KR20060042012A - 반도체 장치 및 그 제조 방법 - Google Patents
반도체 장치 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20060042012A KR20060042012A KR1020050012866A KR20050012866A KR20060042012A KR 20060042012 A KR20060042012 A KR 20060042012A KR 1020050012866 A KR1020050012866 A KR 1020050012866A KR 20050012866 A KR20050012866 A KR 20050012866A KR 20060042012 A KR20060042012 A KR 20060042012A
- Authority
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- South Korea
- Prior art keywords
- semiconductor substrate
- insulating layer
- via hole
- pad electrode
- layer
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 108
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000005530 etching Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 102
- 230000004888 barrier function Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- -1 tantalum nitride compound Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (9)
- 반도체 기판 상에 절연층을 개재하여 형성된 패드 전극을 피복하도록 상기 반도체 기판의 표면에 접착된 지지체와, 상기 반도체 기판의 이면으로부터 상기 패드 전극의 표면에 도달하도록 형성된 비아홀을 갖는 반도체 장치로서,상기 반도체 기판의 이면에 가까운 부분의 비아홀의 개구경보다 상기 패드 전극의 표면에 가까운 부분의 비아홀의 개구경이 넓은 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 비아홀의 측벽에 절연층 혹은 금속층이 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 반도체 기판의 표면에 절연층을 개재하여 형성된 패드 전극을 피복하도록 상기 반도체 기판의 표면에 지지체를 접착하는 공정과, 상기 반도체 기판의 이면으로부터 상기 패드 전극의 표면에 도달하도록 비아홀을 형성하는 공정을 갖는 반도체 장치의 제조 방법으로서,상기 비아홀을 형성하는 공정은, 상기 반도체 기판에 대하여 상기 절연층이 노출되지 않는 위치까지 제1 개구를 형성하는 공정과, 상기 반도체 기판에 대하여 상기 제1 개구의 개구경보다 넓은 개구경을 갖는 제2 개구를 상기 절연층이 노출되 는 위치까지 형성하는 공정을 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제3항에 있어서,상기 비아홀을 형성하는 공정은, 상기 제2 개구로부터 노출된 상기 절연층을 에칭하여 상기 패드 전극을 노출시키는 공정을 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제3항 내지 제4항에 있어서,상기 비아홀의 측벽에 절연층을 형성하는 공정과, 상기 절연층 상에 금속층을 형성하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제5항에 있어서,상기 비아홀의 측벽에 절연층을 형성하는 공정은, 비아홀을 포함하는 반도체 기판 상에 절연층을 형성한 후에, 상기 반도체 기판 상에 형성한 레지스트층을 마스크로 하여 상기 패드 전극 상의 절연층을 제거하는 공정인 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제6항에 있어서,상기 패드 전극 상의 절연층을 제거하는 공정은, 상기 레지스트층을 마스크 로서 이용하지 않은 에칭 공정인 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제5항에 있어서,상기 금속층에 접속되는 볼 형상 단자를 형성하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제3항 또는 제4항에 있어서,상기 반도체 기판을 복수의 반도체 칩으로 분할하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
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-
2004
- 2004-02-17 JP JP2004040403A patent/JP4850392B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-31 TW TW094102860A patent/TWI268534B/zh active
- 2005-02-11 US US11/055,707 patent/US7732925B2/en active Active
- 2005-02-11 EP EP05002897.6A patent/EP1564810B1/en not_active Expired - Fee Related
- 2005-02-16 KR KR1020050012866A patent/KR100658543B1/ko active IP Right Grant
- 2005-02-17 CN CNB2005100093666A patent/CN100382304C/zh active Active
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Also Published As
Publication number | Publication date |
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TWI268534B (en) | 2006-12-11 |
US7732925B2 (en) | 2010-06-08 |
US7750478B2 (en) | 2010-07-06 |
US20070249158A1 (en) | 2007-10-25 |
TW200531142A (en) | 2005-09-16 |
JP2005235858A (ja) | 2005-09-02 |
EP1564810A1 (en) | 2005-08-17 |
EP1564810B1 (en) | 2017-01-11 |
CN100382304C (zh) | 2008-04-16 |
US20050189637A1 (en) | 2005-09-01 |
JP4850392B2 (ja) | 2012-01-11 |
CN1658387A (zh) | 2005-08-24 |
KR100658543B1 (ko) | 2006-12-19 |
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