KR20110120737A - Polyorganosiloxane composition having a viscosity suitable for led transfer/compression molding - Google Patents
Polyorganosiloxane composition having a viscosity suitable for led transfer/compression molding Download PDFInfo
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- KR20110120737A KR20110120737A KR1020100040292A KR20100040292A KR20110120737A KR 20110120737 A KR20110120737 A KR 20110120737A KR 1020100040292 A KR1020100040292 A KR 1020100040292A KR 20100040292 A KR20100040292 A KR 20100040292A KR 20110120737 A KR20110120737 A KR 20110120737A
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- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 238000000748 compression moulding Methods 0.000 title description 2
- 238000001721 transfer moulding Methods 0.000 title description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 19
- -1 vinyl methylsiloxy group Chemical group 0.000 claims description 14
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 229920006395 saturated elastomer Polymers 0.000 claims description 9
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 9
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 9
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 abstract description 12
- 239000007924 injection Substances 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 230000006835 compression Effects 0.000 abstract description 6
- 238000007906 compression Methods 0.000 abstract description 6
- 238000001746 injection moulding Methods 0.000 abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011369 resultant mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
Abstract
The present invention relates to a polyorganosiloxane composition having a viscosity suitable for LED injection / compression encapsulation, and more particularly to a device for LED injection / compression encapsulation, in particular an LED BLU direct type by including a combination of specific polyorganosiloxanes. It relates to a polyorganosiloxane composition having a viscosity suitable for the injection molding equipment applied to the excellent workability.
Description
The present invention relates to a polyorganosiloxane composition having a viscosity suitable for LED injection / compression encapsulation, and more particularly to a device for LED injection / compression encapsulation, in particular an LED BLU direct type by including a combination of specific polyorganosiloxanes. It relates to a polyorganosiloxane composition having a viscosity suitable for the injection molding equipment applied to the excellent workability.
LED is rapidly expanding the market as a light source with the introduction of white light technology in a simple light emitting semiconductor device. The major industries where LED is applied are expanding from mobile phones to LCD TV BLU, general lighting, and automotive lamps. In terms of cost-effectiveness, the LED industry is approaching the fluorescent light source, which is a conventional light source. .
At present, the biggest demand for LED is the side white view LED which is applied as keypad light and LED light source for mobile phones. However, as the low-end portion of the handset market has expanded and the price of LEDs has fallen, the share of the handset market has decreased, and the speed of light efficiency of LEDs has increased, leading to the LED BLU and general lighting market, where CCFL has led the market. The application range of LED is expanding.
Currently, there are two types of LED encapsulation methods: dispensing and transfer. Dispensing is a dedicated device that remembers each position of a chip on a substrate and discharges a certain amount of product in that position to form a lens. The transfer form determines the shape of the lens on the chip to form a mold and then puts it into a mold. It is a method of injecting and molding the product into the device. This is called injection, or transfer, in which case the operation of the device is not only simple but also convenient in terms of workability because of the large number of lenses to be injected and molded once. Recently, the transfer form (injection type) is increasing to improve productivity.
In general, epoxy resins have been used to encapsulate LEDs. However, epoxy resins are vulnerable to heat resistance and UV, and thus have poor weather resistance. Silicone encapsulants are used for each encapsulant and lens part, and some are now integrated and molded.
The present invention provides a polyorganosiloxane composition for LED chip encapsulation with excellent workability and excellent coating film strength, having a viscosity suitable for an LED injection / compression encapsulation facility, particularly an injection facility applied to an LED BLU direct type. It is technical problem to do.
According to the present invention, (A) a polyorganosiloxane having a structure represented by the following formula (1), (B) a linear poly having a structure represented by the following formula (2), the vinyl methyl siloxy group content is 0.006 ~ 0.2550 mol% Organosiloxane, (C) A polyorgano comprising a polyorganosiloxane having a vinyl group content of 0.001 to 10 mol%, and (D) a polyorganohydrogensiloxane represented by the following Formula (4): The siloxane composition is provided:
[Formula 1]
(R 1 R 2 R 3 SiO 1/2) X and (SiO 2) Z
In Formula 1, R 1 to R 3 are each independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, at least one of R 1 is an alkenyl group, X and Ｚ are each a number greater than 0 And X + Z = 1.
[Formula 2]
R 1 a SiO (4-a) / 2
In Formula 2, R1 is an aliphatic saturated or unsaturated hydrocarbon group, but the content of vinylmethylsiloxy group in the molecule is 0.006-0.250 mol%, and a is a number of 1.95-0.05.
(3)
RR1 2 SiO (R1 2 SiO) n SiR1 2 R
In Formula 3, R1 represents an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group, and the vinyl group content in the molecule is 0.001 to 10 mol%, R is a vinyl group, and n is an integer of 50 to 250.
[Formula 4]
RR1 2 SiO (R1HSiO) m (R2 2 SiO) n SiR1 2 R
In Formula 4, R, R1, and R2 are each independently an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group, and m and n are each independently an integer of 10 to 100.
The polyorganosiloxane composition of the present invention can be suitably used for LED injection / compression encapsulation, in particular for injection applied to LED BLU direct type.
Hereinafter, the present invention will be described in more detail.
The composition of the present invention includes a polyorganosiloxane (A) having a structure represented by the following formula (1):
[Formula 1]
(R 1 R 2 R 3 SiO 1/2) X and (SiO 2) Z
In Formula 1, R 1 to R 3 are each independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms (for example, methyl group, ethyl group, propyl group, butyl group, isobutyl group, hexyl group, vinyl group, butenyl group, hexenyl group, isobutoxy te group such as an alkenyl group;; a phenyl group, a tolyl group such as an aryl group; octyl group such as an alkyl group of one of the benzene group, a phenyl group and the like aralkyl groups, etc.), provided that R 1 in the dog The above is an alkenyl group, X and X are numbers larger than 0, respectively, and X + Z = 1.
The polyorganosiloxane of the component (A) has a branched or three-dimensional mesh structure containing (SiO 2 ) Z units, and when applied to an encapsulant, it is transparent and has high hardness, high heat resistance and high weather resistance coating film. Can be formed. The polyorganosiloxane of component (A) is preferably contained in the composition of the present invention 10 to 70 wt%, more preferably 10 to 50 wt%. If the content of the component (A) is less than 10 wt%, there may be a problem in expressing the coating film strength and elasticity as rubber, and if it exceeds 70 wt%, brittleness may be strong and cracking may occur. have.
In addition, the composition of the present invention has a structure represented by the following formula (2), and includes a linear polyorganosiloxane (B) having a vinyl methylsiloxy group content of 0.006-0.250 mol%:
[Formula 2]
R 1 a SiO (4-a) / 2
In Formula 2, R1 represents an aliphatic saturated or unsaturated hydrocarbon group (eg, an alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isobutyl group, hexyl group, octyl group, etc .; vinyl group, butenyl group) , Alkenyl group having 1 to 10 carbon atoms such as hexenyl group, isobutenyl group, etc., but the vinylmethylsiloxy group content in the molecule is 0.006 to 0.2550% by mole, and a is the number of 1.95 to 2.05.
The polyorganosiloxane of the component (B) is preferably a linear polymer having a trimethylsilyl group or a dimethylvinylsilyl group at the sock end. If the content of the vinylmethylsiloxy group in the polyorganosiloxane molecule of the component (B) is less than 0.006 mol% or more than 0.250 mol%, problems may occur in coating properties, hardness, and tensile strength of the product.
Further, the polyorganosiloxane of component (B) preferably has a viscosity of 10,000,000 to 120,000,000 cP at 25 ° C. If the viscosity at 25 ℃ less than 10,000,000 cP may have a problem that the viscosity of the product is lowered to the level unsuitable for injection, if the viscosity exceeds 120,000,000 cP may have a problem that the viscosity is too high unsuitable for injection equipment.
The polyorganosiloxane of the component (B) is preferably included in the composition of the present invention 0.1 to 20 wt%, more preferably 0.5 to 10 wt%. If the content of the composition of the component (B) is less than 0.1 wt% or more than 20 wt%, there may be a problem in the coating properties (elasticity and resilience) as the rubber of the product.
In addition, the composition of the present invention is represented by the following formula (3), and includes a polyorganosiloxane (C) having a vinyl group content of 0.001 to 10 mol%:
(3)
RR1 2 SiO (R1 2 SiO) n SiR1 2 R
In Formula 3, R1 is an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group (for example, alkyl group such as methyl group, ethyl group, propyl group, butyl group, isobutyl group, hexyl group, octyl group; vinyl group, butenyl group, hex) Alkenyl groups such as senyl group and isobutenyl group; aryl groups such as phenyl group and tolyl group; aralkyl groups such as benzene group and phenylethyl group; and the like. It is a methyl group, R is a vinyl group, n is an integer of 50-250.
The polyorganosiloxane of component (C) preferably has a vinyl group at the sock end. The vinyl group content in the polyorganosiloxane molecule of component (C) is 0.001 to 10 mol%, preferably 0.005 to 5 mol%. If the vinyl group content is less than 0.001 mol%, there is a problem in forming an appropriate crosslinking density. If the vinyl group content is more than 10 mol%, brittleness of the coating film becomes strong. In addition, the polyorganosiloxane of the component (C) preferably has a viscosity of 100 to 200,000 cP at 25 ° C. If the viscosity at 25 ° C. is less than 100 cP, the viscosity drops, and if it exceeds 200,000 cP, there may be a problem in the process for manufacturing the product.
The polyorganosiloxane of component (C) is preferably included in the composition of the present invention 20 to 80 wt%, more preferably 30 to 70 wt%. The content of the composition of the component (C) affects the tensile strength, hardness, etc., which are the cured product properties of the product, and can be adjusted according to the desired physical properties. If the content is maintained at 20 to 80 wt% level, the brittleness of the product is attenuated and thus the elasticity is excellent. There is an interrelationship between the brittleness of the product and other physical properties and therefore may vary with content control.
In addition, the composition of the present invention includes a polyorganohydrogensiloxane (D) represented by the following formula (4):
[Formula 4]
RR1 2 SiO (R1HSiO) m (R2 2 SiO) n SiR1 2 R
In Formula 4, R, R1, and R2 each independently represent an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group (eg, an alkyl group such as methyl group, ethyl group, propyl group, butyl group, isobutyl group, hexyl group, octyl group; Alkenyl groups such as vinyl group, butenyl group, hexenyl group and isobutenyl group; aryl groups such as phenyl group and tolyl group; aralkyl groups such as benzene group and phenylethyl group), and m and n are each independently 10 to 100; Is an integer.
The polyorganohydrogensiloxane of the component (D) preferably contains 1.0 to 10 mmol / g of a hydrogen group in the side chain. This hydrogen group has a correlation with rubber properties such as elasticity, tensile strength, and hardness, and these properties can be appropriately controlled by maintaining the above-described content.
The polyorganohydrogensiloxane of component (D) is preferably contained in the composition of the present invention 3 to 20 wt%, more preferably 5 to 15 wt%. When the content of the composition of the component (D) is 3 to 20 wt%, the crosslinking density is too low to be gelled rather than rubbery, or a raw material having a content exceeding to obtain the same crosslinking density of the rubber phase or brittle ( brittleness) may occur.
In order to cure the composition of the present invention, in order to crosslink the polyorganosiloxane including the vinyl group and the polyorganohydrogen siloxane, a curing catalyst (E) is further included in addition to the components A to D described above. A platinum compound may be used as the curable catalyst. According to one embodiment of the present invention, the platinum catalyst has a zero oxidation number as a complex compound, and may form a complex compound with a low molecular weight vinylsiloxane in order to increase the reactivity and compatibility with the silicon polymer. It is preferable that the platinum content in the platinum compound added with a catalyst is 0.5-5 wt%. The amount of catalyst component usable in the composition of the present invention is preferably 0.01 to 2.0 wt%, more preferably 0.05 to 0.5 wt% per 100 wt% of the composition. If the amount of the catalyst component is too small, the reaction rate may be slow, or the reaction may be incomplete, thus creating a rubbery property. On the contrary, if the amount is too high, problems such as yellowing may occur.
In the composition of the present invention, a curing retardant (F) may be further added together with the above-described catalyst to appropriately adjust the curing rate according to the use and workability. Such curing retardants include compounds having double or triple bonds, such as 1-ethynyl-1-cyclohexanol, 1,1,3,3, -tetramethyl-1,3-divinyldisilazane, 2, 4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 2-methyl-3-butyn-2-ol and the like can be used. The amount of curing retardant usable in the composition of the present invention is preferably 0.01 to 0.7 wt% per 100 wt% of the composition. If the amount of the curing retardant is too small, the curing speed may be too high, on the contrary, if too large, there is a problem that the silicone rubber is uncured.
There is no particular limitation on the method of preparing the composition of the present invention. Although not limited thereto, according to one embodiment of the present invention, after mixing the component (A) and the component (C), the component (B) is added and heated under reduced pressure, in which the component (B) is highly polymerized. It is for mixing with a component (A) and a component (C) in a short time with polyorganosiloxane. Thereafter, components (D), (E), and (F) may be mixed in order to knead uniformly to prepare a composition of the present invention.
Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are merely to illustrate the invention, but the content of the present invention is not limited by the following examples.
Example One
100 parts by weight of polyorganosiloxane (molecular weight 5,311) component (A) having an alkenyl group (vinyl group) and 170 parts by weight of polyorganosiloxane (molecular weight 76,000) component (C) having a viscosity of 10,000 centipoise After mixing the parts uniformly using a Dissolver, 1 part by weight of the polyorganosiloxane component (B) having a terminal vinyl methylsiloxy group content of 0.01 mmol% was added thereto, and the mixture was heated to 90 ° C. under reduced pressure for 3 hours. It was kneaded uniformly. The resultant mixture was colorless and transparent and had a uniform appearance as a liquid silicone polyorganosiloxane.
Thereafter, 40 parts by weight of the polyorganohydrogensiloxane (molecular weight 8,900) component (D) of the formula (4) was mixed as a crosslinking agent and uniformly kneaded.
After uniform mixing, the resultant temperature was lowered to 50 ° C. or lower, and 0.3 parts by weight of component (E) (platinum-based complex compound having a Pt content of 1% and a ligand of Vi-mm (vinyl dimer)) and component (F) (1 0.1 parts by weight of ethynyl-1-cyclohexanol) was separately added, followed by stirring for 30 minutes.
The composition obtained as mentioned above was press-cured at 170 degreeC for 10 minutes, and the rubber sheet of 2 mm thickness was obtained. For the obtained rubber sheet specimens, hardness (durometer A), tensile strength, and elongation were measured based on KS M6518 and shown in Table 1 below.
Example 2
Except for using 50 parts by weight of component (B) to prepare a composition in the same manner as in Example 1, by using the same as in Example 1 to prepare a specimen, and to measure the same physical properties in Table 1 Indicated.
Example 3
A composition was prepared in the same manner as in Example 1, except that 70 parts by weight of component (B) was used. A test piece was prepared in the same manner as in Example 1, and the physical properties thereof were measured in the same manner as in Table 1 below. Indicated.
Comparative example One
Except that the component (B) was not used to prepare a composition in the same manner as in Example 1, using the same as in Example 1 to prepare a specimen, and to measure the physical properties in the same manner shown in Table 1 below It was.
TABLE 1
From the test results, it can be seen that the viscosity of the example is suitable for injection molding compared to the comparative example.
Claims (8)
[Formula 1]
(R 1 R 2 R 3 SiO 1/2) X and (SiO 2) Z
In Formula 1, R 1 to R 3 are each independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, at least one of R 1 is an alkenyl group, X and Ｚ are each a number greater than 0 And X + Z = 1.
(2)
R 1 a SiO (4-a) / 2
In Formula 2, R1 is an aliphatic saturated or unsaturated hydrocarbon group, but the content of vinylmethylsiloxy group in the molecule is 0.006-0.250 mol%, and a is a number of 1.95-0.05.
(3)
RR1 2 SiO (R1 2 SiO) n SiR1 2 R
In Formula 3, R1 represents an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group, and the vinyl group content in the molecule is 0.001 to 10 mol%, R is a vinyl group, and n is an integer of 50 to 250.
[Chemical Formula 4]
RR1 2 SiO (R1HSiO) m (R2 2 SiO) n SiR1 2 R
In Formula 4, R, R1, and R2 are each independently an aliphatic saturated or unsaturated hydrocarbon or aromatic hydrocarbon group, and m and n are each independently an integer of 10 to 100.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20100040292A KR101166562B1 (en) | 2010-04-29 | 2010-04-29 | Polyorganosiloxane composition having a viscosity suitable for LED Transfer/Compression molding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20100040292A KR101166562B1 (en) | 2010-04-29 | 2010-04-29 | Polyorganosiloxane composition having a viscosity suitable for LED Transfer/Compression molding |
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| KR20110120737A true KR20110120737A (en) | 2011-11-04 |
| KR101166562B1 KR101166562B1 (en) | 2012-07-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102010693B1 (en) * | 2018-02-09 | 2019-08-13 | 주식회사 케이씨씨 | Silicone rubber composition |
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| US4032502A (en) | 1975-10-10 | 1977-06-28 | Dow Corning Corporation | Organosiloxane compositions for liquid injection |
| JP3712054B2 (en) | 2001-04-13 | 2005-11-02 | 信越化学工業株式会社 | Sealing material for polymer electrolyte fuel cell separator |
| JP3865639B2 (en) | 2002-01-28 | 2007-01-10 | 信越化学工業株式会社 | Silicone composition for semiconductor encapsulation and semiconductor device |
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| KR102010693B1 (en) * | 2018-02-09 | 2019-08-13 | 주식회사 케이씨씨 | Silicone rubber composition |
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