KR20090051627A - Multilayer ceramic substrate and manufacturing method of the same - Google Patents

Multilayer ceramic substrate and manufacturing method of the same Download PDF

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Publication number
KR20090051627A
KR20090051627A KR1020070118107A KR20070118107A KR20090051627A KR 20090051627 A KR20090051627 A KR 20090051627A KR 1020070118107 A KR1020070118107 A KR 1020070118107A KR 20070118107 A KR20070118107 A KR 20070118107A KR 20090051627 A KR20090051627 A KR 20090051627A
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KR
South Korea
Prior art keywords
ceramic
external electrode
auxiliary member
adhesive auxiliary
electrode
Prior art date
Application number
KR1020070118107A
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Korean (ko)
Inventor
김성룡
Original Assignee
삼성전기주식회사
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Priority to KR1020070118107A priority Critical patent/KR20090051627A/en
Publication of KR20090051627A publication Critical patent/KR20090051627A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

A multilayer ceramic substrate and a method of manufacturing the same have been proposed, which can enhance the adhesion of external electrodes, reduce the risk of short circuits when mounting a plurality of devices, prevent moisture penetration into the substrate, and improve product reliability. The multilayer ceramic substrate of the present invention includes a ceramic laminate, an external electrode formed on an outer surface of the ceramic laminate, and an adhesive auxiliary member including glass and ceramic powder to improve adhesion of the external electrode.

Multilayer Ceramic Substrates, External Electrodes, Adhesion, Adhesion Aids

Description

Multilayer ceramic substrate and manufacturing method thereof

The present invention relates to a multilayer ceramic substrate and a method of manufacturing the same, and more particularly, to improve the reliability of the product by increasing the adhesion of the external electrode to ensure a high accuracy of the current leakage prevention and mounting position, and improved product reliability It is about.

Recently, RF parts such as antenna switch module (ASM) and front end module (FEM), which are used in communication devices, are being developed with miniaturization and complex functionalization. It implements complex functionalization.

Low temperature co-fired ceramic (LTCC) technology, which is widely used as a multilayer structure, is a technology for forming a substrate using a co-fired method of ceramic and metal at a relatively low temperature ranging from 800 ° C to 1,000 ° C. LTCC substrates mix low-melting glass and ceramics to form a green sheet with an appropriate dielectric constant, then print conductive paste on it to print passive elements such as capacitors, resistors, or inductors in a pattern, and then stack each sheet. Thereby forming a substrate.

In detail, the ceramic substrate is formed by mixing a binder and other additives in ceramic to form a laminate in which a via for pattern connection between the inner electrode and each layer is formed on a ceramic green sheet formed in a sheet shape, and a laminate formed thereon, and an outer substrate on the surface thereof. Or, it is manufactured by forming an external electrode for electrical connection with the component and firing it. Alternatively, the ceramic substrate may be obtained by forming the internal electrode and the conductive via on the ceramic green sheet and baking the same, and separately forming the external electrode to perform the second baking.

After solder paste is printed on the LTCC substrate surface to mount external devices, devices such as high-capacity chip capacitors, chip inductors, chip resistors, and surface acoustic wave (SAW) filters are mounted to induce functional integration. Doing.

However, the recent miniaturization of LTCC modules has reached a limit on the number and area of devices that can be mounted on the surface of a substrate. Due to the reduction in the spacing between devices, undesired electrical conduction occurs between the mounted parts due to the spread of solder paste for adhesion during surface mounting of the device. There was a case when affected. In addition, during the external electrode plating, deterioration of adhesion force of the external electrode frequently occurs due to the glass erosion of the ceramic sheet around the external electrode in the etching process.

Accordingly, there has been a demand for development of a method for more reliable mounting of an external device on a ceramic substrate and a method of improving reliability of the ceramic substrate since a device embedded in the ceramic substrate may not be affected by the environment.

The present invention is to solve the above problems, an object of the present invention is to enhance the adhesion of the external electrode, to reduce the risk of short circuit when mounting a plurality of devices, to prevent moisture penetration into the substrate, etc. There is provided a multilayer ceramic substrate having improved reliability and a method of manufacturing the same.

In order to achieve the above technical problem, the multilayer ceramic substrate according to an aspect of the present invention, the ceramic pattern including the first glass and the first ceramic powder, the circuit pattern including the internal electrode is printed therein is laminated ceramic Laminate; An external electrode formed to apply an internal electrode exposed to the outside of the ceramic laminate to an external surface of the ceramic laminate and electrically connected to the circuit pattern; And an adhesive auxiliary member formed while being in contact with the surface of the external electrode and the surface of the ceramic laminate and including the second glass and the second ceramic powder.

It is preferable that a 2nd glass and a 2nd ceramic powder are the same as a 1st glass and a 1st ceramic powder, respectively.

The surface of the external electrode on which the adhesive auxiliary member is formed may be part of the side surface of the external electrode and the upper surface of the external electrode, or the surface of the external electrode on which the adhesive auxiliary member is formed may be part of the side surface of the external electrode.

The external electrode may include at least one metal selected from the group consisting of Ag, Au, Cu, and Pd.

Adhesive auxiliary member according to an embodiment of the present invention, may be formed in a layer (layer), the layer of the adhesive auxiliary member is formed on the outer surface of the ceramic substrate, can be formed surrounding the side of the external electrode have. Alternatively, the layer of the adhesive auxiliary member may further apply a portion of the upper surface of the external electrode.

According to another aspect of the invention, the step of preparing a multilayer ceramic laminate printed circuit pattern; Forming an external electrode on the outer surface of the ceramic laminate to be electrically connected to the circuit pattern; And forming an adhesive auxiliary member to be in contact with the side surface of the external electrode and the outer surface of the ceramic laminate.

The adhesive auxiliary member may be formed in a layer.

As described above, according to the present invention, it is possible to enhance the adhesion of the external electrode attached to the multilayer ceramic substrate and to improve product reliability, which can reduce the risk of short circuit between devices due to spreading of solder paste when mounting a plurality of devices. have.

In addition, since the multilayer ceramic substrate according to the present invention forms a layer on the same plane as the external electrode using the ceramic sheet composition, it is possible to block adverse environmental factors such as moisture penetrating into the ceramic substrate, thereby improving durability. It works.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity.

1A is a cross-sectional view of a multilayer ceramic substrate according to an exemplary embodiment of the present invention, and FIG. 1B is an enlarged view of portion A of FIG. 1A. The multilayer ceramic substrate 100 according to the exemplary embodiment of the present invention includes a ceramic sheet 110 and 112 including a first glass and a first ceramic powder, on which a circuit pattern including the internal electrodes 120 and 130 is printed. , 113, 114 ceramic laminates laminated; An external electrode 140 formed to apply an internal electrode 120 exposed to the outside of the ceramic laminate to an external surface of the ceramic laminate and electrically connected to a circuit pattern; And an adhesive auxiliary member 150 formed in contact with the surface of the external electrode and the surface of the ceramic laminate and including the second glass and the second ceramic powder.

The multilayer ceramic substrate 100 according to the present invention includes a ceramic laminate in which a circuit pattern including the internal electrodes 120 and 130 is printed. In the ceramic laminate, a plurality of ceramic sheets 110, 111, 112, and 113 are laminated. In FIG. 1A, the ceramic laminate shows that the ceramic sheet includes four first to fourth ceramic sheets, but it is also possible to include less than four or more than four ceramic sheets.

An internal electrode including the via electrode 120 and the internal pad electrode 130 is formed between each green sheet. Although not shown in FIG. 1A, an internal electrode may be further printed in the ceramic laminate in addition to the illustrated via electrode 120 and the inner pad electrode 130, and may also be formed on the ceramic sheet. It will be apparent to those skilled in the art (hereinafter, those skilled in the art) that these may be embedded.

The ceramic sheets 110, 111, 112, 113 comprise ceramic powders sinterable at low temperatures. The ceramic sheets 110, 111, 112, and 113 are formed in a sheet form by mixing a first ceramic powder, which is an inorganic filler, and a binder for bonding the first glass to a solvent, in a solvent. In addition to these components, additives such as dispersants for improving physical properties may be added to the ceramic sheets 110, 111, 112, and 113. As the binder, a resin such as an acrylic resin may be used, and the solvent may be water or an organic solvent.

The ceramic sheets 110, 111, 112, 113 are sintered at 800 ° C. to 900 ° C. To this end, the glass included in the ceramic sheets 110, 111, 112, and 113 may be glass including B 2 O 3 , SiO 2 , Al 2 O 3 , and CaO, and the inorganic filler may be SiO 2 , Al 2. O 3 , or TiO 2 . When the ceramic sheets 110, 111, 112, and 113 are heated, the glass component is viscously flowed into the inorganic filler and sintered. However, inorganic fillers such as Al 2 O 3 or TiO 2 have a higher sintering temperature than glass, and thus, the ceramic sheets 110, 111, 112, and 113 are sintered due to the sintering of glass components. Can be maintained.

For example, the via electrode 120 and the internal pad electrode 130 may be printed on the ceramic sheet as internal electrodes. Each of the internal electrodes 120 and 130 may be appropriately printed in the required number. The via electrode 120 may be formed by a known method, for example, a punching method or a laser irradiation method may be used.

The via electrodes 120 are punched through the ceramic sheets 110, 111, 112, and 113 or penetrated by laser irradiation to form via holes, and filled with a conductive material to print the printed circuits on the ceramic sheets 110, 111, 112, and 113. Can be connected between layers. Metal may be used as the conductive material to fill the internal electrodes 120 and 130. For example, Ag or Cu may be used. In addition to the via electrodes 120, a predetermined number of pad-shaped inner pad electrodes 130 may be formed to connect the via electrodes 120 or other printed circuits. Since the method of forming the printed circuit pattern is a known method, detailed description thereof will be omitted.

When the circuit patterns 120 and 130 are formed in the ceramic laminate, the external electrodes 140 for connecting the circuit patterns 120 and 130 and the elements or external substrates to be mounted on the outside are the surfaces of the ceramic laminate. It is formed on the surfaces of the first ceramic sheet 110 and the fourth ceramic sheet 113. Each external electrode 140 may be formed in a portion where the printed circuit pattern is exposed to the outside. Referring to FIG. 1A, the external electrode 140 is electrically connected to the via electrode 120.

The external electrode 140 may include a metal. For example, the external electrode 140 may include at least one metal selected from the group consisting of Ag, Au, Cu, and Pd. The external electrode 140 may be formed on the surface of the ceramic sheets 110, 111, 112, and 113 in the form of a metal paste by mixing a metal with a solvent such as a resin. The external electrode 140 may exhibit a desirable shape for bonding with an external device and an external substrate. For example, the external electrode 140 may have a pad shape such as the internal pad electrode 130.

The adhesive auxiliary member 150 may be formed while contacting the first ceramic sheet 110 exposed to the external surface of the external electrode 140 and the ceramic laminate to be in contact with the external electrode 140. That is, when the external electrode 140 is formed while being electrically connected to the via electrode 120, which is an internal electrode exposed to the outside from the first ceramic sheet 110, the adhesive auxiliary member 150 is connected to the external electrode 140 and the first electrode. 1 is formed to apply the ceramic sheet 110 together. The adhesive assistant member 150 is a member for improving the adhesive strength between the external electrode 140 and the first ceramic sheet 110.

The adhesive auxiliary member 150 is prepared in the form of a paste by mixing the second ceramic powder and the second glass with a solvent together with a binder, such as a material constituting the ceramic sheets 110, 111, 112, and 113, and then at a desired position. Can be implemented by application. It is preferable that the second ceramic powder and the second glass included in the adhesion assistant member 150 are the same as or similar to those included in the ceramic sheet. As the binder, a resin such as an acrylic resin may be used, and the solvent may be water or an organic solvent.

The second glass of the adhesive auxiliary member 150 may be diffused toward the ceramic laminate during sintering to increase the bonding force. It is more preferable if the glass and ceramic powder components of the adhesive auxiliary member 150 and the components of the ceramic sheets 110, 111, 112, and 113 are the same or similar, and both of them are compatible with each other to further increase the adhesive strength during the subsequent firing. Because it can.

FIG. 1B is an enlarged view of a portion A in FIG. 1A. In FIG. 1B, the adhesion assistant member 150 is formed to cover the side surface of the external electrode 140 and the top surface of the first ceramic sheet 110. The external electrode 140 and the first ceramic sheet 110 may exhibit the weakest bonding strength at the contact point 141. The surface on which the external electrode 140 and the first ceramic sheet 110 are adhered around the contact 141 is physically or chemically weak. For example, in the shrinkage process, when an acid for removing the restraint layer after firing is used, acid is introduced around the contact point 141 to damage the interface, and eventually, the external electrode 140 and the first ceramic sheet ( 110 may crack or separate. In addition, the external electrode 140 and the via electrode 120 may also be affected so that an interface thereof may be cracked or separated.

Therefore, the adhesion assistant member 150 is formed to apply the contact 141 on the side of the external electrode 140 and the first ceramic sheet 110 to improve the fixing force of the external electrode 140.

2 is a view showing an adhesive auxiliary member formed in accordance with another embodiment of the present invention, Figure 3 is a view showing an adhesive auxiliary member formed in accordance with another embodiment of the present invention. In the multilayer ceramic substrate of the present invention, the surface of the external electrode 240 on which the adhesive auxiliary member 250 is formed may be part of a side surface of the external electrode and an upper surface of the external electrode, or the adhesive auxiliary member 350 may be formed. The surface of the external electrode 340 may be part of a side surface of the external electrode 340.

2 is a view showing an adhesive auxiliary member 250 formed according to another embodiment of the present invention. The adhesion assistant member 250 is formed on a portion of the upper surface of the external electrode 240 while surrounding the side surface of the external electrode 240. Since the adhesive auxiliary member 250 is formed on a part of the upper surface of the external electrode 240, the adhesion between the external electrode 240 and the first ceramic sheet 110 is expected to be further improved.

However, when the adhesive auxiliary member 250 is formed as shown in FIG. 2, the adhesive auxiliary member 250 covers a part of the external electrode 240. Therefore, in consideration of the adhesive area of the external electrode 240, such as solder for contact with the external device to be bonded later, the adhesive auxiliary member 250 is formed to cover only a part of the upper surface of the external electrode 240 It is preferable.

3 is a view showing an adhesive auxiliary member 350 formed according to another embodiment of the present invention. In FIG. 3, the adhesion assistant member 350 is formed on a portion of the side surface of the external electrode 340 and the top surface of the first ceramic sheet 310. The adhesive auxiliary member 350 is not formed on the entire side surface of the external electrode 340, but is formed to cover a part in the height direction.

In this case, unlike the adhesive auxiliary member 250 of FIG. 2, the adhesive auxiliary member 350 in this drawing reduces the possibility of adversely affecting the performance of the external electrode 340, and is used for the adhesive auxiliary member 350. The amount of material that can be reduced can be reduced. However, since only a part of the side surface of the external electrode 340 is formed, the effect of improving the fixing strength of the external electrode 340 will be somewhat lower than that of the case of using the adhesive auxiliary member 250 of FIG. 2.

FIG. 4 is a diagram illustrating that an element is mounted on the multilayer ceramic substrate of FIG. 1A. The ceramic sheets 410, 411, 412, and 413, the via electrodes 420, the inner pad electrodes 430, the outer electrodes 440, and the adhesive auxiliary member 450 of FIG. 4 are the same as those described with reference to FIG. 1A. It will be omitted below.

4, there is shown a multilayer ceramic substrate according to an embodiment of the present invention. An external element 470 to be bonded is shown on the upper portion of the external electrode 440 and the adhesion assistant member 450 of the multilayer ceramic substrate. A solder 460 is formed on the upper surface of the external electrode 440 to face the electrode pad 480 for electrical connection between the external device 470 and the multilayer ceramic substrate.

5 is a cross-sectional view of the multilayer ceramic substrate 500 according to another exemplary embodiment of the present invention, and FIGS. 6A to 6C are plan views of the multilayer ceramic substrate 500 of FIG. 5, respectively. It is a figure which shows that a layer was formed. The ceramic sheets 510, 511, 512, and 513, the via electrodes 520, the inner pad electrodes 530, the outer electrodes 540, and the bonding auxiliary member 550 of FIG. 5 are the same as those described with reference to FIG. 1A. Will be omitted below.

In this figure, the adhesive auxiliary member is formed in a layer. The layer of the adhesive auxiliary member will be referred to as an adhesive auxiliary layer 550 hereinafter. The adhesive auxiliary layer 550 may be formed on an outer surface of the ceramic substrate, that is, the first ceramic sheet 510 and may surround the side surface of the external electrode 540. According to the present invention, since the adhesive auxiliary member includes glass and ceramic powder components, such as the ceramic sheets 510, 511, 512, and 513, the adhesive auxiliary member is formed as the adhesive auxiliary layer 550 to improve adhesion strength of the external electrode 540. In addition, the protection function from the external environment for the multilayer ceramic substrate 500 may be implemented.

The shape of the adhesive auxiliary member formed as a layer may refer to FIGS. 6A to 6C. In FIG. 6A, the via electrode 520 is exposed on the top surface of the first ceramic sheet 510. The exposed via electrode 520 is applied to the external electrode 540 as shown in FIG. 6B. Although the shape of the external electrode 540 is illustrated as a quadrangular shape in the drawing, it will be apparent that the shape is not limited thereto.

As shown in FIG. 6B, the external electrode 540 is disposed on the first ceramic sheet 510. When applied, an adhesive auxiliary layer 550 is formed to improve adhesion strength of the external electrode 540 . The multilayer ceramic substrate 500 may minimize the influence of external environmental factors such as moisture by the adhesive auxiliary layer 550 formed on the side of the external electrode 540 and the exposed region of the first ceramic sheet 510. The external electrode 540 may have improved adhesion, and leakage current of the internal electrodes 520 and 530 may be prevented.

7 is a cross-sectional view of the multilayer ceramic substrate 600 according to an embodiment of the present invention, FIG. 8 is a plan view of the multilayer ceramic substrate 600 of FIG. 7, and FIG. 9 is a device mounted on the multilayer ceramic substrate of FIG. 7. It is a figure which shows that. The ceramic sheet 610, 611, 612, and 613, the via electrode 620, the inner pad electrode 630, the outer electrode 640, and the adhesive auxiliary member 650 of FIG. 7 are the same as those described with reference to FIG. 1A. It will be omitted below.

In this drawing, the adhesive auxiliary layer 650 is further coated on not only the side surface of the external electrode 640 but also a part of the upper surface. Accordingly, the adhesion strength of the external electrode 640 is further enhanced. In FIG. 8, a region where the adhesive auxiliary layer 650 is applied to a part of the upper surface of the external electrode 640 is a region 651 in which the external electrode 640 and the adhesive auxiliary layer 650 overlap (hereinafter, referred to as an overlapping region). )to be.

Due to the overlapping region 651, the exposed area on the upper surface of the external electrode 640 is slightly reduced, but the adhesion strength reinforcing auxiliary function of the external electrode 640 of the adhesive auxiliary layer 650 increases. The difference between the size of the overlapping region 651 and the height of the adhesive auxiliary layer 650 and the external electrode 640 may be appropriately selected in consideration of strengthening the adhesion strength of the external electrode 640 and electrical connection of the external electrode 640.

In FIG. 9, a solder 660 is formed on an upper surface of the external electrode 640, and an electrode pad 680 of the external device 670 is positioned on an upper surface of the solder 660. Since the adhesive auxiliary layer 650 is formed to the upper surface of the external electrode 640, the spreadability of the solder 660 is suppressed. As a result, the short circuit rate that may occur as the solder 660 spreads is reduced.

10A to 10C are views provided to explain a method of manufacturing a multilayer ceramic substrate according to an aspect of the present invention. According to another aspect of the invention, a step of preparing a ceramic laminate by printing and stacking a circuit pattern including an internal electrode in a ceramic sheet comprising a first glass and a first ceramic powder; Forming an external electrode electrically connected to the circuit pattern to apply an internal electrode exposed to the outside of the ceramic laminate to an external surface of the ceramic laminate; Forming an adhesion assistant member comprising a second glass and a second ceramic powder to be in contact with the surface of the external electrode and the surface of the ceramic laminate; And firing the ceramic laminate; there is provided a laminated ceramic substrate manufacturing method comprising a. The adhesive auxiliary member may be implemented as a layer.

As a ceramic sheet of a laminated ceramic substrate, the first glass and the first ceramic powder are mixed together with a binder in a solvent to form a sheet. When the ceramic green sheet is formed, circuit elements such as resistors, conductors, capacitors, and inductors are printed by screen printing according to the circuit diagram, and then laminated to prepare ceramic laminates (FIG. 10A).

An external electrode is formed on the external surface of the ceramic laminate to apply the internal electrodes exposed to the outside of the ceramic laminate (FIG. 10B). Since the external electrode contacts and contacts the internal electrode, the external electrode is electrically connected to the circuit pattern, and the driving voltage is subsequently applied to the ceramic substrate from an external power source.

An adhesive auxiliary member is formed to contact the surface of the external electrode and the surface of the ceramic laminate (FIG. 10C). The adhesive auxiliary member is prepared in the form of a paste by mixing the second glass and the second ceramic powder together with a binder in a solvent, and then applying a part of the external electrode and the external surface of the ceramic laminate or all the external surfaces of the ceramic laminate. It may be formed in a layer to cover.

The ceramic laminate, in which the external electrode and the adhesive auxiliary member are formed, is fired at a temperature range of 800 ° C. to 1000 ° C. to manufacture a multilayer ceramic substrate. The adhesive auxiliary member including the second glass and the second ceramic powder behaves similarly to the ceramic sheet upon firing. Therefore, it is possible to bond more closely on the ceramic sheet, thereby increasing the bonding strength of the external electrode.

Alternatively, the ceramic substrate on which the circuit pattern is printed may be first fired, and then secondary firing may be performed after forming the external electrode and the adhesive auxiliary member.

It is intended that the invention not be limited by the foregoing embodiments and the accompanying drawings, but rather by the claims appended hereto. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

1A is a cross-sectional view of a multilayer ceramic substrate according to an exemplary embodiment of the present invention, and FIG. 1B is an enlarged view of portion A of FIG. 1A.

2 is a view showing an adhesive auxiliary member formed according to an embodiment of the present invention, Figure 3 is a view showing an adhesive auxiliary member formed according to an embodiment of the present invention.

FIG. 4 is a diagram illustrating that an element is mounted on the multilayer ceramic substrate of FIG. 1A.

5 is a cross-sectional view of a multilayer ceramic substrate according to an embodiment of the present invention. 6A to 6C are plan views of the multilayer ceramic substrate of FIG. 5, showing via electrodes, external electrodes, and an adhesive auxiliary layer, respectively.

7 is a cross-sectional view of a multilayer ceramic substrate according to an exemplary embodiment of the present invention, FIG. 8 is a plan view of the multilayer ceramic substrate of FIG. 7, and FIG. 9 is a view illustrating a device mounted on the multilayer ceramic substrate of FIG. 7.

10A to 10C are views provided to explain a method of manufacturing a multilayer ceramic substrate according to an aspect of the present invention.

<Code Description of Main Parts of Drawing>

100 laminated ceramic substrate

110, 111, 112, 113 Ceramic Green Sheet

120 Via Electrode 130 Internal Pad Electrode

140 External electrode 150 Adhesive aid

Claims (10)

A ceramic laminate in which a ceramic sheet including a first glass and a first ceramic powder, on which a circuit pattern including an internal electrode is printed, is stacked; An external electrode formed to apply an internal electrode exposed to the outside of the ceramic laminate to an external surface of the ceramic laminate and electrically connected to the circuit pattern; And And an adhesion assistant member formed in contact with the surface of the external electrode and the surface of the ceramic laminate and comprising a second glass and a second ceramic powder. The method of claim 1, The second glass and the second ceramic powder are the same as the first glass and the first ceramic powder, respectively. The method of claim 1, The surface of the external electrode on which the adhesive auxiliary member is formed, the multilayer ceramic substrate, characterized in that the part of the side of the external electrode and the upper surface of the external electrode. The method of claim 1, The surface of the external electrode on which the adhesion assistant member is formed, the multilayer ceramic substrate, characterized in that a portion of the side surface of the external electrode. The method of claim 1, The external electrode may include at least one metal selected from the group consisting of Ag, Au, Cu, and Pd. The method of claim 1, The adhesive auxiliary member is a laminated ceramic substrate, characterized in that formed in a layer (layer). The method of claim 6, The adhesive auxiliary member layer is formed on the outer surface of the ceramic substrate, characterized in that formed around the side of the external electrode laminated ceramic substrate. The method of claim 7, wherein The layer of the adhesive auxiliary member is laminated ceramic substrate, characterized in that for coating a portion of the upper surface of the external electrode. Preparing a ceramic laminate by printing and stacking a circuit pattern including an internal electrode in a ceramic sheet including a first glass and a first ceramic powder; Forming an external electrode electrically connected to the circuit pattern to apply an internal electrode exposed to the outside of the ceramic laminate to an external surface of the ceramic laminate; Forming an adhesive auxiliary member including a second glass and a second ceramic powder so as to be on the surface of the external electrode and the surface of the ceramic laminate; And Calcining the ceramic laminate; The method of claim 9, The adhesive auxiliary member is a laminated ceramic substrate manufacturing method, characterized in that formed in a layer (layer).
KR1020070118107A 2007-11-19 2007-11-19 Multilayer ceramic substrate and manufacturing method of the same KR20090051627A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051583B1 (en) * 2009-06-03 2011-07-29 삼성전기주식회사 Multilayer ceramic substrate and its manufacturing method
US10516157B2 (en) 2015-09-16 2019-12-24 Samsung Electronics Co., Ltd. Electrode active material, electrode and secondary battery including the same, and method of preparing the electrode active material
KR20220065462A (en) * 2020-11-13 2022-05-20 (주) 알엔투테크놀로지 Ceramic protect device having internal heating member and secondary battery charging apparatus having the same
KR20220117368A (en) * 2021-02-15 2022-08-24 (주) 알엔투테크놀로지 Ceramic protect device having electrode integrated fuse member and secondary battery charging apparatus having the same
US20220319777A1 (en) * 2021-03-31 2022-10-06 Tdk Corporation Laminated electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051583B1 (en) * 2009-06-03 2011-07-29 삼성전기주식회사 Multilayer ceramic substrate and its manufacturing method
US10516157B2 (en) 2015-09-16 2019-12-24 Samsung Electronics Co., Ltd. Electrode active material, electrode and secondary battery including the same, and method of preparing the electrode active material
KR20220065462A (en) * 2020-11-13 2022-05-20 (주) 알엔투테크놀로지 Ceramic protect device having internal heating member and secondary battery charging apparatus having the same
KR20220117368A (en) * 2021-02-15 2022-08-24 (주) 알엔투테크놀로지 Ceramic protect device having electrode integrated fuse member and secondary battery charging apparatus having the same
US20220319777A1 (en) * 2021-03-31 2022-10-06 Tdk Corporation Laminated electronic component
US11935700B2 (en) * 2021-03-31 2024-03-19 Tdk Corporation Laminated electronic component with differing glass content electrodes

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