KR20140098581A - Apparatus for bonding chip on wafer precisely - Google Patents

Apparatus for bonding chip on wafer precisely Download PDF

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KR20140098581A
KR20140098581A KR1020130011425A KR20130011425A KR20140098581A KR 20140098581 A KR20140098581 A KR 20140098581A KR 1020130011425 A KR1020130011425 A KR 1020130011425A KR 20130011425 A KR20130011425 A KR 20130011425A KR 20140098581 A KR20140098581 A KR 20140098581A
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wafer
chip
transferring
alignment
mounting
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KR101445123B1 (en
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함영준
서민석
백태현
조경호
임준우
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(주) 예스티
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H01L2224/83125—Bonding areas on the body

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A device for precisely bonding a chip on a wafer according to the present invention comprises a wafer loading member for loading a wafer; a chip loading member for loading a chip; a wafer transfer member for transferring the wafer from the wafer loading member to a wafer mounting and heating member; a chip transfer member for transferring the chip from the chip loading member; the wafer mounting and heating member for heating the wafer while accommodating the wafer; and an alignment checking member for checking the alignment of the wafer mounted on the wafer mounting and heating member and the chip. According to the present invention, the alignment of the chip with regard to the wafer can be adjusted precisely, and thermal junction between the wafer and the chip is possible. Further, devices for thermal junction can be cooled quickly after the thermal junction between the wafer and the chip.

Description

웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치{APPARATUS FOR BONDING CHIP ON WAFER PRECISELY}[0001] APPARATUS FOR BONDING CHIP ON WAFER PRECISELY [0002]

본 발명은 웨이퍼 상에 칩을 본딩하기 위한 장치에 관한 발명으로서, 보다 상세하게는 웨이퍼에 대한 칩의 정렬을 매우 정밀하게 조절가능하면서도 웨이퍼와 칩 간의 열접합이 가능하도록 구성되는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치에 관한 발명이다.The present invention relates to an apparatus for bonding a chip on a wafer, and more particularly, to an apparatus for bonding a chip on a wafer, and more particularly to an apparatus for bonding a chip on a wafer which is configured to enable precise alignment of the chip with respect to the wafer, The present invention relates to an apparatus for precision bonding.

일반적으로, 반도체 소자는 반도체 기판으로 이용되는 실리콘 웨이퍼를 형성하고 이를 리드프레임에 본딩하여 에폭시 수지 등으로 몰딩함으로써 제조된다. In general, a semiconductor device is manufactured by forming a silicon wafer used as a semiconductor substrate, bonding it to a lead frame, and molding it with an epoxy resin or the like.

상기와 같은 반도체 소자는 보다 많은 양의 정보 저장을 위해 소형화 집적화가 요구되고 있다.Such semiconductor devices are required to be miniaturized and integrated in order to store a larger amount of information.

상기와 같은 소형화 집적화의 요구에 따라 최근에는 복수 개의 칩을 적층하여 반도체 소자를 구성하는 3D 집적회로가 개발되고 있으며, 상기 3D 집적회로는웨이퍼 상에 칩을 쌓아 이를 본딩함으로써 형성된다.In recent years, a 3D integrated circuit has been developed, in which a plurality of chips are stacked to form a semiconductor device in accordance with the demand for miniaturization and integration. The 3D integrated circuit is formed by stacking chips on a wafer and bonding the chips.

상기와 같이 웨이퍼 상에 칩을 쌓아 반도체 소자를 형성하기 위해서는 웨이퍼와 칩 간의 정밀한 위치 조절이 요구되며, 만약 웨이퍼와 칩 간의 위치가 정확하지 못할 경우에는 반도체 소자의 불량의 원인이 되고 전체 공정 수율을 급격히 저하시키게 된다.In order to form a semiconductor device by stacking chips on a wafer as described above, it is necessary to precisely adjust the position between the wafer and the chip. If the position between the wafer and the chip is not precise, the semiconductor device may be defective. And is rapidly lowered.

따라서, 웨이퍼 상의 정확한 위치에 칩을 배치시키고 웨이퍼와 칩을 본딩하는 장치의 개발이 요구된다.Therefore, it is required to develop a device for placing a chip at a precise position on the wafer and bonding the wafer and the chip.

본 발명의 목적은, 웨이퍼에 대한 칩의 위치 정렬을 매우 정밀하게 조절가능하면서도 웨이퍼와 칩 간의 열접합이 가능하도록 구성되는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치를 제공하는 것이다.It is an object of the present invention to provide an apparatus for precisely bonding a chip on a wafer which is configured to be capable of highly precisely aligning the chip with respect to the wafer while allowing thermal bonding between the wafer and the chip.

본 발명의 또 다른 목적은, 웨이퍼와 칩 간의 열접합 이후에는 웨이퍼와 칩이 신속하게 냉각될 수 있도록 구성되는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치를 제공하는 것이다.It is a further object of the present invention to provide an apparatus for precisely bonding a chip on a wafer that is configured to allow rapid cooling of the wafer and the chip after thermal bonding between the wafer and the chip.

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치는, 웨이퍼 적재를 위한 웨이퍼적재부재와, 칩 적재를 위한 칩적재부재와, 상기 웨이퍼 적재부재로부터 웨이퍼안착가열부재로 웨이퍼를 이송시키기 위한 웨이퍼이송부재와, 상기 칩적재부재로부터 칩을 이송시키기 위한 칩이송부재와, 상기 웨이퍼를 수용하면서 웨이퍼에 대해 열을 가하기 위한 웨이퍼안착가열부재와, 상기 웨이퍼안착가열부재에 안착되는 웨이퍼와 칩의 정렬상태를 검사하기 위한 정렬검사부재를 포함한다.According to an aspect of the present invention, there is provided an apparatus for precisely bonding a chip on a wafer. The apparatus includes a wafer mounting member for mounting a wafer, a chip mounting member for mounting a chip, A chip transferring member for transferring the chip from the chip mounting member; a wafer mounting heating member for applying heat to the wafer while accommodating the wafer; And an alignment inspection member for inspecting the alignment state of the wafer and the chip to be mounted.

바람직하게는, 상기 칩을 정렬시키기 위한 칩정렬부재를 추가적으로 포함하며, 상기 칩이송부재는 상기 칩적재부재로부터 상기 칩정렬부재로 칩을 이송시키기 위한 제 1 칩이송부재와 상기 칩정렬부재로부터 상기 웨이퍼안착가열부재로 칩을 이송시키기 위한 제 2 칩이송부재를 포함한다.The chip transferring member may further include a first chip transferring member for transferring the chip from the chip loading member to the chip aligning member, and a second chip transferring member for transferring the chip from the chip aligning member to the chip aligning member, And a second chip transferring member for transferring the chip to the wafer seating heating member.

또한, 상기 웨이퍼적재부재와 상기 웨이퍼안착가열부재 사이에 웨이퍼의 정렬을 위한 웨이퍼정렬부재를 추가적으로 포함할 수 있다.In addition, a wafer alignment member for alignment of the wafer may be additionally provided between the wafer mounting member and the wafer positioning heating member.

바람직하게는, 상기 정렬검사부재는 상기 웨이퍼와 상기 웨이퍼의 상부에 배치되는 칩의 정렬상태를 상하방향으로 동시에 검사한다.Preferably, the alignment inspection member inspects the alignment state of the wafer and a chip disposed on the wafer at the same time in the vertical direction.

여기서, 상기 웨이퍼안착가열부재는 가로, 세로 방향으로 이동가능하며 또한 회전가능하도록 구성될 수 있다.Here, the wafer seating heating member may be configured to be movable in the horizontal and vertical directions and rotatable.

또한, 상기 칩의 정렬상태를 검사하기 위한 칩정렬검사부재를 추가적으로 포함할 수 있다.In addition, a chip alignment inspection member for inspecting the alignment state of the chip may be additionally included.

바람직하게는, 상기 제 2 칩이송부재에는 가열을 위한 히터부가 포함된다.Preferably, the second chip transferring member includes a heater for heating.

본 발명에 의해, 웨이퍼에 대한 칩의 위치 정렬을 매우 정밀하게 조절가능하면서도 웨이퍼와 칩 간의 열접합이 가능하다.According to the present invention, thermal alignment between the wafer and the chip is possible, while the alignment of the chip with respect to the wafer can be adjusted with high precision.

또한, 웨이퍼와 칩 간의 열접합 이후에는 상기 열접합을 위한 장치들이 신속하게 냉각될 수 있다.Further, after the thermal bonding between the wafer and the chip, the devices for thermal bonding can be rapidly cooled.

첨부의 하기 도면들은, 발명의 상세한 설명과 함께 본 발명의 기술적 사상을 이해시키기 위한 것이므로, 본 발명은 하기 도면에 도시된 사항에 한정 해석되어서는 아니 된다.
도1 은 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치의 사사도이며,
도 2 는 상기 장치의 정면도이다.BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a perspective view of a device for precisely bonding a chip on a wafer according to the present invention,
Figure 2 is a front view of the device.

이하, 첨부된 도면을 참조하여 본 발명의 구성을 상세히 설명하기로 한다. Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

이에 앞서, 본 명세서 및 청구범위에 사용된 용어는 사전적인 의미로 한정 해석되어서는 아니되며, 발명자는 자신의 발명을 최선의 방법으로 설명하기 위해 용어의 개념을 적절히 정의할 수 있다는 원칙에 입각하여, 본 발명의 기술적 사상에 부합되는 의미와 개념으로 해석되어야 한다.Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

따라서, 본 명세서에 기재된 실시예 및 도면에 도시된 구성은 본 발명의 바람직한 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 표현하는 것은 아니므로, 본 출원 시점에 있어 이들을 대체할 수 있는 다양한 균등물과 변형예들이 존재할 수 있음을 이해하여야 한다.Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

도1 은 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치의 사사도이며, 도 2 는 상기 장치의 정면도이다.1 is a perspective view of a device for precisely bonding a chip on a wafer according to the present invention, and Fig. 2 is a front view of the device.

도 1 과 2 를 참조하면, 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치는, 웨이퍼 적재를 위한 웨이퍼적재부재(10)와, 칩 적재를 위한 칩적재부재(20)와, 상기 웨이퍼 적재부재(10)로부터 웨이퍼안착가열부재(60)로 웨이퍼를 이송시키기 위한 이송부재(30)와, 상기 칩적재부재(20)로부터 칩을 이송시키기 위한 칩이송부재(40)와, 상기 웨이퍼를 수용하면서 웨이퍼에 대해 열을 가하기 위한 웨이퍼안착가열부재(60)와, 상기 웨이퍼안착가열부재(60)에 안착되는 웨이퍼와 칩의 정렬상태를 검사하기 위한 정렬검사부재(70)를 포함한다.1 and 2, an apparatus for precisely bonding a chip on a wafer according to the present invention includes a wafer mounting member 10 for wafer mounting, a chip mounting member 20 for chip mounting, A transferring member 30 for transferring the wafer from the wafer mounting member 10 to the wafer positioning heating member 60, a chip transferring member 40 for transferring the chip from the chip mounting member 20, And an alignment inspection member 70 for inspecting the alignment state of the wafer and the chips that are seated on the wafer seating heating member 60. The wafer positioning heating member 60 includes a plurality of positioning members 70,

상기 웨이퍼적재부재(10)는 칩을 본딩할 웨이퍼들을 적재하기 위한 구성으로서, 트레이 또는 카세트에 수납된 웨이퍼가 높이 방향으로 정렬된다.The wafer loading member 10 is configured to load wafers to be bonded with chips, and the wafers accommodated in the tray or cassette are aligned in the height direction.

상기 칩적재부재(20)는 웨이퍼 상에 본딩되는 칩을 적재하기 위한 구성으로서, 트레이 또는 카세트에 수납된 칩이 거치된다.The chip loading member 20 is a structure for loading a chip bonded on a wafer, and a chip housed in a tray or a cassette is mounted.

상기 웨이퍼이송부재(30)는 예를 들어, 로봇암으로 구성되어 상기 웨이퍼적재부재(10)로부터 웨이퍼정렬부재(90)로 웨이퍼를 이송시킨다.The wafer transfer member 30 is constituted by, for example, a robot arm, and transfers the wafer from the wafer loading member 10 to the wafer alignment member 90.

상기 웨이퍼정렬부재(90)는 그 위에 웨이퍼를 놓아 정위치로 정렬하기 위한 구성으로서, 일차적으로 상기 웨이퍼정렬부재(90) 위에 배치된 웨이퍼의 위치를 정밀하게 조절하는 역할을 수행한다.The wafer aligning member 90 serves to precisely adjust the position of the wafer placed on the wafer aligning member 90, primarily to arrange the wafer on the wafer aligning member 90 in a proper position.

상기 웨이퍼정렬부재(90)는 웨이퍼를 X, Y 방향 및 일정정도 회전시킬 수 있도록 구성되어, 상기 이송부재(30)에 의해 상기 웨이퍼안착가열부재(60)에 웨이퍼를 배치시키기 이전에 보다 정확한 위치에 놓여지도록 정렬시킨다.The wafer alignment member 90 is configured to rotate the wafer in the X and Y directions and to a certain degree so that the wafer alignment member 90 can be moved to a more accurate position Lt; / RTI >

제 1 칩이송부재(40)는 내부에 음압을 인가할 수 있는 음압인가부가 설치되어, 상기 칩적재부재(20)에 놓여진 칩을 셕션압으로 들어올려 칩정렬부재(80)로 이송시킨다.The first chip transferring member 40 is provided with a negative pressure applying portion capable of applying a negative pressure therein. The chip transferring member 40 lifts the chip placed on the chip loading member 20 with a differential pressure and transfers the chip to the chip aligning member 80.

여기서, 상기 제 1 칩이송부재(40)를 통해 칩을 칩정렬부재(80)로 이송시키기 전에, 상기 제 1 칩이송부재(40)에 의해 들어올려진 칩의 정렬 상태를 검사하기 위한 칩정렬검사부재(75) 상부에 칩을 배치시켜 칩이 올바른 위치로 파지되었는지를 검사하게 된다.Here, before the chip is transferred to the chip aligning member 80 through the first chip conveying member 40, a chip aligning inspection for inspecting the alignment state of the chip lifted by the first chip conveying member 40 A chip is placed on the member 75 to check whether the chip is held in the correct position.

상기와 같이 칩의 정렬상태를 검사한 상태에서 상기 칩은 칩정렬부재(80) 상에 놓여지며, 상기 칩정렬부재(80)에 의해 칩의 위치가 정밀하게 조절된다.As described above, the chip is placed on the chip aligning member 80 while checking the alignment state of the chip, and the position of the chip is precisely adjusted by the chip aligning member 80.

여기서, 상기 칩정렬부재(80)를 통한 칩 위치 조절을 위해 상기 칩정렬부재(80) 역시 X, Y 방향으로 칩을 이송시키면서도 일정각도 회전될 수 있도록 구성된다.Here, the chip aligning member 80 is also configured to be rotated at a predetermined angle while feeding the chips in the X and Y directions for adjusting the chip position through the chip aligning member 80.

상기 웨이퍼정렬부재(90)에 의해 그 위치가 조절된 웨이퍼는 상기 웨이퍼이송부재(30)에 의해 웨이퍼안착가열부재(60)에 놓여진다.The wafer whose position is adjusted by the wafer aligning member 90 is placed on the wafer seating heating member 60 by the wafer transferring member 30.

또한, 상기 칩정렬부재(80)에 의해 위치가 조절된 칩은 제 2 칩이송부재(50)에 의해 들어올려져 상기 웨이퍼안착가열부재(60) 상부로 이송된다.Further, a chip whose position is adjusted by the chip aligning member 80 is picked up by the second chip transferring member 50 and transferred to the upper portion of the wafer seating heating member 60.

상기 제 2 칩이송부재(50) 역시 내부에 음압을 인가할 수 있는 음압인가부가 설치되어, 상기 칩정렬부재(80)에 의해 위치가 조절된 칩을 셕션압으로 들어올려 상기 웨이퍼안착가열부재(60) 상부로 이송시킨다.The second chip transferring member 50 is also provided with a negative pressure applying portion capable of applying a negative pressure therein so that the chip having its position adjusted by the chip aligning member 80 is lifted up by the pressure of the wafer, 60).

상기와 같이 웨이퍼안착가열부재(60)에 안착된 웨이퍼 상부에 상기 제 2 칩이송부재(50)가 배치되고, 상기 제 2 칩이송부재(50)에 의해 칩이 파지된 상태에서, 상기 웨이퍼안착가열부재(60)에 안착된 웨이퍼와 칩의 정렬상태를 정렬검사부재(70)를 통해 검사한다.As described above, the second chip transferring member 50 is disposed on the wafer mounted on the wafer mounting heating member 60, and in a state where the chip is gripped by the second chip transferring member 50, The alignment state of the wafer and the chip placed on the heating member 60 is inspected through the alignment inspection member 70. [

상기 정렬검사부재(70)는 그 하부에 배치된 웨이퍼의 위치와 그 상부에 배치된 칩의 위치를 동시에 촬영할 수 있는 양방향카메라를 포함하여 구성되며, 상기 웨이퍼와 칩에 형성된 위치확인 마크를 촬영하여 기준 위치와 비교함으로써, 상기 웨이퍼와 칩이 기준위치에 배치되었는지의 여부를 검사한다.The alignment inspection member 70 includes a bidirectional camera capable of simultaneously photographing a position of a wafer disposed at a lower portion thereof and a position of a chip disposed at an upper portion of the alignment inspection member 70. The alignment mark formed on the wafer and the chip is photographed By comparing with the reference position, it is checked whether or not the wafer and the chip are arranged at the reference position.

또한, 상기 웨이퍼안착가열부재(60) 역시 이송기구(62) 및 회전기구(64)에 의해 X, Y 방향으로 이송되면서도 일정각도 회전될 수 있도록 구성되어, 상기 칩에 대한 웨이퍼의 상대적 위치를 조절할 수 있도록 구성된다.The wafer seating heating member 60 is also rotated by a predetermined angle while being transferred in the X and Y directions by the transfer mechanism 62 and the rotating mechanism 64 so as to adjust the relative position of the wafer with respect to the chip .

상기와 같이, 웨이퍼에 대한 칩의 위치가 정밀하게 조절된 이후 상기 제 2 칩이송부재(50)에 파지된 칩은 하방으로 하강하여 상기 웨이퍼 상에 밀착된다. As described above, after the position of the chip with respect to the wafer is precisely adjusted, the chip held by the second chip transfer member 50 descends downward and is brought into close contact with the wafer.

여기서, 상기 제 2 칩이송부재(50) 하부에는 가열을 위한 히터부(52)와 냉각수순환관이 설치되고, 상기 웨이퍼안착가열부재(60) 내부에도 가열을 위한 히터부와 냉각수순환관이 설치된다.A heater portion 52 for heating and a cooling water circulation pipe are provided in the lower portion of the second chip transferring member 50. A heater portion for heating and a cooling water circulation pipe are also installed inside the wafer seating heating member 60 do.

그리하여, 상기 제 2 칩이송부재(50) 하부의 히터부(52)로 칩을 웨이퍼에 가압하면서 열을 가하여 웨이퍼 상에 칩을 열접착하고, 이후에는 상기 냉각수순환관을 통해 냉각수를 유동시킴으로써, 신속히 냉각시킬 수 있다.Thus, the chips are thermally adhered to the wafer by applying heat while pressing the chips to the wafer with the heater unit 52 under the second chip transfer member 50, and then the cooling water flows through the cooling water circulation pipe, It can be quickly cooled.

이상, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명의 기술적 사상은 이러한 것에 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해, 본 발명의 기술적 사상과 하기 될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형 실시가 가능할 것이다.While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.

10: 웨이퍼적재부재 20: 칩적재부재
30: 웨이퍼이송부재 40: 제 1 칩이송부재
50: 제 2 칩이송부재 60: 웨이퍼안착가열부재10: Wafer mounting member 20: Chip mounting member
30: wafer transfer member 40: first chip transfer member
50: second chip transferring member 60: wafer seating heating member

Claims (7)

웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치로서,
웨이퍼 적재를 위한 웨이퍼적재부재와;
칩 적재를 위한 칩적재부재와;
상기 웨이퍼 적재부재로부터 웨이퍼안착가열부재로 웨이퍼를 이송시키기 위한 웨이퍼이송부재와;
상기 칩적재부재로부터 칩을 이송시키기 위한 칩이송부재와;
상기 웨이퍼를 수용하면서 웨이퍼에 대해 열을 가하기 위한 웨이퍼안착가열부재와;
상기 웨이퍼안착가열부재에 안착되는 웨이퍼와 칩의 정렬상태를 검사하기 위한 정렬검사부재를 포함하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.An apparatus for precisely bonding a chip on a wafer,
A wafer mounting member for wafer mounting;
A chip mounting member for chip mounting;
A wafer transfer member for transferring the wafer from the wafer mounting member to the wafer mounting heating member;
A chip transferring member for transferring a chip from the chip loading member;
A wafer seating heating member for receiving the wafer and applying heat to the wafer;
And an alignment inspection member for inspecting alignment of the wafer with the wafer that is seated on the wafer seating heating member. 제 1 항에 있어서,
상기 칩을 정렬시키기 위한 칩정렬부재를 추가적으로 포함하며, 상기 칩이송부재는 상기 칩적재부재로부터 상기 칩정렬부재로 칩을 이송시키기 위한 제 1 칩이송부재와 상기 칩정렬부재로부터 상기 웨이퍼안착가열부재로 칩을 이송시키기 위한 제 2 칩이송부재를 포함하는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.The method according to claim 1,
Wherein the chip transferring member further comprises a first chip transferring member for transferring a chip from the chip stacking member to the chip aligning member and a second chip transferring member for transferring the wafer from the chip aligning member to the wafer seating heating member And a second chip transferring member for transferring the chip to the wafer. 제 2 항에 있어서,
상기 웨이퍼적재부재와 상기 웨이퍼안착가열부재 사이에 웨이퍼의 정렬을 위한 웨이퍼정렬부재를 추가적으로 포함하는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.3. The method of claim 2,
Further comprising a wafer alignment member for alignment of the wafer between the wafer mounting member and the wafer seating heating member. ≪ RTI ID = 0.0 > 8. < / RTI > 제 3 항에 있어서,
상기 정렬검사부재는 상기 웨이퍼와 상기 웨이퍼의 상부에 배치되는 칩의 정렬상태를 상하방향으로 동시에 검사하는 것을 특징으로 한느 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.The method of claim 3,
Wherein the alignment inspection member simultaneously inspects an alignment state of the wafer and a chip disposed on an upper portion of the wafer in a vertical direction at the same time. 제 4 항에 있어서,
상기 웨이퍼안착가열부재는 가로, 세로 방향으로 이동가능하면서도 회전가능하도록 구성되는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.5. The method of claim 4,
Wherein the wafer seating heating member is configured to be movable in a horizontal and vertical direction while being rotatable. 제 5 항에 있어서,
상기 칩의 정렬상태를 검사하기 위한 칩정렬검사부재를 추가적으로 포함하는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.6. The method of claim 5,
Further comprising a chip alignment inspection member for inspecting alignment of the chip. ≪ RTI ID = 0.0 >< / RTI > 제 6 항에 있어서,
상기 제 2 칩이송부재에는 가열을 위한 히터부가 포함되는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.

The method according to claim 6,
Wherein the second chip transferring member is provided with a heater for heating the chip transferring member.

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