KR20050119902A - Method for metallizing a non-metallic surface and the metallized surface structure thereof - Google Patents

Method for metallizing a non-metallic surface and the metallized surface structure thereof Download PDF

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KR20050119902A
KR20050119902A KR1020040045040A KR20040045040A KR20050119902A KR 20050119902 A KR20050119902 A KR 20050119902A KR 1020040045040 A KR1020040045040 A KR 1020040045040A KR 20040045040 A KR20040045040 A KR 20040045040A KR 20050119902 A KR20050119902 A KR 20050119902A
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plating
metal
metal layer
plated
base metal
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텅 신 우
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텅 신 우
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명에 따른 비금속 표면의 도금 방법은 비금속 표면에 기재 금속 도금 필름을 도금하는 단계, 내부 금속층이 형성되도록 상기 기재 금속 도금 필름의 표면에 제1 금속 물질을 도금하는 단계, 및 외부 금속층이 형성되도록 상기 내부 금속층 표면에 제2 금속 물질을 도금하는 단계를 포함한다.The plating method of the non-metallic surface according to the present invention comprises the steps of: plating a base metal plating film on the nonmetal surface, plating a first metal material on the surface of the base metal plating film so that an inner metal layer is formed, and an outer metal layer is formed. Plating a second metal material on the inner metal layer surface.

Description

비금속 표면의 도금 방법 및 상기 방법에 따라 도금된 표면 구조물 {METHOD FOR METALLIZING A NON-METALLIC SURFACE AND THE METALLIZED SURFACE STRUCTURE THEREOF}Plating method of non-metallic surface and surface structure plated according to the method {METHOD FOR METALLIZING A NON-METALLIC SURFACE AND THE METALLIZED SURFACE STRUCTURE THEREOF}

본 발명은 비금속 표면의 도금 방법 및 상기 방법에 따라 도금된 표면 구조물에 관한 것이다.The present invention relates to a method of plating a nonmetallic surface and a surface structure plated according to the method.

도 2에 도시된 바와 같이, 종래 기술에 따른 비금속 표면의 도금 방법은 비금속 표면에 전도성 오일을 주입하는 전도성 오일 주입 단계(101), 상기 비금속 표면을 건조시키는 건조 단계(102), 상기 비금속 표면을 세척하는 세척 단계(103), 상기 비금속 표면에 구리를 도금하는 구리 도금 단계(104), 상기 구리 도금된 표면을 세척하는 세척 단계(105), 상기 구리 도금된 표면에 니켈을 도금하는 니켈 도금 단계(106), 상기 니켈 도금된 표면을 세척하는 세척 단계(107), 크롬산을 이용하여 상기 니켈 도금된 표면을 거칠게 처리하는 굴곡 표면 처리(roughing) 단계(108), 상기 니켈 도금된 표면을 세척하는 세척 단계(109), 및 상기 니켈 도금된 표면을 건조시키는 건조 단계(110)를 포함하며, 전술한 단계를 전부 수행함으로써 작업 공정이 완료된다. 이 같은 종래 방법에서는 상기 비금속 표면을 구리와 니켈로 코팅함으로써, 상기 방법에 따라 형성된 도금된 표면 구조물은 저항이 작고 두께가 두껍다. 그러나, 이러한 종래 방법은 크롬 및 전도성 오일을 이용해야 하므로 환경 오염을 초래하기 때문에 환경 보호 측면에서 바람직하지 않다.As shown in FIG. 2, the plating method of a nonmetal surface according to the related art includes a conductive oil injection step 101 of injecting a conductive oil on a nonmetal surface, a drying step 102 of drying the nonmetal surface, and a surface of the nonmetal surface. Washing step 103 for washing, copper plating step 104 for plating copper on the nonmetal surface, washing step 105 for washing the copper plated surface, nickel plating step for plating nickel on the copper plated surface 106, a washing step 107 of cleaning the nickel plated surface, a rough surface step 108 of roughening the nickel plated surface using chromic acid, and a cleaning of the nickel plated surface A washing step 109 and a drying step 110 for drying the nickel plated surface are completed, and the work process is completed by performing all the above-described steps. In this conventional method, by coating the non-metallic surface with copper and nickel, the plated surface structure formed in accordance with the method is small in resistance and thick in thickness. However, this conventional method is undesirable from the viewpoint of environmental protection because it requires the use of chromium and conductive oils, which leads to environmental pollution.

본 발명의 목적은 비금속 표면의 도금 방법 및 상기 방법에 따라 도금된 표면 구조물을 제공하는 것으로서, 진공 스퍼터링 방법에 따라 비금속 표면에 기재 금속 도금 박막을 도금함으로써 상기 비금속 표면이 전기 전도성을 갖게 됨에 따라, 이후의 화학적 도금 또는 전기 도금 단계의 수행 시간을 단축시킬 수 있고, 생산성을 향상시킬 수 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a method for plating a nonmetal surface and a surface structure plated according to the method, and as the nonmetal surface becomes electrically conductive by plating a base metal plating thin film on the nonmetal surface according to a vacuum sputtering method, The performance time of the subsequent chemical plating or electroplating step can be shortened and productivity can be improved.

도 1을 참조해 볼 때, 본 발명에 따른 비금속 표면의 도금 방법은,Referring to Figure 1, the plating method of the non-metallic surface according to the present invention,

진공 스퍼터링 방법에 따라 (플라스틱 물질의 표면과 같은) 비금속 표면에 얇은 기재 금속 도금 필름을 도금하여, 상기 비금속 표면이 전기 전도성을 갖도록 하기 위한 진공 스퍼터링 단계(201); A vacuum sputtering step (201) for plating a thin base metal plating film on a nonmetallic surface (such as a surface of a plastic material) according to a vacuum sputtering method, such that the nonmetallic surface is electrically conductive;

상기 기재 금속 도금 필름의 표면을 세척하는 1차 세척 단계(202);A first washing step 202 for cleaning the surface of the base metal plating film;

내부 금속층이 형성되도록, 상기 기재 금속 도금 필름의 표면에 제1 금속 물질을 도금하는 내부 금속층 도금 단계(203);An internal metal layer plating step (203) of plating a first metal material on a surface of the base metal plating film so that an internal metal layer is formed;

상기 내부 금속층 표면을 세척하는 2차 세척 단계(204);A second washing step 204 for cleaning the inner metal layer surface;

외부 금속층이 형성되도록, 상기 내부 금속층 표면에 제2 금속 물질을 도금하는 외부 금속층 도금 단계(205);An outer metal layer plating step of plating a second metal material on the inner metal layer surface to form an outer metal layer;

상기 외부 금속층 표면을 세척하는 3차 세척 단계(206); 및A third washing step 206 for washing the outer metal layer surface; And

상기 외부 금속층 표면을 건조시키는 건조 단계(207)Drying step 207 to dry the outer metal layer surface

를 포함하며, 전술한 단계를 전부 수행함으로써 본 발명에 따른 작업 공정이 완료된다.It includes, the work process according to the invention is completed by performing all the above-described steps.

상기 제1 금속 물질은 구리와 같이 큰 인력을 갖는 금속으로서, 화학적 도금 방법 또는 전기 도금 방법에 따라 도금되는 것이 바람직하다. 상기 제2 금속 물질은 니켈과 같이 경도가 큰 금속으로서, 보호 효과를 제공할 수 있는 것이 바람직하다. 그 대안으로서, 상기 제2 금속 물질이 스테인리스 강(stainless steel) 또는 크롬일 수 있다. 아울러, 상기 제2 금속 물질은 화학적 도금 방법 또는 전기 도금 방법에 따라 상기 내부 금속층 표면에 도금된다.The first metal material is a metal having a large attraction force, such as copper, and is preferably plated according to a chemical plating method or an electroplating method. The second metal material is a metal having a high hardness, such as nickel, and may provide a protective effect. As an alternative, the second metal material may be stainless steel or chromium. In addition, the second metal material is plated on the surface of the inner metal layer by a chemical plating method or an electroplating method.

본 발명의 방법에 따라 도금된 표면 구조물은 비금속 표면, 상기 비금속 표면에 형성된 기재 금속 도금 필름, 상기 기재 금속 도금 필름의 표면에 형성된 내부 금속층, 및 상기 내부 금속층 표면에 보호층으로서 형성된 외부 금속층을 포함한다.The surface structure plated according to the method of the present invention includes a nonmetal surface, a base metal plating film formed on the nonmetal surface, an inner metal layer formed on the surface of the base metal plating film, and an outer metal layer formed as a protective layer on the inner metal layer surface. do.

본 발명의 방법에 따르면, 진공 스퍼터링 방법에 따라 비금속 표면에 얇은 기재 금속 도금 필름을 도금함으로써 상기 비금속 표면이 전기 전도성을 갖게 되어, 이후의 화학적 도금 또는 전기 도금 단계의 수행 시간을 단축시킬 수 있으며, 생산성을 향상시킬 수 있다. 또한, 본 발명의 도금 방법에서는 크롬 또는 전도성 오일을 이용할 필요가 없기 때문에, 환경 보호 측면에서 바람직하다. 아울러, 상기 방법에 따라 도금된 표면 구조물의 두께를 증가시키기 위해, 상기 기재 금속 도금 필름의 표면에 내부 금속층 및 외부 금속층을 제공함으로써, 전도 효과 및 상기 도금된 표면 구조물의 외관을 개선할 수 있다.According to the method of the present invention, the non-metal surface is electrically conductive by plating a thin base metal plating film on the non-metal surface according to the vacuum sputtering method, thereby shortening the execution time of a subsequent chemical plating or electroplating step, Productivity can be improved. Further, in the plating method of the present invention, since it is not necessary to use chromium or conductive oil, it is preferable in terms of environmental protection. In addition, in order to increase the thickness of the plated surface structure according to the method, by providing an inner metal layer and an outer metal layer on the surface of the base metal plating film, it is possible to improve the conduction effect and the appearance of the plated surface structure.

도 1은 본 발명의 바람직한 구현예에 따른 비금속 표면의 도금 방법을 도시한 순서도(flow chart).1 is a flow chart illustrating a plating method of a non-metallic surface in accordance with a preferred embodiment of the present invention.

도 2는 종래 기술에 따른 비금속 표면의 도금 방법을 도시한 순서도.2 is a flow chart illustrating a plating method of a non-metallic surface according to the prior art.

Claims (12)

비금속 표면에 기재 금속 도금 필름을 도금하는 단계;Plating a base metal plating film on a nonmetal surface; 내부 금속층이 형성되도록 상기 기재 금속 도금 필름의 표면에 제1 금속 물질을 도금하는 단계; 및Plating a first metal material on a surface of the base metal plating film to form an inner metal layer; And 외부 금속층이 형성되도록 상기 내부 금속층 표면에 제2 금속 물질을 도금하는 단계Plating a second metal material on the inner metal layer surface to form an outer metal layer 를 포함하는 비금속 표면의 도금 방법.Plating method of the non-metal surface comprising a. 제1항에 있어서,The method of claim 1, 상기 비금속 표면이 전기 전도성을 갖도록, 진공 스퍼터링 방법에 따라 상기 비금속 표면에 상기 기재 금속 도금 필름을 도금하는 것을 특징으로 하는 방법.Plating the base metal plating film on the base metal surface according to a vacuum sputtering method such that the base metal surface is electrically conductive. 제1항에 있어서,The method of claim 1, 화학적 도금 방법에 따라 상기 기재 금속 도금 필름의 표면에 상기 제1 금속 물질을 도금하는 것을 특징으로 하는 방법.Plating the first metal material on the surface of the base metal plating film according to a chemical plating method. 제1항에 있어서,The method of claim 1, 전기 도금 방법에 따라 상기 기재 금속 도금 필름의 표면에 상기 제1 금속 물질을 도금하는 것을 특징으로 하는 방법.And plating the first metal material on the surface of the base metal plating film according to an electroplating method. 제1항에 있어서,The method of claim 1, 화학적 도금 방법에 따라 상기 내부 금속층 표면에 제2 금속 물질을 도금하는 것을 특징으로 하는 방법.Plating a second metal material on the surface of the inner metal layer according to a chemical plating method. 제1항에 있어서,The method of claim 1, 전기 도금 방법에 따라 상기 내부 금속층 표면에 제2 금속 물질을 도금하는 것을 특징으로 하는 방법.And plating a second metal material on the surface of the inner metal layer according to an electroplating method. 비금속 표면;Nonmetallic surfaces; 상기 비금속 표면에 형성된 기재 금속 도금 필름;A base metal plating film formed on the nonmetal surface; 상기 기재 금속 도금 필름의 표면에 형성된 내부 금속층; 및An inner metal layer formed on a surface of the base metal plating film; And 상기 내부 금속층 표면에 보호층으로서 형성된 외부 금속층An outer metal layer formed as a protective layer on the inner metal layer surface 을 포함하는 도금된 표면 구조물.Plated surface structure comprising a. 제7항에 있어서,The method of claim 7, wherein 상기 기재 금속 도금 필름이 진공 스퍼터링 방법에 의해 비금속 표면에 도금되어, 상기 비금속 표면이 전기 전도성을 갖는 The base metal plating film is plated on the nonmetal surface by the vacuum sputtering method, so that the nonmetal surface has electrical conductivity 것을 특징으로 하는 도금된 표면 구조물.Plated surface structure. 제7항에 있어서,The method of claim 7, wherein 상기 제1 금속 물질이 구리인 것을 특징으로 하는 도금된 표면 구조물.A plated surface structure, characterized in that the first metal material is copper. 제7항에 있어서,The method of claim 7, wherein 상기 제2 금속 물질이 니켈인 것을 특징으로 하는 도금된 표면 구조물.A plated surface structure, characterized in that the second metal material is nickel. 제7항에 있어서,The method of claim 7, wherein 상기 제2 금속 물질이 스테인리스 강인 것을 특징으로 하는 도금된 표면 구조물.And the second metallic material is stainless steel. 제7항에 있어서,The method of claim 7, wherein 상기 제2 금속 물질이 크롬인 것을 특징으로 하는 도금된 표면 구조물.A plated surface structure, characterized in that the second metal material is chromium.
KR1020040045040A 2004-06-17 2004-06-17 Method for metallizing a non-metallic surface and the metallized surface structure thereof KR20050119902A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210056965A (en) * 2019-06-11 2021-05-20 주식회사 포엠비 Fluorine-based substrate with a low dielectric constant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210056965A (en) * 2019-06-11 2021-05-20 주식회사 포엠비 Fluorine-based substrate with a low dielectric constant

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