KR20160150443A - Silicon wafer crushing device - Google Patents
Silicon wafer crushing device Download PDFInfo
- Publication number
- KR20160150443A KR20160150443A KR1020150088442A KR20150088442A KR20160150443A KR 20160150443 A KR20160150443 A KR 20160150443A KR 1020150088442 A KR1020150088442 A KR 1020150088442A KR 20150088442 A KR20150088442 A KR 20150088442A KR 20160150443 A KR20160150443 A KR 20160150443A
- Authority
- KR
- South Korea
- Prior art keywords
- silicon wafer
- plate
- concave
- upper plate
- lower plate
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crushing And Grinding (AREA)
Abstract
The present invention relates to a silicon wafer crusher capable of uniformly crushing a silicon wafer to fill it with a raw material during an ingot growing process.
The present invention relates to a lower plate on which a silicon wafer is mounted; An upper plate adapted to be engaged with the upper side of the lower plate; A cylinder for raising and lowering the upper plate to collide with the lower plate; And an upper / lower uneven portion provided on the contact surfaces of the upper and lower plates, respectively.
Description
The present invention relates to a silicon wafer crusher capable of uniformly crushing a silicon wafer to fill it with a raw material during an ingot growing process.
Generally, silicon wafers are made by melting polycrystalline silicon, growing them into monocrystalline ingots, cutting the ingots, and various surface polishing and deposition processes.
Silicon wafers which do not have desired characteristics due to various factors can be produced during such processes, and techniques for utilizing silicon wafers have been proposed.
Korean Patent No. 786722 discloses a method and system for recycling a silicon wafer to remove a pattern and an oxide film deposited on the surface of a silicon wafer using a sandblast method.
However, there is a problem that it is difficult to guarantee the quality or the quality of the silicon wafer because the conventional technology is a method of directly recycling the silicon wafer.
Therefore, in order to produce silicon wafers of desired characteristics, existing silicon wafers are crushed and used as a raw material in the ingot growing process. In this case, an operator directly shreds a silicon wafer using a hammer.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a conventional silicon wafer piece broken by a hammer; FIG.
When the operator directly crushes the silicon wafer using the hammer, it is crushed into a nonuniform shape of the silicon wafer piece as shown in Fig.
As described above, as the operator breaks the silicon wafer with the hammer, the working efficiency is lowered, and the crushed pieces are discarded in the form of crumbs.
In addition, when pieces of silicon wafer crushed in a nonuniform shape are introduced into a tube-shaped raw material supply device for use as a raw material during the progress of the ingot growing process, there is a problem that it is difficult to supply the raw material smoothly .
SUMMARY OF THE INVENTION It is an object of the present invention to provide a silicon wafer crusher capable of uniformly crushing a silicon wafer to be filled with a raw material during an ingot growing process.
The present invention relates to a lower plate on which a silicon wafer is mounted; An upper plate adapted to be engaged with the upper side of the lower plate; A cylinder for raising and lowering the upper plate to collide with the lower plate; And an upper / lower uneven portion provided on the contact surfaces of the upper and lower plates, respectively.
The silicon wafer crushing apparatus according to the present invention is capable of simultaneously and uniformly crushing a plurality of silicon wafers while the silicon wafer is placed on the lower plate and the upper plate and the lower plate are collided with each other so that the upper / have.
Therefore, by simultaneously crushing a plurality of silicon wafers, it is possible to increase the working efficiency and prevent the wastes from being crushed, thereby improving the productivity.
In addition, a uniform piece of silicon wafer can be smoothly supplied through the raw material supply device while the ingot growing process is in progress, so that it can be reused as a raw material in the ingot growing process.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a view of a conventional silicon wafer piece broken by a hammer;
2 is a view showing a silicon wafer crushing apparatus according to the present invention.
Fig. 3 is a view showing an upper plate and an upper uneven part applied to Fig. 2; Fig.
4 is a view showing a silicon wafer piece broken by a silicon wafer breaking apparatus according to the present invention.
Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings. It should be understood, however, that the scope of the inventive concept of the present embodiment can be determined from the matters disclosed in the present embodiment, and the spirit of the present invention possessed by the present embodiment is not limited to the embodiments in which addition, Variations.
FIG. 2 is a view showing a silicon wafer crushing apparatus according to the present invention, and FIG. 3 is a view showing an upper plate and an upper uneven part applied to FIG.
2 to 3, the silicon wafer crushing apparatus according to the present invention includes upper and
The
Of course, the
In addition, a predetermined partition (not shown) may be provided between the upper and
The
The upper and lower convex and
At this time, the upper and lower concave-
When the upper and
In the embodiment, the upper and
The
Therefore, after the
In order to prevent excessive collision between the upper and lower concave and
A process of crushing a silicon wafer by the above-configured silicon wafer crusher will be described below.
The
At this time, the upper / lower convex and
Therefore, it is possible to increase work efficiency and productivity by automating the operation of crushing the silicon wafer.
4 is a view showing a piece of silicon wafer broken by a silicon wafer crusher according to the present invention.
When the silicon wafer is crushed using the silicon wafer crushing apparatus of the present invention, it is crushed into a uniformly shaped silicon wafer crust as shown in FIG. 4, and compared with the pieces of the silicon wafer crushed by the hammer by an existing worker, The volume appears to be much smaller.
As described above, the pieces of silicon wafer which are crushed in a uniform size are collected and supplied smoothly as a raw material during the ingot growing process, whereby the silicon wafer of desired characteristics and quality can be reproduced.
110: lower plate 120: upper plate
130: cylinder 140: lower concave-
150: upper concave / convex portion 160: guide
Claims (5)
An upper plate adapted to be engaged with the upper side of the lower plate;
A cylinder for raising and lowering the upper plate to collide with the lower plate; And
And an upper / lower uneven portion provided on the abutting surfaces of the upper and lower plates.
Wherein the upper and lower concave-convex portions are formed so as to have a sharp edge toward the end of each of the concavities and convexities.
Wherein the upper / lower convexo-concave portions are arranged so that the irregularities of the upper and lower convexo-concaves are shifted from each other in the vertical direction.
And the upper / lower convexo-concave portion is formed with a concavo-convex interval of 4 cm or less.
And a plurality of guides guiding the upward / downward movement of the upper plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150088442A KR20160150443A (en) | 2015-06-22 | 2015-06-22 | Silicon wafer crushing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150088442A KR20160150443A (en) | 2015-06-22 | 2015-06-22 | Silicon wafer crushing device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160150443A true KR20160150443A (en) | 2016-12-30 |
Family
ID=57737209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150088442A KR20160150443A (en) | 2015-06-22 | 2015-06-22 | Silicon wafer crushing device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20160150443A (en) |
-
2015
- 2015-06-22 KR KR1020150088442A patent/KR20160150443A/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2785598A1 (en) | Modelling plate for a stereolithography machine, stereolithography machine using said modelling plate and tool for cleaning said modelling plate | |
US20080263996A1 (en) | Process and apparatus for artificially ageing blocks | |
CN206068860U (en) | A kind of propelling movement type automatic blanking mechanism | |
CN207578484U (en) | A kind of ganoderma lucidum slicer | |
CN1304179C (en) | A method and related apparatus for cutting a product from a sheet material | |
KR101343970B1 (en) | System for cutting quartz crucible | |
KR20160150443A (en) | Silicon wafer crushing device | |
CN213613881U (en) | Vertical ring rolling mill capable of automatically feeding and discharging | |
CN102264515B (en) | Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method | |
CN110962243A (en) | Pretreatment method for artificial marble curtain wall veneer construction | |
CN206416344U (en) | Erecting device for multi-line cutting machine crystal holder | |
KR101376339B1 (en) | Manufacturing apparatus and method of worm shaft plug and worm shaft plug for steering apparatus by manufactured the same | |
US20060073775A1 (en) | Process for artificially ageing blocks | |
KR20140043104A (en) | Multi-lined bushhammering machine and bushhammering method using by the machine, and stone panel made by the method | |
CN104588457A (en) | Bending machine upper die assembly convenient to detach | |
CN209394941U (en) | Frame horizontal cutting machine | |
CN204194536U (en) | A kind of edger scrap cutter | |
KR20120020559A (en) | Fineblanking apparatus capable of omitting deburring process | |
CN204221167U (en) | A kind ofly cut anti-slag bath and comprise the cutting machine of this anti-slag bath | |
CN210357300U (en) | A breaker for broken silicon rim charge | |
KR20080082317A (en) | Apparatus for cutting stone | |
CN105798421A (en) | Automatic removing device for cutting residues of flame cutting machine | |
JP5246224B2 (en) | Casting line and sand removal method | |
CN109435030A (en) | Frame horizontal cutting machine | |
CN205816432U (en) | High pressure water dephosphorizing machine |