KR20100050320A - Address electrode paste - Google Patents

Abstract

The present invention relates to an address electrode paste. The address electrode paste according to the present invention comprises a glass frit, a silver powder, a solvent and a photopolymerizable monomer, wherein the average particle diameter (D ₅₀ ) value of the silver powder is 1.7 to 3.21 μm, and the maximum particle diameter (D _max ) value is 3.45. To 6.2 µm. As a result, the thickness of the address electrode is 2 µm or less, whereby thin film can be realized, and the electrode can maintain excellent conductivity.

Description

Address electrode paste

The present invention relates to an address electrode paste, and more particularly, to an address electrode paste containing silver powder having an average particle diameter (D ₅₀ ) in a predetermined range.

In general, a plasma display panel (PDP) injects a discharge gas into a discharge cell separated by a partition wall, and is caused by an energy difference when ultraviolet rays generated during plasma emission excite phosphors and return to a ground state. A display device using a light emission phenomenon of visible light.

The plasma display panel includes an upper panel, which is a display surface on which an image is displayed, and a lower panel coupled in parallel thereto, and the upper panel includes a plurality of sustain electrode pairs formed by pairing a scan electrode and a sustain electrode on the upper substrate. In the lower panel, a plurality of address electrodes are arranged on the lower substrate to intersect a plurality of pairs of sustain electrodes formed in the upper panel.

In general, the plurality of electrodes formed on the upper panel and the lower panel is formed by a method of forming a conductor pattern using photolithography technology.

On the other hand, in the above-described various electrode patterns, it is required to generate less pin holes, lower electrode resistance, and less disconnection defects. However, when the thickness of the electrode is small, many pin holes may be generated accordingly. In addition, since silver powder or the like is highly charged in the general composition of the photosensitive conductive paste, insufficient light curing cannot be performed, and undercut due to development may occur.

It is an object of the present invention to provide an address electrode paste capable of realizing a thin film having a thickness of 2 μm or less, and forming an electrode having an excellent conductivity due to the compact electrode coating.

The address electrode paste according to the present invention for achieving the above object comprises a glass frit, silver powder, a solvent and a photopolymerizable monomer, the average particle diameter (D ₅₀ ) value of the silver powder is 1.7 to 3.21㎛, the maximum particle diameter (D _max ) value is 3.45-6.2 micrometers.

In addition, the address electrode paste according to the present invention for achieving the above object, the glass frit is 3 to 5 parts by weight, the silver powder is 40 to 50 parts by weight, the solvent is 30 to 40 parts by weight and the photopolymerizable monomer 3 to 10 parts by weight.

According to the present invention, the address electrode paste contains silver powder having an average particle diameter (D ₅₀ ) of 1.7 to 3.21 μm and a maximum particle size (D _max ) of 3.45 to 6.2 μm, whereby the thickness of the address electrode is formed to be 2 μm or less, thereby reducing the thickness of the electrode. At the same time, the electrode can maintain excellent conductivity.

Hereinafter, with reference to the drawings will be described the present invention in more detail.

The address electrode paste according to an embodiment of the present invention may include 3 to 5 parts by weight of glass frit, 40 to 50 parts by weight of silver powder, 30 to 40 parts by weight of solvent, and 3 to 10 parts by weight of photopolymerizable monomer.

First, the glass frit may be included in 3 to 5 parts by weight. When the glass frit is included in less than 2 parts by weight, the adhesive strength of the conductive film to the substrate may not be sufficient, whereas when the glass frit is added in excess of 5 parts by weight, the sinterability of the conductive film is lowered and the resistance of the resulting electrode is reduced. Can increase.

Meanwhile, the glass frit has 55 to 78.4 parts by weight of lead oxide (PbO), 1.1 to 9.8 parts by weight of aluminum oxide (Al ₂ O ₃ ), and 1 to 8.9 parts by weight of boron oxide (B ₂ O ₃ ), respectively, based on 100 parts by weight of glass frit. ) And 8 to 38.4 parts by weight of silicon oxide (SiO ₂ ).

Lead oxide (PbO) is a major constituent of glass and serves to lower the firing temperature of the composition and to increase the coefficient of thermal expansion.

If the content of lead oxide (PbO) is less than 55 parts by weight relative to the total weight of the glass frit, the firing temperature of the composition may not be low enough so that the processing time may be long, whereas if it is more than 78.4 parts by weight, the coefficient of thermal expansion is too high. Lead oxide (PbO) is preferably included in the 55 to 78.4 parts by weight because it can be increased.

Aluminum oxide (Al ₂ O ₃ ) is an element for adjusting the phase separation, it is possible to improve the mechanical and chemical stability of the composition by reducing the coefficient of thermal expansion, increasing the high temperature viscosity.

If the content of aluminum oxide (Al ₂ O ₃ ) is less than 1 part by weight relative to the total weight of the glass frit, the mechanical and chemical stability of the composition may be inhibited. Since the behavior may be inadequate, aluminum oxide (Al ₂ O ₃ ) is preferably included in 1 to 9.8 parts by weight.

In addition, the composition for the dielectric may include 1 to 8.9 parts by weight of boron oxide (B ₂ O ₃ ) based on 100 parts by weight of the glass frit. Boron oxide (B ₂ O ₃ ) is a glass forming component for expanding the vitrification range of the composition, and serves to form a network structure of the dielectric composition.

Thus, when the content of boron oxide (B ₂ O ₃ ) is less than 1 part by weight relative to the total glass frit weight, the network structure of the composition cannot be sufficiently formed, and when larger than 8.9, the transition temperature of the composition is prevented from rising. Since it is difficult to, boron oxide (B ₂ O ₃ ) is preferably included in 1 to 8.9 parts by weight.

Silicon oxide (SiO ₂ ) is a glass-forming component that can stabilize the glass chemically and optically, and greatly increases the glass transition temperature (Tg) and glass softening temperature (Ts).

If the content of silicon oxide (SiO ₂ ) is less than 8 parts by weight based on the total weight of the glass frit, the chemical and optical stability of the dielectric may be impaired, and if it is greater than 38.4 parts by weight, the glass transition temperature (Tg) And the glass softening temperature (Ts) is too high, the resulting glass can easily occur phase separation.

On the other hand, it is preferable that the glass transition temperature (Tg) of a glass frit is 350-550 degreeC. When the glass transition point (Tg) of the glass frit is 350 ° C. or higher, generation of bubbles, expansion, etc. is suppressed, and adhesion with the 550 ° C. substrate is excellent, and shape defects such as pinholes and edge curls can be effectively suppressed. have.

Further, in the present invention, the glass frit is preferably a fine powder having a particle size in the range of 1.0 to 4.5 μm of the maximum particle size (Dmax) and 0.2 to 1.2 μm of the average particle diameter (D50) in order to effectively make a firing pattern without pinholes.

On the other hand, silver (Ag) powder gives electroconductivity to a paste, and although it does not specifically limit as spherical shape, a flake shape, etc., It is preferable that it is spherical in consideration of dispersibility.

Silver powder may be included in 40 to 50 parts by weight. When silver powder is less than 40 weight part, sufficient electroconductivity of the conductor pattern obtained from a paste will not be obtained, but when it contains more than 70 weight part, adhesiveness with a base material will fall and light transmittance will fall and sufficient photocuring may not be performed. It is not preferable because it becomes.

Here, the average particle diameter (D ₅₀₎ value of the powder is preferably 1.7 to 3.21㎛. In addition, the maximum particle diameter (D _max ) value may be 3.45 to 6.2㎛.

If the average particle diameter (D ₅₀ ) of the silver powder is less than 1.7 μm, the fluidity of the paste may be deteriorated and workability may be deteriorated, and light transmittance may be deteriorated and sufficient light curing may not be performed, and undercut may occur in the electrode. On the other hand, when the average particle diameter (D ₅₀ ) exceeds 3.21 μm, voids may occur in the electrode after firing, thereby increasing the electrical resistance of the electrode.

Therefore, since the address electrode paste contains silver powder having an average particle diameter (D ₅₀ ) value of 1.7 to 3.21 µm, the shrinkage ratio of the electrode can be increased in the firing step, so that the electrode can be thinned, and the electrode film is dense and excellent conductivity An address electrode can be formed.

The solvent may include, but is not limited to, an aldehyde group such as a-terpinol, buty cabitol acetate, texanol, and butyl cabitol.

The solvent is preferably included in 30 to 40 parts by weight. When the content of the solvent is less than 30 parts by weight, it may be difficult for the paste to be uniformly applied on the substrate. On the other hand, when the content of the solvent is more than 40 parts by weight, sufficient conductivity of the conductor pattern is not obtained, and It is not preferable because the adhesion is poor.

The photopolymerizable monomer is used to promote photocurability and improve developability of the address electrode paste, and may be included in an amount of 3 to 10 parts by weight.

As the photopolymerizable monomer, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylol propane Triacrylate, pentaerythrite triacrylate, pentaerythrite tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropanepropylene oxide modified triacrylate, dipentaery little pentaacrylate, dipentaeryth Little hexaacrylate and each methacrylate corresponding to the said acrylate; Mono-, di-, tri- or more polyesters of polybasic acids such as phthalic acid, adipic acid, maleic acid, ataconic acid, succinic acid, trimellitic acid and terephthalic acid with hydroxyalkyl (meth) acrylates. However, it is not limited to a specific thing, These can be used individually or in combination of 2 or more types.

When the photopolymerizable monomer is included in less than 3 parts by weight, it may be difficult to obtain sufficient photocurability, and when it exceeds 10 parts by weight, curing unevenness may occur because the photocuring becomes too fast. Therefore, the photopolymerizable monomer is preferably included in 3 to 10 parts by weight.

Moreover, the address electrode paste of this invention is benzoin and benzoin alkyl ether, such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, as a photoinitiator; Acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone- Aminoacetophenones such as 1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone; Anthraquinones such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone and 1-chloroanthraquinone; Thioxanthones, such as 2, 4- dimethyl thioxanthone, 2, 4- diethyl thioxanthone, 2-chloro thioxanthone, and 2, 4- diisopropyl thioxanthone; Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzophenones such as benzophenone; Or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphineoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine jade Phosphine oxides such as seeds and ethyl-2,4,6-trimethylbenzoylphenylphosphinate; Various peroxides etc. are mentioned, These known conventional photoinitiators can be used individually or in combination of 2 or more types.

The address electrode paste which concerns on this invention can mix | blend other additives, such as a defoaming and leveling agent, such as a silicone type and an acryl type, and a silane coupling agent for improving the adhesiveness of a film as needed.

In addition, if necessary, a known conventional antioxidant for preventing oxidation of the address metal powder, a thermal polymerization inhibitor for improving thermal stability during storage, a metal oxide as a bonding component with a substrate during firing, and silicon Fine particles such as oxides, boron oxides and low melting glass may be further added, and inorganic powders such as silica, bismuth oxide, aluminum oxide and titanium oxide, organometallic compounds, metal organic acid salts and metal alkoxides for the purpose of adjusting plastic shrinkage. Etc. can also be added.

1 is a diagram illustrating a manufacturing process of an address electrode of a plasma display panel.

Referring to FIG. 1, first, as shown in FIG. 1A, the address electrode paste 120 is applied to a substrate 110 by an appropriate method such as a screen printing method, a bar coater, a blade coater, and the like. Subsequently, in order to obtain a touch drying property, it dries in a hot air circulation type drying furnace or a far-infrared drying furnace, and an organic solvent is evaporated.

On the other hand, the address electrode paste 120 according to the present invention includes a silver powder having an average particle diameter (D ₅₀ ) value of 1.7 to 3.21㎛, it is possible to produce a thinner thin-film electrode. Therefore, the address electrode paste 120 may be applied thinly.

Next, as shown in FIG. 1B, the negative mask 130 having a predetermined pattern is positioned on the substrate 110 to which the paste 120 is applied. In this case, the mask 130 has an opening 132 formed at a position corresponding to the position where the electrode 124 is to be formed.

After the mask 130 is positioned, the mask 130 is exposed to light for a predetermined time. As an exposure amount, about 50-1000 mJ / cm <^2> is preferable. The active light source used at this time includes visible light, near infrared ray, ultraviolet ray, electron beam, X-ray dimming laser light and the like, and preferably ultraviolet ray is used.

For example, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a halogen lamp, a germicidal lamp, etc. can be used as an ultraviolet light source. Preferably, an ultra-high pressure mercury lamp may be used, but is not limited thereto.

When irradiating the UV lamp in the exposure process step, the paste 120 is cured in response to the UV lamp. At this time, the paste 120 positioned below the openings 132 is irradiated and cured by the UV lamp, and the paste 120 positioned below the portion where the openings 132 are not formed does not pass through the UV lamp. It does not harden.

On the other hand, the address electrode paste 120 according to the present invention can form a thin electrode 124, thereby minimizing the occurrence of the undercut of the electrode 124, to ensure sufficient adhesion to the substrate 110 do.

Subsequently, after removing the mask 132, the substrate 110 is developed with a developer. As the developing step, a spraying method, a dipping method, or the like is used. As a developing solution, aqueous metal alkali solutions, such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, and sodium silicate, aqueous amine solutions, such as monoethanolamine, diethanolamine, and triethanolamine, especially the dilute aqueous alkali solution of about 1.5 weight% or less is used. Although preferably used, the carboxyl group of the carboxyl group-containing resin in the composition may be saponified, and the unexposed portion may be removed, and is not limited to the developer as described above. In addition, it is preferable to perform washing with water or acid neutralization in order to remove unnecessary developer after development.

 As a result, as shown in (c), only the part hardened in response to the UV lamp remains, and the paste 120 in the remaining part is removed. Subsequently, the firing process is performed to complete formation of the electrode 124.

On the other hand, the electrode 124 formed of the address electrode paste 120 according to the present invention containing silver powder having an average particle diameter (D ₅₀ ) of 1.7 to 3.21 μm has a higher thickness shrinkage rate and a line width shrinkage rate, and as a result, As the density of the electrode 124 is improved, the resistance of the electrode 124 is lowered, thereby having excellent conductivity.

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to the following Examples. In the following, the unit uses parts by weight unless otherwise specified.

Butyl Carbitol Acetate and Di (propylene Glycol) Monomethyl Ether were used as a solvent for the address electrode paste of the present invention.

Such a component is mix | blended in the ratio similar to Table 1 below, and it is obtained by disperse | distributing uniformly in kneading machines, such as three rolls and a blender. The address electrode paste thus obtained was formed as a pattern of electrodes by the process as described above in FIG. 1. In addition, the address electrode paste shown in Table 1 was apply | coated to PD200 glass in thickness of 3 micrometers.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Carboxyl group-containing resin 10.76 10.76 10.76 10.76 8.76 10.76 Butyl Carbitol Acetate 14.23 14.23 14.23 14.23 13.23 14.23 Di (propylene Glycol) Monomethyl Ether 17.63 17.63 17.63 17.63 14.63 17.63 Trimethylolpropane Triacrylate 5.09 5.09 5.09 5.09 5.09 5.09 DAROCUR TPO 1.7 1.7 1.7 1.7 1.7 1.7 Ag Powder 45.66 45.66 45.66 45.66 51.66 45.66 Glass frit 4.53 4.53 4.53 4.53 4.53 4.53 BYK-352 0.4 0.4 0.4 0.4 0.4 0.4 total 100 100 100 100 100 100 D ₅₀ (㎛) 0.8 1.26 1.37 1.83 0.8 2.16 D _max (μm) 3.45 3.60 4.01 4.20 3.45 6.63

In Table 1, Examples 1 to 4 and Comparative Example 2 all have the same composition ratio. However, the particle size of the silver powder contained is different. However, in Comparative Example 1, the particle size of the silver powder is the same as that of Example 1, but the addition ratio of the silver powder is higher.

Table 2 below is a result of measuring the thickness, shrinkage, the density of the electrode and the specific resistance of the address electrode manufactured by the composition of Table 1 described above.

Shrinkage (%) Thickness of the electrode (㎛) Specific resistance (10 ^-6 Ω㎝) Density Example 1 37 1.89 2.5 ○ Example 2 36 1.92 2.7 ○ Example 3 36 1.93 2.6 ○ Example 4 33.3 2.0 3 ○ Comparative Example 1 42 1.71 5.2 ○ Comparative Example 2 22.3 2.33 5 ×

Here, the thickness of the electrode represents the thickness of the address electrode after firing, and the shrinkage ratio represents the difference between the thickness of the coated paste and the thickness of the electrode after firing, based on the thickness of the first paste. The density was visually observed by photographing the formed address electrode, and FIGS. 2A and 2B are photographs of Comparative Example 2 and Example 1. FIG.

First, referring to FIG. 2A, when the address electrode is formed by the paste having the composition of Comparative Example 2, it is understood that voids are formed in the formed electrode and the density is inferior. As a result, as shown in Table 2, the specific resistance of the electrode increases to increase the resistance value.

Figure 2b is taken in Example 1, it can be seen that the width of the electrode is narrower than Comparative Example 2. This is a result of forming the address electrode using a paste containing a small particle size of the silver powder according to the present invention, the shrinkage occurs more during the firing process to improve the density of the address electrode, and thus the resistance of the electrode can be lowered It means that there is.

On the other hand, the thickness of the address electrode formed by the address electrode paste of the present invention can be formed to be 2㎛ or less, it is possible to realize a thin film. However, as can be seen in Comparative Example 1 of Table 2, when the thickness of the electrode is formed to be thinner than 1.89㎛, it can be seen that the resistance value of the electrode increases. This is because when the silver powder is contained too much, light transmittance is poor and sufficient photocuring cannot be performed, and undercut occurs in the electrode.

Therefore, the address electrode paste preferably contains 40 to 50 parts by weight of silver powder having an average particle diameter (D ₅₀ ) of 1.7 to 3.21 µm and a maximum particle diameter (D _max ) of 3.45 to 6.2 µm. The address electrode formed of this structure can realize a thin film of 2 m or less. In addition, the electrode has a thickness of 1.89 µm or more, so that the electrode can maintain excellent conductivity.

3 is a diagram illustrating a structure of a PDP including an address electrode according to the present invention.

Referring to the drawings, the plasma display panel 300 includes a scan electrode 311 and a sustain electrode 312, which are pairs of sustain electrodes formed on the upper substrate 310, and an address electrode 322 formed on the lower substrate 320. It includes.

The sustain electrode pairs 311 and 312 generally include transparent electrodes 311a and 312a and bus electrodes 311b and 312b formed of indium tin oxide (ITO). 312b) may be formed of a metal such as silver (Ag) or chromium (Cr) or a stack of chromium / copper / chromium (Cr / Cu / Cr) or a stack of chromium / aluminum / chromium (Cr / Al / Cr). .

The bus electrodes 311b and 312b are formed on the transparent electrodes 311a and 312a to reduce the voltage drop caused by the transparent electrodes 311a and 312a having high resistance.

On the other hand, between the transparent electrodes 311a and 312a and the bus electrodes 311b and 311c of the scan electrode 311 and the sustain electrode 312 absorbs external light generated from the outside of the upper substrate 310 to reduce reflection. The black matrix (Black Matrix, BM, 315) is arranged to serve as a light blocking function and to improve the purity and contrast of the upper substrate 310.

The black matrix 315 is formed on the upper substrate 310. The first black matrix 315, the transparent electrodes 311a and 312a and the bus electrodes 311b and 312b are formed at positions overlapping the partition wall 321. Second black matrices 311c and 312c formed therebetween.

Here, the first black matrix 315 and the second black matrices 311c and 312c, which are also called black layers or black electrode layers, may be simultaneously formed and physically connected in the formation process, or may not be simultaneously formed and thus not physically connected. .

In addition, when physically connected and formed, the first black matrix 315 and the second black matrix 311c and 312c may be formed of the same material, but may be formed of another material when the physically separated material is formed.

The upper dielectric layer 313 and the passivation layer 314 are stacked on the upper substrate 310 having the scan electrode 311 and the sustain electrode 312 side by side. Charged particles generated by the discharge are accumulated in the upper dielectric layer 313, and may function to protect the sustain electrode pairs 311 and 312.

The passivation layer 314 protects the upper dielectric layer 313 from sputtering of charged particles generated during gas discharge, and increases emission efficiency of secondary electrons.

The address electrode 322 is formed in the direction crossing the scan electrode 311 and the sustain electrode 312.

Meanwhile, according to the present invention, the address electrode 322 includes glass frit, silver powder, a solvent, and a photopolymerizable monomer in a constant ratio, and the average particle diameter (D ₅₀ ) value of the silver powder is 1.7 to 3.21 μm, and the maximum particle diameter. It can be formed from an address electrode paste having a (D _max ) value of 3.45 to 6.2 μm.

As a result, the address electrode can realize a thin film having a thickness of 2 μm or less, and the electrode has a thickness of 1.89 μm or more, so that the electrode can maintain excellent conductivity.

The lower dielectric layer 324 and the partition wall 321 are formed on the lower substrate 320 on which the address electrode 322 is formed.

The lower dielectric layer 324 is electrically condensed to protect the address electrode 322, and is formed in white to prevent discharge light from being transmitted to the rear substrate.

Screen printing is mainly used for forming the lower dielectric layer 324. However, the lower dielectric layer 324 may be formed by various coating methods such as a green sheet laminate method, a slot coater method, and a roll coater method.

The partition wall 321 may be formed by a screen printing method, a sand blast method, a lift-off method, a photosensitive paste method, a direct etching method, or the like, and includes an etching process.

In addition, a phosphor layer 323 is formed on the surfaces of the lower dielectric layer 324 and the partition wall 321. The partition wall 321 has a vertical partition wall 321a and a horizontal partition wall 321b formed in a closed shape, and physically distinguishes the discharge cells, and prevents ultraviolet rays and visible light generated by the discharge from leaking to the adjacent discharge cells.

While the preferred embodiments of the present invention have been shown and described, the present invention is not limited to the specific embodiments described above, and the present invention is not limited to the specific embodiments of the present invention, without departing from the spirit of the invention as claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

1 is a cross-sectional view illustrating a manufacturing process of an address electrode of a plasma display panel.

2 is a view photographing Example 1 and Comparative Example 2 of the present invention.

3 is a diagram illustrating a structure of a PDP including an address electrode according to the present invention.

Claims (12)

Glass frit, silver powder, solvent and photopolymerizable monomer, An address electrode paste, wherein the average particle diameter (D ₅₀ ) of the silver powder is 1.7 to 3.21 μm, and the maximum particle size (D _max ) is 3.45 to 6.2 μm. The method of claim 1, 3 to 5 parts by weight of the glass frit, 40 to 50 parts by weight of the silver powder, 30 to 40 parts by weight of the solvent, and 3 to 10 parts by weight of the photopolymerizable monomer. The method of claim 2, The glass frit includes 55 to 78.4 parts by weight of lead oxide (PbO), 1.1 to 9.8 parts by weight of aluminum oxide (Al ₂ O ₃ ), and 10 to 25 parts by weight of boron oxide (B ₂ O ₃ ), respectively, based on 100 parts by weight of the glass frit. ), 8 to 38.4 parts by weight of silicon oxide (SiO ₂ ) and 0.3 to 11.3 parts by weight of bismuth oxide (Bi ₂ O ₃ ). The method of claim 1, The solvent includes an address electrode paste including at least one of a-terpinol, buty cabitol acetate, texanol, and butyl cabitol. The method of claim 1, The photopolymerizable monomer is 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylol Propane triacrylate, pentaerythrite triacrylate, pentaerythrite tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropanepropylene oxide modified triacrylate, dipentaery little pentaacrylate, dipenta An address electrode paste comprising at least one of an erythrilic hexaacrylate and each methacrylate corresponding to the acrylate. The method of claim 1, The maximum particle diameter (D _max ) of the glass frit is from 1.0 to 4.5 ㎛, the average particle diameter (D ₅₀ ) 0.2 to 1.2 ㎛ address electrode paste. The method of claim 1, The glass transition temperature (Tg) of the glass frit is an address electrode paste of 350 to 550 ℃. The method of claim 1, An address electrode paste further comprising at least one of a photopolymerization initiator, a leveling agent, an antifoaming agent, and a coupling agent. The method of claim 8, The photopolymerization initiator includes at least one of benzoin alkyl ethers, acetophenones, aminoacetophenones, anthraquinones, thioxanthones, benzophenones, xanthones, phosphine oxides and peroxides. Address electrode paste. An address electrode formed of a fired product of the address electrode paste of any one of claims 1 to 9. The method of claim 10, The address electrode has a thickness of 1.89 to 2㎛. A plasma display device comprising the address electrode of claim 10.

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