KR20170006894A - Light emitting diode package and substrate - Google Patents

Light emitting diode package and substrate Download PDF

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Publication number
KR20170006894A
KR20170006894A KR1020150098265A KR20150098265A KR20170006894A KR 20170006894 A KR20170006894 A KR 20170006894A KR 1020150098265 A KR1020150098265 A KR 1020150098265A KR 20150098265 A KR20150098265 A KR 20150098265A KR 20170006894 A KR20170006894 A KR 20170006894A
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KR
South Korea
Prior art keywords
substrate
light emitting
emitting diode
heat dissipation
spaced apart
Prior art date
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KR1020150098265A
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Korean (ko)
Inventor
박재현
송재완
남기범
Original Assignee
서울반도체 주식회사
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Priority to KR1020150098265A priority Critical patent/KR20170006894A/en
Publication of KR20170006894A publication Critical patent/KR20170006894A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting diode package and a substrate for a light emitting diode package, wherein the light emitting diode package comprises: a substrate; And a light emitting diode chip mounted on the substrate and having first and second electrode pads spaced apart from each other at a lower portion thereof, the substrate comprising: a base constituting a body of the substrate; And first and second substrate electrodes formed on the base, the first and second substrate electrodes being spaced apart from each other to be electrically connected to the first and second electrode pads, the first and second substrate electrodes being spaced apart from each other, . According to the present invention, the space between the substrate electrodes is filled in the state that the light emitting diode chip is mounted on the substrate, so that the empty space is not formed between the light emitting diode chip and the substrate, There is an effect that can be effectively released.

Description

[0001] DESCRIPTION [0002] LIGHT EMITTING DIODE PACKAGE AND SUBSTRATE [0003]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode package and a substrate for a light emitting diode package, and more particularly, to a light emitting diode package and a substrate for a light emitting diode package capable of effectively emitting heat generated from the light emitting diode chip.

Light emitting diodes are inorganic semiconductor devices that emit light generated by the recombination of electrons and holes. Recently, they have been used in various fields such as displays, automobile lamps, and general lighting. Since the light emitting diode has a long lifetime, low power consumption, and high response speed, the light emitting device using the light emitting diode is expected to replace the conventional light source.

The light emitting diode chip is classified into a horizontal type light emitting diode chip, a flip chip type light emitting diode chip and a vertical type light emitting diode chip according to the position and structure of the electrode. Among the flip chip type light emitting diode chip, Phase can be directly mounted and used. Therefore, the flip chip type light emitting diode chip is excellent in current dispersion in the horizontal direction and has good heat dissipation efficiency and is widely used in high output light emitting devices.

The substrate on which the flip chip type light emitting diode chip is mounted is mainly made of a ceramic or a metal material having good heat conductivity in order to release heat generated from the light emitting diode chip more effectively. In order to mount a light emitting diode chip on a ceramic or metal substrate, a metal interconnection method such as eutectic is mainly used.

However, when a ceramic or metal substrate is used as described above, the insulating layer for electrical isolation is applied in various forms, so that the heat generated from the LED chip is transferred through the substrate, There is a problem that does not support.

One of the problems to be solved by the present invention is to provide a light emitting diode package and a substrate for a light emitting diode package that can effectively emit heat generated from the light emitting diode chip.

A light emitting diode package according to an embodiment of the present invention includes a substrate; And a light emitting diode chip mounted on the substrate and having first and second electrode pads spaced apart from each other at a lower portion thereof, the substrate comprising: a base constituting a body of the substrate; And first and second substrate electrodes formed on the base, the first and second substrate electrodes being spaced apart from each other to be electrically connected to the first and second electrode pads, the first and second substrate electrodes being spaced apart from each other, As shown in FIG.

At this time, the charger may fill the spaced space between the first and second electrode pads.

The substrate may further include a heat dissipation unit disposed on the base and disposed between the first and second substrate electrodes and in thermal contact with the light emitting diode chip.

The heat dissipating unit may be spaced apart from the first and second substrate electrodes, and the charging unit may fill a spaced space between the first substrate electrode, the second substrate electrode, and the heat dissipating unit, As shown in FIG. At this time, the plurality of heat dissipating units may be spaced apart from each other, and the charging unit may fill the spaced apart spaces of the plurality of heat dissipating units.

The heat dissipation unit may include at least one groove, and the at least one groove may be formed at an edge of the heat dissipation unit. And the at least one groove may be formed in a direction toward the center of the heat dissipation unit. Here, the filling part can fill the at least one groove.

In this case, the light emitting diode chip may further include a bonding portion for bonding the substrate and the light emitting diode chip. The bonding portion may include a plurality of bonding portions, and the plurality of bonding portions may bond the first and second electrode pads and the first and second substrate electrodes, respectively. One of the plurality of bonding portions may couple the bottom surface of the LED chip at a spaced position of the first and second electrode pads with the top surface of the base at a spaced position between the first and second substrate electrodes.

The plurality of adhesive portions may be spaced apart from each other, and the filling portion may fill the plurality of spaced spaces.

Here, the charging unit may be formed of an insulating material.

According to another aspect of the present invention, there is provided a substrate for a light emitting diode package, the base comprising: a base for mounting a light emitting diode chip; First and second substrate electrodes formed on the base and spaced apart from each other to be electrically connected to the light emitting diode chip; And a charging unit that fills the spaced apart spaces of the first and second substrate electrodes.

The light emitting diode chip may further include a heat dissipation unit disposed on the base and disposed between the first and second substrate electrodes and in thermal contact with the light emitting diode chip. The heat dissipation unit may be spaced apart from the first and second substrate electrodes, and the charging unit may fill a spaced space between the first substrate electrode, the second substrate electrode, and the heat dissipation unit.

The plurality of heat dissipation units may be spaced apart from each other, and the charging unit may fill the spaced apart spaces of the plurality of heat dissipation units.

The heat dissipation unit may include at least one groove, and the at least one groove may be formed at an edge of the heat dissipation unit. Here, the at least one groove may be formed in a direction toward the center of the heat dissipation unit.

And the filler may fill the at least one groove.

According to the present invention, the space between the substrate electrodes is filled in the state that the light emitting diode chip is mounted on the substrate, so that the empty space is not formed between the light emitting diode chip and the substrate, There is an effect that can be effectively released.

Furthermore, since the void space between the light emitting diode chip and the substrate is eliminated, the physical durability of the light emitting diode package can be enhanced.

In addition, since the substrate used in the light emitting diode package is in direct contact with the light emitting diode chip, the heat generated from the light emitting diode chip can be more effectively discharged to the substrate side. When the light emitting diode chip and the substrate are bonded to each other, voids that can be generated at the interface can be minimized by dividing the heat dissipating portion of the substrate directly in contact with the light emitting diode chip into a plurality of openings or by forming one or more grooves in the heat dissipating portion , The heat generated from the light emitting diode chip can be more effectively discharged to the substrate side.

1 is a cross-sectional view illustrating a light emitting diode package according to an embodiment of the present invention.
2 is a plan view showing a substrate for a light emitting diode package according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a substrate for a light emitting diode package according to another embodiment of the present invention.
4 is a plan view illustrating a substrate for a light emitting diode package according to another embodiment of the present invention.

Preferred embodiments of the present invention will be described more specifically with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view illustrating a light emitting diode package according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating a substrate for a light emitting diode package according to an embodiment of the present invention.

1 and 2, a light emitting diode package according to an embodiment of the present invention includes a substrate 110, a light emitting diode chip 120, a bonding portion 130, and a charging portion 140.

The substrate 110 may be mounted on the LED chip 120 and may transmit power from the LED chip 120 to the LED chip 120. The substrate 110 may be an insulating substrate 110 made of a polymer material or a ceramic material, and may include a ceramic material having high thermal conductivity, such as AlN. Alternatively, the conductive substrate 110 may be made of a metal or the like.

A conductive pattern may be formed on the upper surface 112u of the substrate 110 and first and second substrate electrodes 114 and 116 may be formed as shown. To this end, the substrate 110 includes a base 112, a first substrate electrode 114, and a second substrate electrode 116.

As described above, the base 112 may be formed of an insulating material including a polymer material or a ceramic material, and may be formed of a conductive material made of a metal or the like. 1, the base 112 has a top surface 112u on which the LED chip 120 is mounted, and a heat radiating portion 118 is formed on the top surface 112u of the base 112 The second and third surfaces 112b and 112c on which the first surface 112a and the first and second substrate electrodes 114 and 116 are formed may protrude from the upper surface 112u of the base 112 Respectively. A first groove H1 may be formed between the first to third surfaces 112a, 112b, and 112c so that the first to third surfaces 112a, 112b, and 112c may be spaced apart from each other.

The first surface 112a directly contacts the LED chip 120. The second surface 112b forms the first substrate electrode 114 and the third surface 112c forms the second substrate electrode 116. [ . 1, a heat dissipating unit 118 may be formed on the first surface 112a so that the heat generated from the LED chip 120 may be transmitted to the substrate 110 more quickly.

2, the first surface 112a of the substrate 110 is disposed at the center of the upper surface 112u of the base 112 and is formed into a hexagonal shape, and four sides of six sides And is exposed to the outside. And the second and third surfaces 112b and 112c are disposed on the other two surfaces. The second and third surfaces 112b and 112c are each formed in a right triangle shape.

The heat dissipating unit 118 and the first and second substrate electrodes 114 and 116 are formed on the first to third surfaces 112a, 112b and 112c formed on the upper surface 112u of the base 112, In FIG. 2, only the heat radiating portion 118 and the first and second substrate electrodes 114 and 116 are formed to be seen. The first to third surfaces 112a, 112b and 112c are arranged to be spaced apart from each other and are arranged between the first and second surfaces 112a and 112b and between the first and third surfaces 112a and 112c And a first groove H1 are respectively formed.

The light emitting diode chip 120 is mounted on the substrate 110, and the light emitting diode chip 120 capable of emitting blue light or ultraviolet light may be used. In addition, the light emitting diode chip 120 may be provided with a plurality of light emitting diode chips 120 as needed. In an embodiment of the present invention, the light emitting diode chip 120 includes an n-type semiconductor layer and a p-type semiconductor layer, and has a structure capable of emitting light by the combination of holes and electrons. For this purpose, an active layer may be interposed between the n-type semiconductor layer and the p-type semiconductor layer. Accordingly, the light emitting diode chip 120 may have a structure of a horizontal type, a vertical type, a flip chip type, and the like, and a flip chip type LED chip 120 is used in an embodiment of the present invention.

First and second electrode pads 122 and 124 may be formed under the light emitting diode chip 120 to be electrically connected to the first and second substrate electrodes 114 and 116 of the substrate 110. The first and second electrode pads 122 and 124 may be formed on a substantially same plane as the lower surface of the light emitting diode chip 120 and may be formed on the lower surface of the light emitting diode chip 120, As shown in Fig. Further, it may be located higher than the lower surface of the light emitting diode chip 120 if necessary.

As the first and second electrode pads 122 and 124 are formed as described above, the first and second electrode pads 122 and 124 are electrically connected to the first and second substrate electrodes 114 and 116, So that the power supplied from the first and second substrate electrodes 114 and 116 can be transmitted to the LED chip 120. The first and second electrode pads 122 and 124 may be electrically connected to the first and second substrate electrodes 114 and 116 when the LED chip 120 is mounted on the substrate 110 Respectively.

The light emitting diode chip 120 and the substrate 110 are coupled to each other by the bonding portion 130. The bonding portion 130 is formed between the light emitting diode chip 120 and the substrate 110 to bond the light emitting diode chip 120 to the substrate 110, as shown in FIG. The bonding portion 130 is formed on the first and second substrate electrodes 114 and 116 formed on the upper surface 112u of the substrate 110 and on the heat dissipating portion 118 to be in direct contact with the light emitting diode chip 120 do. At this time, as shown in the drawing, the bonding portions 130 formed on the first and second substrate electrodes 114 and 116 and the heat radiating portion 118 are formed so as not to contact each other. The first groove H1 formed on the substrate 110 may be formed to the bottom surface of the LED chip 120. [

The bonding portion 130 includes a material having electrical conduction so that the first electrode pad 122 and the first substrate electrode 114 and the second electrode pad 124 and the second substrate electrode 116 are electrically connected to each other can do. For this, a metal may be included, and if necessary, the metal sintered body may be formed.

The bonding portion 130 is formed on the heat dissipating portion 118 so that the heat generated from the LED chip 120 can be transmitted to the substrate 110 through the heat dissipating portion 118 through the bonding portion 130 . As described above, since the bonding portion 130 includes a conductive material, heat can be transmitted more smoothly.

As described above, when the light emitting diode chip 120 is mounted on the substrate 110 by the bonding portion 130, when power is supplied to the light emitting diode chip 120 by an external power source, the light emitting diode chip 120 to emit light. A plurality of voids may be formed in the LED package 100 by a first groove H1 formed in the substrate 110 between the LED chip 120 and the substrate 110. [ When the light emitting diode chip 120 is molded and installed in another device in the state where the empty space is formed, air in the empty space is expanded by the heat generated from the outside in the process, and the durability of the light emitting diode package 100 can be weakened .

Accordingly, the empty space formed inside the light emitting diode package 100 can be filled by the charging unit 140. The charging unit 140 is formed by a first groove H1 formed between the first surface 112a and the second surface 112b of the substrate 110 and between the first surface 112a and the third surface 112c The light emitting diode chip 120 may be filled in an empty space formed up to the lower surface of the LED chip 120. At this time, the charger 140 may electrically insulate the first and second electrode pads 122 and 124 from the adhesive 130 by electrically insulating material. In addition, the charger 140 may include a ceramic material having a high thermal conductivity, such as AlN, so that heat can be transferred well.

Here, the charger 140 may be filled in the empty space by a syringe or the like, and the empty space may be filled in the empty space due to capillary phenomenon or the like due to the narrow cross-sectional area.

FIG. 3 (a) is a cross-sectional view illustrating a substrate for a light emitting diode package according to a first alternative embodiment of the present invention, and FIG. 3 (b) Fig.

Referring to FIG. 3A, a substrate 110 for a light emitting diode package 100 according to the first embodiment of the present invention includes a base 112, a heat radiating portion 118, (114, 116), and a description of the first alternative embodiment of the present invention will be omitted, and the same description as in the first embodiment will be omitted.

The base 112 includes an insulating material or an electrically conductive material as in the embodiment, and the second and third surfaces 112b and 112c protrude from the upper surface 112u. The first surface 112a on which the heat dissipation unit 118 is formed may be concave compared to the second and third surfaces 112b and 112c.

A first substrate electrode 114 is formed on the second surface 112b and a second substrate electrode 116 is formed on the third surface 112c on the first surface 112a. And the first electrode pad 122 and the second electrode pad 124 of the LED chip 120 are mounted on the first substrate electrode 114 and the second substrate electrode 116, respectively. The bonding portion 130 is interposed between the first electrode pad 122 and the first substrate electrode 114 and between the second electrode pad 124 and the second substrate electrode 116 and the light emitting diode chip 120 And between the lower surface and the heat-radiating portion 118, respectively. The bonding portion 130 formed between the heat dissipating portion 118 and the LED chip 120 may be thicker than the bonding portion 130. In an embodiment of the present invention, .

In addition, the space separated as described above may be used to remove the void space between the light emitting diode chip 120 and the substrate 110 according to filling using the charger 140.

Referring to FIG. 3B, a substrate 110 for a light emitting diode package 100 according to the second embodiment of the present invention includes a base 112, a heat radiating portion 118, (114, 116), and the second embodiment of the present invention is described, and the same description as in the first embodiment and the first embodiment is omitted.

The base 112 is formed in the same shape as in the first alternative embodiment and the adhesive portion 130 in the form of a metal sintered product film 130a including a metal sintered body on the heat dissipating portion 118 May be formed. At this time, the metal sintered body may include an Ag sintered body formed by sintering the Ag particles, and the Ag sintered body may be formed in the form of a film on the heat dissipating unit 118. The light emitting diode chip 120 may be disposed on the Ag sintered product film and cured by applying a low temperature and / or pressure to the Ag sintered product film. Accordingly, the light emitting diode chip 120 can be bonded to the substrate 110 by the Ag sintered film.

The metal sintered product film 130a has almost no change in volume or position even when the light emitting diode chip 120 is arranged and then fired. Therefore, in the process of mounting the light emitting diode chip 120 like the conventional paste, the adhesive portions 130 are contacted with each other to prevent the electrical short circuit from occurring. In addition, since the pre-fabricated metal sintered product film 130a is used, no holes or pores are generated in the adhesive portion 130 during the mounting process of the LED chip 120, so that the heat emission efficiency of the adhesive portion 130 is lowered . In addition, it is possible to prevent the mechanical strength from being lowered.

Furthermore, the thickness of the metal sintered product film 130a can be freely adjusted, thereby increasing the thickness of the metal sintered product film 130a, thereby enhancing heat dissipation efficiency when the light emitting diode chip 120 is driven. In one example, the thickness of the metal sintered film 130a may be about 10 to 30 占 퐉. The curing of the metal sintered product film 130a can be performed at a relatively low pressure and temperature so that the light emitting diode chip 120 can be cured by high temperature or high pressure in the process of mounting the light emitting diode chip 120 on the substrate 110 There is an advantage that damage can be minimized.

In addition, the space separated as described above may be used to remove the void space between the light emitting diode chip 120 and the substrate 110 according to filling using the charger 140.

4 (a) is a plan view showing a substrate for a light emitting diode package according to a third embodiment of the present invention, and FIG. 4 (b) shows a substrate for a light emitting diode package according to the fourth embodiment FIG. And FIG. 4C is a plan view illustrating a substrate for a light emitting diode package according to the fifth embodiment.

Referring to FIG. 4A, a substrate 110 for a light emitting diode package 100 according to a third embodiment of the present invention includes a base 112, first and second substrate electrodes 114 and 116, And explanations of the third alternative embodiment of the present invention are omitted and the same explanations as those in the first embodiment are omitted.

First and second substrate electrodes 114 and 116 are mounted on the upper surface 112u of the base 112. The first and second substrate electrodes 114 and 116 are spaced apart from each other, And the second substrate electrode (114, 116). A bonding portion 130 is formed on the first and second substrate electrodes 114 and 116 and electrically connected to the first and second electrode pads 122 and 124 of the LED chip 120, The bonding portions 130 formed on the two substrate electrodes 114 and 116 may be spaced apart from each other. The first groove H1 formed between the first and second substrate electrodes 114 and 116 may be filled by the charging unit 140 after the LED chip 120 is mounted.

Referring to FIG. 4B, a substrate 110 for a light emitting diode package 100 according to a fourth embodiment of the present invention includes a base 112, first and second substrate electrodes 114 and 116, And includes first to fourth heat radiating portions 118a, 118b, 118c, and 118d. The fourth embodiment of the present invention will be described while omitting the same description as in the first embodiment.

The first to fourth heat radiating portions 118a, 118b, 118c and 118d are formed on the first surface 112a of the substrate 110 on the upper surface 112u of the base 112, A first substrate electrode 114 is formed and a second substrate electrode 116 is formed on the third surface 112c. In the fourth embodiment of the present invention, the first to fourth heat dissipating units 118a, 118b, 118c, and 118d are formed at the same positions as the heat dissipating unit 118 in the embodiment, And the portions 180 may be formed in four separated shapes.

A bonding portion 130 is formed on the first to fourth heat dissipating portions 118a to 118d and the first and second substrate electrodes 114 and 116 to be bonded to the light emitting diode chip 120 When the light emitting diode chip 120 is mounted on the substrate 110, an empty space may be formed between the first to fourth heat dissipating units 118a, 118b, 118c, and 118d independently of the first groove H1. have. The light emitting diode chip 120 is mounted on the substrate 110 in a state where the first to fourth heat dissipating units 118a, 118b, 118c and 118d are formed, and the first to fourth heat dissipating units 118a, 118b and 118c And 118d can be filled by the charging part 140 like the first groove H1.

As described above, in the fourth alternative embodiment of the present invention, the first to fourth heat radiation parts 118a, 118b, 118c, and 118d are formed, and the first to fourth heat radiation parts 118a, 118b, 118c, The bonding portion 130 formed on the first to fourth heat dissipating portions 118a, 118b, 118c, and 118d in the process of mounting the light emitting diode chip 120 on the substrate 110, The pores and pores that can be formed by the pores of the pores can be minimized.

Referring to FIG. 4C, a substrate 110 for a light emitting diode package 100 according to a fifth embodiment of the present invention includes a base 112, first and second substrate electrodes 114 and 116, And a heat radiating portion 118. A description of the fifth embodiment of the present invention will be omitted and the same description as in the embodiment will be omitted.

The first to third surfaces 112a, 112b and 112c are formed on the upper surface 112u of the base 112 as in the embodiment and the first to third surfaces 112a, 112b and 112c are provided with heat- First and second substrate electrodes 118 and 118, and first and second substrate electrodes 114 and 116 are formed. At this time, the heat dissipating unit 118 is formed by forming one or more second grooves H2 as shown in the figure. The second groove H2 may be formed in a planar shape of the heat dissipating unit 118 in the direction from the edge of the heat dissipating unit 118 to the center.

When the bonding portion 130 is formed on the heat dissipating portion 118 formed as described above, the bonding portion 130 may be formed along the plane shape of the heat dissipating portion 118. The light emitting diode chip 120 may be bonded to the substrate 110 on the bonding portion 130 formed in accordance with the shape of the heat dissipating portion 118.

After the light emitting diode chip 120 and the substrate 110 are adhered to each other by the bonding portion 130, the first groove H1 formed on the LED chip 120 and the substrate 110 using the charger 140, And the second grooves H2. The second groove H2 is formed in the fifth embodiment of the present invention so that the heat dissipation part 118 is formed in the process of mounting the light emitting diode chip 120 on the substrate 110, The voids and pores that can be formed by the bonding portion 130 formed on the substrate 130 can be minimized.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It should be understood that the scope of the present invention is to be understood as the scope of the following claims and their equivalents.

100: Light emitting diode package
110: substrate 112: base
114: first substrate electrode 116: second substrate electrode
118:
116a to 116d: the first to fourth heat-
120: light emitting diode chip 122: first electrode pad
124: second electrode pad 130:
140:
H1, H2: first and second grooves

Claims (23)

Board; And
And a light emitting diode chip mounted on the substrate and having first and second electrode pads spaced apart from each other,
Wherein:
A base constituting a body of the substrate; And
And first and second substrate electrodes formed on the base and spaced apart from each other to be electrically connected to the first and second electrode pads,
Further comprising a charging unit that fills the spaced apart spaces of the first and second substrate electrodes. The method according to claim 1,
Wherein the live portion fills a spaced space between the first and second electrode pads. The plasma display panel according to claim 1,
And a heat dissipation unit disposed on the base and disposed between the first and second substrate electrodes, the heat dissipation unit being in thermal contact with the light emitting diode chip. The method of claim 3,
The heat dissipating unit may be spaced apart from the first and second substrate electrodes,
Wherein the charging portion fills a spaced space between the first substrate electrode, the second substrate electrode, and the heat dissipation portion. The method of claim 3,
And a plurality of the heat dissipation units are formed on the base. The method of claim 5,
The plurality of heat dissipating units may be spaced apart from each other,
Wherein the charging part fills a spaced space of the plurality of heat dissipation parts. The method of claim 3,
Wherein the heat dissipation unit includes at least one groove. The method of claim 7,
Wherein the at least one groove is formed at an edge of the heat dissipation portion. The method of claim 8,
Wherein the at least one groove is formed in a direction toward the center of the heat radiating portion. The method of claim 7,
Wherein the live portion fills the at least one groove. The method according to claim 1,
And a bonding portion for bonding the substrate and the light emitting diode chip. The method of claim 11,
A plurality of the adhesive portions are provided,
And the plurality of bonding portions join the first and second electrode pads and the first and second substrate electrodes, respectively. The method of claim 12,
Wherein one of the plurality of bonding portions couples the bottom surface of the LED chip at a spaced position of the first and second electrode pads with the top surface of the base at a spaced apart position of the first and second substrate electrodes. The method of claim 12,
Wherein the plurality of adhesive portions are spaced apart from each other,
Wherein the live portion fills the plurality of spaced apart spaces. The method according to claim 1,
Wherein the charging portion is formed of an insulating material. A base constituting a body for mounting the light emitting diode chip;
First and second substrate electrodes formed on the base and spaced apart from each other to be electrically connected to the light emitting diode chip; And
And a filling portion that fills the spaced apart spaces of the first and second substrate electrodes. 18. The method of claim 16,
And a heat dissipation unit disposed on the base and disposed between the first and second substrate electrodes, the heat dissipation unit being in thermal contact with the light emitting diode chip. 18. The method of claim 17,
The heat dissipating unit may be spaced apart from the first and second substrate electrodes,
Wherein the filling portion fills a spaced space between the first substrate electrode, the second substrate electrode, and the heat dissipation portion. 18. The method of claim 17,
The plurality of heat dissipation units are spaced apart from each other,
Wherein the charging part fills a spaced space of the plurality of heat dissipation parts. 18. The method of claim 17,
Wherein the heat dissipation unit includes at least one groove. The method of claim 20,
Wherein the at least one groove is formed at an edge of the heat dissipation portion. 23. The method of claim 21,
Wherein the at least one groove is formed in a direction toward a center of the heat dissipation portion. The method of claim 20,
Wherein the filler fills the at least one groove.
KR1020150098265A 2015-07-10 2015-07-10 Light emitting diode package and substrate KR20170006894A (en)

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KR1020150098265A KR20170006894A (en) 2015-07-10 2015-07-10 Light emitting diode package and substrate

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KR20170006894A true KR20170006894A (en) 2017-01-18

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