KR20080000432A - Shadow mask and apparatus for depositing chemical layers which comprise the same and method for manufacturing oled with the apparatus - Google Patents

Shadow mask and apparatus for depositing chemical layers which comprise the same and method for manufacturing oled with the apparatus Download PDF

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KR20080000432A
KR20080000432A KR1020060058245A KR20060058245A KR20080000432A KR 20080000432 A KR20080000432 A KR 20080000432A KR 1020060058245 A KR1020060058245 A KR 1020060058245A KR 20060058245 A KR20060058245 A KR 20060058245A KR 20080000432 A KR20080000432 A KR 20080000432A
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shadow mask
deposition
source
organic film
substrate
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KR1020060058245A
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KR101424249B1 (en
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이상근
이준석
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엘지.필립스 엘시디 주식회사
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A shadow mask, a deposition apparatus having the same, and a method for manufacturing an OLED using the deposition apparatus are provided to improve the efficiency of deposition by easily cleaning the shadow mask. A deposition apparatus(100) includes a deposition chamber(102), a deposition source(104), a substrate(106), and a shadow mask(108). The deposition source is arranged at one side of the deposition chamber to receive a source. The substrate for forming a thin film is arranged inside the deposition chamber to face the deposition source. The coated shadow mask is arranged between the substrate and the deposition source. The shadow mask is coated with an organic film. The organic film is a photoresist composite.

Description

섀도우 마스크 및 그를 포함하는 증착 장치와 그 증착 장치를 이용한 유기전계발광소자의 제조방법 {Shadow mask and Apparatus for depositing chemical layers which comprise the same and Method for manufacturing OLED with the Apparatus}Shadow mask and deposition apparatus including the same and method for manufacturing organic light emitting device using the deposition apparatus {including shadow mask and Apparatus for depositing chemical layers which comprise the same and Method for manufacturing OLED with the Apparatus}

도 1은 본 발명의 일실시예에 따른 증착 장치의 모식도.1 is a schematic view of a deposition apparatus according to an embodiment of the present invention.

도 2는 도 1 상의 A영역의 부분 확대도.FIG. 2 is an enlarged view of a portion A of FIG. 1; FIG.

* 도면의 주요 부분에 관한 부호의 설명 *Explanation of symbols on main parts of the drawings

100 : 증착 장치 102 : 증착 챔버100: deposition apparatus 102: deposition chamber

104 : 증착원(source) 106 : 기판104: source of deposition 106: substrate

108 : 섀도우마스크 110 : 코팅 막108: shadow mask 110: coating film

112a : 발광층 112b : 증착물 112a: emitting layer 112b: deposit

본 발명은 섀도우 마스크 및 그를 포함하는 증착 장치와 그 증착 장치를 이용한 유기전계발광소자의 제조방법에 관한 것이다.The present invention relates to a shadow mask, a deposition apparatus including the same, and a method of manufacturing an organic light emitting display device using the deposition apparatus.

열적 물리적 기상 증착은 소스(source)의 증기로 기판 표면에 층을 형성하는 기술로서, 용기(vessel) 내에 수용된 소스를 기화 온도까지 가열함으로써 발생되는 소스의 증기가 수용된 용기 밖으로 이동한 후 코팅될 기판 상에서 응축되는 원리를 이용하였다. Thermal physical vapor deposition is a technique of forming a layer on the surface of a substrate with vapor from a source, the substrate being coated after moving out of the vessel containing the vapor of the source generated by heating the source contained in the vessel to the vaporization temperature. The principle of condensation in the bed was used.

이러한 증착 공정은 소스를 수용하는 용기 및 코팅될 기판이 장착된 챔버 내부에서 진행되었으며 이때, 챔버 내부는 일반적으로 10-7 내지 10-2 Torr 범위의 압력 상태로 조성되었다. This deposition process was carried out inside a chamber equipped with a vessel containing a source and a substrate to be coated, wherein the chamber was generally formed at a pressure in the range of 10 −7 to 10 −2 Torr.

소스를 수용하는 용기인 증착원(deposition source)은 전류가 벽(부재)들을 통과할 때 온도가 증가되는 전기적 저항 재료로 만들어졌다. A deposition source, a container that houses the source, is made of an electrically resistive material that increases in temperature as current passes through the walls (members).

따라서, 증착원에 전류가 인가되면, 그 내부의 소스는 증착원의 벽으로부터 전달되는 방사열 및 벽과의 접촉에 의한 전도열에 의해 가열되어 증기화되었다. Therefore, when a current is applied to the deposition source, the source therein is heated and vaporized by radiant heat transmitted from the wall of the deposition source and conductive heat by contact with the wall.

한편, 전술한 증착원의 셀 캡에는 기화된 재료 증기가 외부로 배출되도록 증기 배출 개구(vapor efflux aperture)가 형성되어 있었다.On the other hand, a vapor efflux aperture was formed in the cell cap of the above-described deposition source so that vaporized material vapor was discharged to the outside.

유기전계발광소자의 제조 방법에 있어서, 소스로 유기 화합물의 박막을 형성하는 방법으로는 일반적으로 진공 증착법이 사용되었다.In the method of manufacturing an organic light emitting device, a vacuum evaporation method is generally used as a method of forming a thin film of an organic compound as a source.

진공 증착법은 진공 상태의 챔버 내에서 증착원과 막 형성용 기판을 적당히 조합 배치하여 박막을 형성하는 방법으로 스핀 코팅(Spin-coating) 이나 디 핑(Dipping) 등의 웨트 프로세스(wet process)에 비하여 균질한 박막을 얻기 쉽다는 장점이 있다.The vacuum deposition method is a method in which a deposition source and a film forming substrate are appropriately arranged in a vacuum chamber to form a thin film, compared to wet processes such as spin-coating or dipping. There is an advantage that it is easy to obtain a homogeneous thin film.

진공 증착법으로는 비교적 전기저항이 높은 금속 용기(금속 보드)에 소스를 부착시키고, 그 금속 용기에 전류를 흘려보냄으로써 금속 용기를 가열하고, 그에 따라 소스를 증발시켜 막 형성용 기판 상에 소스 박막을 형성하는 저항 가열 증착법과, 소스에 전자빔이나 레이저빔을 조사하고 그 빔의 에너지로 소스를 증발시켜 막 형성용 기판 표면에 소스 박막을 형성하는 전자빔·레이저빔 증착법 등이 널리 사용되고 있다. In the vacuum deposition method, the source is attached to a metal container (metal board) having a relatively high electrical resistance, and the metal container is heated by flowing a current through the metal container, and the source is evaporated accordingly, so that the source thin film is formed on the film forming substrate. A resistive heating vapor deposition method for forming a film and an electron beam or laser beam vapor deposition method for irradiating an electron beam or a laser beam to a source and evaporating the source with the energy of the beam to form a source thin film on the surface of a film forming substrate are widely used.

종래 박막 형성 공정에서는 동일한 챔버 내에서 여러 종류의 소스로 박막을 형성하였고, 소스가 바뀜에 따라 기 사용된 섀도우마스크의 세정이 필요하였다.In the conventional thin film formation process, a thin film was formed from several types of sources in the same chamber, and as the source was changed, cleaning of the used shadow mask was necessary.

섀도우마스크의 세정 방법으로는 브러싱(Brushing)을 주로 사용하였으나, 외력에 의해 섀도우마스크가 변형되거나 증착 물질이 잘 분리되지 않는 문제점이 있었다. Brushing is mainly used as a method of cleaning the shadow mask, but there is a problem in that the shadow mask is deformed or the deposition material is not separated by external force.

이러한 문제를 해결하기 위해 본 발명은 세정이 용이한 섀도우마스크를 제공하는 데 그 목적이 있다.In order to solve this problem, an object of the present invention is to provide a shadow mask that is easy to clean.

다른 측면에서, 본 발명은 증착 효율이 향상된 증착 장치를 제공하고, 이를 이용한 유기전계발광소자의 제조 방법을 제공하는 데 그 목적이 있다.In another aspect, the present invention is to provide a deposition apparatus with improved deposition efficiency, and to provide a method for manufacturing an organic light emitting device using the same.

이상과 같은 목적을 달성하기 위해 본 발명은 유기막으로 코팅 처리된 섀도 우 마스크를 제공한다.In order to achieve the above object, the present invention provides a shadow mask coated with an organic film.

유기막은 포토레지스트(PR; Photo-Resist) 조성물일 수 있다.The organic layer may be a photoresist (PR) composition.

유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 한다.The organic film is characterized in that the coating to a thickness of 2㎛ or less.

다른 측면에서, 본 발명은 챔버, 챔버 내 일측에 배치되며 소스를 수용하고 배출하는 증착원, 챔버 내 증착원과 대향하여 배치되는 기판과 증착원 사이에 배치되며, 코팅 처리된 섀도우 마스크(shadowmask)를 포함하는 증착 장치를 제공한다.In another aspect, the present invention provides a chamber, a deposition shadow disposed on one side of the chamber and receiving and discharging the source, disposed between the substrate and the deposition source disposed opposite the deposition source in the chamber, the coated shadowmask It provides a deposition apparatus comprising a.

섀도우 마스크는 소스가 기판으로 향하는 경로 상에 배치된 것을 특징으로 한다.The shadow mask is characterized in that the source is disposed on a path towards the substrate.

섀도우 마스크는 유기막으로 코팅 처리될 수 있다.The shadow mask may be coated with an organic film.

유기막은 포토레지스트(PR; Photo-Resist) 조성물일 수 있다.The organic layer may be a photoresist (PR) composition.

유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 한다.The organic film is characterized in that the coating to a thickness of 2㎛ or less.

또 다른 측면에서, 본 발명은 섀도우 마스크의 표면에 유기막을 코팅하는 단계, 섀도우 마스크와 제 1 전극이 형성된 기판을 얼라인하여 발광층을 형성하는 단계, 및 섀도우 마스크를 세정하여 유기막을 제거하는 단계를 포함하는 유기전계발광소자의 제조방법을 제공한다.In another aspect, the present invention includes the steps of coating the organic film on the surface of the shadow mask, aligning the substrate on which the shadow mask and the first electrode is formed to form a light emitting layer, and cleaning the shadow mask to remove the organic film It provides a method of manufacturing an organic electroluminescent device.

유기막은 스핀 코팅법(Spin-coating)에 의해 섀도우 마스크의 표면에 코팅될 수 있다.The organic layer may be coated on the surface of the shadow mask by spin-coating.

유기막은 포토레지스트(PR; Photo-Resist) 조성물일 수 있다.The organic layer may be a photoresist (PR) composition.

유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 한다.The organic film is characterized in that the coating to a thickness of 2㎛ or less.

이하, 첨부한 도면을 참조하여 본 발명의 일실시예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

도 1은 본 발명의 일실시예에 따른 증착 장치의 모식도이다.1 is a schematic diagram of a deposition apparatus according to an embodiment of the present invention.

도 1을 참조하면, 본 발명의 일실시예에 따른 증착 장치(100)는 증착 챔버(102)의 일측에 소스(source)를 수용한 증착원(104)이 배치된다. Referring to FIG. 1, in the deposition apparatus 100 according to an embodiment of the present invention, a deposition source 104 containing a source is disposed on one side of the deposition chamber 102.

또한, 증착 챔버(102) 내부에는 증착원(104)과 대향하도록 박막 형성용 기판(106)이 배치된다. In addition, a thin film forming substrate 106 is disposed inside the deposition chamber 102 to face the deposition source 104.

박막 형성용 기판(106)은 예를 들어, 유기전계발광소자를 형성하는 경우 제 1 전극이 형성되고, 발광 영역을 구분하기 위한 절연막과 격벽이 제 1 전극과 인접하여 형성된 기판(106)일 수 있다.The thin film forming substrate 106 may be, for example, a substrate 106 in which a first electrode is formed when an organic light emitting diode is formed, and an insulating film and a partition wall are formed adjacent to the first electrode to distinguish the emission region. have.

박막 형성용 기판(106)과 증착원(104) 사이 증착원(104)으로부터 배출된 소스가 박막 형성용 기판(106)으로 향하는 경로에 코팅 처리된 섀도우마스크(108)가 배치된다.The coated shadow mask 108 is disposed in a path between the thin film forming substrate 106 and the deposition source 104 toward the thin film forming substrate 106 toward the thin film forming substrate 106.

도 2는 도 1 상의 A영역의 부분 확대도이다.FIG. 2 is a partially enlarged view of region A on FIG. 1.

도 1 및 도 2를 참조하면, 섀도우마스크(108)의 증착원(104)과 대향하는 측면은 코팅 막(110) 처리가 되어있다.1 and 2, the side of the shadow mask 108 facing the deposition source 104 is coated with a coating film 110.

코팅 막(110)으로는 유기막(110)이 사용될 수 있으며, 공정의 효율 향상 및 비용 절감 측면에서 유기막(110)으로 예를 들어 포토레지스트(PR; Photo-Resist)가 적용될 수 있다. The organic layer 110 may be used as the coating layer 110. For example, a photo-resist (PR) may be applied to the organic layer 110 in terms of improving efficiency and reducing costs.

유기막(110)은 2㎛ 이하의 두께로 형성되는 것이 바람직하며, 2㎛ 초과시 섀도우마스크(108)의 기능을 위한 구멍을 막는 역효과가 발생할 수 있다. The organic layer 110 may be formed to a thickness of 2 μm or less, and when the thickness exceeds 2 μm, an adverse effect of blocking a hole for the function of the shadow mask 108 may occur.

이상과 같은 섀도우마스크(108)의 구조에 따라 섀도우마스크(108) 표면에 코팅된 유기막(110)은 소스가 박막 형성용 기판(106) 상에 증착되어 발광층(112a)이 형성될 때, 섀도우마스크(108) 표면에 소스가 직접 들러붙는 것을 방지한다.According to the structure of the shadow mask 108 as described above, the organic film 110 coated on the surface of the shadow mask 108 has a shadow when a source is deposited on the thin film forming substrate 106 to form the light emitting layer 112a. The source is prevented from sticking directly to the mask 108 surface.

이상 본 발명의 일실시예에 따른 증착 장치(100)에서는 증착 챔버(102)내 증착원(104)이 하나인 것으로 도시 참조하여 설명하였으나, 본 발명의 증착원(104)은 필요에 따라 하나 이상일 수 있다.In the deposition apparatus 100 according to the exemplary embodiment of the present invention, the deposition source 104 in the deposition chamber 102 has been described with reference to one, but the deposition source 104 of the present invention may be one or more as necessary. Can be.

또한, 증착원(104)은 유기물, 무기물 , 금속 중 어느 하나를 포함하는 소스를 수용, 배출할 수 있다.In addition, the deposition source 104 may receive and discharge a source containing any one of an organic material, an inorganic material, and a metal.

또한, 증착원(104)이 챔버(102)의 하단부 일측에 치우쳐 배치된 것으로 도시 참조하여 설명하였으나, 본 발명의 챔버(102) 내 증착원(104)의 위치는 이에 국한되지 않으며, 챔버(102) 내 하단부의 중앙에 위치하거나 챔버(102)의 내측 벽 일부에 위치할 수 있다. In addition, although the deposition source 104 has been described with reference to the center disposed on one side of the lower end of the chamber 102, the position of the deposition source 104 in the chamber 102 of the present invention is not limited thereto, the chamber 102 It may be located in the center of the lower end of the inside or a portion of the inner wall of the chamber 102.

또한, 섀도우마스크(108)의 증착원(104)과 대향하는 측면에만 유기막(110)이 코팅된 것으로 도시 참조하여 설명하였으나, 유기막(110)이 코팅되는 섀도우마스크(108)의 영역은 이에 국한되지 않으며, 섀도우마스크(108)의 표면 전체가 유기막(110)으로 코팅될 수 있다.In addition, although the organic film 110 is coated with only the side of the shadow mask 108 facing the deposition source 104, the region of the shadow mask 108 on which the organic film 110 is coated is described. Without being limited, the entire surface of the shadow mask 108 may be coated with the organic layer 110.

이상과 같은 구조의 본 발명의 일실시예에 따른 증착 장치(100)를 전계발광소자의 발광층(112a)을 형성하는 증착 공정 측면에서 살펴보면, 각 기능부의 역할 및 기능 관계는 다음과 같다. Looking at the deposition apparatus 100 according to the embodiment of the present invention having the structure described above in terms of the deposition process for forming the light emitting layer 112a of the electroluminescent device, the role and functional relationship of each functional unit is as follows.

도 1 및 도 2를 다시 참조하면, 증착 챔버(102)의 하부 일측에 소스를 수용한 증착원(104)이 배치된다. Referring again to FIGS. 1 and 2, a deposition source 104 containing a source is disposed at a lower side of the deposition chamber 102.

증착 챔버(102)의 상부에는 제 1 전극이 패터닝되고, 제 1 전극 상에 발광 영역을 구분하는 절연막이 형성된 기판(106)이 발광층(112a)의 형성을 목적으로 증착원(104)에 대향하도록 배치된다. The first electrode is patterned on the deposition chamber 102, and the substrate 106, on which the insulating layer is formed on the first electrode, is formed to face the deposition source 104 for the purpose of forming the emission layer 112a. Is placed.

한편, 섀도우마스크(108)는 스핀 코팅법에 의해 유기막(110) 예를 들어, 포토레지스트로 코팅된다.On the other hand, the shadow mask 108 is coated with an organic film 110, for example, a photoresist by a spin coating method.

코팅 처리된 섀도우마스크(108)는 증착 챔버(102) 내부로 이동되어 증착원(104)과 기판(106) 사이에서 기판(106)과 얼라인(align)되어 배치된다. The coated shadow mask 108 is moved into the deposition chamber 102 to be aligned with the substrate 106 between the deposition source 104 and the substrate 106.

이때, 기판(106)과 섀도우마스크(108)는 고정 수단 예를 들어, 하나의 척(chuck)에 각각의 양 말단부가 고정될 수 있다. In this case, both ends of the substrate 106 and the shadow mask 108 may be fixed to a fixing means, for example, one chuck.

한편, 증착원(104)은 열원에 의해 가열되어 소스를 배출시킨다.On the other hand, the deposition source 104 is heated by a heat source to discharge the source.

소스가 배출됨에 따라, 기판(106)과 섀도우마스크(108)는 고른 박막 형성을 위해 동심 축을 기준으로 회전된다.As the source is discharged, the substrate 106 and the shadow mask 108 are rotated about the concentric axis for even film formation.

이상과 같은 과정을 통해 한 번의 증착 공정이 수행되면, 차기 증착 공정 수행을 위해 섀도우마스크(108) 표면에 붙은 증착물(112b)을 제거해야 한다. 따라서, 기 사용된 섀도우마스크(108)를 증착 챔버(102) 외부로 이동시킨 후, 세정 작업을 한다. When one deposition process is performed through the above process, the deposit 112b attached to the surface of the shadow mask 108 should be removed to perform the next deposition process. Therefore, the used shadow mask 108 is moved out of the deposition chamber 102 and then cleaned.

이때, 섀도우마스크(108)는 유기막(110)으로 코팅되어 있으므로, 유기 용제를 사용하여 세정하게 된다. 예를 들어, 유기막(110)이 포토레지스트인 경우, 유기 용제는 현상액이 될 수 있다.At this time, since the shadow mask 108 is coated with the organic film 110, it is cleaned using an organic solvent. For example, when the organic layer 110 is a photoresist, the organic solvent may be a developer.

이상과 같이 용제를 사용한 섀도우마스크(108)의 세정 방법은 종래 브러싱(Brushing) 또는 애싱(ashing)을 통한 섀도우마스크(108)의 변형 및 손상 문제와 증착물(112b)이 섀도우마스크(108)와 잘 분리되지 않음에 따른 섀도우마스크(108)의 오염문제를 해결할 수 있다.As described above, the cleaning method of the shadow mask 108 using a solvent is a problem of deformation and damage of the shadow mask 108 through brushing or ashing, and the deposit 112b is well connected with the shadow mask 108. It is possible to solve the problem of contamination of the shadow mask 108 as it is not separated.

위에서 설명한 본 발명은 예시의 목적을 위해 개시된 것이며, 본 발명에 대한 통상의 지식을 가지는 당업자라면 본 발명의 사상과 범위 안에서 다양한 수정, 변경, 부가가 가능할 것이다. 따라서, 이러한 수정, 변경 및 부가는 하기의 특허청구범위에 속하는 것으로 보아야 할 것이다. The present invention described above has been disclosed for purposes of illustration, and those skilled in the art having various general knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention. Accordingly, such modifications, changes and additions should be considered to be within the scope of the following claims.

위에서 설명한 바와 같이, 본 발명은 표면이 코팅 처리되어 세정이 간편한 섀도우마스크를 제공할 수 있다.As described above, the present invention can provide a shadow mask that is easy to clean the surface is coated.

또한, 본 발명은 섀도우마스크의 세정이 간편해짐에 따라 증착 효율이 향상된 증착 장치 및 그 증착 장치를 이용한 유기전계발광소자의 제조 방법을 제공할 수 있다.In addition, the present invention can provide a deposition apparatus having an improved deposition efficiency and a method of manufacturing an organic light emitting device using the deposition apparatus as cleaning of the shadow mask is simplified.

Claims (12)

유기막으로 코팅 처리된 섀도우 마스크.Shadow mask coated with organic film. 제 1항에 있어서, The method of claim 1, 상기 유기막은 포토레지스트(PR; Photo-Resist) 조성물인 것을 특징으로 하는 섀도우 마스크.The organic film is a shadow mask, characterized in that the photoresist (PR; Photo-Resist) composition. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 상기 유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 하는 섀도우 마스크.The organic film is a shadow mask, characterized in that the coating to a thickness of less than 2㎛. 챔버;chamber; 상기 챔버 내 일측에 배치되며 소스를 수용하고 배출하는 증착원; 및A deposition source disposed at one side of the chamber to receive and discharge a source; And 상기 챔버 내 상기 증착원과 대향하여 배치되는 기판과 상기 증착원 사이에 배치되며, 코팅 처리된 섀도우 마스크(shadowmask)를 포함하는 증착 장치. A deposition mask disposed between the substrate and the substrate disposed opposite to the deposition source in the chamber, and including a coated shadow mask. 제 4항에 있어서, The method of claim 4, wherein 상기 섀도우 마스크는 상기 소스가 상기 기판으로 향하는 경로 상에 배치된 것을 특징으로 하는 증착 장치.And the shadow mask is disposed on a path toward which the source is directed to the substrate. 제 4항에 있어서, The method of claim 4, wherein 상기 섀도우 마스크는 유기막으로 코팅 처리된 것을 특징으로 하는 증착 장치.And the shadow mask is coated with an organic film. 제 6항에 있어서, The method of claim 6, 상기 유기막은 포토레지스트(PR; Photo-Resist) 조성물인 것을 특징으로 하는 증착 장치.The organic film is a deposition device, characterized in that the photoresist (PR; Photo-Resist) composition. 제 6항 또는 제 7항에 있어서,The method according to claim 6 or 7, 상기 유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 하는 유기전계발광소자 제조용 증착 장치.Deposition apparatus for manufacturing an organic light emitting device, characterized in that the organic film is coated with a thickness of 2㎛ or less. 섀도우 마스크의 표면에 유기막을 코팅하는 단계;Coating an organic film on a surface of the shadow mask; 상기 섀도우 마스크와 제 1 전극이 형성된 기판을 얼라인하여 발광층을 형성하는 단계; 및Forming a light emitting layer by aligning the substrate on which the shadow mask and the first electrode are formed; And 상기 섀도우 마스크를 세정하여 유기막을 제거하는 단계를 포함하는 유기전계발광소자의 제조방법.Cleaning the shadow mask to remove the organic layer. 제 9항에 있어서,The method of claim 9, 상기 유기막은 스핀 코팅법(Spin-coating)에 의해 상기 섀도우 마스크의 표면에 코팅되는 것을 특징으로 하는 유기전계발광소자의 제조방법.The organic film is a method of manufacturing an organic light emitting display device, characterized in that the coating on the surface of the shadow mask by spin-coating (Spin-coating). 제 9항 또는 제 10항에 있어서,The method according to claim 9 or 10, 상기 유기막은 포토레지스트(PR; Photo-Resist) 조성물인 것을 특징으로 하는 유기전계발광소자의 제조방법.The organic film is a method of manufacturing an organic light emitting device, characterized in that the photoresist (PR; Photo-Resist) composition. 제 9항 또는 제 10항에 있어서,The method according to claim 9 or 10, 상기 유기막은 2㎛ 이하의 두께로 코팅되는 것을 특징으로 하는 유기전계발광소자의 제조방법.The organic film is a method of manufacturing an organic light emitting device, characterized in that the coating to a thickness of 2㎛ or less.
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US10161030B2 (en) 2013-01-29 2018-12-25 Samsung Display Co., Ltd. Deposition mask and deposition apparatus having the same
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CN110021715A (en) * 2018-01-09 2019-07-16 鸿富锦精密工业（深圳）有限公司 The manufacturing method of evaporation source and organic LED display panel
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US10161030B2 (en) 2013-01-29 2018-12-25 Samsung Display Co., Ltd. Deposition mask and deposition apparatus having the same
US9637816B2 (en) 2014-10-17 2017-05-02 Samsung Display Co., Ltd. Mask assembly, apparatus for manufacturing display apparatus, and method of manufacturing display apparatus
US10196732B2 (en) 2014-11-24 2019-02-05 Samsung Display Co., Ltd. Mask assembly for thin film deposition that includes a partially etched area and method of manufacturing the mask assembly
US10590533B2 (en) 2015-10-28 2020-03-17 Samsung Display Co., Ltd. Method of manufacturing display apparatus utilizing mask assembly including intermediate layer and self-assembled monolayer
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