KR20130113027A - Backlight unit - Google Patents

Backlight unit Download PDF

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Publication number
KR20130113027A
KR20130113027A KR1020120035273A KR20120035273A KR20130113027A KR 20130113027 A KR20130113027 A KR 20130113027A KR 1020120035273 A KR1020120035273 A KR 1020120035273A KR 20120035273 A KR20120035273 A KR 20120035273A KR 20130113027 A KR20130113027 A KR 20130113027A
Authority
KR
South Korea
Prior art keywords
guide plate
light guide
circuit board
light source
light
Prior art date
Application number
KR1020120035273A
Other languages
Korean (ko)
Inventor
박동욱
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120035273A priority Critical patent/KR20130113027A/en
Publication of KR20130113027A publication Critical patent/KR20130113027A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side

Abstract

A backlight unit according to an embodiment includes a light guide plate; A light source module disposed on at least one side of the light guide plate and including a circuit board and a plurality of light sources electrically connected to the circuit board; And a bottom cover accommodating the light guide plate and the light source module, wherein the circuit board has a concave-convex structure including a plurality of concave portions and convex portions on one side thereof, and the light source is inserted into the concave portions, respectively, The light guide plate is spaced apart from the first light guide plate, and the concave-convex structure is positioned corresponding to the light guide plate.

Description

Backlight unit {BACKLIGHT UNIT}

An embodiment relates to a backlight unit.

Typically, typical large-sized display devices include a liquid crystal display (LCD), a plasma display panel (PDP), and the like.

Unlike the self-luminous PDP, an LCD requires a separate backlight unit due to the absence of its own light emitting device.

The backlight unit used in LCD is classified into an edge type backlight unit and a direct type backlight unit according to the position of the light source. In the edge type, the light source is disposed on the left and right sides or the top and bottom sides of the LCD panel and the light guide plate is used. Since the light is evenly distributed on the front surface, the light is uniform and the panel thickness can be made ultra thin.

The direct-type method is generally used for a display of 20 inches or more, and since the light source is arranged at a lower portion of the panel, the light efficiency is higher than that of the edge method. Thus, it is mainly used for a large display requiring high brightness.

CCFL (Cold Cathode Fluorescent Lamp) was used as the light source of the existing edge type or direct type backlight unit.

However, since the CCFL-based backlight unit is always powered by the CCFL, a considerable amount of power is consumed, and the problems of environmental pollution due to the addition of about 70% color reproduction rate and mercury are pointed out as disadvantages.

As a substitute for solving the above problems, research on a backlight unit using an LED (Light Emitting Diode) has been actively conducted.

When the LED is used as a backlight unit, it is possible to partially turn on / off the LED array, thereby drastically reducing the power consumption. In the case of the RGB LED, the color reproduction range specification exceeding 100% of the National Television System Committee (NTSC) So that a more vivid image quality can be provided to the consumer.

1 is a side cross-sectional view schematically showing a conventional backlight unit.

Referring to FIG. 1, a conventional backlight unit includes a light source module 30, a light guide plate 20, and a bottom cover 10 to receive them.

The light source module 30 includes a circuit board 31 and a plurality of light sources 32 electrically connected to the circuit board 31, and the light generated by the light source module 30 is incident on the light guide plate 20 to provide light. This can be spread evenly.

A plurality of through holes 31 a are formed in the circuit board 31, and the light sources 32 are inserted into the plurality of through holes 31 a, respectively.

A panel (not shown) is positioned above the light guide plate 20. When the light source 32 is positioned too close to the panel, a hot spot may occur and thus image quality may be degraded. ) Is positioned at the lower end of the circuit board 31.

In order to position the light source 32 at the lower end of the circuit board 31, the through hole 31a is also formed at the lower end of the circuit board 31, and the edge portion of the lower end of the circuit board 31 is inevitable when the through hole 31a is formed. As a result of this, processing and quality problems such as hole rupture have often occurred.

In addition, the light source 32 should be disposed to correspond to the light incident surface of the light guide plate 20 so that light can be uniformly diffused without light loss. In this case, the bottom cover is formed by the portion of the circuit board 30 below the through hole 31a. The bottom edge of (10) had to have a complicated structure in which the bottom edge was bent three times, and processing and quality problems frequently occurred.

Embodiments provide a backlight unit having improved processability and quality.

A backlight unit according to an embodiment includes a light guide plate; A light source module disposed on at least one side of the light guide plate and including a circuit board and a plurality of light sources electrically connected to the circuit board; And a bottom cover accommodating the light guide plate and the light source module, wherein the circuit board has a concave-convex structure including a plurality of concave portions and convex portions on one side thereof, and the light source is inserted into the concave portions, respectively, The light guide plate is spaced apart from the first light guide plate, and the concave-convex structure is positioned corresponding to the light guide plate.

An upper surface of the convex portion of the uneven structure may be positioned in parallel with one surface of the light guide plate facing the bottom cover.

The bottom cover may include a first region in which the light source module is disposed on one surface, and a second region extending from the first region and in which the light guide plate is positioned, wherein the bottom cover is disposed between the first region and the second region. It may include a bent portion of.

The first interval may be 0.05mm to 0.5mm.

The circuit board may include a metal substrate, an insulating layer on the metal substrate, a recess formed through the metal substrate and the insulating layer, and a circuit pattern positioned on at least a portion of the insulating layer.

The circuit pattern may be located on a surface facing the light guide plate.

The circuit pattern may be located on a surface opposite to the surface facing the light guide plate.

A heat transfer member may be positioned between the circuit board of the light source module and the first area of the bottom cover.

The reflective member may be positioned between the light guide plate and the second region of the bottom cover.

The reflective member may extend to be positioned between the light source module and the second area of the bottom cover.

The light source may include a plurality of lead frames, and the lead frame may be electrically connected to the circuit pattern, and the lead frame may be bonded to the light guide plate through a bonding layer positioned on an upper surface of the lead frame.

The circuit board may be any one of a flexible printed circuit board and a metal core printed circuit board.

The circuit board may be disposed in contact with the light guide plate.

The circuit board may be disposed spaced apart from the light guide plate.

The height of the recess may correspond to the thickness of the light guide plate.

According to the embodiment, it is possible to fundamentally solve quality problems such as hole bursting, and to solve the structural problems of the bottom cover according to the arrangement of the light guide plate and the light source, thereby manufacturing a backlight unit having improved processability and quality.

1 is a side cross-sectional view briefly showing a conventional backlight unit;
2 is a side cross-sectional view of a backlight unit according to an embodiment;
3 is a perspective view of the backlight unit of FIG. 2;
4 is an enlarged perspective view illustrating only a light source module in a backlight unit according to an embodiment;
5 and 6 are enlarged views of portion B of FIG. 2,
7 and 8 are views schematically illustrating a part of a cross-sectional view of a light guide plate and a light source module of a backlight unit according to an embodiment;
9 is an exploded perspective view briefly illustrating an embodiment of a display device in which a backlight unit is disposed according to an embodiment.

Hereinafter, embodiments will be described with reference to the accompanying drawings.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

2 is a side cross-sectional view of the backlight unit according to an embodiment, and FIG. 3 is a perspective view of the backlight unit of FIG. 2.

2 and 3, a backlight unit according to an embodiment may include a light source module 100, a light guide plate 200, and a bottom cover 300.

The bottom cover 300 accommodates the light source module 100, the light guide plate 200, and the like, and since the panel (not shown) is positioned above the light guide plate 200, the bottom cover 300 may have an open shape.

The bottom cover 300 may be formed of a metal material or a resin material, and may be manufactured through a process such as press molding or extrusion molding.

The light guide plate 200 serves to uniformly diffuse the light provided from the light source module 100. The light guide plate 200 is made of a transparent material, for example, an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN) resin. It may include at least one of.

The light source module 100 is positioned on at least one side of the light guide plate 200.

2 and 3 illustrate a two-edge type in which the light source module 100 is positioned on both side surfaces of the light guide plate 200 as an example.

The light source module 100 provides light to the light guide plate 200, and includes a circuit board 110 and a plurality of light sources 120 electrically connected to the circuit board 100.

The circuit board 110 may be a printed circuit board (PCB) having a circuit pattern formed on one surface thereof, and may be any one of a general printed circuit board, a flexible printed circuit board (PCB), or a metal core printed circuit board (Metal Core PCB). But it is not limited thereto.

The circuit board 100 may be disposed in contact with one surface of the light guide plate 200 facing each other, or may be spaced apart from each other by a predetermined interval. This will be described later.

The reflective member 400 may be positioned between the light guide plate 200 and the bottom cover 300.

The reflective member 400 may improve the brightness of the backlight unit by reflecting light directed toward the bottom surface of the light guide plate 200 facing the bottom cover 300 and pointing upward.

The reflective member 400 may be made of a material having high reflectivity, and may include, for example, a metal or metal oxide such as aluminum (Al), silver (Ag), gold (Au), titanium dioxide (TiO 2 ), or the like. It may be made of PET, PC, PVC resin and the like, but is not limited thereto.

The reflective member 400 extends to the bottom of the light source module 100 as well as the bottom surface of the light guide plate 200, and reflects the light generated by the light source module 100 and proceeds downward to further improve the brightness of the backlight unit. In this case, a shift problem that may occur when the light source module 100 is arranged may be solved.

The bottom cover 300 has a first region 310 in which the light source module 100 is fixed and positioned on one surface thereof, and a second region 320 extending from the first region 310 and having the light guide plate 200 positioned thereon. ) May be included.

The first region 310 is positioned in parallel with one surface of the light guide plate 200 facing the light source module 100, and the second region 320 forms a predetermined angle with the first region 310 and the light guide plate 200. It can be positioned parallel to the base of.

One bent part 300a exists between the first area 310 and the second area 320, and the first area 310 and the second area 320 may generally be vertical.

The heat transfer member 500 may be positioned between the circuit board 110 of the light source module 100 and the first region 310 of the bottom cover 300.

The heat transfer member 500 has excellent thermal conductivity, electrical insulation, and flame retardancy, thereby bringing the light source module 100 and the bottom cover 300 into close contact with each other, thereby transferring heat generated from the light source module 100 to the outside. It can be maximized.

4 is an enlarged perspective view illustrating only a light source module in a backlight unit according to an exemplary embodiment.

1 and 4, the light source module 100 includes a circuit board 110 and a plurality of light sources 120 electrically connected to the circuit board 100, and the circuit board 110 includes a plurality of light sources at one side thereof. And the concave-convex structure 130 including the concave portion 130a and the convex portion 130b, and the concave-convex structure 130 is positioned to correspond to the light guide plate 200.

Since the light source 120 is inserted into the concave portion 130a of the concave-convex structure 130, the light guide plate 200 is positioned to correspond to the concave-convex structure 130, so that the light source 120 disposed in the concave portion 130a is light guide plate. Light may be provided toward 200.

The upper surface 132 of the convex portion 130b of the uneven structure 130 may be positioned in parallel with one surface of the light guide plate 200 facing the second region 320 of the bottom cover 300.

That is, the virtual surface extending from one surface of the light guide plate 200 facing the second region 320 of the bottom cover 300 and the virtual surface 134 extending from the upper surface 132 of the convex portion 130b are formed. They can be placed side by side and placed in a straight line as an example.

In the related art, as shown in FIG. 1, since the light source 32 is positioned in the lower region of the center rather than one side of the circuit board 31 and the light source 32 and the light guide plate 20 correspond to each other, the circuit board 31 is located. Since the end of the) and the light guide plate 20 are not positioned side by side, the bottom surface of the bottom cover 10 forms a complicated bending structure, which frequently causes machining and quality problems.

According to the backlight unit according to the embodiment, the light source 120 is inserted into the concave portion 130a of the concave-convex structure 130 existing on one side of the circuit board 110, and the concave-convex structure 130 and the light guide plate 200 are disposed. ) Is correspondingly located, the bottom cover 300 includes only one bent portion (300a) between the first region 310 and the second region 320 can solve the conventional processing and quality problems.

The height H of the concave portion 130a of the uneven structure 130 and the thickness D of the light guide plate 200 may correspond to each other with a predetermined tolerance. For example, the height H of the concave portion 130a and the light guide plate 200 may correspond to each other. Thickness D may be the same.

The height H of the recess 130a may be the same as the size of the light source 120, and the size of the light source 120 may be smaller than the height H of the recess 130a.

5 and 6 are enlarged views of portion B of FIG. 2.

Referring to FIG. 5, the light source module 100 is positioned on one surface of the first region 310 of the bottom cover 300, and the light guide plate 200 is positioned on the second region 320 of the bottom cover 300. One bent portion 300a exists between the first region 310 and the second region 320.

The light source module 100 includes a circuit board 110 including a concave-convex structure 130 on one side, and a light source 120 disposed in the recess 130a of the concave-convex structure 130 of the circuit board 100. do.

The height H of the recess 130a of the uneven structure 130 may correspond to the thickness D of the light guide plate 200.

The reflective member 400 may be positioned between the second region 320 of the bottom cover 300 and the light guide plate 200. The reflective member 400 may improve the brightness of the backlight unit by reflecting light directed toward the bottom surface of the light guide plate 200 facing the bottom cover 300 and pointing upward.

Referring to FIG. 6, the reflective member 400 positioned between the second region 320 of the bottom cover 300 and the light guide plate 200 may include the second region 320 of the bottom cover 300 and the light source module 100. You can see that it extends to between.

That is, the reflective member 400 is not only between the second region 320 of the bottom cover 300 and the light guide plate 200, but also the circuit board of the light source module 100 and the second region 320 of the bottom cover 300. Shift between the 110 and the light source 120 to reflect the light generated in the light source module 100 and proceeding downward to further improve the brightness of the backlight unit, and a shift that may occur when the light source module 100 is arranged. (shift) can solve the problem.

7 and 8 are views schematically illustrating a part of a cross-sectional view of a light guide plate and a light source module of a backlight unit according to an embodiment.

Referring to FIG. 7, the circuit board 110 of the light source module 100 is disposed in contact with one surface of the light guide plate 200 facing the light source module 100, and the light source 120 of the light source module 100 emits light. A surface may be disposed to be spaced apart from one surface of the light guide plate 200 by a first interval d.

Since the light source 110 is disposed so that the light exit surface is spaced apart from the light guide plate 200 by the first gap d, the light generated by the light source 110 is uniformly diffused in the light guide plate 200. This can be prevented from occurring.

The first interval d may be, for example, 0.05 mm to 0.5 mm.

The circuit board 110 includes a metal substrate 111, an insulating layer 112 on the metal substrate 111, and a circuit pattern 113 positioned on at least a portion of the insulating layer 112.

The circuit board 110 may have a concave-convex structure 130 on one side, and the concave portion 130a of the concave-convex structure 130a may be formed through the metal substrate 111 and the insulating layer 112.

The metal substrate 111 may be formed of an alloy including copper (Cu), aluminum (Al), silver (Ag), gold (Au), or the like as a heat radiation plate having high thermal conductivity.

The insulating layer 112 is positioned between the metal substrate 111 and the circuit pattern 113 to prevent electrical short, and may be formed of an epoxy or polyamide resin or an oxide or nitride.

A circuit pattern 113 is formed on at least a portion of the insulating layer 112, and the light source 120 is electrically connected to the circuit pattern 113.

Since the circuit board 110 is disposed to be in contact with the light guide plate 200, the metal substrate 111 is positioned at the portion that is in contact with the light guide plate 200, and the circuit pattern 113 is located at a surface opposite to the light guide plate 200.

The light source 120 disposed in the recess 130a of the uneven structure 130 of the circuit board 110 may be a light emitting device package.

The light source 120, which is a light emitting device package, includes a body 121, a plurality of lead frames 123 and 124 installed on the body 121, and are installed on the body 121 to electrically connect with the lead frames 123 and 124. The light emitting device 122 may be connected to each other, and the molding unit 126 may be formed to cover the light emitting device 122. A cavity may be formed in the body 121.

The body 121 may include a silicon material, a synthetic resin material, or a metal material. When the body 121 is made of a conductive material such as a metal material, although not shown, an insulating layer may be coated on the surface of the body 121 to prevent an electrical short between the lead frames 123 and 124.

The lead frames 123 and 124 are electrically separated from each other, and supply current to the light emitting device 122. In addition, the lead frames 123 and 124 may increase light efficiency by reflecting the light generated by the light emitting device 122 and may also radiate heat generated by the light emitting device 122 to the outside.

The light emitting device 122 may be installed on the body 121 or on the lead frames 123 and 124. The light emitting device 122 may be connected to the lead frames 123 and 124 by a flip chip method or a die bonding method in addition to the wire 125 bonding method.

The molding part 126 may surround and protect the light emitting device 122. In addition, a phosphor is included on the molding part 126 to change the wavelength of light emitted from the light emitting device 122.

The phosphor may include a garnet-based phosphor, a silicate-based phosphor, a nitride-based phosphor, or an oxynitride-based phosphor.

For example, the garnet-base phosphor is YAG (Y 3 Al 5 O 12 : Ce 3 +) or TAG: may be a (Tb 3 Al 5 O 12 Ce 3 +), wherein the silicate-based phosphor is (Sr, Ba, Mg, Ca) 2 SiO 4 : Eu 2 + , and the nitride phosphor may be CaAlSiN 3 : Eu 2 + containing SiN, and the oxynitride phosphor may be Si 6 - x Al x O x N 8 -x: Eu 2 + (0 <x <6) can be.

Light in the first wavelength region emitted from the light emitting element 122 is excited by the phosphor 250 and converted into light in the second wavelength region, and the light in the second wavelength region passes through a lens (not shown). The light path can be changed.

The lead frames 123 and 124 of the light source 120 may be electrically connected to the circuit patterns 113 of the circuit board 110 to supply a current required for driving the light source 120.

Referring to FIG. 8, the circuit board 110 of the light source module 100 is disposed to be spaced apart from one surface of the light guide plate 200 facing the light source module 100 by a first distance d, whereby the light exit surface is disposed on the light guide plate. The light source 120 may be disposed to be spaced apart from one surface of the 200 at a first interval d.

Portions overlapping with the contents described with reference to FIG. 7 will not be described again, and the following description will focus on differences.

When the circuit board 110 is spaced apart from the light guide plate 200, the circuit pattern 113 is positioned on a surface facing the light guide plate 200, and the metal substrate 111 is disposed on a surface opposite to the surface facing the light guide plate 200. ) May be located.

Referring to FIG. 8, the lead frames 123 and 124 included in the light source 120 are bent and formed in the emission surface direction of the light source 120, and the bonding layer 140 is formed on the upper surfaces of the lead frames 123 and 124. This is located.

The lead frames 123 and 124 of the light source 120 and the light guide plate 200 are bonded to each other through the bonding layer 140, and the light exit surface is formed by the bonding layer 140 and the lead frames 123 and 124. Since the light source 110 is disposed to be spaced apart from the first space d 200, the light generated by the light source 110 is uniformly diffused in the light guide plate 200, thereby preventing occurrence of a phenomenon such as Mura. can do.

9 is an exploded perspective view briefly illustrating an embodiment of a display device in which a backlight unit is disposed according to an embodiment.

Referring to FIG. 9, the display device 800 according to the exemplary embodiment is disposed in front of the light source modules 830 and 835, the reflective member 820 on the bottom cover 810, and the reflective member 820. The light guide plate 840 for guiding the light emitted from the light source module to the front of the display device, the first prism sheet 850 and the second prism sheet 860 disposed in front of the light guide plate 840, and the second prism And a panel 870 disposed in front of the sheet 860 and a color filter 880 disposed throughout the panel 870.

The light source module includes the above-described light source 835 on the circuit board 830. Here, the circuit board 830 may be a PCB, etc., the light source 835 is as described with reference to FIG.

The bottom cover 810 may house the components in the display device 800. The reflective member 820 may be provided as a separate component as shown in the figure, or may be provided in the form of a high reflective material on the back of the light guide plate 840, or the front of the bottom cover 810. It is possible.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance. The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. Here, the plurality of patterns may be provided in the stripe type and the valley repeatedly as shown.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to evenly distribute the light transmitted from the light source module and the reflective sheet in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

100: light source module 110: circuit board
120: light source 130: uneven structure
130a: concave portion 130b: convex portion
200: light guide plate 300: bottom cover
310: first region 320: second region
400: reflective member 500: heat transfer member
800: Display device 810: Bottom cover
820: reflector 840: light guide plate
850: first prism sheet 860: second prism sheet
870: Panel 880: Color filter

Claims (15)

A light guide plate;
A light source module disposed on at least one side of the light guide plate and including a circuit board and a plurality of light sources electrically connected to the circuit board; And
A bottom cover to accommodate the light guide plate and the light source module;
The circuit board has a concave-convex structure including a plurality of concave portions and convex portions on one side, and the light source is inserted into the concave portion, respectively, so that a light exit surface is spaced apart from the light guide plate by a first interval, and the concave-convex structure is the A backlight unit positioned corresponding to the light guide plate. The method of claim 1,
The upper surface of the convex portion of the concave-convex structure is located in parallel with one surface of the light guide plate facing the bottom cover. The method of claim 1,
The bottom cover may include a first region in which the light source module is disposed on one surface, and a second region extending from the first region and in which the light guide plate is positioned, wherein the bottom cover is disposed between the first region and the second region. A backlight unit comprising a bent portion of. The method of claim 1,
The first interval is 0.05mm to 0.5mm backlight unit. The method of claim 1,
The circuit board may include a metal substrate, an insulating layer on the metal substrate, a recess formed through the metal substrate and the insulating layer, and a circuit pattern on at least a portion of the insulating layer. The method of claim 5, wherein
The circuit pattern is a backlight unit located on the surface facing the light guide plate. The method of claim 5, wherein
The circuit pattern is located on the surface opposite to the surface facing the light guide plate. The method of claim 3, wherein
And a heat transfer member positioned between the circuit board of the light source module and the first area of the bottom cover. The method of claim 3, wherein
And a reflective member positioned between the light guide plate and the second area of the bottom cover. The method of claim 9,
The reflective member extends between the light source module and the second area of the bottom cover. The method according to claim 6,
The light source includes a plurality of lead frames, and the lead frame is electrically connected to the circuit pattern, and the lead frame is bonded to the light guide plate through a bonding layer positioned on an upper surface of the lead frame. The method of claim 1,
The circuit board is any one of a flexible printed circuit board or a metal core printed circuit board. The method of claim 1,
The circuit board is disposed in contact with the light guide plate. The method of claim 1,
The circuit board is disposed in the backlight unit spaced apart from the first light guide plate. The method of claim 1,
The height of the recess portion corresponds to the thickness of the light guide plate.
KR1020120035273A 2012-04-05 2012-04-05 Backlight unit KR20130113027A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140070137A (en) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 Backlight Unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140070137A (en) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 Backlight Unit

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