KR200307443Y1 - Semiconductor Package Manufacturing Equipment - Google Patents
Semiconductor Package Manufacturing Equipment Download PDFInfo
- Publication number
- KR200307443Y1 KR200307443Y1 KR2019980021621U KR19980021621U KR200307443Y1 KR 200307443 Y1 KR200307443 Y1 KR 200307443Y1 KR 2019980021621 U KR2019980021621 U KR 2019980021621U KR 19980021621 U KR19980021621 U KR 19980021621U KR 200307443 Y1 KR200307443 Y1 KR 200307443Y1
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- semiconductor package
- bumping
- solder balls
- solder
- solder ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 고안은 솔더볼을 입출력 단자로 사용하는 볼 그리드 어레이 반도체 패키지의 배면에 다수의 솔더볼을 접합시키도록 된 반도체 패키지 제조 장비에 관한 것으로, 그 구성은 볼 그리드 어레이 반도체 패키지의 배면에 형성되는 다수의 솔더볼 랜드와 동일한 수의 범핑홀이 구비되고, 이 범핑홀로 솔더볼을 범핑하여 볼 그리드 어레이 반도체 패키지의 배면에 솔더볼을 안착시키도록 된 범핑툴을 구성함에 있어서, 상기한 범핑툴에는 범핑홀에 흡착되어 있는 모든 솔더볼을 동시에 밀어주도록 실린더에 의해 업/다운하는 플레이트를 설치하여서 된 것이다.The present invention relates to a semiconductor package manufacturing equipment for bonding a plurality of solder balls to the back of the ball grid array semiconductor package using solder balls as input and output terminals, the configuration is a plurality of solder balls formed on the back of the ball grid array semiconductor package In the bumping tool provided with the same number of bumping holes as the lands, the bumping holes are used to bump the solder balls to seat the solder balls on the back surface of the ball grid array semiconductor package. This is done by installing a plate that is pushed up and down by the cylinder to push all the solder balls simultaneously.
Description
본 고안은 솔더볼을 입출력 단자로 사용하는 볼 그리드 어레이(Ball Grid Array) 반도체 패키지의 배면에 다수의 솔더볼을 접합시키도록 된 반도체 패키지 제조 장비에 관한 것으로, 더욱 상세하게는 반도체 패키지 제조 장비에서의 범핑장치로 솔더볼을 반도체 패키지의 배면에 범핑시 상기한 솔더볼이 용이하게 안착될 수 있도록 하여 불량을 최대한 방지하고, 생산성 및 신뢰성을 향상시킬 수 있도록 된 것이다.The present invention relates to a semiconductor package manufacturing equipment for bonding a plurality of solder balls to the back surface of a ball grid array semiconductor package using solder balls as input and output terminals, and more specifically, bumping in a semiconductor package manufacturing equipment. When the solder ball is bumped into the back of the semiconductor package as a device, the solder ball can be easily seated, thereby preventing defects as much as possible and improving productivity and reliability.
일반적으로 솔더볼을 입출력 단자로 사용하는 볼 그리드 어레이 반도체 패키지는, 그 배면에 다수의 솔더볼랜드가 형성되어 있고, 이 솔더볼랜드에 솔더볼을 안착시켜 접속시킴으로서, 신호 입출력 단자로 사용한다.In general, a ball grid array semiconductor package using solder balls as an input / output terminal has a large number of solder ball lands formed on its back surface, and is used as a signal input / output terminal by mounting solder balls on the solder ball lands.
이러한 반도체 패키지의 배면에 안착되는 솔더볼은 솔더볼랜드에 정확하게 안착시켜 접합하여야 하는데, 종래에는 반도체 패키지의 배면에 솔더볼을 안착시킬 때 솔더볼을 일일이 손으로 하나씩 안착시키거나, 티져(Tweezer)나 핀셋 등으로 안착시켰던 것이다. 이렇게 함으로서 다수의 솔더볼랜드에 솔더볼을 안착시키기 위한 작업시간이 많이 소요되어 생산성이 저하되고, 솔더볼을 패키지의 솔더볼랜드에 정확히 안착시키지 못하여 많은 불량을 초래하게 되는 문제점이 있었다.The solder balls seated on the back side of the semiconductor package should be seated on the solder bores accurately and bonded. In the related art, when solder balls are seated on the back side of the semiconductor package, the solder balls are seated one by one by hand or by a teaser or tweezers. It was seated. By doing so, it takes a lot of work time for the solder balls to be seated in a plurality of solder borland, the productivity is lowered, there is a problem that the solder ball is not seated correctly on the solder borland of the package, causing a lot of defects.
이러한 문제점을 해결 보완하기 위하여 도 3에 도시된 바와 같이 다수의 솔더볼(S)을 동시에 흡착하여 반도체 패키지의 배면에 안착시켜 접합하도록 된 범핑장치가 개발되어 있다. 그러나, 이러한 범핑장치에는 솔더볼(S)을 반도체 패키지의 배면에 범핑시 상기한 솔더볼(S)을 밀어 줄 수 있는 이젝터 핀(2')이 설치되어 있다.In order to solve this problem, as illustrated in FIG. 3, a bumping device has been developed in which a plurality of solder balls S are simultaneously adsorbed and seated on a rear surface of a semiconductor package to be bonded. However, such a bumping device is provided with an ejector pin 2 'which can push the solder ball S when bumping the solder ball S to the back surface of the semiconductor package.
그러나, 상기한 이젝터 핀(2')은 범핑툴(1)에 형성된 범핑홀(1a)에 대응해서 각각 설치되어 있음으로서, 상기 범핑홀(1a)에 흡착되어 있는 모든 솔더볼(S)을 밀어줄 수는 있으나, 반도체 패키지의 크기가 점차 소형화되어 가고 있는 추세에 따라 솔더볼의 크기가 작아질 경우에는 상기한 이젝터 핀의 제작이 불가능해지고, 상기한 이젝터 핀의 사이즈나 길이 등의 평평도를 일정하게 유지시키기가 매우 어려웠다. 또한, 상기한 이젝터 핀이 설치되는 범핑장치를 제작하기 위해서는 가격이 상승되어 유지 보수시에도 많은 애로점이 있었다.However, since the ejector pins 2 'are respectively provided corresponding to the bumping holes 1a formed in the bumping tool 1, they can push all the solder balls S adsorbed in the bumping holes 1a. However, as the size of the semiconductor package is gradually miniaturized, when the size of the solder ball becomes small, the manufacturing of the ejector pins becomes impossible, and the flatness of the ejector pins is uniform. It was very difficult to maintain. In addition, in order to fabricate the bumper device in which the ejector pins are installed, the price is increased and there are many difficulties in maintenance.
본 고안의 목적은 이와 같은 문제점을 해소하기 위하여 안출된 것으로서, 솔더볼을 입출력 단자로 사용하는 볼 그리드 어레이 반도체 패키지의 배면에 다수의 솔더볼을 접합시키기 위하여 범핑툴로 솔더볼을 흡착한 후, 반도체 패키지의 배면에 상기한 솔더볼을 안착시킬 때, 상기한 솔더볼을 하나의 플레이트에 의해 밀어주도록 함으로서, 모든 솔더볼을 일정한 양 많큼 동일하게 밀어줄 수 있어 신뢰성을 향상시키고, 구조가 간단하여 가격을 절감시킴은 물론, 유지 보수를 용이하게 할 수 있도록 된 반도체 패키지 제조 장비의 범핑장치를 제공함에 있다.The purpose of the present invention is to solve such a problem, and after adsorbing a solder ball with a bumping tool to join a plurality of solder balls on the back of the ball grid array semiconductor package using the solder ball as input and output terminals, When the solder ball is seated on the back side, the solder ball is pushed by one plate, so that all the solder balls can be pushed in the same amount by a certain amount, improving reliability, and the structure is simple, and the price is reduced. Another object of the present invention is to provide a bumping apparatus for a semiconductor package manufacturing equipment that can facilitate maintenance.
도 1은 본 고안에 의한 구성을 나타낸 도면1 is a view showing a configuration according to the present invention
도 2는 본 고안의 구성을 설명하기 위한 요부 단면도Figure 2 is a sectional view of the main part for explaining the configuration of the subject innovation
도 3은 종래의 구조를 설명하기 위한 요부 단면도3 is a sectional view of principal parts for explaining a conventional structure;
- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-
1 - 범핑툴 1a - 범핑홀1-bumping tool 1a-bumping hole
2 - 플레이트 3 - 실린더2-plate 3-cylinder
이하, 본 고안을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 고안에 의한 반도체 패키지 제조 장비는, 볼 그리드 어레이 반도체 패키지의 배면에 형성되는 다수의 솔더볼 랜드와 동일한 수의 범핑홀(1a)이 구비되고, 상기 범핑홀(1a)에서 솔더볼(S)을 범핑하여 볼 그리드 어레이 반도체 패키지의 배면에 솔더볼을 안착시키도록 된 범핑툴(1)을 구성함에 있어서, 상기한 범핑툴(1)에는 범핑홀(1a)에 흡착되어 있는 모든 솔더볼(S)을 동시에 밀어주도록 실린더(3)에 의해 업/다운하는 플레이트(2)를 설치하여서 된 것을 특징으로 한다.The semiconductor package manufacturing apparatus according to the present invention is provided with the same number of bumping holes 1a as the plurality of solder ball lands formed on the rear surface of the ball grid array semiconductor package, and bumps the solder balls S in the bumping holes 1a. In the configuration of the bumping tool 1 to seat the solder ball on the back of the ball grid array semiconductor package, the bumping tool (1) to push all the solder ball (S) adsorbed in the bumping hole (1a) at the same time It is characterized in that the plate (2) to be provided up / down by the cylinder (3) to be provided.
이와 같이 구성된 본 고안은, 볼 그리드 어레이 반도체 패키지의 배면에 솔더볼을 안착시키기 위해서 상기한 범핑툴(1)의 범핑홀(1a)에 솔더볼(S)을 범핑한 후, 상기한 솔더볼(S)을 플레이트(2)로 동시에 밀어서 반도체 패키지의 배면에 솔더볼을 안착시킨다.According to the present invention, the solder ball S is bumped into the bumping hole 1a of the bumping tool 1 in order to seat the solder ball on the back surface of the ball grid array semiconductor package. The solder balls are seated on the back surface of the semiconductor package by simultaneously pushing the plates 2.
이와 같이 솔더볼을 안착하기 위한 동작을 구체적으로 설명하면, 본 고안은 배큠에 의해 솔더볼을 흡착하는 것이 아니라, 솔더볼(S)의 자중에 의해서 상기한 범핑홀(1a)에 솔더볼이 안착되도록 하여 반도체 패키지의 배면에 솔더볼을 범핑하는 것이다.When describing the operation for seating the solder ball in detail, the present invention does not suck the solder ball by the backing, the solder ball is seated in the bumping hole (1a) by the weight of the solder ball (S) to the semiconductor package Bump the solder ball on the back of the.
즉, 도 1에 도시된 바와 같이 범핑툴(1)의 일측에 솔더볼이 보관되는 솔더볼 박스(4)를 설치하고, 상기 솔더볼 박스(4)에 보관된 솔더볼(S)을 상기한 범핑툴(1)의 상면으로 이동시켜 범핑툴(1)의 범핑홀(1a)에 솔더볼(S)이 안착되도록 한다.That is, as shown in FIG. 1, the solder ball box 4 in which the solder balls are stored is installed at one side of the bumping tool 1, and the bumping tools 1 in which the solder balls S are stored in the solder ball box 4 are installed. The solder ball (S) is seated in the bumping hole (1a) of the bumping tool (1) by moving to the top surface.
이와 같이 범핑툴(1)의 범핑홀(1a)에 솔더볼을 안착되도록 하는 것은, 상기한 솔더볼 박스(4)를 열은 상태에서 회전축(5)을 일정 각도로 왕복 회전시키면 상기한 솔더볼 박스(4)에 있는 솔더볼(S)이 상기한 범핑툴(1)의 상면으로 이동되면서 범핑툴(1)의 범핑홀(1a)에 위치되는 솔더볼은 상기한 범핑홀(1a)에 안착된다.The solder ball is seated in the bumping hole 1a of the bumping tool 1. The solder ball box 4 may be reciprocated by rotating the rotary shaft 5 at a predetermined angle while the solder ball box 4 is opened. The solder ball (S) in the) is moved to the upper surface of the bumping tool 1, the solder ball located in the bumping hole (1a) of the bumping tool (1) is seated in the bumping hole (1a).
이러한 상태에서 상기한 솔더볼 박스(4)를 닫고, 상기한 범핑툴(1)의 상면에 반도체 패키지의 배면이 위치시킨 다음, 회전축(5)을 회전시켜 상기한 범핑툴(1)과 반도체 패키지를 180°회전시키면, 반도체 패키지는 하부에 위치되고, 그 상부로 상기한 범핑툴(1)이 위치되므로 솔더볼(S)이 자중에 의해 안착된다.In this state, the solder ball box 4 is closed, the back surface of the semiconductor package is positioned on the upper surface of the bumping tool 1, and then the rotating shaft 5 is rotated so that the bumping tool 1 and the semiconductor package are rotated. When rotated by 180 °, the semiconductor package is located at the bottom, and the bumping tool 1 is positioned at the top thereof, so that the solder balls S are seated by their own weight.
이와 같이 범핑툴(1)과 반도체 패키지가 180°회전되어 솔더볼(S)이 자중에 의해서 안착될 때, 상기한 솔더볼(S)이 자중에 의해서 안착되지 않는 것이 없도록 플레이트(2)를 실린더(3)에 의해 작동시켜 모든 솔더볼을 동일하게 밀어준다.As such, when the bumping tool 1 and the semiconductor package are rotated 180 ° so that the solder balls S are seated by their own weight, the plate 2 is moved to the cylinder 3 such that the solder balls S are not seated by their own weight. ) And push all solder balls equally.
따라서, 상기한 범핑툴(1)의 범핑홀(1a)에 안착된 모든 솔더볼은 전부 반도체 패키지 자재에 안착될 수 있고, 모든 솔더볼을 안착시키면 상기한 범핑툴(1)은다시 180°회전되어 원위치로 복원된다.Therefore, all the solder balls seated in the bumping hole 1a of the bumping tool 1 can be seated on the semiconductor package material. When the solder balls are seated, the bumping tool 1 is rotated 180 ° again. Is restored.
이러한 동작에 의해 솔더볼을 안착시킴으로써, 솔더볼을 동일하고 균일하게 밀어줌으로써, 불량의 발생을 최소화 할 수 있다.By mounting the solder ball by this operation, by pushing the solder ball evenly, it is possible to minimize the occurrence of defects.
이상의 설명에서와 같이 본 고안에 의하면, 솔더볼을 입출력 단자로 사용하는 볼 그리드 어레이 반도체 패키지의 배면에 다수의 솔더볼을 접합시키기 위하여 상기한 솔더볼을 흡착하여 안착시킬 때, 플레이트에 의해 상기 범핑홀에 흡착된 모든 솔더볼을 동일하게 밀어 줌으로서, 불량을 방지하고, 신뢰성 및 생산성을 향상시킬 수 있는 효과가 있다.As described above, according to the present invention, when the solder balls are adsorbed and seated in order to bond a plurality of solder balls to the back of the ball grid array semiconductor package using the solder balls as input / output terminals, the plates are adsorbed to the bumping holes by plates. By pushing all the solder balls equally, there is an effect of preventing defects and improving reliability and productivity.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980021621U KR200307443Y1 (en) | 1998-11-07 | 1998-11-07 | Semiconductor Package Manufacturing Equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980021621U KR200307443Y1 (en) | 1998-11-07 | 1998-11-07 | Semiconductor Package Manufacturing Equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000009594U KR20000009594U (en) | 2000-06-05 |
| KR200307443Y1 true KR200307443Y1 (en) | 2003-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019980021621U KR200307443Y1 (en) | 1998-11-07 | 1998-11-07 | Semiconductor Package Manufacturing Equipment |
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| Country | Link |
|---|---|
| KR (1) | KR200307443Y1 (en) |
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1998
- 1998-11-07 KR KR2019980021621U patent/KR200307443Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR20000009594U (en) | 2000-06-05 |
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