KR20160011436A - Conductible layer clad flim, manufacturing method thereof and manufacturing method for file type antenna using the same - Google Patents

Conductible layer clad flim, manufacturing method thereof and manufacturing method for file type antenna using the same Download PDF

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Publication number
KR20160011436A
KR20160011436A KR1020140092508A KR20140092508A KR20160011436A KR 20160011436 A KR20160011436 A KR 20160011436A KR 1020140092508 A KR1020140092508 A KR 1020140092508A KR 20140092508 A KR20140092508 A KR 20140092508A KR 20160011436 A KR20160011436 A KR 20160011436A
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KR
South Korea
Prior art keywords
film
conductive thin
thin film
base film
manufacturing
Prior art date
Application number
KR1020140092508A
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Korean (ko)
Inventor
원찬희
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원찬희
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Application filed by 원찬희 filed Critical 원찬희
Priority to KR1020140092508A priority Critical patent/KR20160011436A/en
Publication of KR20160011436A publication Critical patent/KR20160011436A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive

Abstract

The present invention relates to a conductive thin laminate film, a manufacturing method thereof, and a method for manufacturing a film-type antenna and, more specifically, to a conductive thin laminate film using a polyethylene terephthalate (PET) film as a base film, while having the same performance as an existing PI film, to a manufacturing method thereof, and to a method for manufacturing a film-type antenna. According to an embodiment of the present invention, provided is a conductive thin laminate film. The conductive thin laminate film comprises a base film made of a heat-resistant PET material; and a conductive thin film attached on at least one surface of the base film, wherein the conductive thin film is attached on the base film by a heat-resistant adhesive including a certain size of inorganic particles.

Description

TECHNICAL FIELD [0001] The present invention relates to a conductive thin film laminated film, a method of manufacturing the same, and a method of manufacturing a film antenna using the conductive thin film laminated film. [0002]

The present invention relates to a conductive thin film laminated film, a method of manufacturing the same, and a method of manufacturing a film antenna using the same. More particularly, the present invention relates to a conductive thin film laminate Film, a method of manufacturing the same, and a method of manufacturing a film antenna using the same.

2. Description of the Related Art [0002] In recent years, electronic devices have become complicated and a large portion of wiring is being implemented using a printed circuit board. This not only saves workforce due to product size, weight, assembly, but also provides higher reliability than wires.

In addition, with the recent miniaturization of electronic devices, existing printed circuit boards have been replaced with flexible printed circuit boards. Since flexible printed circuit boards have excellent flexibility and flexibility, they can be applied to various kinds of apparatuses regardless of the shape of the apparatus, and thus they are widely used not only in electronic apparatuses but also in general industrial machines.

Such a flexible printed circuit board can be manufactured by processing a flexible film having a conductive thin film laminated thereon to form a circuit pattern such as an antenna pattern. As a typical example of the conductive thin film laminated film, a flexible copper clad laminate (FCCL) having a copper foil as a conductive thin film can be cited.

1 shows a conventional conductive thin film laminated film. As shown in FIG. 1, a conventional conductive thin film laminated film is formed by using a PI (polyimide) film as a base film, The conductive thin film may be manufactured by laminating the conductive thin film at a high temperature. Since the PI film is advantageous in heat resistance as compared with the PET film and has a merit in that the conductive thin film laminated film does not cause thermal deformation due to high temperature during the manufacturing process or the subsequent processing process even if the thickness is reduced, In the case of most conductive thin film laminated films used in the past, PI films have been applied as base films.

Particularly, in the case of a film-type antenna, most film-type antennas are required to have a thickness of 25 nm (μm) except for a part of a radio frequency identification (RFID) antenna or the like, And the following PI film is used as a base film.

However, since such a PI film is expensive as compared with a PET film, the manufacturing cost of the conductive thin film laminated film inevitably increases.

The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a conductive thin film laminated film having the same performance as a conventional product using a PET film as a base film, a method of manufacturing the same, and a method of manufacturing a film- The purpose is to provide.

In order to achieve the above object, according to an embodiment of the present invention, there is provided a conductive thin film laminated film. The conductive thin film laminated film includes a base film made of a heat-resistant PET (polyethylene terephthalate) material; And a conductive thin film attached to at least one side of the base film, wherein the conductive thin film is attached to the base film by a heat resistant adhesive containing inorganic particles of a predetermined size.

Preferably, the inorganic particles may be talc particles.

Also preferably, the base film may have a thickness in the range of 9 to 25 nanometers ([mu] m).

According to an embodiment of the present invention, a method of manufacturing a conductive thin film laminated film is provided. The manufacturing method includes the steps of: providing a base film made of heat-resistant PET (polyethylene terephthalate) material;

Applying a heat-resistant adhesive containing inorganic particles of a predetermined size to at least one surface of the base film to form an adhesive layer; Attaching the conductive thin film to at least one surface of the base film on which the adhesive layer is formed by a laminating method; And drying the base film to which the conductive thin film is adhered so that the adhesive layer is cured.

Preferably, the inorganic particles may be talc particles.

Also preferably, the base film may have a thickness in the range of 9 to 25 nanometers ([mu] m).

Also, preferably, the step of drying the base film to which the conductive thin film is adhered may be performed at a temperature of 60 to 120 ° C for 48 to 120 hours.

According to an embodiment of the present invention, a method of manufacturing a film-type antenna is provided. The manufacturing method includes: providing the conductive thin film laminated film; Forming an antenna pattern layer of a predetermined shape on the conductive thin film of the conductive thin film laminated film; Bonding a coverlay on the antenna pattern layer; And forming a connection terminal connected to the antenna pattern layer.

According to the present invention, heat resistance of a base film is effectively prevented by applying a heat-resistant PET base material and a heat-resistant adhesive containing inorganic particles, thereby reducing the burden on the price, The conductive thin film laminated film having the same performance as that of the conductive thin film laminated film of the present invention can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS A brief description of each drawing is provided to more fully understand the drawings recited in the description of the invention.
1 shows a conventional conductive thin film laminated film.
2 is a vertical cross-sectional view showing a schematic configuration of a conductive thin film laminated film according to an embodiment of the present invention.
FIG. 3 illustrates a method of manufacturing a conductive thin film laminated film according to an embodiment of the present invention.
4 is a vertical sectional view showing a schematic configuration of a film type antenna using a conductive thin film laminated film according to an embodiment of the present invention.
5 illustrates a method of manufacturing a film antenna using a conductive thin film laminated film according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, embodiments of the present invention will be described below, but the technical idea of the present invention is not limited thereto and can be variously modified by those skilled in the art.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

2 is a vertical cross-sectional view showing a schematic configuration of a conductive thin film laminated film according to an embodiment of the present invention.

2, a conductive thin film laminated film 100 according to an embodiment of the present invention includes a base film 110, adhesive layers 120-1 and 120-2, and conductive thin films 130-1 and 130-2. ≪ / RTI >

The base film 110 is a substrate to which the conductive thin films 130-1 and 130-2 are attached, and may be made of a heat-resistant PET (polyethylene terephthalate) material. Here, the heat-resistant PET material is a product in which heat resistance such as a melting point and a heat distortion temperature is improved by adding other materials such as glass fiber to an existing PET material, and a variety of materials known in the art Heat-resistant PET material may be applied. The base film 110 may preferably be implemented to have a thickness in the range of 9 to 25 nanometers ([mu] m).

The adhesive layers 120-1 and 120-2 may be formed by applying a heat resistant adhesive to at least one surface of the base film 110. [ The conductive thin films 130-1 and 130-2 can be attached on the base film 110 through the adhesive layers 120-1 and 120-2. At this time, a polyurethane-based adhesive may be preferably applied to the heat-resistant adhesive, and heat-resistant adhesives of various materials applicable in the related art may be applied.

Meanwhile, inorganic particles 122 having a predetermined size may be included in the adhesive layers 120-1 and 120-2. The inorganic particles 122 may be composed of, for example, powdered talc, asbestos, mica, silica, asbestos, glass, or the like, or a combination thereof, and preferably has a particle size of 0.5 to 5 nanometers Lt; / RTI > As described above with reference to FIG. 3, since the inorganic particles 122 hardly swell or shrink due to heat, the adhesion process of the conductive thin films 130-1 and 130-2 or the adhesion layers 120-1, It is possible to minimize the occurrence of thermal deformation such as bending or wrinkling of the base film 110 and / or the conductive thin films 130-1 and 130-2 during the drying process of the conductive films 120-1 and 120-2.

The conductive thin films 130-1 and 130-2 may be attached to at least one surface of the base film 110 on which the adhesive layers 120-1 and 120-2 are formed. The conductive thin films 130-1 and 130-2 may be implemented using a thin film made of various conductive materials available in the art, such as an aluminum thin film, a copper thin film and the like, May be configured to have a thickness in the order of meters (μm). These conductive thin films 130-1 and 130-2 can be subsequently processed into a circuit pattern such as an antenna pattern through an additional process such as etching. A specific method of attaching the conductive thin films 130-1 and 130-2 will be described in detail with reference to FIG.

2, the conductive thin films 130-1 and 130-2 are shown as being attached to both sides of the base film 110. However, the conductive thin films 130-1 and 130-2 may be formed on the base film 110 in accordance with an embodiment of the present invention. The conductive thin film laminated film 100 may be implemented in such a manner that the conductive thin films 130-1 and 130-2 are attached to only one side of the base film 110. [

FIG. 3 illustrates a method of manufacturing a conductive thin film laminated film according to an embodiment of the present invention.

Referring to FIG. 3, a method 300 of fabricating a conductive thin film laminated film 100 according to an embodiment of the present invention includes the steps of providing a base film 110 (step S310), bonding layers 120-1 and 120 (S330) of attaching the conductive thin films 130-1 and 130-2 to the base film 110 and forming the adhesive layers 120-1 and 120-2 to be cured (S340).

First, in step S310, a base film 110 may be provided. Here, the base film 110 may be made of a heat-resistant PET material as described above.

Subsequently, in step S320, the adhesive layers 120-1 and 120-2 can be formed by coating a heat-resistant adhesive on at least one surface of the base film 110. [ Inside the adhesive layers 120-1 and 120-2 are formed inorganic particles such as talc particles, asbestos particles, and mica particles for minimizing the expansion and contraction of the adhesive layers 120-1 and 120-2 due to heat Particles 122 may be included. On the other hand, after the heat-resistant adhesive is applied, the adhesive layers 120-1 and 120-2 can be semi-cured at a predetermined temperature and time through a dryer or the like so that the heat-resistant adhesive does not flow down.

In step S330, the conductive thin films 130-1 and 130-2 may be attached to at least one side of the base film 110 on which the adhesive layers 120-1 and 120-2 are formed. The adhesion of the conductive thin films 130-1 and 130-2 can be performed by a high temperature and high pressure laminating method. Specifically, the conductive thin films 130-1 and 130-2 are positioned so as to overlap at least one surface of the base film 110 on which the adhesive layers 120-1 and 120-2 are formed, respectively, The conductive thin films 130-1 and 130-2 can be attached to the base film 110 by compressing the conductive thin films 130-1 and 130-2 at a predetermined temperature and pressure. At this time, the adhesion of the conductive thin films 130-1 and 130-2 can be preferably performed at a temperature of 200 to 250 ° C and a compression pressure of 5 to 30 kgf / cm 2.

In step S340, the base film 110 to which the conductive thin films 130-1 and 130-2 are attached may be dried so that the adhesive layers 120-1 and 120-2 are completely cured. The drying step is preferably carried out at a temperature of 60 to 120 ° C for 48 to 120 hours. By conducting the drying process for a long time at a temperature lower than that of the conventional conductive thin film laminated film performing the drying process at the temperature of 200 to 250 ° C, the abrupt contraction of the adhesive layers 120-1 and 120-2 can be prevented, It is possible to further improve the problem that the base film 110 and / or the conductive thin films 130-1 and 130-2 are bent or wrinkled.

As described above, the method 300 for manufacturing a conductive thin film laminated film 100 according to an embodiment of the present invention includes applying a heat-resistant adhesive containing a heat-resistant PET base film 110 and inorganic particles 122, In performing the laminating process at a high temperature in which the conductive thin films 130-1 and 130-2 are attached to the base film 110 or the drying process of the adhesive layers 120-1 and 120-2, The conductive thin film laminated film 100 having the same quality as that of the conventional conductive thin film laminated film using a film of a PI (polyimide) material can be realized at a low cost.

4 is a vertical sectional view showing a schematic configuration of a film antenna according to an embodiment of the present invention.

4, the film-type antenna 200 according to one embodiment of the present invention includes a base film 110, adhesive layers 120-1 and 120-2, antenna pattern layers 230-1 and 230-2, A coverlay film 240, and a connection terminal 250. [ The film-type antenna 200 according to one embodiment of the present invention is fabricated by processing the conductive thin films 130-1 and 130-2 of the conductive thin film laminated film 100 described with reference to FIG. 2, 110 and the adhesive layers 120-1 and 120-2, the above description of FIG. 2 is referred to in order to avoid repetition.

The antenna pattern layers 230-1 and 230-2 are layers having antenna patterns for radiating signals to the outside, and can function as built-in antennas. The antenna pattern layers 230-1 and 230-2 may be formed by leaving only the predetermined antenna pattern on the conductive thin films 130-1 and 130-2 provided on both sides or one side of the conductive thin film laminated film 100, And corrosion of the portion.

The coverlay 240 is attached to the antenna pattern layers 230-1 and 230-2 to protect and insulate the antenna pattern layers 230-1 and 230-2 from the external environment. The coverlay film 240 And a coverlay adhesive layer 244. The coverlay film 242 may be formed of a PI material. The coverlay adhesive layer 244 may be formed by applying a predetermined adhesive to one surface of the coverlay film 242, And may be formed by attaching a bonding sheet. 4, the coverlay film 240 is shown as being attached only to a part of the antenna pattern layers 230-1 and 230-2. However, the coverlay film 240 is illustrative, May be respectively attached to both surfaces of the antenna pattern layers 230-1 and 230-2.

The connection terminal 250 electrically connects the film type antenna 200 to an external power source or an electronic device and electrically connects the film type antenna 200 to an area of the antenna pattern layers 230-1 and 230-2 through soldering or the like As shown in FIG.

5 illustrates a method of manufacturing a film antenna using a conductive thin film laminated film according to an embodiment of the present invention.

Referring to FIG. 5, a method 500 of manufacturing a film-type antenna 200 according to an embodiment of the present invention includes the steps of providing a conductive thin film laminated film 100 (step S510), forming an antenna pattern layer 230- The step S530 of forming the connection terminals 250 and the step S530 of bonding the coverlay 240 may be included in the step S520.

In step S510, a conductive thin film laminated film 100 may be provided. At this time, the conductive thin film laminated film 100 may be a conductive thin film laminated film 100 according to an embodiment of the present invention described above with reference to FIG.

In step S520, antenna pattern layers 230-1 and 230-2 of a predetermined shape may be formed on the conductive thin films 130-1 and 130-2 of the conductive thin film laminated film 100. [ Specifically, the antenna pattern layers 230-1 and 230-2 are formed by laminating a dry film using rollers heated to the conductive thin films 130-1 and 130-2, And then performing an etching operation sequentially to corrode and remove the remaining portions except for the antenna pattern.

The conductive thin films 130-1 and 130-2 located on both surfaces of the conductive thin film laminated film 100 may be formed in the same manner as the conductive thin films 130-1 and 130-2 before the antenna pattern layers 230-1 and 230-2 are formed. A process of forming a via hole may be performed first. The via hole may be formed through a drill, a UV laser, or the like. By plating the inner surface of the via hole, the antenna pattern layers 230-1 and 230-2 may be electrically connected to each other.

In step S530, the coverlay 240 may be adhered onto the antenna pattern layers 230-1 and 230-2. Specifically, after the coverlay 240 is contacted through punching, the coverlay 240 is thermally bonded to the antenna pattern layers 230-1 and 230-2 using a hot press.

In step S540, connection terminals 250 connected to the antenna pattern layers 230-1 and 230-2 may be formed. As described above, the connection terminal 250 may be formed to be electrically connected to one region of the antenna pattern layers 230-1 and 230-2 through a method such as soldering.

As described above, the film-type antenna 200 according to one embodiment of the present invention includes the conductive thin film laminated film 100 to which the heat resistant adhesive including the heat-resistant PET base film 110 and the inorganic particles 122 is applied It is possible to prevent thermal deformation due to high temperature during the operation of the above-mentioned dry film laminating, coverlay 240 thermal bonding, soldering of connection terminal 250, and the like, Type antenna 200 having the above-described structure.

As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100; Conductive thin film laminated film 110: base film
120-1, 120-2: adhesive layer 122: inorganic particles
130-1, 130-2: conductive thin film 240; Cover Ray
242: a coverlay film 244: a coverlay adhesive layer
250: connection terminal

Claims (8)

A base film made of heat resistant PET (polyethylene terephthalate) material; And
And a conductive thin film attached to at least one side of the base film,
Wherein the conductive thin film is attached to the base film by a heat resistant adhesive containing inorganic particles of a predetermined size. The method according to claim 1,
Wherein the inorganic particles are talc particles. The method according to claim 1,
Wherein the base film has a thickness in the range of 9 to 25 nanometers ([mu] m). Providing a base film made of heat resistant PET (polyethylene terephthalate) material;
Applying a heat-resistant adhesive containing inorganic particles of a predetermined size to at least one surface of the base film to form an adhesive layer;
Attaching a conductive thin film to at least one surface of the base film on which the adhesive layer is formed by a laminating method; And
And drying the base film to which the conductive thin film is adhered so that the adhesive layer is cured. 5. The method of claim 4,
Wherein the inorganic particles are talc particles. 5. The method of claim 4,
Wherein the base film has a thickness in the range of 9 to 25 nanometers ([mu] m). 5. The method of claim 4,
Wherein the step of drying the base film with the conductive thin film is performed at a temperature of 60 to 120 ° C for 48 to 120 hours. Providing a conductive thin film laminated film according to any one of claims 1 to 3;
Forming an antenna pattern layer of a predetermined shape on the conductive thin film of the conductive thin film laminated film;
Bonding a coverlay on the antenna pattern layer; And
And forming a connection terminal to be connected to the antenna pattern layer.
KR1020140092508A 2014-07-22 2014-07-22 Conductible layer clad flim, manufacturing method thereof and manufacturing method for file type antenna using the same KR20160011436A (en)

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KR1020140092508A KR20160011436A (en) 2014-07-22 2014-07-22 Conductible layer clad flim, manufacturing method thereof and manufacturing method for file type antenna using the same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019039876A1 (en) * 2017-08-24 2019-02-28 동우화인켐 주식회사 Film antenna and display device comprising same
KR20190075625A (en) * 2017-12-21 2019-07-01 한솔테크닉스(주) Board laminate structure and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019039876A1 (en) * 2017-08-24 2019-02-28 동우화인켐 주식회사 Film antenna and display device comprising same
US11469492B2 (en) 2017-08-24 2022-10-11 Dongwoo Fine-Chem Co., Ltd. Film antenna and display device including the same
KR20190075625A (en) * 2017-12-21 2019-07-01 한솔테크닉스(주) Board laminate structure and manufacturing method thereof

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