KR20060026715A - Cleaning solution spraying pipe for cleaning apparatus - Google Patents

Cleaning solution spraying pipe for cleaning apparatus Download PDF

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Publication number
KR20060026715A
KR20060026715A KR1020040075560A KR20040075560A KR20060026715A KR 20060026715 A KR20060026715 A KR 20060026715A KR 1020040075560 A KR1020040075560 A KR 1020040075560A KR 20040075560 A KR20040075560 A KR 20040075560A KR 20060026715 A KR20060026715 A KR 20060026715A
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South Korea
Prior art keywords
cleaning liquid
injection
cleaning
injection pipe
flow rate
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KR1020040075560A
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Korean (ko)
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김석주
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주식회사 케이씨텍
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Priority to KR1020040075560A priority Critical patent/KR20060026715A/en
Publication of KR20060026715A publication Critical patent/KR20060026715A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Nozzles (AREA)

Abstract

본 발명은 세정 장비의 세정액 분사파이프에 관한 것으로, 세정액을 분사하도록 다수개의 분사노즐이 형성된 분사파이프를 포함하는 세정 장비에 있어서, 상기 분사파이프와 연통되는 연결포트는 다수의 분사노즐이 배치된 방향에 대하여 비수직적인 연결각도를 갖으며 연결되어, 상기 분사파이프 내부로 유입되는 세정액의 유량 분포를 각각의 분사노즐에 적합하도록 하여 공급손실을 줄일 수 있도록 된 것이다.
The present invention relates to a cleaning liquid injection pipe of a cleaning equipment, the cleaning equipment comprising a plurality of injection nozzles formed with a plurality of injection nozzles for injecting the cleaning liquid, the connection port communicating with the injection pipe is a direction in which a plurality of injection nozzles are arranged It is connected to have a non-vertical connection angle with respect to the flow rate of the cleaning liquid flowing into the injection pipe to fit the respective injection nozzles to reduce the supply loss.

세정 장비, 세정액, 분사파이프, 연결포트, 연결각도Cleaning equipment, cleaning liquid, spray pipe, connection port, connection angle

Description

세정 장비의 세정액 분사파이프{Cleaning Solution Spraying Pipe for Cleaning Apparatus}Cleaning Solution Spraying Pipe for Cleaning Apparatus

도 1은 종래기술에 따른 세정액 분사파이프가 설치된 세정 라인의 개략적인 사시도,1 is a schematic perspective view of a cleaning line with a cleaning liquid injection pipe according to the prior art,

도 2는 종래기술에 따른 세정액 분사파이프와 연결포트의 연결 관계를 보여주는 개략적인 단면도,Figure 2 is a schematic cross-sectional view showing the connection between the cleaning liquid injection pipe and the connection port according to the prior art,

도 3은 본 발명에 따른 세정액 분사파이프와 세정액 연결포트의 연결 관계를 보여주는 개략적인 단면도이다.Figure 3 is a schematic cross-sectional view showing the connection between the cleaning liquid injection pipe and the cleaning liquid connection port according to the present invention.

- 도면의 주요부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawings-

10 : 롤러 20 : 이송부10: roller 20: transfer unit

30 : 분사노즐 40 : 분사파이프30: injection nozzle 40: injection pipe

50 : 연결포트 α : 연결각도50: connection port α: connection angle

본 발명은 반도체 및 전자부품 등의 세정 공정에 사용되는 세정 장비에 관한 것으로, 특히 다수개의 분사노즐이 부착된 분사파이프 내부로 유입되는 세정액의 유입유량이 각각의 분사노즐의 필요유량에 따라 적절하게 분배되도록 세정액의 유량 흐름을 기구적으로 제어할 수 있도록 된 세정 장비의 세정액 분사파이프에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning equipment used for cleaning processes such as semiconductors and electronic components. Particularly, the inflow flow rate of the cleaning liquid flowing into the injection pipe with the plurality of injection nozzles is appropriately adjusted according to the required flow rate of each injection nozzle. It relates to a cleaning liquid injection pipe of the cleaning equipment to be able to mechanically control the flow rate of the cleaning liquid to be dispensed.

일반적으로, 습식 세정 장비는 반도체 웨이퍼나 TFT-LCD 기판 등의 제조 공정에서 발생되는 각종 이물질을 제거하기 위해 세정액을 분사하여 이송되는 작업 대상물에 누적된 이물질을 제거하게 된다.In general, the wet cleaning equipment is to remove the foreign matter accumulated in the workpiece to be transported by spraying the cleaning liquid in order to remove various foreign substances generated in the manufacturing process, such as a semiconductor wafer or TFT-LCD substrate.

이러한 이물질을 제거하기 위해 사용되는 종래의 세정 장비 중 세정 처리 수단을 좀 더 자세히 살펴보면, 도 1 및 도 2에서 보는 바와 같이, 다수개의 롤러(10)들이 횡방향으로 설치되어 작업 대상물(예를 들어, 반도체 웨이퍼, TFT-LCD 기판 등)을 후속 공정으로 이송시키도록 된 이송부(20)가 구비되고, 이 이송부(20)의 상부에는 다수개의 분사노즐(30)이 하부에 형성된 분사파이프(40)가 마련되며, 이 분사파이프(40)의 상부 일측은 세정액이 저장되는 저장탱크(미도시)와 연결포트(50)를 매개로 연결된다.Looking in more detail of the cleaning treatment means of the conventional cleaning equipment used to remove such foreign matter, as shown in Figures 1 and 2, a plurality of rollers 10 are installed in the transverse direction to the workpiece (for example, , A semiconductor wafer, a TFT-LCD substrate, etc.) is provided with a conveying part 20 for conveying it in a subsequent process. Is provided, the upper one side of the injection pipe 40 is connected via a storage tank (not shown) and the connection port 50 in which the cleaning liquid is stored.

이에 따라, 상기 저장탱크에서 공급되는 세정액은 연결포트(50)를 경유하여 상기 분사파이프(40) 내부로 유입된 후, 상기 분사노즐(30)을 통해 분사되어 이동중인 작업 대상물에 누적된 이물질을 제거하게 된다.Accordingly, the cleaning liquid supplied from the storage tank flows into the injection pipe 40 through the connection port 50 and is then sprayed through the injection nozzle 30 to accumulate foreign matter accumulated in the moving object. Will be removed.

한편, 세정 장비를 구성하는 부품간의 간섭의 우려 또는 부품의 최적 배치에 따른 이유 등으로 인해 상기 연결포트(50)는, 도 2에서 보는 바와 같이, 상기 분사파이프(40)의 중앙에 연결하지 않고 분사파이프(40)의 일측에 치우친 상태로 연결한다. On the other hand, the connection port 50 is not connected to the center of the injection pipe 40 as shown in FIG. Connect in a state biased to one side of the injection pipe (40).                         

더욱이 상기 분사파이프(40)와 연결포트(50)는 수직적으로 연결되기 때문에, 공급되는 세정액은 상기 분사파이프(40)의 각각의 분사노즐(30a,30b,30c,30d,30e)에 알맞게 분기되지 못한다.Furthermore, since the injection pipe 40 and the connection port 50 are vertically connected, the supplied cleaning liquid does not branch appropriately to the respective injection nozzles 30a, 30b, 30c, 30d, and 30e of the injection pipe 40. can not do it.

이를 다시 표현하면 아래와 같다.This is expressed as follows.

Q = Q1 + Q2 Q = Q 1 + Q 2

Q1 = Q/2Q 1 = Q / 2

Q2 = Q/2Q 2 = Q / 2

(여기서, Q 는 총 유입유량, Q1 은 좌측 유입유량, Q2 는 우측 유입유량)(Where Q is the total inflow, Q 1 is the left inflow, and Q 2 is the right inflow)

그리고, 각각의 분사노즐(30a,30b,30c,30d,30e)에 필요한 유량은 다음과 같이 계산된다.The flow rates required for the respective injection nozzles 30a, 30b, 30c, 30d, and 30e are calculated as follows.

SQ1 = NQ1 SQ 1 = NQ 1

SQ2 = NQ2 + NQ3 + NQ4 + NQ5 SQ 2 = NQ 2 + NQ 3 + NQ 4 + NQ 5

(여기서, SQ1 은 좌측방향 필요유량, SQ2 는 우측방향 필요유량, NQ1 은 분사노즐(30a)의 필요유량, NQ2 는 분사노즐(30b)의 필요유량, NQ3 은 분사노즐(30c)의 필요유량, NQ4 는 분사노즐(30d)의 필요유량, NQ5 는 분사노즐(30e)의 필요유량)(SQ 1 is required flow rate in the left direction, SQ 2 is required flow rate in the right direction, NQ 1 is required flow rate of the injection nozzle 30a, NQ 2 is required flow rate of the injection nozzle 30b, NQ 3 is injection nozzle 30c) NQ 4 is the required flow rate of the injection nozzle 30d, NQ 5 is the required flow rate of the injection nozzle 30e).

이에 따라, 상기 분사노즐(30a,30b,30c,30d,30e)의 필요유량이 Q/2 이 아닐 경우에는 그 만큼 공급손실이 발생하게 된다. 즉, Q1 ≠SQ1, Q2 ≠SQ2 의 관계가 된 다.As a result, when the required flow rate of the injection nozzles 30a, 30b, 30c, 30d, and 30e is not Q / 2, supply loss is generated accordingly. In other words, Q 1 ≠ SQ 1 , Q 2 ≠ SQ 2 .

결과적으로, 상기 분사파이프(40)의 분사노즐(30)을 통해 분사되는 세정액의 분사압력이 분사노즐(30a,30b,30c,30d,30e) 마다 상이하여 작업 대상물의 이물질을 깨끗하고 균일하게 제거하지 못하는 문제점이 있었다.As a result, the injection pressure of the cleaning liquid sprayed through the injection nozzle 30 of the injection pipe 40 is different for each injection nozzle 30a, 30b, 30c, 30d, 30e to cleanly and uniformly remove foreign substances of the work object. There was a problem that can not.

이에 본 발명은 상기와 같은 문제점을 해결하기 위해 창출된 것으로, 분사파이프와 연결된 연결포트의 연결각도를 조절하여 상기 분사파이프의 내부로 유입되는 세정액의 유량 분포를 각각의 분사노즐에 적합하도록 된 세정 장비의 세정액 분사파이프를 제공하는데 그 목적이 있다.Therefore, the present invention was created to solve the above problems, by adjusting the connection angle of the connection port connected to the injection pipe to clean the flow distribution of the cleaning liquid flowing into the injection pipe to each injection nozzle The purpose is to provide a cleaning fluid spray pipe for the equipment.

상기와 같은 목적을 달성하기 위한 본 발명은, 세정액을 분사하도록 다수개의 분사노즐이 형성된 분사파이프를 포함하는 세정 장비에 있어서, 상기 분사파이프와 연통되는 연결포트는 다수의 분사노즐이 배치된 방향에 대하여 비수직적인 연결각도를 갖으며 연결되는 것을 특징으로 한다.The present invention for achieving the above object, in the cleaning equipment comprising a plurality of injection nozzles formed with a plurality of injection nozzles for injecting the cleaning liquid, the connection port in communication with the injection pipe in the direction in which the plurality of injection nozzles It is characterized by being connected with a non-vertical connection angle with respect to.

여기서, 상기 연결각도는 상기 분사파이프 내부로 유입되는 세정액의 총 유입유량과 분사노즐의 배치상태에 따라 가감되는 것을 특징으로 한다.Here, the connection angle is characterized in that it is added or subtracted according to the total inflow of the cleaning liquid flowing into the injection pipe and the arrangement of the injection nozzle.

이하 본 발명을 첨부된 예시도면을 참조로 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 세정액 분사파이프와 세정액 연결포트의 연결 관계를 보여주는 개략적인 단면도로서, 종래구조와 동일한 부위에는 동일부호를 표기하고 자세한 설명은 생략하기로 한다. Figure 3 is a schematic cross-sectional view showing a connection between the cleaning liquid injection pipe and the cleaning liquid connection port according to the present invention, the same parts as the conventional structure is denoted by the same reference numerals will be omitted.                     

본 발명에 따르면, 다수개의 롤러(10)들로 이루어진 이송부(20)의 상부에는 다수개의 분사노즐(30)이 하부에 형성된 분사파이프(40)가 마련되고, 이 분사파이프(40)의 일측 상부에는 연결포트(50)가 연통된다.According to the present invention, an injection pipe 40 having a plurality of injection nozzles 30 formed thereon is provided at an upper portion of the transfer part 20 formed of a plurality of rollers 10, and an upper portion of one side of the injection pipe 40 is provided. The connection port 50 is in communication with.

여기서, 상기 분사파이프(40)와 연결포트(50)가 이루는 연결각도(α)는 비수직적인 각도를 형성하는데, 본 발명의 일실시예인 도 3을 참조해서 좀 더 자세히 살펴보면, 상기 연결포트(50)를 통해 분사파이프(40)쪽으로 유입되는 세정액은 상기 분사파이프(40) 내부로 분기되는 과정에서 상기 연결포트(50)가 비수직적, 즉 상기 분사파이프(40)의 법선에 대해 일측으로 기울어져 있기 때문에 좌·우측의 세정액 유입량이 달라지게 된다.Here, the connection angle α formed by the injection pipe 40 and the connection port 50 forms a non-vertical angle. Referring to FIG. 3, which is an embodiment of the present invention, the connection port ( The cleaning liquid flowing into the injection pipe 40 through 50 is inclined to one side with respect to the normal of the injection pipe 40 while the connection port 50 is non-vertical in the process of branching into the injection pipe 40. As a result, the flow rate of the washing liquid on the left and right sides will be different.

즉, 비가속 검사체적에 대한 뉴튼(Newton)의 제2법칙 검사체적 공식을 적용하면 분사파이프(40)의 양방향으로 공급되는 각각의 유량은 다음과 같다.That is, when Newton's second law of the test volume formula for the non-accelerated test volume is applied, each flow rate supplied in both directions of the injection pipe 40 is as follows.

Q = Q1 + Q2 Q = Q 1 + Q 2

Q1 = Q/2 ×(1 - COS α)Q 1 = Q / 2 × (1-COS α)

Q2 = Q/2 ×(1 + COS α)Q 2 = Q / 2 × (1 + COS α)

(여기서, Q 는 총 유입유량, Q1 은 좌측 유입유량, Q2 는 우측 유입유량)(Where Q is the total inflow, Q 1 is the left inflow, and Q 2 is the right inflow)

이를 본 발명에 따른 분사파이프(40)와 연결포트(50)가 이루는 연결각도(α)를 이용하여 각각의 분사노즐(30a,30b,30c,30d,30e)에 필요한 유량은 다음과 같이 계산된다. Using the connection angle α formed by the injection pipe 40 and the connection port 50 according to the present invention, the flow rate required for each injection nozzle 30a, 30b, 30c, 30d, 30e is calculated as follows. .                     

SQ1 = NQ1 SQ 1 = NQ 1

SQ2 = NQ2 + NQ3 + NQ4 + NQ5 SQ 2 = NQ 2 + NQ 3 + NQ 4 + NQ 5

(여기서, SQ1 은 좌측방향 필요유량, SQ2 는 우측방향 필요유량, NQ1 은 분사노즐(30a)의 필요유량, NQ2 는 분사노즐(30b)의 필요유량, NQ3 은 분사노즐(30c)의 필요유량, NQ4 는 분사노즐(30d)의 필요유량, NQ5 는 분사노즐(30e)의 필요유량)(SQ 1 is required flow rate in the left direction, SQ 2 is required flow rate in the right direction, NQ 1 is required flow rate of the injection nozzle 30a, NQ 2 is required flow rate of the injection nozzle 30b, NQ 3 is injection nozzle 30c) NQ 4 is the required flow rate of the injection nozzle 30d, NQ 5 is the required flow rate of the injection nozzle 30e).

이에 따라, 분사파이프(40)와 연결포트(50)의 연결각도(α)를 이용하여 세정액을 공급하게 되면, Q1 = SQ1, Q2 = SQ2 의 관계가 성립하므로 세정액의 공급손실을 줄일 수 있게 된다.Accordingly, when the cleaning liquid is supplied using the connection angle α between the injection pipe 40 and the connection port 50, the relationship of Q 1 = SQ 1 and Q 2 = SQ 2 is established, so that the supply loss of the cleaning liquid is reduced. Can be reduced.

한편, 전술한 본 발명의 실시예에서는 분사파이프(40)의 분사노즐(30)이 좌측에 1개가 배치되고 우측에 4개가 배치된 경우를 설명하였으나, 상기 분사노즐(30)의 좌·우측 배치상태 및 세정액의 총 유입유량에 따라 상기 연결각도(α)를 달리할 수 있음은 물론이다.Meanwhile, in the above-described embodiment of the present invention, the case in which one injection nozzle 30 of the injection pipe 40 is disposed on the left side and four on the right side has been described, but the left and right sides of the injection nozzle 30 are disposed. It is a matter of course that the connection angle (α) can be varied according to the state and the total inflow of the cleaning liquid.

이상 설명한 바와 같이 본 발명에 따르면, 분사파이프와 연결된 연결포트의 연결각도를 조절하여 상기 분사파이프 내부로 유입되는 세정액의 유량 분포를 각각의 분사노즐에 적합하도록 하여 공급손실을 줄일 수 있는 효과가 있다.As described above, according to the present invention, by adjusting the connection angle of the connection port connected to the injection pipe, it is possible to reduce the supply loss by adjusting the flow rate distribution of the cleaning liquid flowing into the injection pipe to each injection nozzle. .

이상에서는 본 발명을 특정의 바람직한 실시예에 대해서 도시하고 설명하였지만, 본 발명은 상술한 실시예에만 한정되는 것은 아니며, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 이하의 특허청구범위에 기재된 본 발명의 기술적 사상의 요지를 벗어나지 않고 얼마든지 다양하게 변경 실시할 수 있을 것이다.Although the present invention has been illustrated and described with respect to specific preferred embodiments, the present invention is not limited to the above-described embodiments, and those of ordinary skill in the art to which the present invention pertains should have the following claims. Various modifications can be made without departing from the spirit of the technical spirit of the invention described.

Claims (2)

세정액을 분사하도록 다수개의 분사노즐이 형성된 분사파이프를 포함하는 세정 장비에 있어서,What is claimed is: 1. A cleaning apparatus including a spray pipe in which a plurality of spray nozzles are formed to spray a cleaning liquid. 상기 분사파이프와 연통되는 연결포트는 다수의 분사노즐이 배치된 방향에 대하여 비수직적인 연결각도를 갖으며 연결되는 것을 특징으로 하는 세정 장비의 세정액 분사파이프.The connection port communicating with the injection pipe is a cleaning liquid injection pipe of the cleaning equipment, characterized in that the non-vertical connection angle with respect to the direction in which the plurality of injection nozzles are arranged. 제1항에 있어서,The method of claim 1, 상기 연결각도는 상기 분사파이프 내부로 유입되는 세정액의 총 유입유량과 분사노즐의 배치상태에 따라 가감되는 것을 특징으로 하는 세정 장비의 세정액 분사파이프.The connection angle of the cleaning liquid injection pipe of the cleaning equipment, characterized in that the sum of the flow rate of the cleaning liquid flowing into the injection pipe and the arrangement of the injection nozzle.
KR1020040075560A 2004-09-21 2004-09-21 Cleaning solution spraying pipe for cleaning apparatus KR20060026715A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049442B1 (en) * 2009-03-17 2011-07-15 세메스 주식회사 Substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049442B1 (en) * 2009-03-17 2011-07-15 세메스 주식회사 Substrate processing apparatus

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