KR20140065952A - Encapsulation material and electronic device including the same - Google Patents
Encapsulation material and electronic device including the same Download PDFInfo
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- KR20140065952A KR20140065952A KR20120133067A KR20120133067A KR20140065952A KR 20140065952 A KR20140065952 A KR 20140065952A KR 20120133067 A KR20120133067 A KR 20120133067A KR 20120133067 A KR20120133067 A KR 20120133067A KR 20140065952 A KR20140065952 A KR 20140065952A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
(Si-H) having a silicon-bonded end at the terminal, and a silicon-bonded alkenyl group (Si-Vi) at the end of the first polysiloxane, An encapsulant comprising the second polysiloxane, and an encapsulant.
Description
An encapsulant and the encapsulant.
BACKGROUND ART Light emitting devices such as light emitting diodes (LEDs), organic light emitting diode devices (OLED devices), and photoluminescence devices (PL devices) And various automation devices.
These light emitting devices can display an intrinsic color of a light emitting material such as blue, red, and green in a light emitting portion, and can display a white color by combining light emitting portions that display different colors.
Such a light emitting device generally includes an encapsulant of a packaging or encapsulated structure.
The sealing portion may be made of an encapsulant including a light transmitting resin through which light emitted from the light emitting portion can pass to the outside.
One embodiment provides an encapsulant that can prevent moisture and oxygen permeation to increase reliability.
Another embodiment provides an electronic device comprising the encapsulant.
According to one embodiment, a filler that is surface treated with a silane coupling agent having at least one fluorine, a first polysiloxane having silicon-bonded hydrogen (Si-H) at the end, and a silicon- And a second polysiloxane having a silyl group (Si-Vi).
The silane coupling agent may be represented by the following general formula (1).
[Chemical Formula 1]
In Formula 1,
R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may be represented by the following general formula (1a) or (1b).
[Formula 1a]
[Chemical Formula 1b]
In the above formula (1a) or (1b)
R a to R 1 are each independently hydrogen or fluorine,
At least one of R a to R e and at least one of R f to R l is fluorine,
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may be represented by the following formula (1aa) or (1bb).
(1aa)
≪ RTI ID = 0.0 &
In the above general formula (1aa) or (1bb)
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may be included in an amount of 10 to 100 parts by weight based on 100 parts by weight of the filler.
The filler may include silica, alumina, titanium oxide, zinc oxide, or combinations thereof.
The filler surface-treated with the silane coupling agent may be contained in an amount of about 0.01 to 10% by weight based on the total amount of the sealing material.
The first polysiloxane may be represented by the following general formula (2).
(2)
(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1
In Formula 1,
R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R < 1 > to R < 6 >
0 < D1 < 1, 0 <
M1 + D1 + T1 + Q1 = 1.
The second polysiloxane may be represented by the following general formula (2).
(2)
(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2
In Formula 2,
R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,
0 < M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <
M2 + D2 + T2 + Q2 = 1.
The first polysiloxane is included at less than about 50 weight percent of the total amount of the encapsulant and the second polysiloxane can be included at greater than about 50 weight percent of the total encapsulant.
According to another embodiment, there is provided an electronic device including an encapsulation portion obtained by curing the above encapsulation material.
Moisture and oxygen permeation can be prevented, and the reliability of the encapsulant and the electronic device including the encapsulant can be enhanced.
1 is a cross-sectional view schematically illustrating a light emitting diode according to one embodiment.
Hereinafter, exemplary embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless otherwise defined herein, "substituted" means that the hydrogen atom in the compound is a halogen atom (F, Br, Cl, or I), a hydroxy group, an alkoxy group, a nitro group, a cyano group, an amino group, A thio group, an ester group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, A C 1 to C 30 arylalkyl group, a C 7 to C 30 arylalkyl group, a C 1 to C 30 alkoxy group, a C 1 to C 20 heteroalkyl group, a C 3 to C 20 heteroarylalkyl group, a C 3 to C 30 cycloalkyl group, a C 3 to C 15 cycloalkenyl group, C6 to C15 cycloalkynyl groups, C3 to C30 heterocycloalkyl groups, and combinations thereof.
In addition, unless otherwise defined herein, "hetero" means containing 1 to 3 heteroatoms selected from N, O, S and P.
Hereinafter, an encapsulant according to one embodiment will be described.
An encapsulant according to one embodiment comprises a filler that has been surface treated with a silane coupling agent having at least one fluorine, a first polysiloxane having silicon-bonded hydrogen (Si-H) at the end, and a silicon- And a second polysiloxane having an alkenyl group (Si-Vi).
The filler may be made of inorganic oxide and may include, for example, silica, alumina, titanium oxide, zinc oxide, or combinations thereof.
The filler is surface treated with a silane coupling agent having at least one fluorine.
The silane coupling agent may be represented by the following general formula (1).
[Chemical Formula 1]
In Formula 1,
R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may modify the surface of the filler from hydrophilic to hydrophobic to increase the dispersibility of the filler. Thereby reducing the packing of the filler in the encapsulant and preventing the filler from being unevenly distributed in the encapsulant due to the difference in density with the polysiloxane which will be described later. Particularly, by including fluorine in the silane coupling agent, water permeability and oxygen permeability can be lowered, and it is possible to reduce the occurrence of deterioration such as discoloration even after a lapse of time.
The silane coupling agent may be represented, for example, by the following formula (1a) or (1b).
[Formula 1a]
[Chemical Formula 1b]
In the above formula (1a) or (1b)
R a to R 1 are each independently hydrogen or fluorine,
At least one of R a to R e and at least one of R f to R l is fluorine,
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may be represented by, for example, the following formula (1aa) or (1bb).
(1aa)
≪ RTI ID = 0.0 &
In the above general formula (1aa) or (1bb)
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent may be included in an amount of about 10 to 100 parts by weight based on 100 parts by weight of the filler. By including it in the above-mentioned range, the surface modification of the filler can sufficiently proceed, effectively preventing water and oxygen permeation effectively, and ultimately, a highly reliable sealing material can be realized.
The filler surface-treated with the silane coupling agent may be contained in an amount of about 0.01 to 10% by weight based on the total amount of the sealing material. By being included in the above range, permeation of moisture and oxygen can be effectively prevented, and a highly reliable sealing material can be realized.
The first polysiloxane may be represented by the following general formula (2).
(2)
(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1
In Formula 1,
R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R < 1 > to R < 6 >
0 < D1 < 1, 0 <
M1 + D1 + T1 + Q1 = 1.
M1, D1, T1 and Q1 are each in a molar ratio.
The first polysiloxane may have an average of at least two silicon-bonded hydrogen (Si-H) per molecule.
The first polysiloxane may be obtained by hydrolysis and condensation polymerization of at least one monomer selected from the group consisting of a monomer represented by the following formula (2a) and a monomer represented by the following formula (2b), (2c) and (2d)
(2a)
(2b)
[Chemical Formula 2c]
(2d)
In the above general formulas (2a) to (2d)
The definitions of R 1 to R 6 are as defined above,
X 4 to X 13 are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen group, a carboxyl group or a combination thereof.
The weight average molecular weight of the first polysiloxane may be about 100 to 30000 g / mol, and may be about 100 to 10000 g / mol.
The first polysiloxane may be included in an amount less than about 50 wt%, and preferably about 1 to 35 wt%, based on the total amount of encapsulant.
The second polysiloxane may be represented by the following general formula (3).
(3)
(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2
In Formula 3,
R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,
0 < M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <
M2 + D2 + T2 + Q2 = 1.
M2, D2, T2 and Q2 are respectively in molar ratio.
The second polysiloxane may have an average of at least two silicon-bonded alkenyl groups (Si-Vi) per molecule.
The second polysiloxane can be obtained by hydrolysis and condensation polymerization of at least one monomer selected from the group consisting of the following general formula (3a), (3b), (3c) and (3d)
[Chemical Formula 3]
(3b)
[Chemical Formula 3c]
(3d)
The definition of R 7 to R 12 is as described above,
X 14 to X 23 are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen group, a carboxyl group or a combination thereof.
The weight average molecular weight of the second polysiloxane may be about 100 to 30000 g / mol, and may be about 100 to 10000 g / mol.
The second polysiloxane may be included in an amount greater than about 50 weight percent, and preferably about 65 to 99 weight percent, based on the total weight of the encapsulant.
The first polysiloxane having silicon-bonded hydrogen (Si-H) positioned at the end and the second polysiloxane having the silicon-bonded alkenyl group (Si-Vi) are included together so that the degree of crosslinking and curing of the light- Can be adjusted.
The encapsulation material may further include a hydrogen sacylation catalyst.
The hydrogen silylation catalyst may facilitate the hydrogen silylation reaction of the first polysiloxane and the second polysiloxane, and may include, for example, platinum, rhodium, palladium, ruthenium, iridium or combinations thereof.
The hydrogen sacylation catalyst may be contained in an amount of about 0.1 ppm to 1000 ppm based on the total amount of the light transmitting resin composition.
The encapsulating material may further include an adhesion promoter. Examples of the adhesion promoting agent include glycidoxypropyltrimethoxysilane, vinyltriethoxysilane, and glycidoxypropyltriethoxysilane.
The encapsulation material may further include a fluorescent material.
The phosphor includes a material which is stimulated by light and emits light of a specific wavelength range by itself. The phosphor may also include a quantum dot such as a semiconductor nanocrystal in a broad sense.
The phosphor may be, for example, a blue phosphor, a green phosphor, or a red phosphor, and may be a mixture of two or more types.
The phosphor may display a color of a predetermined wavelength region by light supplied from a separate light emitting portion, and the light emitting portion may display a color of a shorter wavelength region than a color displayed by the phosphor. For example, when the phosphor displays a red color, the light emitting unit may emit blue or green light having a shorter wavelength than the red color.
Further, a white color can be displayed by combining a color emitted from the light emitting portion and a color emitted from the phosphor. For example, when the light emitting portion supplies blue light and the phosphor includes a red phosphor and a green phosphor, the electronic device may display white by combining blue, red, and green.
The encapsulant can be prepared, for example, by surface-treating the filler with the silane coupling agent and then mixing the surface-treated filler with the first polysiloxane and the second polysiloxane. In this case, the surface-treated filler can be obtained by mixing the filler and the silane coupling agent in a solvent and then heat-treating the mixture at a predetermined temperature. The heat treatment temperature may be, for example, about 40 to 200 ° C.
Alternatively, the encapsulating material may be subjected to a heat treatment at a predetermined temperature after mixing the filler, the silane coupling agent, the first polysiloxane, and the second polysiloxane, and surface-treating the filler with the silane coupling agent. The heat treatment temperature may be, for example, about 40 to 200 ° C.
The encapsulating material may be cured and used as an encapsulating layer of an electronic device. The electronic device may include, for example, a light emitting diode and an organic light emitting device.
Hereinafter, a light emitting diode according to one embodiment will be described with reference to FIG. 1 as an example of an electronic device using the sealing material.
1 is a cross-sectional view schematically illustrating a light emitting diode according to one embodiment.
1, the light emitting diode includes a
The
The
The color emitted from the light emitting
Hereinafter, embodiments of the present invention will be described in detail with reference to examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
Surface-treated Filler Produce
Manufacturing example One
Water, ethanol and silica (Aerosil 90, manufactured by Evonik) (filler) were mixed at a weight ratio of 5:95:10 and stirred at room temperature for 30 minutes. At this time acetic acid was used to maintain the pH at 4.5 to 5.5. Subsequently, 50 parts by weight of CF 3 (CH 2 ) 3 Si (OCH 3 ) 3 (silane coupling agent) was added to 100 parts by weight of the mixed solution, and the mixture was heated to 90 ° C. . The mixture was then placed in a vacuum atmosphere for 3 hours to remove the solvent and then cooled to room temperature. Subsequently, the resulting filler was washed with ethanol and then dried in an oven at 110 ° C for 6 hours to obtain a surface-treated filler.
Manufacturing example 2
Except that CF 3 (CF 2 ) 3 (CH 2 ) 3 Si (OCH 3 ) 3 was used as the silane coupling agent, a surface-treated filler was obtained in the same manner as in Production Example 1.
Manufacturing example 3
A surface-modified filler was obtained in the same manner as in Production Example 1 except that C 6 F 5 (CH 2 ) 3 Si (OCH 3 ) 3 was used as a silane coupling agent.
1st Polysiloxane Produce
1 kg of a mixed solvent in which water and toluene were mixed at a weight ratio of 5: 5 was charged into a three-necked flask, and 159.39 g of diphenyldichlorosilane and 402 g of tetramethyldisiloxane were added dropwise to the monomer over 2 hours while maintaining the temperature at 23 占 폚. After completion of the dropwise addition, condensation polymerization reaction was carried out while refluxing at 90 ° C for 3 hours. After cooling to room temperature, the water layer was removed to prepare a polymer solution dissolved in toluene. The resulting polymer solution was washed with water to remove chlorine as a by-product of the reaction. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene to obtain a liquid polysiloxane.
The molecular weight of the obtained polysiloxane was measured using gel permeation chromatography. The molecular weight in terms of polystyrene was 350 g / mol, and the structure of the formula (2-A) was determined using H-NMR, Si- Respectively. Where Me is a methyl group, Ph is a phenyl group, Si is silicon, and H is hydrogen.
[Chemical Formula 2-A]
(Me 2 HSiO 2/2) 0.66 (Ph 2 SiO 2/2) 0.33
Second Polysiloxane Produce
1 kg of a mixed solvent prepared by mixing water and toluene in a weight ratio of 5: 5 was charged into a three-necked flask, and while maintaining the temperature at 23 캜, 372 g of phenylmethyldimethoxysilane and 372 g of divinyltetramethyldisiloxane, H 2 O was mixed at 25 ° C. The condensation polymerization reaction was carried out while heating to reflux at 90 占 폚 for 3 hours. After cooling to room temperature, the water layer was removed to prepare a polymer solution dissolved in toluene. The resulting polymer solution was washed with water to remove chlorine as a by-product of the reaction. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene to obtain a liquid polysiloxane.
The molecular weight of the resulting polysiloxane was measured by gel permeation chromatography. The molecular weight in terms of polystyrene was 6000 g / mol. The structure of the compound of formula (3-A) was determined using H-NMR, Si- Respectively. Where Me is methyl, Ph is phenyl, Vi is vinyl, and Si is silicon.
[Formula 3-A]
Manufacture of encapsulant
Example One
2% by weight of the surface-treated filler obtained in Preparation Example 1, 23% by weight of the first polysiloxane represented by Formula 2-A, 75% by weight of the second polysiloxane represented by Formula 3-A, 2.0 (manufactured by Umicore) (added so that the content of Pt was 5 ppm) were mixed and defoamed in vacuo to prepare a liquid encapsulant.
Example 2
A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated filler obtained in Preparation Example 2 was used in place of the surface-treated filler obtained in Preparation Example 1.
Example 3
A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated filler obtained in Preparation Example 3 was used in place of the surface-treated filler obtained in Preparation Example 1.
Comparative Example
A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated silica (Aerosil 90, manufactured by Evonik) was used instead of the surface-treated filler obtained in Preparation Example 1.
Rating 1
The encapsulant according to Examples 1 to 3 and Comparative Example was measured for refractive index under the D-line (589 nm) wavelength using Abbe's refractometer.
The results are shown in Table 1.
As shown in Table 1, it can be seen that the encapsulant according to Examples 1 to 3 exhibits a refractive index similar to that of the encapsulant according to the comparative example. It can be seen from this that the refractive index is not affected by the surface-treated filler.
Rating 2
The encapsulant according to Examples 1 to 3 and Comparative Example was injected into the mold. Then, the film was first cured at 80 ° C for 1 hour, and further thermally cured at 160 ° C for 1 hour to form a film-shaped encapsulation.
The water permeability was measured using a moisture permeability meter (ASTM F-1249, manufactured by MOCON), and the oxygen permeability was measured using an air permeability meter (ASTM D-3985, manufactured by MOCON).
The results are shown in Table 2.
As shown in Table 2, it can be seen that the sealing materials according to Examples 1 to 3 are greatly lowered in water permeability and oxygen permeability compared with the sealing material according to the comparative example.
Rating 3
The encapsulant according to Examples 1 to 3 and Comparative Example was injected into a mold equipped with a light emitting diode chip using a syringe. Then, the resultant was thermally cured at 80 DEG C for 1 hour and at 160 DEG C for 1 hour to form an encapsulating portion.
Then, the test piece was continuously operated at a condition of 85 ° C / 85% RH (ralative humidity) and 120 mA, and then the time at which the discoloration occurred in the sealed portion was observed to confirm reliability.
The discoloration was observed using an optical microscope (magnification: 200x).
The results are shown in Table 3.
In Table 3, ⊚ indicates that no discoloration occurs within 8 weeks, ◯ indicates that discoloration occurs between 4 and 8 weeks, and X indicates discoloration within 4 weeks.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And falls within the scope of the invention.
110: Mold 120: Lead frame
140: light emitting diode chip 150: bonding wire
180: Resin 190: Phosphor
200:
Claims (11)
A first polysiloxane having silicon-bonded hydrogen (Si-H) at its end, and
A second polysiloxane having a silicon-bonded alkenyl group (Si-Vi)
.
Wherein the silane coupling agent is represented by the following formula (1).
[Chemical Formula 1]
In Formula 1,
R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
Wherein the silane coupling agent is represented by the following formula (1a) or (1b).
[Formula 1a]
[Chemical Formula 1b]
In the above formula (1a) or (1b)
R a to R 1 are each independently hydrogen or fluorine,
At least one of R a to R e and at least one of R f to R l is fluorine,
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
The silane coupling agent is represented by the following formula (1aa) or (1bb).
(1aa)
≪ RTI ID = 0.0 &
In the above general formula (1aa) or (1bb)
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
Wherein the silane coupling agent is contained in an amount of 10 to 100 parts by weight based on 100 parts by weight of the filler.
Wherein the filler comprises silica, alumina, titanium oxide, zinc oxide or a combination thereof.
Wherein the filler surface-treated with the silane coupling agent is contained in an amount of 0.01 to 10% by weight based on the total amount of the sealing material.
Wherein the first polysiloxane is represented by the following formula (2).
(2)
(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1
In Formula 1,
R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R < 1 > to R < 6 >
0 < D1 < 1, 0 <
M1 + D1 + T1 + Q1 = 1.
Wherein the second polysiloxane is represented by the following formula (3).
(3)
(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2
In Formula 3,
R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,
0 < M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <
M2 + D2 + T2 + Q2 = 1.
Wherein the first polysiloxane comprises less than 50% by weight based on the total amount of the encapsulant,
Wherein said second polysiloxane is contained in an amount greater than 50% by weight based on the total amount of said encapsulant.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120133067A KR101574085B1 (en) | 2012-11-22 | 2012-11-22 | Encapsulation material and electronic device including the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120133067A KR101574085B1 (en) | 2012-11-22 | 2012-11-22 | Encapsulation material and electronic device including the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140065952A true KR20140065952A (en) | 2014-05-30 |
| KR101574085B1 KR101574085B1 (en) | 2015-12-03 |
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| JP4006220B2 (en) | 2001-11-02 | 2007-11-14 | 三菱レイヨン株式会社 | Surface-modified spherical silica, method for producing the same, and resin composition for semiconductor encapsulant |
| JP4428618B2 (en) | 2003-07-01 | 2010-03-10 | 三菱レイヨン株式会社 | Surface-modified spherical silica, method for producing the same, and sealing resin composition |
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