
KR1020150144067A 2015-10-15 2015-10-15 Manufacturing method of PCB for mounting gas sensor chip KR20170044407A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150144067A KR20170044407A (en) 2015-10-15 2015-10-15 Manufacturing method of PCB for mounting gas sensor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150144067A KR20170044407A (en) 2015-10-15 2015-10-15 Manufacturing method of PCB for mounting gas sensor chip

Publications (1)

Publication Number Publication Date
KR20170044407A true KR20170044407A (en) 2017-04-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150144067A KR20170044407A (en) 2015-10-15 2015-10-15 Manufacturing method of PCB for mounting gas sensor chip

Country Status (1)

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KR (1) KR20170044407A (en)

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