KR20170032544A

KR20170032544A - Single layered touch panel and method for preparing the same

Info

Publication number: KR20170032544A
Application number: KR1020150129978A
Authority: KR
Inventors: 신동혁; 이덕영
Original assignee: 이엘케이 주식회사
Priority date: 2015-09-14
Filing date: 2015-09-14
Publication date: 2017-03-23

Abstract

The present invention relates to a single layered touch panel and a method for fabricating the same, capable of improving the visibility of an electrode and improving a bending characteristic. According to the present invention, a method for fabricating a single layered touch panel is as follows. An electrode forming step is performed to form a first pattern electrode and a second pattern electrode. First pattern electrodes are arranged on a substrate while forming division areas in a first direction. The second pattern electrodes are electrically insulated from the first pattern electrodes and arranged in the division areas in a second direction. An insulating layer is formed in the division areas to insulate the first pattern electrode from the second pattern electrode. A bridge is formed to connect second pattern electrodes with each other. In the forming of the bridge, a photoresist layer is formed on a layer in which the first pattern electrode, the second pattern electrode, and the insulating layer are formed. A pattern is formed on the photoresist layer to form the bridge. A first metallic oxide layer is formed on the pattern. A metallic layer is formed on the first metallic oxide layer. A second metallic oxide layer is formed on the metallic layer. The photoresist layer is removed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a touch panel,

The present invention relates to a single-layer touch panel and a method of manufacturing the same.

The touch panel is the input device of the display, which is typically a cell phone, a tablet PC, or a touch screen panel for an automobile. By generating a voltage or current signal corresponding to the pressed position of the stylus pen or the finger, .

The touch panel is classified into a resistance film, a capacitance, a surface ultrasonic wave conduction, and an infrared light type according to the technology of the detection sensor. Recently, a capacitive touch panel is mainly used.

The electrodes formed on the touch panel are used to determine the presence or absence of contact input, detect input coordinates, and transmit signals to the touch sensor chip. This is because the signal input to the first and second pattern electrodes is a trace electrode It is based on the mechanism that is passed through. For the pattern electrode and the trace electrode, the performance of the touch panel is improved as the resistance is lowered to improve the signal transmission rate and the reaction speed.

Particularly, interest in a flexible display has increased recently, and a technique for improving the flexibility characteristic of a touch panel is required as the curved display is applied.

Accordingly, there is a need for a method of manufacturing a touch panel in which pattern electrodes and bridge electrodes of low resistance are realized, and visibility and banding characteristics of the touch panel are improved.

An object of the present invention is to provide a single-layer touch panel capable of improving the visibility and bending characteristics of the bridge electrode and lowering the resistance of the trace electrode and a method of manufacturing the same.

It is an object of the present invention to provide a single-layer touch panel having excellent process efficiency and a method of manufacturing the same.

The above and other objects of the present invention can be achieved by the present invention described below.

A method of manufacturing a touch panel, which is one aspect of the present invention, includes the steps of: forming a first patterned electrode on a substrate by forming an isolation region along a first direction; and electrically insulated from the first patterned electrode, An electrode forming step of forming a second pattern electrode arranged in a second direction; Forming an insulating layer on the isolation region, the insulating layer insulating the first pattern electrode and the second pattern electrode; And a bridge forming step of forming a bridge connecting the second pattern electrodes in a second direction,

In one embodiment, the bridge forming step includes forming a photoresist layer on the first patterned electrode, the second patterned electrode, and the layer on which the insulating layer is formed; Forming a pattern in the photoresist layer to form a bridge; Forming a first metal oxide layer on the pattern; Forming a metal layer on the first metal oxide layer; Forming a second metal oxide layer on the metal layer; And removing the photoresist layer.

In another embodiment, the electrode forming comprises: forming a metal oxide layer on a substrate; Forming a photoresist layer on the metal oxide layer; Patterning the photoresist layer to form a first pattern electrode and a second pattern electrode; Removing the portion of the metal oxide layer other than the pattern forming the first pattern electrode and the second pattern electrode; And removing the photoresist layer.

The electrode forming step may include: forming a photoresist layer on a substrate; Forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode; Forming a first metal oxide layer on the pattern; Forming a metal layer on the deposited metal oxide; Forming a second metal oxide layer on the metal layer; And removing the photoresist layer.

The step of forming the photoresist layer may be formed by a method of coating a liquid type photoresist or a method of laminating a film type photoresist.

The step of forming the insulating layer may include: coating a photosensitive insulating material on a layer on which the first pattern electrode and the second pattern electrode are formed; And patterning the photosensitive insulating material so that the first pattern electrode and the second pattern electrode are isolated from each other in the isolation region.

The step of forming the insulating layer may include forming an insulating layer by liquid coating, film type transfer, screen printing, or inkjet printing.

The manufacturing method of the touch panel may further include forming a trace electrode.

In one embodiment, the trace electrode forming step may be performed simultaneously with the electrode forming step.

In another embodiment, the trace electrode forming step may be performed simultaneously with the bridge forming step.

The trace electrode may be an electrode formed of at least one of a silver paste, a silver nanowire, a metal oxide, and a metal oxide-metal-metal oxide laminate.

The manufacturing method of the touch panel may further include forming a protective layer.

The substrate may be a glass or a flexible film.

The photoresist layer may comprise at least one selected from the group consisting of aromatic bisazides, methacrylic acid esters, cinnamic acid esters, poly (methyl methacrylate), naphthoquinone di Naphthoquinonediazide, polybutene-1 sulfone, diazonaphthoquinone-novolac resin (DNQ / NR), chemically amplified photoresist, KrF excimer laser resist, ArF excimer laser resist, An ArF resist into which a lactone ring is introduced, or an ArF dip resist.

The metal oxide may include at least one of indium zinc tin oxide (IZTO), indium tin oxide (ITO), indium gallium zinc oxide (IGZO), ZnO, and TiO.

The metal layer may include at least one of Ag, Cu, Au, Al, W, Mo, Zn, Ni, . &Lt; / RTI >

The insulating layer may be a photosensitive insulating material including at least one of an acrylic resin, a urethane resin, and a silicone resin.

The touch panel, which is another aspect of the present invention, may be one manufactured by the touch panel manufacturing method.

The present invention has the effect of providing a method of manufacturing a single-layer touch panel which not only improves the visibility and bending characteristics of the bridge electrode, but also reduces the resistance of the trace electrode, and is excellent in process efficiency.

1 schematically illustrates a method of manufacturing a touch panel according to an embodiment of the present invention.
FIG. 2 is a plan view schematically showing one step of a manufacturing method of a touch panel according to an embodiment of the present invention.
3 is a plan view schematically showing one step of a manufacturing method of a touch panel according to one embodiment of the present invention.
4 is a plan view schematically showing one step of a manufacturing method of a touch panel according to one embodiment of the present invention.
5 is a cross-sectional view schematically showing one step of a manufacturing method of a touch panel according to another embodiment of the present invention.

Embodiments of the present application will now be described in more detail with reference to the accompanying drawings. However, the techniques disclosed in the present application are not limited to the embodiments described herein but may be embodied in other forms.

It should be understood, however, that the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. In addition, although only a part of the components is shown for convenience of explanation, those skilled in the art can easily grasp the rest of the components.

It is to be understood that when an element is described above as being located above or below another element, it is to be understood that the element may be directly on or under another element, It means that it can be done. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. In the drawings, the same reference numerals denote substantially the same elements.

Meanwhile, the meaning of the terms described in the present application should be understood as follows. The terms " first " or " second " and the like are used to distinguish one element from another, and the scope of the right should not be limited by these terms.

For example, the first pattern electrode may be referred to as a second pattern electrode, and similarly, the second pattern electrode may also be referred to as a first pattern electrode.

The 'first direction' to the 'second direction' used in the specification of the present invention set arbitrary directions that can be set in the multi-dimensional structure. In one embodiment, Means the X-axis direction or the Y-axis direction in a two-dimensional structure in which two-pattern electrodes can vertically cross each other.

It should be understood, however, that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" That does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof, .

Further, in carrying out the method or the manufacturing method, the respective steps of the method may take place differently from the stated order unless clearly specified in the context. That is, each process may occur in the same order as described, may be performed substantially concurrently, or may be performed in the opposite order.

Hereinafter, the present invention will be described in detail.

A manufacturing method of a touch panel which is one aspect of the present invention will be described with reference to Fig.

FIG. 1 schematically shows a method of manufacturing a single-layer touch panel according to an embodiment of the present invention.

The manufacturing method of the touch panel includes a first pattern electrode 22 arranged on a substrate 10 with a separation region 15 formed along a first direction and a second pattern electrode 22 electrically insulated from the first pattern electrode 22 An electrode forming step of forming a second pattern electrode (21) arranged in the isolation region (15) along a second direction; Forming an insulating layer (30) on the isolation region (15) and insulating the first pattern electrode (22) and the second pattern electrode (21); And forming a bridge (40) connecting the second pattern electrode (21) in a second direction,

The forming of the bridge may include forming a photoresist layer on the layer on which the first pattern electrode 22, the second pattern electrode 21, and the insulating layer 30 are formed; Forming a pattern in the photoresist layer to form a bridge (40); Forming a first metal oxide layer on the pattern; Forming a metal layer on the first metal oxide layer; Forming a second metal oxide layer on the metal layer; And removing the photoresist layer.

Electrode formation step

FIG. 1 (a) schematically shows an electrode forming step of forming the first pattern electrode 22 and the second pattern electrode 21, and a plan view thereof is shown in FIG.

In the embodiment, the first and second pattern electrodes 22 and 21 are formed as a single layer on the substrate 10 in the electrode forming step. The first pattern electrode 22 is formed on the substrate 10 so that the isolation region 15 is arranged along the first direction and the second pattern electrode 22 is formed on the isolation region along the second direction. 21 can be formed. The second pattern electrode 21 is electrically insulated from the first pattern electrode 22.

The substrate 10 may have a curved surface or a planar structure to provide a space for forming the first pattern electrode 22 and the second pattern electrode 21 and constitute a touch panel screen.

The substrate 10 may be a glass or a flexible film.

The flexible film may use a polymer. Specific examples of the polymer include polycarbonate (PC) resin, cycloolefin polymer (COP), (meth) acrylic resin, polyester resin, polyethersulfone (PES) resin, cellulose ester ) Resin, a benzocyclobutene (BCB) resin, and a polyvinyl chloride (PVC) resin, but the present invention is not limited thereto.

The first and second pattern electrodes 22 and 21 may have a rhombic shape as illustrated in FIG. 2, but are not limited thereto. For example, the first and second pattern electrodes 22 and 21 may be formed in various shapes such as a rectangular shape, an octagonal shape, a circular shape, an elliptical shape, or a polygonal shape including a concave- The shape is not necessarily limited thereto as long as the characteristic can be realized. The cross-section of the fine lines constituting the first and second pattern electrodes 22 and 21 may be a square, a triangle, a semicircle, a semi-ellipse, or the like.

In one embodiment, the electrode forming step comprises forming a metal oxide layer on the substrate 10, forming a photoresist layer on the metal oxide layer, forming a first pattern electrode and a second pattern electrode Removing the portion of the metal oxide layer other than the pattern forming the first pattern electrode and the second pattern electrode, and removing the photoresist layer.

The metal oxide layer may be formed by a dry method such as sputtering, chemical vapor deposition (CVD), physical vapor deposition (PVD), or e-beam, and may be formed by a wet process such as coating And may be, but is not necessarily limited to.

The metal oxide may include at least one of indium tin oxide (ITO), indium gallium zinc oxide (IGZO), ZnO, and TiO.

The step of patterning the photoresist layer to form the first pattern electrode and the second pattern electrode may be formed by a conventional photoresist pattern forming method. For example, a photoresist may be coated on the metal oxide layer to form a photoresist layer, followed by exposure and development using a photomask. Specifically, a method of forming a photoresist pattern includes coating a substrate with a photoresist that is cured or decomposed by UV light, irradiating the photoresist with a UV light source to cure or decompose the irradiated photoresist portion, But the present invention is not limited thereto.

The photoresist may be selected from the group consisting of aromatic bisazides, methacrylic acid esters, cinnamic acid esters, poly (methyl methacrylate), naphthoquinonediazides Naphthoquinonediazide, polybutene-1 sulfone, diazonaphthoquinone-novolak resin (DNQ / NR), chemically amplified photoresist, KrF excimer laser resists, ArF excimer laser resists, A ring-introduced ArF resist, or an ArF immersion resist. However, the present invention is not limited thereto.

The photoresist may be applied to both a positive type and a negative type in response to a UV light source, and may be applied to a product formed of a liquid or semi-solid film.

Most of the developing step for selectively removing the photoresist may use a water-soluble alkali solution, but it is not necessarily limited thereto. As an example of the water-soluble alkali solution, an aqueous solution of KOH and TMAH (TetraMethyl-Ammonium-Hydroxide) may be used, but is not limited thereto. In general, the development time is about 60 seconds, but it may be advantageous to reduce development time if the thickness of the photosensitive agent is low.

The step of removing the portion of the metal oxide layer other than the pattern for forming the first pattern electrode and the second pattern electrode may be, for example, an etching method. Specifically, an etchant for etching includes a waxy (HCl + HNO ₃ ) etchant, an etchant consisting of one selected from hydrochloric acid, weak acid and alcohol, an iron chloride (FeCl ₃ ) etchant, A chloride etchant, and the like may be used, but the present invention is not limited thereto.

The step of removing the photoresist layer may be performed by a lift-off method. The lift-off step may be a physical or chemical method.

Chemical methods of lift-off include acetone, trichlorethylene (TCE), phenol-based strippers (Indus-Ri-Chem J-100), methyl ether ketone methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), and the like.

Physical methods of the lift-off include plasma etching with oxygen (O ₂ ), or a method of stripping a Shipley 1165 stripper (Shipley 1160) containing n-methyl-2-pyrrolidone 1165 stripper) may be used, but the present invention is not limited thereto.

In another embodiment, the electrode forming step comprises: forming a photoresist layer on a substrate; Forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode; Forming a first metal oxide layer on the pattern; Forming a metal layer on the deposited metal oxide; Forming a second metal oxide layer on the metal layer; And removing the photoresist layer.

Forming a photoresist layer on the substrate, forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode, and removing the photoresist layer, May be carried out in the same manner as described in one embodiment.

Hereinafter, a step of forming a first metal oxide layer on the pattern, a step of forming a metal layer on the first metal oxide layer, and a step of forming a second metal oxide layer on the metal layer will be described.

The first metal oxide layer may be formed by CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), or sputtering. However, the present invention is not limited thereto.

The step of forming the metal layer may be performed by CVD, PVD, sputtering or a method of applying a metal nanowire composition. The method by CVD, PVD and sputtering is substantially the same as the method of depositing the first metal oxide.

When a metal layer is formed by applying a metal nanowire composition, the metal nanowire composition may include additives, binders, and the like for dispersing the nanowires. The binder is not particularly limited and, for example, a cellulose compound or polyvinyl alcohol can be used. The method of applying the metal nanowire composition onto the first metal oxide is not particularly limited and may be bar coating, spin coating, roll coating, flow coating, die coating and the like.

The method of forming the second metal oxide layer may be performed in substantially the same manner as the method of depositing the first metal oxide. However, the second metal oxide may be the same as or different from the first metal oxide.

Insulating layer Forming step

FIG. 1 (b) and FIG. 3 schematically illustrate the step of forming the insulating layer 30 according to an embodiment of the present invention.

According to one embodiment, the step of forming the insulating layer 30 may use a photolithography method. The photolithography method can use a photosensitive insulating material. For example, the step of forming the insulating layer 30 using the photolithography method may include a step of coating a photosensitive insulating material on a layer on which the first pattern electrode 22 and the second pattern electrode 21 are formed, And patterning the photosensitive insulating material so that the first pattern electrode 22 and the second pattern electrode 21 are insulated from each other. The step of coating and patterning the photosensitive insulating material can be performed by a conventional photolithography method and the thickness thereof can be adjusted.

The photosensitive insulating material may be an acrylic resin, a urethane resin, a silicone resin or the like, and they may be used alone or in combination of two or more. The insulating layer 30 may be formed to have a uniform thickness on the intersection of the first and second pattern electrodes 22 and 21. The insulating layer 30 may be formed as in the prior art or may be formed by electrodeposition in another embodiment.

According to another embodiment, the step of forming the insulating layer 30 may form an insulating layer by a method of liquid coating, film lamination, screen printing, or inkjet printing. According to the above method, there is an effect of reducing the material.

The liquid coating may be performed by, but not limited to, bar coating, spin coating, roll coating, flow coating, die coating and the like.

The film lamination can form an insulating layer using, for example, a thermal transfer film.

The screen printing method is a method of printing patterns on an object through a screen plate having a plurality of thin holes in a desired shape and is used for patterning electronic parts such as a wiring board and a display and is provided with a photosensitive insulating material And the like can be applied. Specifically, the insulating layer 40 is formed by using the above-described photosensitive insulating material, setting the clearance of the screen plate on the object blank, pressing the screen plate with the squeegee so that the screen plate and the object come in contact with each other, Thereby enabling pattern driving.

The inkjet printing method may be a piezo method, a heating method, a bubble jet method, or the like, but is not limited thereto.

According to a specific example, the insulating layer 30 may be formed to have a thickness of 0.1 탆 to 15 탆, which may be configured to have a reduced thickness than that of the conventional insulating layer. It is advantageous in improving the visibility of the touch panel in the thickness range and advantageously in the structural reliability of the second pattern electrode 21 formed on the upper part.

Bridge forming step

Fig. 1 (c) schematically illustrates the step of forming the bridge 40 according to embodiments of the present invention.

The step of forming the bridge 40 includes the steps of forming a photoresist layer on the layer on which the first pattern electrode 22, the second pattern electrode 21 and the insulating layer 30 are formed, Forming a pattern on the photoresist layer, forming a first metal oxide layer on the pattern, forming a metal layer on the first metal oxide layer, forming a second metal oxide layer on the metal layer And removing the photoresist layer.

The metal layer may be a layer containing a metal that improves conductivity. Specifically, the metal layer may be formed of a metal such as silver (Ag), copper (Cu), gold (Au), aluminum (Al), tungsten (W), molybdenum (Zn), nickel (Ni), and tin (Sn). For example, the metal layer may be a metal nanowire layer, specifically, in terms of conductivity, the metal layer may be a silver nanowire layer.

Forming a photoresist layer on the layer on which the first pattern electrode 21, the second pattern electrode 22 and the insulating layer 30 are formed; forming a pattern on the photoresist layer to form a bridge And removing the photoresist layer may be performed on the layer on which the first pattern electrode 22, the second pattern electrode 21, and the insulating layer 30 are formed instead of performing on the substrate 10, May be carried out in substantially the same manner as described in one embodiment of the electrode forming step.

The patterning step may include forming a first metal oxide layer on the pattern, forming a metal layer on the first metal oxide layer, and depositing a second metal oxide layer on the metal layer, Can be carried out in substantially the same manner as described in the examples.

The bridge layer 40 is formed on the layer on which the insulating layer 30 is formed and the coordinates of the second direction can be recognized by electrically connecting the second pattern electrodes 21 in the second direction.

At least one of the component, position, size, or shape of the bridge layer 40 may not be limited. The bridge layer 40 may be formed into a rod shape or a strip shape or the like, but is not limited thereto. The bridge layer 40 of Fig. 1 (c) represents a laminate in which a first metal oxide layer, a metal layer and a second metal oxide layer are sequentially laminated.

In addition, as shown in FIGS. 1 and 4 of the present invention, the bridge layer 40 may have conductivity and may be in the form of a rectangular bar. However, But is not limited to the shape. In another embodiment, the conductive bridge layer 40, which is exposed by the insulating layer 30, may have a shape in which both end portions are wider than other portions (for example, a pinnate shape).

The bridge layer 40 is a structure in which a first metal oxide layer, a metal layer, and a second metal oxide layer are sequentially stacked. The first or second metal oxide layer increases the transparency of the bridge 40 and the metal layer can lower the resistance of the bridge 40. Further, the bridge 40 in which the first metal oxide layer, the metal layer, and the second metal oxide layer are sequentially stacked has excellent banding characteristics. In FIG. 1, the bridge layer 40 simply shows a structure in which a first metal oxide layer, a metal layer, and a second metal oxide layer are sequentially stacked.

The first metal oxide layer may have a thickness of 2 nm to 100 nm, specifically, 2 nm to 90 nm. The balance of transparency and banding characteristics is excellent in the above range.

The metal layer may have a thickness of 0.1 nm to 150 nm, specifically 1 nm to 75 nm. The balance of conductivity and banding characteristics is excellent in the above range.

The second metal oxide layer may have a thickness of 1 nm to 80 nm, specifically 1 nm to 70 nm. The balance of transparency and banding characteristics is excellent in the above range.

The first and second metal oxide layers and the metal layer may have a width of 0.5 nm to 100 nm, specifically 1 nm to 70 nm. In the above range, not only the conductivity of the bridge electrode is excellent but also the banding characteristic is excellent.

Trace electrode Forming step

The manufacturing method may further include a step of forming a trace electrode (41).

The trace electrode 41 is a plurality of lines formed on the edges of the first and second pattern electrodes 22 and 21 to receive an electric signal from the first and second pattern electrodes 22 and 21. May be formed in one pattern as shown in FIG. 4, but the present invention is not limited thereto.

The step of forming the trace electrodes 41 may be performed during all steps of the manufacturing method of the touch panel according to the process efficiency or the environment. Specifically, it is preferable that the insulating layer is formed before the electrode forming step, the electrode forming step, the electrode forming step, the insulating layer forming step, the insulating layer forming step, the insulating layer forming step, But is not limited thereto. For example, it may be performed simultaneously with each of the above steps. FIG. 4 shows that the trace electrode 41 is formed after the formation of the bridge 40 as a specific example, but this is not limitative.

The trace electrode forming step may be performed independently of each step of the manufacturing method of the touch panel, and may be performed simultaneously. The trace electrode may be an electrode formed of at least one of a silver paste, a silver nanowire, a metal oxide, and a metal oxide-metal-metal oxide laminate.

The silver paste is a commonly used conductive paste, and may be a conductive paste containing silver particles as a conductive material. Also, a conductive paste containing silver nanowires as a conductive material can be used.

The conductive paste may be a sol, gel or liquid ink including a binder for fixing conductive particles such as silver particles or silver nanowires, and other possible conductive and fillable materials may be used.

In one embodiment, the trace electrode forming step may be performed simultaneously with the electrode forming step. Specifically, in the case of forming the trace electrode in the electrode formation step, the step of patterning the photoresist layer so as to form the first pattern electrode and the second pattern electrode with respect to the whole substrate as the electrode formation range is referred to as a first pattern electrode, When patterning the photoresist layer to form the second pattern electrode and the trace electrode, trace electrodes may be formed together in the electrode forming step.

When the trace electrodes are formed together in the electrode formation step, the trace electrode may be a metal oxide layer or a laminate of a metal oxide layer-metal layer-metal oxide layer according to an electrode formation method.

In another embodiment, the trace electrode forming step may be performed simultaneously with the bridge forming step. Specifically, when the trace electrode is formed in the bridge forming step, the step of patterning the photoresist layer to form the bridge is performed by patterning the photoresist layer to form the bridge and trace electrodes. In the bridge forming step, Can be formed together. When the trace electrodes are formed together in the bridge forming step, the trace electrode may be a laminate of a metal oxide layer-metal layer-metal oxide layer.

Step of forming protective layer

The manufacturing method of the touch panel may further include a protective layer forming step.

5 is a cross-sectional view schematically showing a step of forming a protective layer 50 according to an embodiment of the present invention. Specifically, the protective layer 50 may be formed on the surface of the bridge layer 40 and the first and second pattern electrodes 22 and 21. The protective layer 50 may be formed on the surface of the first and second pattern electrodes 22 and 21, A heat resistant material can be preferably applied to prevent scratches or other damage to the two-pattern electrodes 22 and 21, improve visibility, and prevent exposure to high temperatures. Specifically, the protective layer 50 may be made of a ceramic material having transparency and insulation. More specifically, the protective layer 50 may be made of a liquid type or a film type material having transparency and insulation.

As the protective layer 50, for example, an acrylic resin, a urethane resin, a silicone resin, or the like may be used, and these may be used alone or in combination of two or more. The protective layer 50 may also be formed on the substrate 10 to cover the first and second pattern electrodes 22 and 21 through a coating process and may be formed on the substrate 40, ) May be formed on the layer on which the bridge 40 and the trace electrode 41 are formed.

Touch panel

Another aspect of the present invention is to provide a single layer touch panel.

The single layer touch panel may be manufactured by one of the single layer touch panel manufacturing methods.

In an embodiment, the thickness of the bridge and trace electrodes of the touch panel may be 0.1 탆 to 20 탆, preferably 0.1 탆 to 19 탆, and more preferably 0.1 탆 to 18 탆. In addition, the pattern electrode of the touch panel manufactured by the above method may have an interval of 0.5 μm to 150 μm, preferably 0.5 μm to 140 μm, more preferably 0.5 μm to 130 μm. There is an advantage that resistance reduction and visibility are improved in the above-mentioned range.

100: touch panel 10: substrate
15: isolation region 21: first pattern electrode
22: second pattern electrode 30: insulating layer
40: bridge 41: trace electrode
50: Protective layer

Claims

A first pattern electrode formed on the base material with an isolation region formed along a first direction and a second pattern electrode electrically insulated from the first pattern electrode and arranged in the isolation region along a second direction ;
Forming an insulating layer on the isolation region, the insulating layer insulating the first pattern electrode and the second pattern electrode; And
Forming a bridge connecting the second pattern electrodes in a second direction;
Lt; / RTI >
Wherein the bridge forming step comprises:
Forming a photoresist layer on the first pattern electrode, the second pattern electrode, and the layer on which the insulating layer is formed;
Forming a pattern in the photoresist layer to form a bridge;
Forming a first metal oxide layer on the pattern;
Forming a metal layer on the first metal oxide layer;
Forming a second metal oxide layer on the metal layer; And
Removing the photoresist layer;
Wherein the first and second electrodes are electrically connected to each other.

The method according to claim 1,
Forming a metal oxide layer on the substrate;
Forming a photoresist layer on the metal oxide layer;
Patterning the photoresist layer to form a first pattern electrode and a second pattern electrode;
Removing the portion of the metal oxide layer other than the pattern forming the first pattern electrode and the second pattern electrode; And
Removing the photoresist layer;
Wherein the first and second electrodes are electrically connected to each other.

The method according to claim 1,
Forming a photoresist layer on the substrate;
Forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode;
Forming a first metal oxide layer on the pattern;
Forming a metal layer on the deposited metal oxide;
Forming a second metal oxide layer on the metal layer; And
Removing the photoresist layer;
Wherein the first and second electrodes are electrically connected to each other.

4. The method of any one of claims 1 to 3, wherein forming the photoresist layer comprises:
A method of coating a liquid type photoresist, or a method of laminating a film type photoresist.

The method of claim 1, wherein forming the insulating layer comprises:
Coating a photosensitive insulating material on a layer on which the first pattern electrode and the second pattern electrode are formed; And
Patterning the photosensitive insulating material so that the first pattern electrode and the second pattern electrode are insulated from each other in the isolation region;
Wherein the first and second electrodes are electrically connected to each other.

The manufacturing method of a touch panel according to claim 1, wherein the step of forming the insulating layer comprises forming an insulating layer by coating, film lamination, screen printing, or inkjet printing.

The manufacturing method of a touch panel according to claim 1, wherein the manufacturing method further comprises a trace electrode forming step.

8. The method of claim 7, wherein the trace electrode forming step is performed simultaneously with the electrode forming step.

8. The method of claim 7, wherein the trace electrode forming step is performed simultaneously with the bridge forming step.

8. The method of claim 7, wherein the trace electrode is an electrode formed of at least one of a silver paste, a silver nanowire paste, a metal oxide, and a metal oxide-metal-metal oxide laminate.

The manufacturing method of a touch panel according to claim 1, wherein the manufacturing method further comprises a protective layer forming step.

The method of manufacturing a touch panel according to claim 1, wherein the substrate is glass or a flexible film.

4. The method of any one of claims 1 to 3, wherein the photoresist layer is selected from the group consisting of aromatic bisazides, methacrylic acid esters, cinnamic acid esters, Poly (methyl methacrylate), Naphthoquinonediazide, Polybutene-1 sulfone, diazonaphthoquinone-novolak resin (DNQ / NR), chemical amplification Wherein the resist film comprises at least one selected from the group consisting of a resistive photo resist, a KrF excimer laser resist, an ArF excimer laser resist, an ArF resist into which a lactone ring is introduced, or an ArF dip resist.

The method according to any one of claims 1 to 3, wherein the metal oxide is selected from the group consisting of indium zinc tin oxide (IZTO), indium tin oxide (ITO), indium tin oxide (IGZO) gallium zinc oxide, ZnO, and TiO.

The method as claimed in claim 1 or 3, wherein the metal layer is at least one selected from the group consisting of Ag, Cu, Au, Al, W, Mo, Zn, Ni) and tin (Sn). &Lt; RTI ID = 0.0 > 11. < / RTI >

The method of claim 1, wherein the insulating layer is a photosensitive insulating material containing at least one of acrylic resin, urethane resin, and silicone resin.

A touch panel manufactured by the method according to claim 1.