KR20160084566A - Paper Cup with Keeping Warm and Heat - Google Patents
Paper Cup with Keeping Warm and Heat Download PDFInfo
- Publication number
- KR20160084566A KR20160084566A KR1020150000849A KR20150000849A KR20160084566A KR 20160084566 A KR20160084566 A KR 20160084566A KR 1020150000849 A KR1020150000849 A KR 1020150000849A KR 20150000849 A KR20150000849 A KR 20150000849A KR 20160084566 A KR20160084566 A KR 20160084566A
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- South Korea
- Prior art keywords
- paper cup
- main coating
- heat
- coating material
- cup
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- 239000000463 material Substances 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000003094 microcapsule Substances 0.000 claims abstract description 15
- 239000002775 capsule Substances 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 3
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/14—Linings or internal coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/34—Coverings or external coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Packages (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
Description
본 발명은 보온축열기능이 있는 종이컵에 관한 것이다.The present invention relates to a paper cup having a thermal storage function.
뜨거운 라면이나 커피 같은 식품의 용기로 흔히 종이컵이 사용된다. 하지만, 종이컵 내부에 수용된 물질은 쉽게 식어버리는 문제가 있었다. 이러한 문제를 해결하기 위하여 종이컵 내외부에 공기층을 추가하거나, 발포재로 성형하는 등 보온시간을 길게 하려는 노력이 있어 왔다.Paper cups are often used as containers for foods such as hot ramen or coffee. However, there is a problem that the material contained in the paper cup is easily cooled. In order to solve such a problem, efforts have been made to increase the warm-up time by adding an air layer to the inside and outside of the paper cup or molding it with a foam material.
하지만, 이로 인해 종이컵의 부피가 커지거나 제조공정이 복잡해지는데 반해 탁월한 보온효과를 가지지는 못하였다.However, this results in an increase in the volume of the paper cup or a complicated manufacturing process.
따라서, 본 발명의 목적은 보온축열기능을 가지는 종이컵을 제공하고자 하는 것이다.Accordingly, it is an object of the present invention to provide a paper cup having a thermal storage and heating function.
상기한 목적은, 종이컵에 있어서, 컵본체와, 상기 컵본체의 내면과 외면 중 적어도 어느 한 쪽에 코팅되며, 합성수지로 된 주코팅재료와 상기 주코팅재료 내에 분산된 다수의 마이크로캡슐을 포함하고, 상기 마이크로캡슐은 상기 주코팅재료보다 용융온도가 높은 재료로 된 캡슐외피와 녹는점이 40 내지 80의 범위에 있는 충전물질로 이루어진 것에 의해 달성된다.The above object is achieved by a paper cup comprising a cup body and a plurality of microcapsules coated on at least one of an inner surface and an outer surface of the cup body and dispersed in the main coating material, The microcapsule is formed of a capsule shell made of a material having a higher melting temperature than the main coating material and a filling material having a melting point in the range of 40 to 80. [
여기서, 충전물질은 Na(CH3COO)·H2O와 Na2S2O3·5H2O 중 하나로 이루어진 것이 바람직하다.Here, the filling material is preferably composed of one of Na (CH3COO) H2O and Na2S2O3 5H2O.
상술한 본 발명의 구성에 따르는 종이컵은 보온축열기능을 가지는 효과가 있게 된다.The paper cup according to the above-described constitution of the present invention has an effect of having a thermal storage and heating function.
도 1은 본 발명에 따른 종이컵의 단면도이며,
도 2는 부분확대도이다.1 is a sectional view of a paper cup according to the present invention,
2 is a partially enlarged view.
이하 도면을 참고하여 본 발명에 따른 보온축열기능이 있는 종이컵을 상세히 설명한다.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a paper cup having a thermal storage function according to the present invention will be described in detail with reference to the drawings.
본 발명에 따른 종이컵은 도 1의 단면도와 도 2의 부분확대도에서 볼 수 있는 바와 같이, 용기형상의 컵본체(1)와 컵본체(1)의 내면 또는 외면에 코팅된 코팅층(3)을 갖는다. 종이컵의 코팅층(3)은 주코팅재료(4)와 주코팅재료(4)에 분산된 마이크로캡슐(5)로 이루어져 있다.
As shown in the cross-sectional view of FIG. 1 and the partially enlarged view of FIG. 2, the paper cup according to the present invention has a
주코팅재료(4)로는 보통 합성수지를 사용하고, 대표적으로 사용되는 합성수지는 PE(폴리에틸렌)이다. 이외에도 옥수수에서 추출한 식물성원료로 이루어진 코팅제 PLA를 사용할 수 있다.
As the main coating material (4), synthetic resin is usually used, and representative synthetic resin is PE (polyethylene). In addition, it is possible to use a coating agent PLA composed of a vegetable raw material extracted from corn.
마이크로캡슐(5)은 캡슐외피와 내부의 충전물질로 구성되어 있다. 내부의 충전물질은 상변화물질로 이루어져 있다. 상변화물질은 외부 온도에 따라서 상변화를 통해 흡열과 발열반응을 반복적으로 하는 물질로 상변화시 잠열을 이용하여, 온열을 저장하거나 냉열을 저장할 수 있다. 이러한 축열기능을 효율적으로 활용하면서 취급이 용이한 형태로 만들기 위하여 캡슐외피를 이용하여 캡슐화한다. 또한 코팅공정시 캡슐외피는 녹지 않아야 내부의 충전물질의 외부와의 분리상태를 유지하게 할 수 있다.
The microcapsule 5 is composed of a capsule shell and a filling material inside. The internal filling material consists of a phase change material. The phase change material is a substance that repeatedly generates endothermic reaction and exothermic reaction through phase change according to the external temperature, and can store heat or store cold heat by using latent heat during phase change. Encapsulation is carried out using a capsular shell to make it easy to handle while efficiently utilizing this heat storage function. In addition, when the capsule shell is not melted during the coating process, the inside of the filling material can be kept separated from the outside.
주코팅재료(4)가 폴리에틸렌이나 아크릴 수지 등의 열가소성 수지로 구성될 때에는 캡슐외피를 이루는 물질은 주코팅재료(4)의 녹는점보다 높은 온도를 가지는 물질로 이루어져야 한다. 또한, 주코팅재료(4)가 멜라민 수지 드의 열경화성 수지로 구성될 때에는 캡슐외피를 이루는 물질은 주코팅재료(4)의 경화온도보다 높은 온도를 가지는 물질로 이루어져야 한다.
When the main coating material 4 is made of a thermoplastic resin such as polyethylene or acrylic resin, the material forming the capsule shell should be made of a material having a temperature higher than the melting point of the main coating material 4. [ When the main coating material 4 is composed of a thermosetting resin of a melamine resin deck, the material constituting the capsule shell should be made of a material having a temperature higher than the curing temperature of the main coating material 4.
마이크로캡슐(5) 내의 충전물질은 캡슐외피에 의해 외부와 공간상으로 분리되어 있지만 외부의 열은 충전물질로 전달할 수 있게 된다. 종이컵에 수용되는 물질의 온도를 보통 100도 이하라고 볼 때 내부 충전물질의 상변화온도는 40도 내지 80도의 범위에 있는 것이 바람직하다. 이러한 상변화온도를 가지는 물질은 Na(CH3COO)·H2O, Na2S2O3·5H2O가 있다.
The filling material in the microcapsule 5 is separated from the outside and the space by the capsule shell, but external heat can be transferred to the filling material. When the temperature of the material accommodated in the paper cup is not more than 100 degrees, it is preferable that the phase change temperature of the internal filling material is in the range of 40 to 80 degrees. Materials with such phase change temperatures are Na (CH3COO) H2O, Na2S2O3. 5H2O.
마이크로캡슐(5)의 사이즈는 종이컵내 코팅하는 두께보다 작아야 하며, 종이컵의 코팅두께는 보통 14~30μm이다. 따라서, 마이크로캡슐(5)은 이보다 작은 사이즈인 14μm이하 인 것이 바람직하다.
The size of the microcapsules 5 should be smaller than the thickness of the coating in the paper cup, and the coating thickness of the paper cup is usually 14 to 30 μm. Therefore, it is preferable that the size of the microcapsules 5 is 14 mu m or less which is smaller than this.
이러한 구성에 의해 마이크로캡슐(5)이 코팅된 종이컵은 종이컵 내부에 수용된 물질의 열에너지에 의해 마이크로캡슐(5) 내부의 충전물질이 상변화를 일으키면서 열을 흡수 혹은 열을 방출하게 된다. 따라서 온도가 높은 물질을 종이컵에 수용한 후 일정 시간이 지나면, 마이크로캡슐(5)의 내부에 충전된 충전물질은 액체상태가 되면서 내부에 열에너지를 저장하게 된다. 반대로 종이컵 내부에 수용된 물질이 외부로부터 열에너지를 빼앗기면서 충전물질의 용융온도 이하가 되면 충전물질은 고체화되면서 열에너지를 방출하게 된다. 이러한 충전물질의 상변화과정을 통해 종이컵 내부에 수용된 음료의 온도는 탁월한 보온축열효과를 가질 수 있다.
According to such a configuration, the paper cup coated with the microcapsules 5 absorbs heat or releases heat while the filling material inside the microcapsules 5 undergoes a phase change due to thermal energy of the material contained in the paper cup. Therefore, after a certain period of time after the material having a high temperature is received in the paper cup, the filling material filled in the microcapsule 5 becomes a liquid state and stores heat energy therein. On the contrary, when the material contained in the paper cup is deprived of heat energy from the outside and the temperature of the filling material becomes lower than the melting temperature of the filling material, the filling material solidifies and emits heat energy. Through the phase change process of the filling material, the temperature of the beverage contained in the paper cup can have an excellent thermal storage effect.
1 : 컵본체
2 : 종이원단
3 : 내부코팅층
4 : 주코팅재료
5 : 마이크로캡슐1: cup body
2: Paper Fabric
3: Inner coating layer
4: Main coating material
5: Microcapsule
Claims (2)
컵본체와,
상기 컵본체의 내면과 외면 중 적어도 어느 한 쪽에 코팅되며, 합성수지로 된 주코팅재료와 상기 주코팅재료 내에 분산된 다수의 마이크로캡슐을 포함하고,
상기 마이크로캡슐은 상기 주코팅재료보다 용융온도가 높은 재료로 된 캡슐외피와 녹는점이 40 내지 80의 범위에 있는 충전물질로 이루어진 것을 특징으로 하는 종이컵.
In the paper cup,
A cup body,
And a plurality of microcapsules coated on at least one of an inner surface and an outer surface of the cup body and dispersed in the main coating material,
Wherein the microcapsule comprises a capsule shell made of a material having a melting temperature higher than that of the main coating material and a filling material having a melting point in the range of 40 to 80.
상기 충전물질은 Na(CH3COO)·H2O와 Na2S2O3·5H2O 중 하나로 이루어진 것을 특징으로 하는 종이컵.
The method according to claim 1,
Wherein the filling material comprises one of Na (CH3COO) H2O and Na2S2O3. 5H2O.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150000849A KR20160084566A (en) | 2015-01-05 | 2015-01-05 | Paper Cup with Keeping Warm and Heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150000849A KR20160084566A (en) | 2015-01-05 | 2015-01-05 | Paper Cup with Keeping Warm and Heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160084566A true KR20160084566A (en) | 2016-07-14 |
Family
ID=56499093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150000849A KR20160084566A (en) | 2015-01-05 | 2015-01-05 | Paper Cup with Keeping Warm and Heat |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20160084566A (en) |
-
2015
- 2015-01-05 KR KR1020150000849A patent/KR20160084566A/en not_active Application Discontinuation
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| E902 | Notification of reason for refusal | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |