KR20060002853A - 반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치 - Google Patents
반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치 Download PDFInfo
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- KR20060002853A KR20060002853A KR1020057017829A KR20057017829A KR20060002853A KR 20060002853 A KR20060002853 A KR 20060002853A KR 1020057017829 A KR1020057017829 A KR 1020057017829A KR 20057017829 A KR20057017829 A KR 20057017829A KR 20060002853 A KR20060002853 A KR 20060002853A
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (8)
- 하기 화학식 1로 표시되는 에폭시 수지(A), 하기 화학식 2로 표시되는 페놀 수지(B), 무기 충전제(C), 경화 촉진제(D), 실란커플링제(E) 및 방향고리를 구성하는 2개 이상의 인접하는 탄소원자에 각각 수산기가 결합된 화합물(F)를 포함하는 것을 특징으로 하는 반도체 봉지용 수지 조성물.[화학식 1](다만, 상기 화학식 1에 있어서, R은 수소 또는 탄소수 4 이하의 알킬기이다. 또한, n은 평균값으로, 1~10의 양수이다.)[화학식 2](다만, 상기 화학식 2에 있어서, R1은 페닐렌기 또는 비페닐렌기, R2는 탄소수 4 이하의 알킬기이다. 또한, n은 평균값으로, 1~10의 양수이다.)
- 제1항의 반도체 봉지용 수지 조성물에 있어서, 상기 화합물(F)를 해당 수지 조성물 전체의 0.01 중량% 이상 포함하는 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제1항의 반도체 봉지용 수지 조성물에 있어서, 상기 실란커플링제(E)를 해당 수지 조성물 전체의 0.01 중량% 이상 1.0 중량% 이하 포함하는 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제1항의 반도체 봉지용 수지 조성물에 있어서, 상기 화합물(F)는 상기 방향고리를 구성하는 2개의 인접하는 탄소원자에 각각 수산기가 결합된 화합물인 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제1항의 반도체 봉지용 수지 조성물에 있어서, 상기 방향고리가 나프탈렌고리인 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제5항의 반도체 봉지용 수지 조성물에 있어서, 상기 화합물(F)는 상기 나프탈렌고리를 구성하는 2개의 인접하는 탄소원자에 각각 수산기가 결합된 화합물인 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제1항의 반도체 봉지용 수지 조성물에 있어서, 해당 수지 조성물 중에 84 중 량% 이상 90 중량% 이하의 무기 충전제(C)를 포함하는 것을 특징으로 하는 반도체 봉지용 수지 조성물.
- 제1항의 반도체 봉지용 수지 조성물을 사용하여 반도체 소자를 봉지해서 되는 것을 특징으로 하는 반도체장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2003-00083937 | 2003-03-25 | ||
JP2003083937 | 2003-03-25 | ||
JP2003083938 | 2003-03-25 | ||
JPJP-P-2003-00083938 | 2003-03-25 |
Publications (2)
Publication Number | Publication Date |
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KR20060002853A true KR20060002853A (ko) | 2006-01-09 |
KR100697938B1 KR100697938B1 (ko) | 2007-03-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020057017829A KR100697938B1 (ko) | 2003-03-25 | 2004-03-10 | 반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4404051B2 (ko) |
KR (1) | KR100697938B1 (ko) |
MY (1) | MY137564A (ko) |
TW (1) | TWI323272B (ko) |
WO (1) | WO2004085511A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101411018B1 (ko) * | 2011-12-28 | 2014-06-24 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006080297A1 (ja) * | 2005-01-28 | 2006-08-03 | Sumitomo Bakelite Co., Ltd. | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2006233016A (ja) * | 2005-02-24 | 2006-09-07 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
EP1860133A4 (en) * | 2005-03-15 | 2008-05-21 | Nippon Kayaku Kk | EPOXY RESIN, EPOXY RESIN COMPOSITION, AND PREPREG AND COMPOSITE PLATE THEREWITH |
JP5028756B2 (ja) * | 2005-06-24 | 2012-09-19 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
CN1962713B (zh) * | 2005-11-07 | 2010-05-05 | 中国科学院化学研究所 | 含氟酚醛树脂衍生物及其组合物与制备方法 |
JP2008063371A (ja) * | 2006-09-05 | 2008-03-21 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
CN101302326B (zh) * | 2007-05-10 | 2010-09-08 | 长春人造树脂厂股份有限公司 | 阻燃性树脂组合物 |
KR100923443B1 (ko) | 2007-12-11 | 2009-10-27 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 |
KR100953823B1 (ko) | 2007-12-24 | 2010-04-21 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 |
KR100953822B1 (ko) | 2007-12-24 | 2010-04-21 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 |
KR101148140B1 (ko) * | 2007-12-24 | 2012-05-23 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
KR101226114B1 (ko) | 2010-12-03 | 2013-01-24 | 곽오봉 | 경사조절이 가능한 골프연습용 스윙 플레이트 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2600258B2 (ja) * | 1988-03-25 | 1997-04-16 | 東レ株式会社 | 半導体封止用樹脂組成物 |
JPH0329352A (ja) * | 1989-06-26 | 1991-02-07 | Nitto Denko Corp | 半導体装置 |
JP3428699B2 (ja) * | 1993-09-24 | 2003-07-22 | ジャパンエポキシレジン株式会社 | エポキシ樹脂組成物 |
JP3010110B2 (ja) * | 1993-11-04 | 2000-02-14 | 日東電工株式会社 | 半導体装置 |
JP3033445B2 (ja) * | 1994-07-05 | 2000-04-17 | 信越化学工業株式会社 | 樹脂用無機質充填剤及びエポキシ樹脂組成物 |
JP4501188B2 (ja) * | 1999-11-02 | 2010-07-14 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物ならびに半導体装置 |
JP2002322347A (ja) * | 2001-04-26 | 2002-11-08 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP5364963B2 (ja) * | 2001-09-28 | 2013-12-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2003292730A (ja) * | 2002-03-29 | 2003-10-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
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2004
- 2004-03-10 WO PCT/JP2004/003105 patent/WO2004085511A1/ja active Application Filing
- 2004-03-10 KR KR1020057017829A patent/KR100697938B1/ko active IP Right Grant
- 2004-03-10 JP JP2005503995A patent/JP4404051B2/ja not_active Expired - Fee Related
- 2004-03-18 MY MYPI20040962A patent/MY137564A/en unknown
- 2004-03-22 TW TW093107637A patent/TWI323272B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101411018B1 (ko) * | 2011-12-28 | 2014-06-24 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
Also Published As
Publication number | Publication date |
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KR100697938B1 (ko) | 2007-03-20 |
JP4404051B2 (ja) | 2010-01-27 |
TWI323272B (en) | 2010-04-11 |
TW200500412A (en) | 2005-01-01 |
MY137564A (en) | 2009-02-27 |
WO2004085511A1 (ja) | 2004-10-07 |
JPWO2004085511A1 (ja) | 2006-06-29 |
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