KR20140050550A - 경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판 - Google Patents

경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판 Download PDF

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Publication number
KR20140050550A
KR20140050550A KR1020130123014A KR20130123014A KR20140050550A KR 20140050550 A KR20140050550 A KR 20140050550A KR 1020130123014 A KR1020130123014 A KR 1020130123014A KR 20130123014 A KR20130123014 A KR 20130123014A KR 20140050550 A KR20140050550 A KR 20140050550A
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KR
South Korea
Prior art keywords
resin composition
curable resin
group
coating film
reflectance
Prior art date
Application number
KR1020130123014A
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English (en)
Korean (ko)
Inventor
슈이찌 야마모또
고우스께 나까지마
유따까 요꼬야마
도우꼬 시이나
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013153737A external-priority patent/JP5841570B2/ja
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20140050550A publication Critical patent/KR20140050550A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
KR1020130123014A 2012-10-19 2013-10-16 경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판 KR20140050550A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-231450 2012-10-19
JP2012231450 2012-10-19
JP2013153737A JP5841570B2 (ja) 2012-10-19 2013-07-24 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
JPJP-P-2013-153737 2013-07-24

Publications (1)

Publication Number Publication Date
KR20140050550A true KR20140050550A (ko) 2014-04-29

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ID=50569876

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130123014A KR20140050550A (ko) 2012-10-19 2013-10-16 경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판

Country Status (2)

Country Link
KR (1) KR20140050550A (zh)
CN (1) CN103777465B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180058694A (ko) * 2018-05-23 2018-06-01 주식회사 효성 백색도가 향상된 폴리케톤 조성물
CN113777881A (zh) * 2020-06-10 2021-12-10 韩国太阳油墨有限公司 阻焊树脂组合物、阻焊结构体、干膜及印刷线路板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE039629T2 (hu) * 2014-12-10 2019-01-28 Goo Chemical Co Ltd Folyékony, forraszanyagnak ellenálló készítmény és bevonattal ellátott nyomtatott áramköri lap
CN108227378B (zh) * 2016-12-15 2023-12-15 太阳油墨（苏州）有限公司 热固化阻焊剂组合物、其干膜、和固化物以及印刷电路板
JP2018131533A (ja) * 2017-02-15 2018-08-23 オリンパス株式会社 医療機器用塗料および医療機器
CN113630958A (zh) * 2020-05-06 2021-11-09 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法、背光板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238771A (ja) * 2008-03-25 2009-10-15 Taiyo Ink Mfg Ltd 白色硬化性樹脂組成物及びその硬化物からなる絶縁層を有するプリント配線板
JP5650460B2 (ja) * 2010-08-18 2015-01-07 株式会社タムラ製作所 白色硬化性樹脂組成物
TWI519581B (zh) * 2010-12-28 2016-02-01 Tamura Seisakusho Kk White hardening resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180058694A (ko) * 2018-05-23 2018-06-01 주식회사 효성 백색도가 향상된 폴리케톤 조성물
CN113777881A (zh) * 2020-06-10 2021-12-10 韩国太阳油墨有限公司 阻焊树脂组合物、阻焊结构体、干膜及印刷线路板

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Publication number Publication date
CN103777465B (zh) 2017-04-12
CN103777465A (zh) 2014-05-07

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