KR200491953Y1 - 비전 정렬 - Google Patents

비전 정렬 Download PDF

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Publication number
KR200491953Y1
KR200491953Y1 KR2020150007057U KR20150007057U KR200491953Y1 KR 200491953 Y1 KR200491953 Y1 KR 200491953Y1 KR 2020150007057 U KR2020150007057 U KR 2020150007057U KR 20150007057 U KR20150007057 U KR 20150007057U KR 200491953 Y1 KR200491953 Y1 KR 200491953Y1
Authority
KR
South Korea
Prior art keywords
mask
light source
alignment
substrate
visualization system
Prior art date
Application number
KR2020150007057U
Other languages
English (en)
Korean (ko)
Other versions
KR20160001545U (ko
Inventor
이쿠오 모리
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20160001545U publication Critical patent/KR20160001545U/ko
Application granted granted Critical
Publication of KR200491953Y1 publication Critical patent/KR200491953Y1/ko

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Classifications

    • H01L51/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H01L51/0011—
    • H01L2251/56—

Landscapes

  • Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Physical Vapour Deposition (AREA)
KR2020150007057U 2014-11-03 2015-10-30 비전 정렬 KR200491953Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462074397P 2014-11-03 2014-11-03
US62/074,397 2014-11-03

Publications (2)

Publication Number Publication Date
KR20160001545U KR20160001545U (ko) 2016-05-11
KR200491953Y1 true KR200491953Y1 (ko) 2020-07-07

Family

ID=55523826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020150007057U KR200491953Y1 (ko) 2014-11-03 2015-10-30 비전 정렬

Country Status (4)

Country Link
JP (1) JP3203147U (ja)
KR (1) KR200491953Y1 (ja)
CN (1) CN205247063U (ja)
TW (1) TWM526177U (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019516867A (ja) * 2016-05-24 2019-06-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 耐プラズマコーティングを有するシャドウマスク
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
KR102217879B1 (ko) * 2018-03-14 2021-02-18 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하기 위한 방법, 진공 프로세싱을 위한 장치, 및 진공 프로세싱 시스템
KR102620156B1 (ko) * 2018-10-30 2023-12-29 캐논 톡키 가부시키가이샤 밀착도 확인 장치, 밀착도 확인 방법, 및 이를 이용한 성막 장치, 성막 방법, 전자 디바이스의 제조방법
CN112575287B (zh) * 2019-09-29 2022-02-18 上海微电子装备（集团）股份有限公司 掩模对准装置和掩模对准方法
CN113466259B (zh) * 2020-03-31 2023-02-17 上海微电子装备（集团）股份有限公司 金属掩模检测装置、光源标定方法及装置和维护标定方法
TWI832091B (zh) * 2020-10-09 2024-02-11 瑞士商巴柏斯特麥克斯合資公司 板材處理單元和用於評估對齊的方法
US11393698B2 (en) * 2020-12-18 2022-07-19 STATS ChipPAC Pte. Ltd. Mask design for improved attach position

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004037248A (ja) * 2002-07-03 2004-02-05 Sumitomo Metal Mining Co Ltd 検査装置および貫通孔の検査方法
KR100712953B1 (ko) * 2006-06-16 2007-05-02 두산디앤디 주식회사 기판 얼라인장치 및 이를 이용한 기판얼라인방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004037248A (ja) * 2002-07-03 2004-02-05 Sumitomo Metal Mining Co Ltd 検査装置および貫通孔の検査方法
KR100712953B1 (ko) * 2006-06-16 2007-05-02 두산디앤디 주식회사 기판 얼라인장치 및 이를 이용한 기판얼라인방법

Also Published As

Publication number Publication date
JP3203147U (ja) 2016-03-17
CN205247063U (zh) 2016-05-18
TWM526177U (zh) 2016-07-21
KR20160001545U (ko) 2016-05-11

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