KR20160067616A - Crystal oscillator package - Google Patents
Crystal oscillator package Download PDFInfo
- Publication number
- KR20160067616A KR20160067616A KR1020140173228A KR20140173228A KR20160067616A KR 20160067616 A KR20160067616 A KR 20160067616A KR 1020140173228 A KR1020140173228 A KR 1020140173228A KR 20140173228 A KR20140173228 A KR 20140173228A KR 20160067616 A KR20160067616 A KR 20160067616A
- Authority
- KR
- South Korea
- Prior art keywords
- quartz
- electrode
- piece
- reinforcing pattern
- quartz crystal
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 73
- 239000010453 quartz Substances 0.000 claims abstract description 71
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000005284 excitation Effects 0.000 claims description 47
- 230000003014 reinforcing effect Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 12
- 230000004048 modification Effects 0.000 claims description 10
- 238000012986 modification Methods 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 210000002445 nipple Anatomy 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
A quartz crystal resonator package according to an embodiment of the present invention includes a base substrate having first and second electrode pads formed on an upper surface thereof, A quartz piece fixed on one side of the two-electrode pad and having exciting electrodes electrically connected to the first and second electrode pads respectively formed on upper and lower surfaces thereof and being vibrated by an electrical signal; And may include one reinforcement pattern.
Description
The present invention relates to a quartz crystal package capable of lowering the equivalent series resistance.
The crystal oscillator is used for various purposes such as a frequency oscillator, a frequency adjuster, and a frequency converter. The quartz oscillator uses a crystal with excellent piezoelectric properties as a piezoelectric material, where the quartz serves as a stable mechanical vibration generator.
The crystal is artificially grown in a high-pressure autoclave, cut in a crystal axis, and then processed into a wafer shape by processing the size and shape so as to have desired characteristics.
Equivalent Series Resistance (ESR) is an index that determines the performance of a crystal oscillator. The lower the ESR value, the faster the response and the higher energy efficiency of the crystal oscillator.
The mesa-type oscillator having a flat thick central portion and a peripheral portion thereof is advantageous in that the ESR is low, but the manufacturing is difficult and the risk of breakage is high.
It is an object of the present invention to provide a crystal oscillator package that can minimize the equivalent series resistance.
A quartz crystal resonator package according to an embodiment of the present invention includes: a base substrate having first and second electrode pads formed on an upper surface thereof, one side fixed to the first and second electrode pads, A quartz crystal having electrically connected excitation electrodes formed on the upper and lower surfaces thereof and vibrated by an electrical signal, and at least one reinforcement pattern formed on the corners of the quartz crystal piece.
The quartz oscillator package according to the present embodiment can remarkably lower the equivalent series resistance (ESR) generated in the quartz crystal through the reinforcing pattern formed on the quartz crystal. It is also possible to reinforce the stiffness of the faucet part of the crystal piece.
1 is a side sectional view of a quartz crystal according to an embodiment of the present invention;
2 is a cross-sectional view taken along line AA in Fig.
3 is a cross-sectional view taken along line BB in Fig.
FIG. 4 is a graph showing changes in ESR of a quartz piece without a reinforcing pattern and a reinforcing piece according to an embodiment of the present invention. FIG.
5 is a schematic view of a quartz crystal resonator package according to another embodiment of the present invention;
Figures 6 and 7 schematically illustrate another embodiment of the present invention.
It is noted that the technical terms used herein are used only to describe specific embodiments and are not intended to limit the invention. It is also to be understood that the technical terms used herein are to be interpreted in a sense generally understood by a person skilled in the art to which the present invention belongs, Should not be construed to mean, or be interpreted in an excessively reduced sense.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. In addition, the shape and size of elements in the figures may be exaggerated for clarity.
1 is a side cross-sectional view of a quartz crystal resonator package according to an embodiment of the present invention, which is a cross section cut in a longitudinal direction of a quartz crystal vibrator, and Fig. 2 is a plan view taken along line A-A in Fig. 1 shows a cross section taken along line C-C in Fig.
3 is a cross-sectional view taken along line BB of Fig.
1 to 3, a quartz
The
First and
A plurality of
The electrical connection between the first and
The first and
The first and
The
The
The
The
The
As a quartz oscillator having a thickness-slip vibration mode as the main vibration, the AT cut quartz crystal is most widely used because of a small change in frequency with respect to a temperature change near room temperature. However, the present invention is not limited thereto.
The excitation electrodes (22a, 22b) are arranged at the center portions of both sides of the crystal piece (21). The
The
Generally, vibrations generated in the quartz crystal are generated in a circular or oval shape from the center where the
In the case where the excitation electrodes of the
The
Each of the
At least one of the
The
The
The
The
The quartz oscillator is greatly influenced by the operation efficiency and quality due to external environmental changes and contamination. Therefore, in order to protect the
To this end, the inside of the
In addition, the quartz piece 31 according to the present embodiment may have at least one reinforcing
The reinforcing
The reinforcing
Further, the reinforcing
Each of the reinforcing
Also, the reinforcing
The
That is, the
The
The
This reinforcing
In the quartz
FIG. 4 is a graph illustrating changes in ESR of a quartz crystal piece without a reinforcing pattern and a reinforcing pattern according to an embodiment of the present invention. FIG. Here, the abscissa represents the change in the aspect ratio of the excitation electrode.
Referring to FIG. 4, it can be seen that the ESR of the quartz crystal according to the present embodiment is lower than that of the quartz crystal having no reinforcement pattern.
Also, it can be seen that as the aspect ratio of the excitation electrode increases, the ESR value of the quartz piece having no reinforcing pattern is not lowered below a critical value (for example, 1.01), but the quartz crystal according to the present embodiment is continuously lowered.
Therefore, when the quartz crystal according to this embodiment is used, it can be seen that the ESR can be remarkably lowered as compared with the case of using a conventional quartz crystal having no reinforcing pattern.
The present invention is not limited to the above-described embodiments, and various modifications are possible.
FIG. 5 is a schematic view of a quartz crystal resonator package according to another embodiment of the present invention, and shows a cross section corresponding to FIG. 2.
5, the quartz
Therefore, the reinforcing
At this time, the sides of the
On the other hand, it is also possible to combine the configuration of this embodiment and the configuration of the above-described embodiment. For example, the reinforcing
6 and 7 are diagrams schematically showing still another embodiment of the present invention. 6 and 7, in the quartz
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. And will be apparent to those skilled in the art.
For example, in the above-described embodiment, the piezoelectric device is described as an example of a crystal piece and a package having the crystal piece. The present invention is not limited thereto, and the oscillation circuit element for oscillating the crystal oscillator may be applied to a crystal oscillator provided in the package.
100 to 400: crystal oscillator package
21: Correction
22a, 22b: Excited electrode
22c and 22d: connection electrodes
22f: dummy electrode
22g: connecting electrode
23: Conductive adhesive
24a, 24b: first and second electrode pads
26a: Base substrate
26b:
27: Lead
50: reinforcement pattern
Claims (17)
A quartz piece fixed on one side of the first and second electrode pads and having exciting electrodes electrically connected to the first and second electrode pads formed on upper and lower surfaces thereof and being vibrated by an electrical signal; And
At least one reinforcing pattern formed at a nip portion of the crystal piece;
.
Wherein the quartz crystal package is formed in a triangular shape at the quartz portion of the rectangle.
And is formed on both sides of the quartz crystal piece.
And electrically connected to the excitation electrode.
And electrically connecting the excitation electrode and the first electrode pad.
And the sides facing the excitation electrode are formed in a straight line.
And a nip portion facing the reinforcing pattern is formed as a straight side.
And the side opposite to the excitation electrode is formed into a concave arc inward of the reinforcing pattern.
And a side opposite to the reinforcing pattern is formed into a convex arc shape toward the reinforcing pattern side.
Wherein the curvature of the arc formed at the nip portion of the excitation electrode and the curvature of the arc formed at the reinforcing pattern are formed with the same curvature.
A quartz oscillator package formed as a whole with the same thickness.
A plurality of excitation electrodes formed at the center of the modification piece;
A plurality of connection electrodes formed on one side of the quartz crystal; And
At least one dummy electrode formed on the other side of the modification member;
.
Wherein the long side is formed in a triangular shape facing the excitation electrode.
A plurality of excitation electrodes formed at the center of the modification piece; And
At least one reinforcing pattern disposed outside the remaining electrode along the periphery of the modification piece;
.
And a quartz portion of the quartz crystal piece, respectively.
And electrically connected to the excitation electrode.
And is formed to have the same thickness as the excitation electrode.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140173228A KR102029502B1 (en) | 2014-12-04 | 2014-12-04 | Crystal oscillator package |
US14/937,134 US9973168B2 (en) | 2014-12-04 | 2015-11-10 | Crystal vibrator package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140173228A KR102029502B1 (en) | 2014-12-04 | 2014-12-04 | Crystal oscillator package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160067616A true KR20160067616A (en) | 2016-06-14 |
KR102029502B1 KR102029502B1 (en) | 2019-10-07 |
Family
ID=56095099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140173228A KR102029502B1 (en) | 2014-12-04 | 2014-12-04 | Crystal oscillator package |
Country Status (2)
Country | Link |
---|---|
US (1) | US9973168B2 (en) |
KR (1) | KR102029502B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6863328B2 (en) * | 2018-04-04 | 2021-04-21 | Tdk株式会社 | Piezoelectric elements and vibration devices |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09167919A (en) * | 1995-12-14 | 1997-06-24 | Mitsumi Electric Co Ltd | Surface mounted crystal oscillator |
KR20090094981A (en) | 2008-03-04 | 2009-09-09 | 삼성전기주식회사 | Package of crystal oscillator |
JP2011061418A (en) * | 2009-09-09 | 2011-03-24 | Nippon Dempa Kogyo Co Ltd | Crystal vibration chip and crystal vibration device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007104042A (en) | 2005-09-30 | 2007-04-19 | Kyocera Kinseki Corp | Crystal resonation element and manufacturing method thereof |
JP5296113B2 (en) * | 2010-02-25 | 2013-09-25 | 日本電波工業株式会社 | Method for manufacturing piezoelectric vibrating piece, piezoelectric vibrating piece and piezoelectric device |
JP2013165404A (en) * | 2012-02-10 | 2013-08-22 | Seiko Instruments Inc | Vibration device and oscillator |
JP2013258519A (en) * | 2012-06-12 | 2013-12-26 | Nippon Dempa Kogyo Co Ltd | Piezoelectric vibration piece and piezoelectric device |
JP6133697B2 (en) * | 2013-06-12 | 2017-05-24 | 日本電波工業株式会社 | Piezoelectric vibrating piece, piezoelectric device, and method of manufacturing piezoelectric device |
US20150188025A1 (en) * | 2013-12-30 | 2015-07-02 | Nihon Dempa Kogyo Co., Ltd. | Container for electronic component and electronic component |
-
2014
- 2014-12-04 KR KR1020140173228A patent/KR102029502B1/en active IP Right Grant
-
2015
- 2015-11-10 US US14/937,134 patent/US9973168B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09167919A (en) * | 1995-12-14 | 1997-06-24 | Mitsumi Electric Co Ltd | Surface mounted crystal oscillator |
KR20090094981A (en) | 2008-03-04 | 2009-09-09 | 삼성전기주식회사 | Package of crystal oscillator |
JP2011061418A (en) * | 2009-09-09 | 2011-03-24 | Nippon Dempa Kogyo Co Ltd | Crystal vibration chip and crystal vibration device |
Also Published As
Publication number | Publication date |
---|---|
US9973168B2 (en) | 2018-05-15 |
US20160163956A1 (en) | 2016-06-09 |
KR102029502B1 (en) | 2019-10-07 |
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