KR20030034417A - method for moving a film type substrate for LCD - Google Patents
method for moving a film type substrate for LCD Download PDFInfo
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- KR20030034417A KR20030034417A KR1020010065346A KR20010065346A KR20030034417A KR 20030034417 A KR20030034417 A KR 20030034417A KR 1020010065346 A KR1020010065346 A KR 1020010065346A KR 20010065346 A KR20010065346 A KR 20010065346A KR 20030034417 A KR20030034417 A KR 20030034417A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
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Abstract
Description
본 발명은 액정표시장치용 어레이기판에 관한 것으로 특히, 필름타입(film type) 기판의 이동방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array substrate for a liquid crystal display device, and more particularly to a method of moving a film type substrate.
도 1은 일반적인 액정표시장치를 개략적으로 도시한 분해 사시도이다.1 is an exploded perspective view schematically illustrating a general liquid crystal display.
도시한 바와 같이, 일반적인 액정표시장치(11)는 다수의 서브컬러필터(7)와, 각 서브 컬러필터 사이에 구성된 블랙매트릭스(6)와, 상기 서브컬러필터(7)와 블랙매트릭스(6)상에 증착된 투명한 공통전극(18)이 형성된 상부기판(5)과, 화소영역(P)과, 화소영역 상에 형성된 화소전극(17)과, 스위칭소자(T)와, 어레이배선이 형성된 하부기판(22)으로 구성되며, 상기 상부기판(5)과 하부기판(22) 사이에는 액정(14)이 충진 되어 있다.As shown in the drawing, a general liquid crystal display device 11 includes a plurality of sub color filters 7, a black matrix 6 disposed between each sub color filter, and the sub color filter 7 and the black matrix 6. An upper substrate 5 having a transparent common electrode 18 deposited thereon, a pixel region P, a pixel electrode 17 formed on the pixel region, a switching element T, and a lower array array formed thereon. It consists of a substrate 22, the liquid crystal 14 is filled between the upper substrate 5 and the lower substrate 22.
상기 하부기판(22)은 어레이기판이라고도 하며, 스위칭소자인 박막트랜지스터(T)가 매트릭스형태(matrix type)로 위치하고, 이러한 다수의 박막트랜지스터를 교차하여 지나가는 게이트배선(13)과 데이터배선(15)이 형성된다.The lower substrate 22 is also referred to as an array substrate, and the thin film transistor T, which is a switching element, is positioned in a matrix type, and the gate wiring 13 and the data wiring 15 passing through the plurality of thin film transistors cross each other. Is formed.
이때, 상기 화소영역(P)은 상기 게이트배선(13)과 데이터배선(15)이 교차하여 정의되는 영역이며, 상기 화소영역 상에는 전술한 바와 같이, 투명한 화소전극(17)이 형성된다.In this case, the pixel area P is an area defined by the gate wiring 13 and the data wiring 15 intersecting. A transparent pixel electrode 17 is formed on the pixel area as described above.
상기 화소전극(17)은 인듐-틴-옥사이드(indium-tin-oxide : ITO)와 같이 빛의 투과율이 비교적 뛰어난 투명 도전성금속을 사용한다.The pixel electrode 17 uses a transparent conductive metal having a relatively high transmittance of light, such as indium-tin-oxide (ITO).
상기 제 1 기판과 제 2 기판은 기존의 유리기판을 사용하는 경우도 있지만, 공정온도가 낮아지면서 상기 유리보다 가격이 저렴하고 다루기 쉬운 플라스틱 필름을 사용하는 경향이 두드러지고 있다.Although the first substrate and the second substrate may use a conventional glass substrate, there is a tendency to use a plastic film which is cheaper than the glass and easy to handle as the process temperature decreases.
전술한 바와 같은 다수의 구성은 다수의 공정을 통해 이루어지며, 이때마다 기판은 증착장비에서 노광장비, 노광장비에서 세정장치 등으로 각 공정마다 운반되는 과정을 겪게 된다.A plurality of configurations as described above is made through a plurality of processes, each time the substrate is subjected to a process transported for each process from the deposition equipment to the exposure equipment, the exposure equipment to the cleaning device.
이때, 상기 유리기판은 시트 타입(sheet type)공정으로 다루기 쉽지만, 필름 타입의 기판일 경우에는 일반적인 유리기판을 다루는 공정과는 동일하게 다루기 힘들다.In this case, the glass substrate may be easily handled by a sheet type process, but in the case of a film type substrate, it may be difficult to handle the glass substrate in the same manner as the general glass substrate process.
이하, 도 2를 참조하여 설명한다.A description with reference to FIG. 2 is as follows.
도 2는 일반적인 시트 타입(sheet type) 운반공정을 도시한 개략적인 도면이다.2 is a schematic diagram showing a general sheet type conveying process.
도시한 바와 같이, 기판(30)은 한번의 공정이 끝나면 다음 공정으로 이동하게 되는데 이때 카세트(32)라는 운반수단에 담겨 이동하게 된다.As shown in the drawing, the substrate 30 moves to the next process after one process is finished, in which case the substrate 30 moves in a conveying means called a cassette 32.
상기 공정을 마친 기판(30)을 상기 카세트(32)에 담는 수단으로 운반 로봇(transfer robot)(34)이 이용된다.A transfer robot 34 is used as a means for holding the substrate 30 in the process into the cassette 32.
이때, 상기 운반 로봇(34)은 공기를 빨아들여 흡착하는 방법으로 기판(30)을 운반하여 상기 카세트(32)안에 담거나 꺼내게 된다.At this time, the transport robot 34 transports the substrate 30 in a manner of sucking and sucking air to be contained or taken out of the cassette 32.
이와 같은 공정은 상기 유리기판(30)을 위한 방법으로는 적당하나, 유연한 필름 타입의 기판을 다루기에는 적합하지 않은 방법이다.Such a process is suitable as a method for the glass substrate 30, but is not suitable for handling a flexible film type substrate.
예를 들면 필름 타입 기판이 상기 운반 로봇(34)에 제대로 흡착이 되지 않거나 하여 기판의 진행이 원활하지 않게 된다.For example, the film type substrate may not be properly adsorbed to the transport robot 34, and thus the substrate may not be smoothly moved.
이와 같은 경우에는 공정 손실이 발생하여 수율을 저하하는 문제가 된다.In such a case, a process loss occurs and the yield decreases.
따라서, 전술한 바와 같은 문제를 해결하기 위해 본 발명이 안출 되었으며, 본 발명은 상기 필름타입 기판을 다루는 새로운 방법을 제안하여, 상기 필름 타입 기판을 운반하는 도중 발생하는 기판 불량을 방지하는 것을 목적으로 한다.Accordingly, the present invention has been devised to solve the above problems, and the present invention proposes a new method for handling the film-type substrate, and aims to prevent substrate defects occurring during transportation of the film-type substrate. do.
도 1은 일반적인 액정표시장치를 개략적으로 도시한 도면이고,1 is a view schematically showing a general liquid crystal display device,
도 2는 종래의 기판 이동 방법인 시트타입(sheet type) 공정을 개략적으로 도시한 도면이고,FIG. 2 is a view schematically showing a sheet type process which is a conventional substrate movement method.
도 3은 공정이 진행된 직후의 필름 타입 기판이, 본 발명에 따라 다루어지는 공정을 도시한 도면이고,3 is a view showing a process in which a film type substrate immediately after the process is handled according to the present invention,
도 4는 공정 직전의 필름 타입 기판이, 본 발명에 따라 다루어지는 공정을 도시한 도면이다.4 is a view showing a step in which the film type substrate immediately before the step is handled according to the present invention.
<도면의 주요부분에 대한 간단한 설명><Brief description of the main parts of the drawing>
100 : 제 1 롤러 102 : 필름 타입 기판100: first roller 102: film type substrate
104 : 공정장비 106 : 제 2 롤러104: process equipment 106: second roller
108 : 제 1 운송수단 110 : 제 2 운송 수단108: first transportation means 110: second transportation means
112a : 제 1 회전롤 112b : 제 2 회전롤112a: first rotating roll 112b: second rotating roll
114 : 코팅막114: coating film
전술한 바와 같은 목적을 달성하기 위한 본 발명에 따른 필름 타입 기판 이동방법은 제 1 롤러에 감겨진 필름타입 기판을 풀면서 상기 기판의 표면에 소정의 공정을 진행하는 단계와; 소정의 공정이 진행된 필름 타입 기판의 표면에 절연막을 코팅하는 단계와; 상기 절연막이 코팅된 필름 타입 기판을 제 2 롤러에 감는 단계와; 상기 제 2 롤러를 연속된 공정을 진행하기 위한 다음 장소로 옮기는 단계를 포함한다.According to an aspect of the present invention, there is provided a method of moving a film type substrate, comprising: performing a predetermined process on the surface of the substrate while unwinding the film type substrate wound on the first roller; Coating an insulating film on a surface of the film type substrate subjected to a predetermined process; Winding the film type substrate coated with the insulating film on a second roller; Moving the second roller to the next location for the subsequent process.
전술한 공정에서, 연속하여 상기 절연막이 코팅되어 제 2 롤러에 감긴 필름 타입 기판을 다음 공정 장소로 옮긴 후, 상기 제 2 롤러에서 감겨진 필름 타입 기판을 풀면서 기판의 표면에 코팅된 절연막을 제거하는 단계와; 상기 절연막이 제거된 기판의 표면에 소정의 공정을 진행한 후 연속으로 상기 공정이 진행된 기판의표면에 다시 절연막을 코팅하여 제 3 롤러를 감는 단계를 더욱 포함한다.In the above-described process, after moving the film type substrate coated with the insulating film on the second roller in succession to the next process site, the insulating film coated on the surface of the substrate is removed while the film type substrate wound on the second roller is released. Making a step; After the predetermined process is performed on the surface of the substrate from which the insulating film has been removed, the method further includes winding the third roller by coating the insulating film on the surface of the substrate on which the process is continuously performed.
이때, 상기 투명한 유기 절연막은 물 또는 솔벤트에 의해 제거되는 폴리에틸렌을 포함하는 절연물질인 것을 특징으로 한다.At this time, the transparent organic insulating film is characterized in that the insulating material containing polyethylene that is removed by water or solvent.
이하, 첨부한 도면을 참조하여 본 발명에 따른 바람직한 실시예를 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
-- 실시예 --Example
본 발명의 특징은 필름 타입 기판을 다루는데 있어서, 기판을 롤러(roller)에 감아 연속적인 공정을 위한 다음 장소로 이동하되, 상기 필름의 표면을 코팅(coating)처리 하여, 상기 필름을 롤러에 감는 도중 공정이 진행된 상태의 필름표면에 결함이 발생하지 않도록 하는 것을 특징으로 한다.A feature of the present invention is that in handling a film type substrate, the substrate is wound on a roller and moved to the next place for a continuous process, while the surface of the film is coated, and the film is wound on the roller. It is characterized in that a defect does not occur in the film surface of the process progressed.
이하, 도 3은 기판을 롤러에 감는 모습을 도시한 도면이다.3 is a view showing how the substrate is wound on a roller.
도시한 바와 같이, 제 1 롤러(100)에 감겨진 필름(102)은 서서히 풀리면서 임의의 공정 장치(104)내에서 공정이 진행된 후, 다시 제 2 롤러(106)에 감겨져 옮겨지게 된다.As shown in the drawing, the film 102 wound on the first roller 100 is gradually unwinded, and after the process proceeds in an arbitrary process apparatus 104, the film 102 is wound on the second roller 106 and moved again.
이때, 상기 공정 장비(104)와 제 1 롤러(100)와 제 2 롤러(106) 사이에는 상기 필름(102)을 고정하면서 일정하게 풀리도록 하기 위한 제 1 수단(108)과 제 2 수단(110)을 더욱 구성한다.At this time, between the process equipment 104 and the first roller 100 and the second roller 106, the first means 108 and the second means 110 to constantly loosen while fixing the film 102 ).
일반적으로, 상기 제 1 수단(108)과 제 2 수단(110)은 제 1 회전롤(112a)과 제 2 회전롤(112b)을 상부와 하부에서 서로 이격하여 구성하며, 상기 각 회전롤(112a,112b)사이의 서로 이격된 공간으로 필름(102)이 지나가게 된다.In general, the first means 108 and the second means 110 comprises a first rotating roll 112a and a second rotating roll 112b spaced apart from each other at the upper and lower portions, and each of the rotating rolls 112a. The film 102 passes into spaces spaced apart from each other between the lines 112b.
상기 제 1 수단(108)과 제 2 수단(110)은 상기 필름의 표면에 손상을 주지 않는 유연한 재질로 제작한다.The first means 108 and the second means 110 is made of a flexible material that does not damage the surface of the film.
이때, 상기 제 2 롤러(106)에 감기기 전에 상기 필름(102)의 표면에 코팅막(114)을 형성한다.At this time, the coating film 114 is formed on the surface of the film 102 before being wound on the second roller 106.
상기 코팅막(114)은 바람직하게는 유기절연물질로 형성하며, 상기 코팅막(114)은 상기 필름(102)의 표면에 소정의 수단(105)을 이용하여 유기물질을 분사하는 방법 또는 기상증착법 등을 사용하여 형성한다.The coating film 114 is preferably formed of an organic insulating material, and the coating film 114 may be formed by spraying an organic material or a vapor deposition method on the surface of the film 102 by using a predetermined means 105. To form.
상기 유기절연물질은 폴리에틸렌(Poly Ethylene)과 같은 저가의 물질을 사용하며, 필름에 구성된 구성층을 손상하지 않고 물 또는 솔벤트(solvent)에 의해 쉽게 제거될 수 있는 물질이어야 한다.The organic insulating material uses a low-cost material such as polyethylene (Poly Ethylene), and should be a material that can be easily removed by water or solvent without damaging the constituent layers of the film.
이와 같이, 상기 제 2 롤러(106)에 감기 전에 필름(102)의 표면에 절연물질 특히, 절연성 고분자 물질을 코팅하는 이유는 필름이 감겨지는 동안 접촉하게 되는 필름의 뒷면에 의해, 상기 공정이 진행된 필름(102)의 표면이 데미지를 입어 결함이 발생하지 않도록 하기 위해서이다.As such, the reason for coating the insulating material, especially the insulating polymer material, on the surface of the film 102 before winding the second roller 106 is due to the back side of the film coming into contact with the film while the process is being carried out. This is for the surface of the film 102 to be damaged so that a defect does not arise.
이때, 상기 롤러에 절연성 코팅막을 사용하는 이유는, 감겨진 필름 사이에서 겹쳐진 도전성 배선들이 공정 중 발생한 국부적인 정전기에 의해 단선되는 것을 방지하기 위해서이다.In this case, the reason why the insulating coating film is used for the roller is to prevent the conductive wires overlapped between the wound film from being disconnected by local static electricity generated during the process.
상기 표면에 절연물질이 코팅된 필름을 다음 공정을 위한 장소에 옮긴 후에는 아래 도 4와 같이 처리하면 된다.After the film coated with an insulating material on the surface is moved to a place for the next process, it may be treated as shown in FIG. 4 below.
도 4는 새로운 공정을 위해 룰러에 감겨진 필름을 다루는 방법을 도시한 도면이다.4 illustrates a method of handling a film wound on a ruler for a new process.
도시한 바와 같이, 상기 필름(102)에 새로운 공정을 진행하기 위해서는 상기 제 2 롤러(106)를 새로운 장소로 옮긴 후, 상기 제 2 롤러(106)에 감겨진 필름을 서서히 풀면서 상기 필름(102)의 상부에 임의의 공정이 진행되도록 해야한다.As shown, in order to perform a new process on the film 102, after moving the second roller 106 to a new place, the film 102 while slowly unwinding the film wound on the second roller 106 At the top of the) should be an arbitrary process.
이때, 임의의 공정이 진행되기 전에 상기 필름(102)의 표면에 물 또는 솔벤트(solvent)를 이용하여 상기 필름(102)의 표면에 형성된 코팅막(114)을 소정의 수단(117)을 이용하여 제거하는 과정을 반드시 거쳐야 한다.At this time, before any process is performed, the coating film 114 formed on the surface of the film 102 by using water or solvent on the surface of the film 102 is removed using a predetermined means 117. You must go through the process.
상기 제 2 롤러(106)에서 상기 필름이 풀려지면서 먼저 절연물질을 제거하는 공정을 거친 후, 공정 장비(104)내 에서 상기 필름의 표면에 소정의 공정이 진행된다.After the film is released from the second roller 106, a process of first removing the insulating material is performed, and then a predetermined process is performed on the surface of the film in the process equipment 104.
연속하여, 상기 소정의 공정이 진행된 필름의 표면에 투명 유기절연물질을 코팅하면서 새로운 제 3 롤러(116)에 감는다.Subsequently, the film is wound on a new third roller 116 while coating a transparent organic insulating material on the surface of the film subjected to the predetermined process.
상기 코팅된 유기절연 물질은 다음 공정이 진행되기 전 앞서 설명한 바와 같이, 소정의 수단에 의해 제거된다.The coated organic insulating material is removed by a predetermined means, as described above, before the next process proceeds.
이와 같은 공정은 상기 필름(102)에 모든 구성요소를 형성하는 공정이 완료될 때까지 반복적으로 행해진다.This process is performed repeatedly until the process of forming all the components in the film 102 is completed.
따라서, 본 발명에 따라 필름 타입기판을 다루게 되면, 필름타입 기판을 옮기기도 편리할 뿐 아니라 옮기는 도중 불량이 발생하지 않아 제품의 수율을 개선할수 있는 효과가 있다.Therefore, when the film-type substrate is handled according to the present invention, the film-type substrate is not only convenient to move, but also does not cause a defect during the transfer has the effect of improving the yield of the product.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010065346A KR20030034417A (en) | 2001-10-23 | 2001-10-23 | method for moving a film type substrate for LCD |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010065346A KR20030034417A (en) | 2001-10-23 | 2001-10-23 | method for moving a film type substrate for LCD |
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| KR20030034417A true KR20030034417A (en) | 2003-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020010065346A KR20030034417A (en) | 2001-10-23 | 2001-10-23 | method for moving a film type substrate for LCD |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100806810B1 (en) * | 2002-03-12 | 2008-02-25 | 엘지.필립스 엘시디 주식회사 | A Mask Aligner |
| KR20160028899A (en) * | 2014-09-04 | 2016-03-14 | 삼성전자주식회사 | Apparatus for protecting extreme ultra violet(EUV) mask, and EUV exposure apparatus comprising the same |
-
2001
- 2001-10-23 KR KR1020010065346A patent/KR20030034417A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100806810B1 (en) * | 2002-03-12 | 2008-02-25 | 엘지.필립스 엘시디 주식회사 | A Mask Aligner |
| KR20160028899A (en) * | 2014-09-04 | 2016-03-14 | 삼성전자주식회사 | Apparatus for protecting extreme ultra violet(EUV) mask, and EUV exposure apparatus comprising the same |
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