KR20050090560A - Flexible copper clad laminate and its manufacturing method for high frequency - Google Patents

Flexible copper clad laminate and its manufacturing method for high frequency Download PDF

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Publication number
KR20050090560A
KR20050090560A KR1020040015699A KR20040015699A KR20050090560A KR 20050090560 A KR20050090560 A KR 20050090560A KR 1020040015699 A KR1020040015699 A KR 1020040015699A KR 20040015699 A KR20040015699 A KR 20040015699A KR 20050090560 A KR20050090560 A KR 20050090560A
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South Korea
Prior art keywords
copper foil
insulating resin
resin
flexible copper
fluorine
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KR1020040015699A
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Korean (ko)
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양유철
최호욱
정연학
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유한회사 한국 타코닉
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Priority to KR1020040015699A priority Critical patent/KR20050090560A/en
Publication of KR20050090560A publication Critical patent/KR20050090560A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene

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  • Laminated Bodies (AREA)

Abstract

본 발명은 연성 동박적층판 및 그 제조방법에 관한 것으로, 특히 본 발명은 유전특성을 향상시켜 1㎓ 이상의 고주파 대역에서도 사용 가능하도록 함으로써 사용 가능한 주파수 대역을 확장시킨다.The present invention relates to a flexible copper clad laminate and a method for manufacturing the same. In particular, the present invention extends the usable frequency band by improving the dielectric properties so that it can be used even in a high frequency band of 1 kHz or more.

이를 위해 본 발명은 연성의 절연수지와, 상기 절연수지의 한 면 또는 양면에 마련되는 동박을 구비하는 연성 동박적층판에 있어서, 절연수지로 불소계수지를 형성함으로써 1㎓이상의 고주파 대역에서도 잡음 등이 발생하지 않게 할 수 있고, 유전손실을 대폭 줄일 수 있을 뿐만 아니라, 넓은 주파수대역에서 온도변화에 따른 안정된 유전특성을 갖게 할 수 있는 장점이 있다.To this end, the present invention is a flexible copper-clad laminate having a flexible insulating resin and a copper foil provided on one side or both sides of the insulating resin, by forming a fluorine resin with the insulating resin to generate noise, even in the high frequency band of 1 kHz or more It is possible not to do it, and to greatly reduce the dielectric loss, and to have a stable dielectric characteristic due to temperature change in a wide frequency band.

Description

고주파용 연성 동박적층판 및 그 제조방법{Flexible Copper Clad Laminate and its manufacturing method for high frequency}Flexible Copper Clad Laminate and its manufacturing method for high frequency

본 발명은 연성 동박적층판(Flexible Copper Clad Laminate ; FCCL) 및 그 제조방법에 관한 것이다.The present invention relates to a flexible copper clad laminate (FCCL) and a method of manufacturing the same.

일반적으로, 연성 동박적층판은 도 1과 같이, 연성의 절연수지(1)와, 이 절연수지(1)에 마련되는 동박(2)을 포함한다. 이 연성 동박 적층판은 절연수지(1)의 양면에 동박(2)을 접착시킨 후 가압 가열함으로써 형성된다.In general, the flexible copper foil laminate includes a flexible insulating resin 1 and a copper foil 2 provided on the insulating resin 1, as shown in FIG. This flexible copper foil laminated sheet is formed by adhering the copper foil 2 to both surfaces of the insulating resin 1 and then heating under pressure.

절연수지(1)로는 폴리이미드(Polyimide ; PI) 또는 폴리에스터(Polyester ; PET)가 주로 사용된다.As the insulating resin 1, polyimide (PI) or polyester (PET) is mainly used.

그러나, PI 또는 PET는 1㎑ 내지 수백 ㎑의 주파수대역 내에서 사용 가능하며, 이 기준 주파수 대역을 넘어서는 경우에는 유전손실이 커지고 온도에 따라 유전율 변화가 극심하기 때문에 잡음 등이 발생할 수 있다. 따라서, 종래의 연성 동박적층판은 사용 가능한 주파수대역을 최대로 확장한다하더라도 1㎓에 미치지 못한다.However, PI or PET can be used in the frequency band of 1 kHz to several hundred kHz, and when the reference frequency band is exceeded, noise may occur because the dielectric loss is large and the dielectric constant changes with temperature. Therefore, conventional flexible copper clad laminates do not reach 1 kHz even when the usable frequency band is expanded to the maximum.

하지만, 최근에는 전자기기의 급격한 고주파화 및 고정보화로 인해 주파수 대역이 점차 높아지고 있는 추세에 있으므로 1㎓ 이상의 고주파에서도 사용 가능한 연성 동박 적층판이 요구되고 있다.However, in recent years, the frequency band is gradually increasing due to the rapid high frequency and high information of the electronic device has been required a flexible copper foil laminate that can be used even at high frequencies of 1 kHz or more.

본 발명은 이러한 요구에 부응하기 위한 것으로, 본 발명의 목적은 보다 향상된 유전특성을 갖게 하여 고주파수 대역에서도 사용 가능하도록 함으로써 사용 가능한 주파수 대역을 확장시키는 연성 동박적층판 및 그 제조방법을 제공하는 데 있다.An object of the present invention is to provide a flexible copper clad laminate and a method for manufacturing the same, which can be used in high frequency bands by providing improved dielectric properties and extending the usable frequency bands.

전술한 목적을 달성하기 위한 본 발명의 연성 동박적층판은 연성의 절연수지와, 상기 절연수지의 한 면 또는 양면에 마련되는 동박을 구비하는 연성 동박적층판에 있어서, 상기 절연수지와 동박사이에 절연 수지로 불소계수지를 형성하는 것을 특징으로 한다.The flexible copper foil laminate of the present invention for achieving the above object is a flexible copper foil laminate comprising a flexible insulating resin and a copper foil provided on one side or both sides of the insulating resin, the insulating resin between the insulating resin and the copper foil It characterized by forming a fluorine resin.

본 발명의 연성 동박적층판의 제조방법은 절연수지와, 상기 절연수지의 한 면 또는 양면에 배치된 동박을 구비하는 연성 동박적층판을 제조하는 방법에 있어서, 상기 절연수지의 한 면 또는 양면에 절연수지로 불소계수지를 형성하고, 상기 불소계수지에 동박을 형성한 것을 특징으로 한다.The method of manufacturing a flexible copper clad laminate of the present invention is a method of manufacturing a flexible copper clad laminate comprising an insulating resin and a copper foil disposed on one or both sides of the insulating resin, the insulating resin on one side or both sides of the insulating resin The fluorine-based resin is formed, and copper foil is formed on the fluorine-based resin.

이하에서는 본 발명의 바람직한 실시예를 본 도면을 참조하여 상세하게 설명하도록 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

본 발명의 실시예에 따른 연성 동박 적층판은 도 2에 도시된 바와 같이, 연성의 절연수지(10)와, 이 절연수지(10)에 마련되는 불소계 수지(11)와, 이 불소계 수지(11)에 마련되는 금속막(12)을 포함한다.As shown in FIG. 2, the flexible copper foil laminate according to the exemplary embodiment of the present invention includes a flexible insulating resin 10, a fluorine resin 11 provided on the insulating resin 10, and the fluorine resin 11. It includes a metal film 12 provided in.

절연수지(1)는 폴리이미드(PI) 또는 폴리에스터(PET)를 포함한다.The insulating resin 1 includes polyimide (PI) or polyester (PET).

불소계 수지(11)는 통상 테프론 수지라고 불리우는 폴리테프라플루오르에틸렌(Poly Tetra Fluoro Ethylene ; PTFE), 헥사 플루오르프로필렌공중합체(Fluorinated Ethylene Propylene ; FEP), 페르 플루오트 알킬비닐에테르 공중합체(Per Fluoro Alkoxy ; PFA) 등과, 불소계 수지들의 여러 다양한 복합체들을 포함한다.The fluorine-based resin 11 includes polytetra fluoro ethylene (PTFE), hexa fluoro propylene propylene (FEP), and perfluoro alkyl vinyl ether copolymer (Per Fluoro Alkoxy; PFA) and the like, and various various composites of fluorine-based resins.

금속막(12)은 구리로 이루어진 동박(Cu)을 포함한다.The metal film 12 includes copper foil Cu made of copper.

이러한 불소계 수지(11)는 고주파에서도 우수한 유전특성을 나타내는 재료로, 유전손실은 낮고, 유전율의 온도의존성이 낮아 고온 및 고주파에 사용 가능하다. 참고로, 본 발명의 실시예에 따른 연성 동박 적층판은 일예로서, 1 ㎓에서 10㎓ 범위내의 고주파에서 사용 가능하다.The fluorine-based resin 11 is a material exhibiting excellent dielectric properties even at high frequencies. The dielectric loss is low and the temperature dependency of the dielectric constant is low, so that the fluorine resin 11 can be used at high temperatures and high frequencies. For reference, the flexible copper foil laminate according to the embodiment of the present invention may be used at a high frequency within a range of 1 Hz to 10 Hz as an example.

도 3은 도 2의 단면도로서, 절연수지(10)로 폴리이미드(PI)를 사용하고, 불소계 수지(11)로 폴리테프라플루오르에틸렌(PTFE)을 사용하여 폴리이미드(PI)의 양면에 폴리테프라플루오르에틸렌(PTFE)와 동박(Cu)을 형성한 연성 적층동박판을 보이고 있다. 이때, 폴리이미드(PI)의 두께는 15㎛ ~ 50㎛이고, 폴리테프라플루오르에틸렌(PTFE)의 두께는 3㎛ ~ 25㎛이고, 동박(Cu)의 두께는 3㎛ ~ 35㎛이다.FIG. 3 is a cross-sectional view of FIG. 2, using polyimide (PI) as the insulating resin 10 and polytetrafluoroethylene (PTFE) as the fluorine-based resin 11. The flexible laminated copper foil in which fluoroethylene (PTFE) and copper foil (Cu) were formed is shown. At this time, the thickness of polyimide (PI) is 15 micrometers-50 micrometers, the thickness of polytetrafluoroethylene (PTFE) is 3 micrometers-25 micrometers, and the thickness of copper foil (Cu) is 3 micrometers-35 micrometers.

그러나, 필요한 경우, 도 4와 같이, 폴리이미드(PI)의 한 면에 폴리테프라플루오르에틸렌(PTFE)를 형성한 후 이 폴리테프라플루오르에틸렌(PTFE)의 바깥면에 동박(12)을 접착시킴으로써 연성 동박 적층판을 제조한다.However, if necessary, as shown in Figure 4, by forming a polytetrafluoroethylene (PTFE) on one side of the polyimide (PI) and then ductile by bonding the copper foil 12 to the outer surface of the polytetrafluoroethylene (PTFE) Copper foil laminated board is manufactured.

이 연성 동박 적층판은 절연수지(10)에 고주파용 불소계 수지(11)를 함침시킨 후 금속박을 압착, 증착, 도금시키는 함침법 또는 절연수지(10)를 베이스로 하여 한 면 또는 양면에 불소계수지(11)를 가열 가압하는 적층법에 의하여 제조된다.The flexible copper foil laminated plate is impregnated with a high frequency fluorine-based resin 11 in the insulating resin 10, and then impregnated, deposited, or plated with metal foil, or based on the insulating resin 10, on one or both sides of the fluorine resin ( It is manufactured by the lamination method which heat-presses 11).

이하에서는 함침법을 이용하여 연성 동박 적층판을 제조하는 과정을 구체적인 예를 통해 살펴보기로 한다.Hereinafter, a process of manufacturing the flexible copper foil laminate using the impregnation method will be described through specific examples.

도 5는 본 발명의 실시예에 따른 연성 동박 적층판을 제조하는 과정을 설명하기 위한 제어흐름도이다. 도 5를 살펴보면, 먼저, 폴리테프라플루오르에틸렌(PTFE)가 비점착성이므로 폴리이미드(PI)의 표면에 폴리테프라플루오르에틸렌(PTFE)을 형성하기 위해 폴리이미드(PI)의 한 면 또는 양면을 표면 처리한다(S100). 도 6과 같이, 소정의 이온 빔 또는 중성빔을 조사하는 이온 소스들 사이로 폴리이미드(PI)를 통과시켜 이온 빔에 의하여 폴리이미드(PI)를 표면 처리함으로써 표면을 활성화시킨다. 이온 빔 또는 중성빔 표면처리는 토출전압 150eV ~ 3000eV, 토출전류는 0.2 ~ 4A, 이온화가스 아르곤(Ar), 수소(H2), 산소(O2), 질소(N2), 네온(NE), 크세논(XE) 또는 혼합가스 유입량 10sccm, 분위기가스 아르곤(Ar), 수소(H2), 산소(O2), 질소(N2) 또는 혼합가스 유입량 0 ~ 300sccm를 이용한다.5 is a control flowchart illustrating a process of manufacturing a flexible copper foil laminate according to an embodiment of the present invention. Referring to FIG. 5, first, since polytetrafluoroethylene (PTFE) is non-adhesive, surface treatment of one or both sides of the polyimide (PI) to form polyteprafluoroethylene (PTFE) on the surface of the polyimide (PI) (S100). As shown in FIG. 6, the surface is activated by surface treatment of the polyimide (PI) by the ion beam by passing the polyimide (PI) between the ion source irradiating a predetermined ion beam or a neutral beam. Ion beam or neutral beam surface treatment, discharge voltage 150eV ~ 3000eV, discharge current 0.2 ~ 4A, ionization gas argon (Ar), hydrogen (H 2 ), oxygen (O 2 ), nitrogen (N 2 ), neon (N E ), Xenon (X E ) or 10 sccm of mixed gas inlet, atmosphere gas argon (Ar), hydrogen (H 2 ), oxygen (O 2 ), nitrogen (N 2 ) or mixed gas inlet 0 ~ 300sccm.

그리고, 표면 처리된 폴리이미드(PI)에 고주파 특성을 부여할 수 있는 폴리테프라플루오르에틸렌(PTFE)를 함침시킨다(S110). 그런 후 폴리테프라플루오르에틸렌(PTFE)을 조건에 따라서 건조과정을 거친다(S120). 도 7에 도시된 바와 같이, 유전율, 유전손실 등 고주파, 고 내열 특성을 만족시키기 위한 복합화 공정으로 표면 처리된 폴리이미드(PI)를 폴리테프라플루오르에틸렌(PTFE) 함침조를 통과시켜 폴리테프라플루오르에틸렌(PTFE)를 함침시킨 후 온도가 200 ~ 400℃인 건조기를 통과시켜 건조시킴으로써 복합 다층화한다.Then, impregnated polytetrafluoroethylene (PTFE) capable of imparting high frequency characteristics to the surface-treated polyimide (PI) (S110). Then, polyteprafluoroethylene (PTFE) is subjected to a drying process according to the conditions (S120). As shown in FIG. 7, polytetrafluoroethylene is obtained by passing a polyimide (PI) surface-treated through a polytetrafluoroethylene (PTFE) impregnating tank in a complexing process to satisfy high frequency and high heat resistance characteristics such as permittivity and dielectric loss. After impregnating (PTFE), a multilayered composite is obtained by drying through a dryer having a temperature of 200 to 400 ° C.

또한, 두께 조절을 위해 원하는 두께가 형성되게 함침과 건조를 반복하여 제작한다(S130). 유전율, 두께 등의 필요한 특성에 맞게 반복하여 실시한다.In addition, the impregnation and drying is repeatedly made so that the desired thickness is formed for controlling the thickness (S130). Repeat the process according to required properties such as permittivity and thickness.

위와 같이 제작된 복합유전체에 동박(Cu)을 형성하기 위해 폴리테프라플루오르에틸렌(PTFE)의 한 면 또는 양면을 표면 처리한다(S140). 그리고, 표면 처리된 폴리테프라플루오르에틸렌(PTFE)에 동박을 200~400℃의 열 및 진공 하에서 압착하거나, 기상증착, 도금 또는 혼용하여 필요두께의 동박을 형성시킨다(S150). 도 8에 도시된 바와 같이, 폴리테프라플루오르에틸렌(PTFE)가 함침된 폴리이미드(PI)를 이온 또는 중성빔 소스사이로 통과시켜 빔으로 표면 처리한 후 연속 공정으로 표면처리에 의하여 표면 활성화된 폴리테프라플루오르에틸렌(PTFE)을 금속원사이로 통과시켜 소정 두께(일예로, 300℃~10000℃)로 기상 증착을 통해 동박(Cu)을 형성한다. 또한, 도 9에 도시된 바와 같이, 전해도금방식을 이용하여 동박의 두께를 조절한다.In order to form copper foil (Cu) on the composite dielectric fabricated as described above, one or both surfaces of polytetrafluoroethylene (PTFE) are surface treated (S140). Then, copper foil is pressed on the surface-treated polytetrafluoroethylene (PTFE) under heat and vacuum at 200 to 400 ° C., or vapor phase deposition, plating, or mixed to form copper foil having a required thickness (S150). As shown in FIG. 8, polyteprafluoroethylene (PTFE) -impregnated polyimide (PI) is passed through an ion or neutral beam source to be surface treated with a beam, and then surface activated by surface treatment in a continuous process. Fluoroethylene (PTFE) is passed between metal sources to form copper foil (Cu) through vapor deposition at a predetermined thickness (for example, 300 ° C to 10000 ° C). In addition, as shown in Figure 9, the thickness of the copper foil is adjusted using the electroplating method.

이하에서는 적층법을 이용하여 연성 동박 적층판을 제조하는 과정을 구체적인 예를 통해 살펴보기로 한다.Hereinafter, a process of manufacturing a flexible copper foil laminate using a lamination method will be described with reference to specific examples.

도 10은 본 발명의 다른 실시예에 따른 연성 동박 적층판을 제조하는 과정을 설명하기 위한 제어흐름도이다. 도 10을 살펴보면, 폴리이미드(PI)의 표면에 폴리테프라플루오르에틸렌(PTFE)을 형성할 수 있도록 폴리이미드(PI)의 한 면 또는 양면을 표면 처리한다(S200). 10 is a control flowchart illustrating a process of manufacturing a flexible copper foil laminate according to another embodiment of the present invention. Referring to FIG. 10, one or both surfaces of the polyimide (PI) may be surface treated to form polytetrafluoroethylene (PTFE) on the surface of the polyimide (PI) (S200).

그리고, 폴리테프라플루오르에틸렌(PTFE)에 동박(Cu)을 형성할 수 있도록 폴리테프라플루오르에틸렌(PTFE)의 한 면 또는 양면을 표면 처리한다(S210).Then, one or both surfaces of the polytetrafluoroethylene (PTFE) are surface treated to form copper foil (Cu) on the polytetrafluoroethylene (PTFE) (S210).

그런 후, 도 11과 같이, 표면 처리된 폴리이미드(PI)와 폴리테프라플루오르에틸렌(PTFE)를 적층 배열한다(S220). 그리고, 도 12와 같이, 적층 배열된 폴리이미드(PI)와 폴리테프라플루오르에틸렌(PTFE)에 동박(Cu)을 배열한다(S230). 이때, 이때, 표면 처리된 폴리이미드(PI)와 폴리테프라플루오르에틸렌(PTFE), 동박을 필요한 두께, 유전율 등을 계산하여 목적에 맞게 배열한다.Thereafter, as illustrated in FIG. 11, the surface-treated polyimide (PI) and the polytetrafluoroethylene (PTFE) are stacked and stacked (S220). And as shown in FIG. 12, copper foil (Cu) is arrange | positioned at the polyimide (PI) and polytetrafluoroethylene (PTFE) which were laminated | stacked and arrange | positioned (S230). At this time, the surface-treated polyimide (PI) and polytetrafluoroethylene (PTFE), the copper foil is calculated by arranging the required thickness, dielectric constant and the like according to the purpose.

그런 후 도 13과 같이, 배열된 폴리이미드(PI), 폴리테프라플루오르에틸렌(PTFE), 동박(Cu)을 진공 열 압착하여 각각 접착시킨다(S240).Then, as shown in Fig. 13, the arranged polyimide (PI), polytetrafluoroethylene (PTFE), copper foil (Cu) by vacuum thermocompression bonding respectively (S240).

이상에서 상세히 설명한 바와 같이, 본 발명은 절연수지와 금속막사이에 고주파 대역에서도 유전특성이 우수한 불소계수지를 마련함으로써 1㎓이상의 고주파대역에서도 잡음 등이 발생하지 않게 할 수 있는 효과가 있다.As described in detail above, the present invention has an effect that noise and the like can be prevented from occurring even in the high frequency band of 1 kHz or more by providing a fluorine resin having excellent dielectric properties even in the high frequency band between the insulating resin and the metal film.

또한, 본 발명은 불소계수지를 사용함으로써 유전손실을 대폭 줄일 수 있는 효과가 있다.In addition, the present invention has the effect of significantly reducing the dielectric loss by using a fluorine resin.

또한, 본 발명은 넓은 주파수대역에서 안정된 유전특성을 갖게 할 수 있는 효과가 있다.In addition, the present invention has the effect of having a stable dielectric properties in a wide frequency band.

도 1은 종래 연성 동박 적층판의 단면도이다.1 is a cross-sectional view of a conventional flexible copper foil laminate.

도 2는 본 발명의 실시예에 따른 연성 동박 적층판의 사시도이다.2 is a perspective view of a flexible copper foil laminate according to an embodiment of the present invention.

도 3은 도 2의 단면도이다.3 is a cross-sectional view of FIG. 2.

도 4는 본 발명의 다른 실시예에 따른 연성 동박 적층판의 단면도이다.4 is a cross-sectional view of a flexible copper foil laminate according to another embodiment of the present invention.

도 5는 본 발명의 실시예에 따른 연성 동박 적층판을 제조하는 과정을 설명하기 위한 제어흐름도이다.5 is a control flowchart illustrating a process of manufacturing a flexible copper foil laminate according to an embodiment of the present invention.

도 6은 도 5의 표면처리 과정을 설명하기 위한 도이다.6 is a view for explaining the surface treatment process of FIG.

도 7은 도 5의 함침 및 건조과정을 설명하기 위한 도이다.7 is a view for explaining the impregnation and drying process of FIG.

도 8은 도 5의 동박을 형성하는 과정을 설명하기 위한 도이다.FIG. 8 is a diagram for explaining a process of forming the copper foil of FIG. 5.

도 9는 도 5의 전해도금 과정을 설명하기 위한 도이다.9 is a view for explaining the electroplating process of FIG.

도 10은 본 발명의 다른 실시예에 따른 연성 동박 적층판을 제조하는 과정을 설명하기 위한 제어흐름도이다.10 is a control flowchart illustrating a process of manufacturing a flexible copper foil laminate according to another embodiment of the present invention.

도 11은 도 10에서 표면처리된 폴리이미드(PI)와 폴리테프라플루오르에틸렌(PTFE)가 배열하는 과정을 설명하기 위한 도이다.FIG. 11 is a view for explaining a process of arranging polyimide (PI) and polyteprafluoroethylene (PTFE) surface-treated in FIG. 10.

도 12는 도 10에서 폴리이미드(PI), 폴리테프라플루오르에틸렌(PTFE), 동박을 적층하는 과정을 설명하기 위한 도이다.FIG. 12 is a diagram for describing a process of stacking polyimide (PI), polytetrafluoroethylene (PTFE), and copper foil in FIG. 10.

도 13은 도 10에서 적층된 폴리이미드(PI), 폴리테프라플루오르에틸렌(PTFE), 동박을 진공 열 압착하는 과정을 설명하기 위한 도이다.FIG. 13 is a view for explaining a process of vacuum thermocompression bonding of polyimide (PI), polytetrafluoroethylene (PTFE), and copper foil laminated in FIG. 10.

*도면의 주요 기능에 대한 부호의 설명** Description of the code for the main functions of the drawings

10 : 절연수지 11 : 불소계수지10: insulation resin 11: fluorine resin

12 : 금속막12: metal film

Claims (9)

연성의 절연수지와, 상기 절연수지의 한 면 또는 양면에 마련되는 동박을 구비하는 연성 동박적층판에 있어서,In the flexible copper foil laminated plate having a flexible insulating resin and a copper foil provided on one side or both sides of the insulating resin, 상기 절연수지와 동박사이에 절연수지로 불소계수지를 형성하는 것을 특징으로 하는 연성 동박적층판.A flexible copper foil laminated plate, characterized in that to form a fluorine resin between the insulating resin and the copper foil as an insulating resin. 제1항에 있어서, 상기 불소계수지는 폴리테프라플루오르에틸렌(PTFE), 헥사 플루오르프로필렌공중합체(FEP)(Fluorinated Ethylene Propylene), 페르 플루오트 알킬비닐에테르 공중합체(PFA)(Per Fluoro Alkoxy) 중 어느 하나 또는 그 조합에 의한 복합체인 것을 특징으로 하는 연성 동박적층판.The method of claim 1, wherein the fluorine resin is any one of polytetrafluoroethylene (PTFE), hexa fluoropropylene copolymer (FEP) (Fluorinated Ethylene Propylene), perfluoro alkyl vinyl ether copolymer (PFA) (Per Fluoro Alkoxy) A flexible copper clad laminate, characterized in that the composite by one or a combination thereof. 제1항에 있어서, 상기 불소계수지의 한 면 또는 양면은 이온 빔 또는 중성빔에 의해 표면 처리된 것을 특징으로 하는 연성 동박적층판.The flexible copper clad laminate of claim 1, wherein one or both surfaces of the fluorine resin are surface treated by an ion beam or a neutral beam. 절연수지와, 상기 절연수지의 한 면 또는 양면에 배치된 동박을 구비하는 연성 동박적층판을 제조하는 방법에 있어서,In the method of manufacturing a flexible copper foil laminated plate having an insulating resin and a copper foil disposed on one side or both sides of the insulating resin, 상기 절연수지의 한 면 또는 양면에 절연수지로 불소계수지를 형성하고,Forming a fluorine resin with an insulating resin on one or both sides of the insulating resin, 상기 불소계수지에 동박을 형성한 것을 특징으로 하는 연성 동박적층판의 제조방법.Copper foil was formed in the said fluorine-type resin, The manufacturing method of the flexible copper foil laminated board characterized by the above-mentioned. 제4항에 있어서, 상기 절연수지를 이온 빔 또는 중성빔을 이용하여 표면 처리한 후 표면처리된 상기 절연수지에 고주파용 불소계수지를 함침시켜 상기 불소계수지를 형성하는 것을 특징으로 하는 연성 동박적층판의 제조방법.5. The flexible copper clad laminate of claim 4, wherein the insulating resin is surface treated using an ion beam or a neutral beam, and then the surface-treated insulating resin is impregnated to form the fluorine resin by impregnating a high frequency fluorine resin. Manufacturing method. 제5항에 있어서, 상기 함침된 불소계수지의 한 면을 이온 빔 또는 중성빔을 이용하여 표면 처리한 후 상기 동박을 형성하는 것을 특징으로 하는 연성 동박적층판의 제조방법.The method of claim 5, wherein the copper foil is formed after surface treatment of one surface of the impregnated fluorine resin using an ion beam or a neutral beam. 제6항에 있어서, 상기 동박은 기상증착, 전해도금, 진공 열압착 또는 이들의 혼용에 의하여 상기 불소계수지에 형성되는 것을 특징으로 하는 연성 동박적층판의 제조방법.The method of claim 6, wherein the copper foil is formed on the fluorine resin by vapor deposition, electroplating, vacuum thermocompression, or a mixture thereof. 제4항에 있어서, 표면 처리된 상기 절연수지와, 한 면 또는 양면이 표면 처리된 상기 불소계수지와, 상기 동박을 적층 배열한 후 진공 열 압착하는 것을 특징으로 하는 연성 동박적층판의 제조방법.The method for manufacturing a flexible copper clad laminate according to claim 4, wherein the insulating resin that has been surface-treated, the fluorine-based resin whose surface or surface is treated on one surface or both surfaces, and the copper foil are laminated and arranged in a vacuum. 제4항에 있어서, 상기 불소계수지는 폴리테프라플루오르에틸렌(PTFE), 헥사 플루오르프로필렌공중합체(FEP)(Fluorinated Ethylene Propylene), 페르 플루오트 알킬비닐에테르 공중합체(PFA)(Per Fluoro Alkoxy) 중 어느 하나 또는 그 조합에 의한 복합체인 것을 특징으로 하는 연성 동박적층판의 제조방법.The method of claim 4, wherein the fluorine resin is any of polytetrafluoroethylene (PTFE), hexa fluoropropylene copolymer (FEP) (Fluorinated Ethylene Propylene), Per Fluoro Alkoxy (PFA) (Per Fluoro Alkoxy) A method for producing a flexible copper clad laminate, characterized in that the composite by one or a combination thereof.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956745B1 (en) * 2008-04-28 2010-05-12 주식회사 서흥플라즈마 Flexible copper clad laminate having polymer-ceramic-metal clad layers and manufacturing method thereof
KR101017468B1 (en) * 2010-09-17 2011-02-25 세종메탈 주식회사 Mccl for lot test of withstanding voltage, method of lot test withstanding voltage by using the same and manufacturing method of normal discriminated mccl
US11549035B2 (en) 2020-12-16 2023-01-10 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11596064B2 (en) 2020-07-28 2023-02-28 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
WO2023191383A1 (en) * 2022-04-01 2023-10-05 주식회사 아이에스시 Flexible copper clad laminate for electronic substrate, and flexible printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956745B1 (en) * 2008-04-28 2010-05-12 주식회사 서흥플라즈마 Flexible copper clad laminate having polymer-ceramic-metal clad layers and manufacturing method thereof
KR101017468B1 (en) * 2010-09-17 2011-02-25 세종메탈 주식회사 Mccl for lot test of withstanding voltage, method of lot test withstanding voltage by using the same and manufacturing method of normal discriminated mccl
US11596064B2 (en) 2020-07-28 2023-02-28 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11805600B2 (en) 2020-07-28 2023-10-31 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11549035B2 (en) 2020-12-16 2023-01-10 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
WO2023191383A1 (en) * 2022-04-01 2023-10-05 주식회사 아이에스시 Flexible copper clad laminate for electronic substrate, and flexible printed circuit board

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