KR20120083017A - Apparatus and method for bonding flexible pcb on panel using anisotropic conductive film - Google Patents

Apparatus and method for bonding flexible pcb on panel using anisotropic conductive film Download PDF

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Publication number
KR20120083017A
KR20120083017A KR1020110004431A KR20110004431A KR20120083017A KR 20120083017 A KR20120083017 A KR 20120083017A KR 1020110004431 A KR1020110004431 A KR 1020110004431A KR 20110004431 A KR20110004431 A KR 20110004431A KR 20120083017 A KR20120083017 A KR 20120083017A
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KR
South Korea
Prior art keywords
film
bonding
substrate
main substrate
circuit board
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Application number
KR1020110004431A
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Korean (ko)
Inventor
한점열
Original Assignee
아프로시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아프로시스템 주식회사 filed Critical 아프로시스템 주식회사
Priority to KR1020110004431A priority Critical patent/KR20120083017A/en
Publication of KR20120083017A publication Critical patent/KR20120083017A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A bonding apparatus and a bonding method for bonding a main substrate and a flexible circuit board using an anisotropic conductive film are disclosed. The bonding method of the present invention is to heat and pressurize and bond a substrate set on which a main substrate, an anisotropic conductive film, and a flexible circuit board are stacked, and pressurize using air pressure to press the main substrate and the flexible circuit in spite of a planar state such as the main substrate. The parallelism between the substrates can be maintained within a certain range. This bonding method prevents a poor electrical connection that may occur between the main substrate and the flexible circuit board according to the plan view of the main substrate.

Description

Bonding apparatus and bonding method for bonding main board and flexible circuit board using anisotropic conductive film {Apparatus and Method for Bonding Flexible PCB on Panel Using Anisotropic Conductive Film}

The present invention relates to a bonding apparatus for bonding a main substrate and a flexible circuit board using an anisotropic conductive film and a bonding method thereof.

In accordance with the tendency of light and thin in information equipment, the main circuit board and the flexible printed circuit board (FPCB) are directly bonded by using an anisotropic conductive film (ACF) without using a separate connector. It is widely used in various devices such as a flat panel display, a touch panel, a camera module, and the like.

In the anisotropic conductive film (ACF), conductive particles or conductive balls are dispersed in the insulating adhesive film, thereby bonding two opposite substrates together and electrically connecting the conductive pads formed on the respective substrates. have.

For example, Korean Patent Laid-Open Publication No. 10-2006-0011607 discloses a method of bonding a liquid crystal display device and a flexible circuit board using an anisotropic conductive film, and a method of eliminating contact failure in a situation different from that of the present invention. Suggesting.

1 illustrates a main circuit and an FPCB bonded to each other using a conventional anisotropic conductive film, and FIG. 2 provides a description of the manufacturing process based on a cross-sectional view taken along the line A-A 'of FIG. 1. It is a drawing.

Referring to FIG. 1, the FPCB 30 is bonded to one side of the main substrate 10. The first pattern portion (or wiring) 11, which is a circuit portion made of a conductive material formed on the main substrate 10, and the second pattern portion 31, which is a circuit portion made of a conductive material formed on the FPCB 30, It is electrically connected to each other by bonding.

As shown in FIG. 2, bonding of the main substrate 10 and the FPCB 30 is performed by the ACF 50, and electrical connection between the first pattern portion 11 and the second pattern portion 31 is performed in the ACF 50. It is made of the conductive balls 51 dispersed therein.

The bonding process of the substrate using the anisotropic conductive film will be briefly described. First, the main substrate 10, the ACF 50, and the FPCB 30 are sequentially stacked. In this case, the circuit first pattern portion 11 of the main substrate 10 and the second pattern portion 31 of the FPCB 30 should be aligned to face each other.

Subsequently, when a press unit (not shown) provided on the upper side of the FPCB 30 presses the FPCB 30, the FPCB 30 and the main substrate 10 closely adhere to each other and are heated to a constant temperature. 50, the FPCB 30 and the main substrate 10 are bonded to each other. By this pressurization, the first pattern portion 11 of the main substrate 10 and the second pattern portion 31 of the FPCB 30 are inherent in the conductive balls 51 in the ACF 50, and the first The pattern portion 11 and the second pattern portion 31 are in a state of being electrically connected to each other.

However, according to the conventional method, a defect in which the first pattern portion 11 and the second pattern portion 31 are not electrically connected in an electrical test performed after bonding by an actual bonding process occurs at a substantial rate. . This problem occurs when the alignment of the first pattern portion 11 and the second pattern portion 31 does not match during the bonding process. This problem is a problem that may occur as it is in the method disclosed in the previously disclosed Patent Publication No. 10-2006-0011607.

There may be various causes of this problem, but in the process of the present invention, the applicant may be one of the causes that the parallelism of the main substrate 10 and the FPCB 30 is out of the threshold (approximately 0.005). Confirmed. In other words, in order to electrically connect the first pattern portion 11 and the second pattern portion 31 by the pressing process, the parallelism between the main substrate 10 and the FPCB 30 must be maintained within a predetermined range.

On the other hand, the parallelism assumes that the main substrate 10 and the FPCB 30 have a plan view within an absolute plane or a reference range. However, depending on the material, the main substrate 10 may not have a plan view within a desired range. For example, when the main substrate 10 is glass, it is generally not easy to maintain a range of plan views.

Therefore, the plane of the main substrate 10 may not be an absolute plane, and at least the bonding portion with the FPCB 30 may be curved with a very small curvature. 4A illustrates the main substrate 10 curved downward, but may be bulged upwardly. Therefore, the first pattern portion 11 may be formed on the curved curved surface. In this case, even if the general pressing means 41 provided on the upper side of the FPCB 30 is pressed while maintaining parallelism, the poor adhesion is not electrically connected between the first pattern portion 11 and the second pattern portion 31. Part a1 may occur.

An object of the present invention is to provide a bonding apparatus and a bonding method for bonding a main substrate and a flexible circuit board using an anisotropic conductive film.

It is still another object of the present invention to provide a bonding apparatus and a bonding method capable of maintaining alignment between respective pattern portions of the main substrate and the flexible printed circuit board by maintaining parallelism between the main substrate and the flexible printed circuit board, even during the pressing process for bonding. Is in.

In order to achieve the above object, the main substrate and the flexible circuit board are bonded to each other at the same time by electrically connecting the first pattern portion of the main substrate and the second pattern portion of the flexible circuit board using an anisotropic conductive film. The bonding apparatus includes a base plate, a pressurizing film, a pressurizing means, and a heater part.

The base plate fixes a position of a substrate set in which the main substrate, the anisotropic conductive film, and the flexible circuit board are sequentially stacked. The pressing film is fixed on the upper side of the substrate set on the base plate and is elastic.

The pressurizing means provides an air pressure acting on the upper surface of the pressurizing film so that the pressurizing film pressurizes the substrate set by the air pressure, and the heater part is heated to the substrate set to melt the anisotropic conductive film during the pressurization. Supply energy.

According to an embodiment, the pressurizing means may include a cylinder, a piston for reciprocating the inner space of the cylinder, and a piston feeder for vertically reciprocating the piston. In this case, the pressurizing film is provided in the lower end portion of the cylinder to seal the inner space portion to press the substrate set by the air pressure of the inner space portion is pressed in accordance with the downward movement of the piston.

According to another embodiment, the pressurizing film is preferably a metal plate so that the heater unit can supply thermal energy to the substrate set through the pressurizing film.

According to another embodiment of the present invention, a bonding method of bonding a main substrate and a flexible circuit board includes: disposing the substrate set on a base plate, and fixing the first pattern portion and the second pattern portion to face each other; Disposing an elastic pressing film on an upper side of the substrate set fixed to the base plate; Providing an air pressure acting on an upper surface of the pressure film, so that the pressure film presses the substrate set by the air pressure; And melting and bonding the anisotropic conductive film by supplying thermal energy to the substrate set during the pressing.

In the bonding apparatus according to the present invention, the main substrate and the flexible circuit board may be bonded to each other by heating and pressing a substrate set on which the main substrate, the anisotropic conductive film, and the flexible circuit board are stacked. Here, in the pressing step, the parallelism between the main board and the flexible circuit board can be maintained within a certain range despite the planar state of the main board or the like by using air pressure.

Accordingly, even when the planar view of the main board and the flexible printed circuit board arranged for bonding as the main board is not an absolute plane exceeds the allowable range, the bonding apparatus of the present invention can bond the electrical connection of each pattern part without problems. Can be.

The bonding apparatus of the present invention pressurizes the anisotropic conductive film and the flexible circuit board provided in the bonding to a uniform strength by using the air pressure, but to ensure a uniform uniformity of the air pressure transmission through the pressure film.

1 illustrates an example of bonding between a main board and a flexible circuit board by an anisotropic conductive film;
FIG. 2 is a cross-sectional view schematically illustrating the bonding portion of FIG. 1 cut along line AA ′; FIG.
3 is a bonding apparatus for bonding a main substrate and a flexible circuit board by using an anisotropic conductive film according to an embodiment of the present invention, and
Figure 4 is a schematic cross-sectional view comparing the cross section bonded by the bonding apparatus of the prior art and the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail with reference to the drawings.

The present invention is a problem in the prior art occurs when the parallelism between the main substrate 10 and the flexible printed circuit board (FPCB) (hereinafter referred to as 'FPCB') 30 is outside the threshold value. Pay attention to Here, the threshold of the degree of parallelism is a value required for the electrical connection between the first pattern portion 11 and the second pattern portion 31 by the ACF 50 can be obtained experimentally meaningful values.

In case the main substrate 10 or the like does not have a plan view within the reference range, the present invention provides the FPCB 30 and the main substrate 10 by pneumatic pressure through a film having a constant elasticity. A bonding apparatus capable of maintaining parallelism between the main substrates 10 is provided.

Hereinafter, a bonding apparatus 300 according to an embodiment of the present invention will be described with reference to FIG. 3. For convenience of description, the main substrate 10, the ACF 50, and the FPCB 30, which are sequentially stacked for bonding, are simply referred to as the substrate set 200.

Referring to the embodiment of Figure 3, the bonding apparatus 300 of the present invention, the pressing means for generating the air pressure for bonding the substrate set 200, and the pressing means 310 is provided below the pressing means (310) Base plate of the pressurizing film 330 to pressurize the substrate set 200 by the air pressure generated by the 310, and a plate provided under the pressing means 310 to fix the position of the substrate set 200 (Base Plate) 350).

The base plate 350 may include a means for fixing the position of the substrate set 200 mounted on the top surface. In addition, since the first pattern portion 11 and the second pattern portion 31 must maintain their mutually opposed states, the base plate 350 has the first pattern portion 11 and the second pattern portion 31 mutually opposed to each other. Fix the aligned state to face.

In addition, the bonding apparatus 300 may transfer the base plate 350 vertically or horizontally to position the substrate set 200 between the base plate 350 and the cylinder 311. Not shown).

The pressurizing means 310 may be in any form capable of generating air pressure, and it is sufficient to provide an even pressure of air pressure over the entire surface of the pressurizing membrane 330 (or the surface in contact with the FPCB 30).

For example, the pressurizing means 310 of FIG. 3 includes a cylinder 311, a piston 313 reciprocating in the cylinder 311, and a piston feeder 315 for vertically reciprocating the piston 313. . Here, the pressure film 330 is implemented in a form in which the edge thereof is connected to the open lower end of the cylinder 311 to seal the inner space 311a of the cylinder 311. For convenience of explanation, hereinafter, the pressing means 310 of FIG. 3 will be described.

The piston transfer unit 315 is a device for vertically reciprocating the piston 313 in the cylinder 311 along the inner surface of the cylinder 311, and any combination of actuators and power transmission means known in the art may be used.

For example, as shown in FIG. 3, the piston transfer part 315 may include a motor for generating a rotation force, a cam member for converting the rotational force of the motor into a vertical reciprocating motion, and a vertical reciprocating motion transmitted by the cam member. It may include a shaft for transmitting to. In addition, a load cell or the like for measuring the degree of pressurization by the piston 313 may be provided.

The pressurizing membrane 330 seals the internal space 311a, thereby facilitating the generation of air pressure due to the downward movement of the piston 313, thereby unnecessary sealing between the cylinder 311 and the base plate 350. do. In addition, the pressure film 330 facilitates the control of the size of the air pressure, and serves as a medium to allow the air pressure to be delivered to the substrate set 200 in a somewhat limited form.

Accordingly, the substrate set 200 is positioned between the base plate 350 and the cylinder 311, and then the air pressurized in the cylinder 311 while the piston 313 is transported downward by the piston transfer part 315. The pressure film 330 is pushed out. The air pressure transmitted to the pressure film 330 pressurizes the substrate set 200 on the base plate 350.

Therefore, the pressure film 330 is a synthetic resin, natural resin, metal, or other elastic material, and should be a film (or panel) having a predetermined elasticity to enable its deformation and restoration depending on the presence or absence of pressure.

Furthermore, when the pressurizing film 330 needs to transfer heat energy necessary for the bonding process of the main substrate 10 and the FPCB 30 by the ACF 50, the pressurizing film 330 is made of a metal having high thermal conductivity. Plates are preferred. For example, a copper plate obtained by thinly processing copper (Cu) can be used as the pressure film 330.

According to another exemplary embodiment, the bonding apparatus 300 may use an air bag filled with air therein, instead of the membrane 330 for pressurization. A portion of the air bag acts as the 'pressurizing membrane' of the present invention. If the air bag has a certain elasticity, the same effect as that of the pressure film 330 of FIG. 3 can be obtained.

When the internal space 311a is pressurized by the piston 313, the air in the internal space 311a is pressed, and the pressure film 330 is pushed downward by the air pressure. Accordingly, the pressing film 330 presses the substrate set 200 while being in close contact with the upper surface of the substrate set 200.

Since the pressurization by the pressurizing film 330 is made by air pressure, it has the characteristic that it acts evenly on the whole pressurizing surface of the FPCB 30 as shown in FIG.4 (b).

Furthermore, there is a feature that the direction of the pressing acts in the normal direction for each point of the main substrate 10 instead of the vertical direction not considering the pressing surface. Referring to FIG. 4B, since the main substrate 10 is generally the hardest among the substrate sets 200, the ACF 50 and the FPCB 30 are driven by the pressurization of the pressure film 330. It can be seen that the deformation is the same curvature as the shape of the top surface of the substrate 10, the pressure film 330 is also deformed in a similar shape. Thus, despite the flatness on the main substrate 10, the parallelism between the main substrate 10 and the FPCB 30 can be maintained within a certain threshold range. Therefore, unlike the adhesion failure portion a1 of FIG. 4A, the first pattern portion 11 and the second pattern portion 31 are electrically connected to each other in the curved portion b1 of the main substrate 10. Defect does not occur.

Subsequently, when the piston 313 is transferred upward, the pressurization by the pressure membrane 330 is also released while the air is released.

In addition, for the melting of the ACF 50 provided for adhesion of the main substrate 10 and the FPCB 30, the ACF 50 must be heated to a constant temperature. To this end, the bonding apparatus 300 may further include a heater unit 370 for heating the substrate set 200 to a constant temperature. The heater 370 may directly heat the substrate set 200, but considering the size of the main substrate 10, the heater 370 may be transferred through the pressure film 330 that comes into contact with the substrate set 200. It may be desirable. For example, in FIG. 3, the heater 370 is provided on the outer surface of the lower end of the cylinder 311, and the thermal energy generated by the heater 370 is provided through the pressure film 330 having a relatively excellent thermal conductivity. It is delivered to the substrate set 200.

Alternatively, the base plate 350 may be provided in the form of a container capable of accommodating the substrate set 200 therein by opening the upper portion of the base plate 350. In this case, the heater 370 may be provided on the base plate 350. However, this method may not be appropriate when a large glass panel used in a flat panel display device or a touch panel having a predetermined size or more is a main substrate.

The heater unit 370 is preferable because a ceramic heater using electrical energy can generate heat instantaneously and can control heat generation relatively easily by a method of blocking electrical energy. Here, the ceramic heater has a form in which a heating means for generating heat by electric energy is printed on a plate or a ceramic substrate of another desired form.

The bonding method based on the above bonding apparatus 300 is very simple.

After the substrate set 200 is positioned on the base plate 350, the substrate set 200 is positioned below the cylinder 311 by a transfer means (not shown). In this case, the pressure film 330 and the upper surface of the FPCB 30 may be almost in contact with each other. Subsequently, when the piston 313 is transferred downward by the piston transfer part 315, the air in the inner space part 311a is pressurized while the pressure film 330 is brought into close contact with the substrate set 200 and the substrate set 200 ) Will be pressed. At this time, when the heater unit 370 provides a predetermined thermal energy to the substrate set 200 through the pressure film 330 or the base plate 350, the ACF 50 is melted and the adhesion process is performed. During this pressing process, the first pattern portion 11 of the main substrate 10 and the second pattern portion 31 of the FPCB 30 are closely adhered while maintaining parallelism with their alignment, and the conductive balls 51 in the ACF 50 are held in close contact. The conductive ball positioned between the first pattern portion 11 and the second pattern portion 31 and fixed to electrically connect the first pattern portion 11 and the second pattern portion 31.

Although the above has been illustrated and described with respect to preferred embodiments of the present invention, the present invention is not limited to the above-described specific embodiments, it is usually in the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

10: main substrate 11: first pattern portion
30: flexible printed circuit board (FPCB) 31: second pattern portion
50: anisotropic conductive film (ACF) 51; Conductive ball
200: substrate set 300: bonding apparatus
310; Pressurization means 311: cylinder
313: piston 315: piston transfer portion
330: pressure film 350: base plate

Claims (6)

In the bonding apparatus for bonding the main substrate and the flexible circuit board at the same time by electrically connecting the first pattern portion of the main substrate and the second pattern portion of the flexible circuit board using an anisotropic conductive film,
A base plate for fixing a position of the substrate set in which the main substrate, the anisotropic conductive film and the flexible circuit board are sequentially stacked;
A pressure film fixed on the base plate on the base plate and having elasticity;
Pressurizing means for providing an air pressure acting on an upper surface of the pressurizing film, such that the pressurizing film pressurizes the substrate set by the air pressure; And
Bonding apparatus, characterized in that for bonding the main substrate and the flexible circuit board including a heater unit for supplying heat energy to the substrate set for melting the anisotropic conductive film.
The method of claim 1,
The pressing means includes a cylinder; A piston for reciprocating an inner space of the cylinder; A piston feeder configured to vertically reciprocate the piston,
The pressurizing film is provided in the lower end of the cylinder is implemented in a form to seal the inner space bonding device characterized in that for pressing the substrate set by the air pressure of the inner space portion is pressed in accordance with the downward transfer of the piston.
The method according to claim 1 or 2,
The heater unit supplies heat energy to the substrate set through the pressure film,
Bonding device, characterized in that the pressure film is a metal plate.
In the bonding method of bonding the main substrate and the flexible circuit board at the same time by electrically connecting the first pattern portion of the main substrate and the second pattern portion of the flexible circuit board using an anisotropic conductive film,
Arranging a substrate set in which the main substrate, the anisotropic conductive film, and the flexible circuit board are sequentially stacked on the base plate, and fixing the first pattern portion and the second pattern portion to face each other;
Disposing an elastic pressing film on an upper side of the substrate set fixed to the base plate;
Providing an air pressure acting on an upper surface of the pressure film, so that the pressure film presses the substrate set by the air pressure; And
Bonding the main substrate and the flexible circuit board by supplying thermal energy to the substrate set during the pressing to melt and bond the anisotropic conductive film.
The method of claim 4
A cylinder for sealing an inner space part by the pressurizing membrane, the piston transferring the inner space part downward; And
And the pressurizing film pressurizes the substrate set by the air pressure of the inner space portion pressurized according to the downward movement of the piston.
The method according to claim 4 or 5,
The bonding step is a bonding method, characterized in that for supplying thermal energy to the substrate set through the pressure film is a metal plate.



KR1020110004431A 2011-01-17 2011-01-17 Apparatus and method for bonding flexible pcb on panel using anisotropic conductive film KR20120083017A (en)

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KR1020110004431A KR20120083017A (en) 2011-01-17 2011-01-17 Apparatus and method for bonding flexible pcb on panel using anisotropic conductive film

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698387A (en) * 2020-10-27 2022-07-01 京东方科技集团股份有限公司 Display device and binding method of display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698387A (en) * 2020-10-27 2022-07-01 京东方科技集团股份有限公司 Display device and binding method of display device
CN114698387B (en) * 2020-10-27 2023-10-17 京东方科技集团股份有限公司 Display device and binding method of display device

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