KR20020050046A - Reuse system of PCB's scrap by brushing - Google Patents
Reuse system of PCB's scrap by brushing Download PDFInfo
- Publication number
- KR20020050046A KR20020050046A KR1020000079404A KR20000079404A KR20020050046A KR 20020050046 A KR20020050046 A KR 20020050046A KR 1020000079404 A KR1020000079404 A KR 1020000079404A KR 20000079404 A KR20000079404 A KR 20000079404A KR 20020050046 A KR20020050046 A KR 20020050046A
- Authority
- KR
- South Korea
- Prior art keywords
- grinding
- circuit board
- parts
- scrap
- metals
- Prior art date
Links
- 230000001680 brushing effect Effects 0.000 title 1
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000002699 waste material Substances 0.000 claims abstract description 11
- 239000000428 dust Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 150000002739 metals Chemical class 0.000 claims abstract description 7
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 239000010792 electronic scrap Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 8
- 238000011084 recovery Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000004064 recycling Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 239000010931 gold Substances 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 229910000498 pewter Inorganic materials 0.000 abstract 2
- 239000010957 pewter Substances 0.000 abstract 2
- 239000002075 main ingredient Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 2
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
금속회수 기술에는 습식법과 건식법이 있다.Metal recovery techniques include wet and dry methods.
습식법은 금과 은을 회수하는 기능이 다르며, 금류는 왕수를 용해 후 중화를 시킨다음 환원을 통해 회수하고, 은류는 초산으로 용해한 다음 침전, 환원제로 환원시킨다음 전해법으로 정제시켜 회수한다.The wet method differs in the function of recovering gold and silver, and the gold is neutralized after dissolving the aqua regia, and then recovered by reduction.
건식법은 폐전자스크랩을 파쇄하여 하소처리한후 소각잔재물을 농축하여 유가금속을 회수하며, 이때 회수를 위하여 전기를 걸어 극판에 붙은 금속을 회수하는 공정이다. 건식법과, 습식법은 효율면에서 떨어지고 또한 공정이 복잡하다 보니 금속을 회수하는 비용이 많이 들어 경쟁력에서 떨어지는 실정이다. 또한 전자스크랩을 파쇄하여 금속을 회수하다 보니 재활용 가능한 부품을 회수 할 수 없으며 2차적으로 폐기물이 다량 배출되므로 환경오염을 유발하고 폐기물 처리비용이 많이 드는 실정이다.The dry method is a process of recovering valuable metals by crushing waste electronic scraps, calcining and then incineration residue to recover valuable metals. The dry method and the wet method are inferior in terms of efficiency and the process is complicated, so the cost of recovering the metal is high. In addition, as the electronic scrap is crushed to recover the metal, it is impossible to recover the recyclable parts. Secondly, a large amount of waste is discharged, which causes environmental pollution and waste disposal costs.
이와 같은 문제를 해결하기위해서 연삭롤러를 통한 공정으로 폐전자스크랩에서 땝납과 동을 연삭을 통해 금속을 회수하며, 기판의 부품에는 손상을 주지 않고 IC칩과 재사용 가능한 부품들을 분리 선별가능하게하고 기타의 부속물은 적정 처리하거나 프린트기판에 함유되어 있는 유가금속을 사전에 선별하여 금과 은등을 회수하고, 프린트 기판을 이루고 있는 주요 성분중의 하나인 수지 또한 재활용을 할수있으며 공해를 유발하지 않는 시스템이라 할 수 있다.In order to solve this problem, the grinding roller is used to recover metal from solder and copper from waste electronic scrap, and to separate and select IC chips and reusable parts without damaging the parts of the board. 'S attachments are properly treated or pre-selected valuable metals contained in the printed board to recover gold and silver, and the resin, one of the main components of the printed board, can also be recycled and does not cause pollution. This can be called.
도1 본 발명에따른 시스템의 구성도1 is a configuration diagram of a system according to the present invention
1. 연삭롤러 2. 구동모터 3. 집진기1. Grinding roller 2. Driving motor 3. Dust collector
4. 가이드롤러 5. 비중선별기 6. 부품회수 컨베어4. Guide roller 5. Specific gravity sorter 6. Parts recovery conveyor
7. 금속회수 농축기 8. 수지선별세정기7. Metal Recovery Thickener 8. Resin Sorting Cleaner
본 발명에 따르는 장치는 연삭롤러(1)가 주 핵심으로서 롤러는 구동모터(2)를 통해 고속회전을 하게되며 가이드롤러(4)에 의해 폐전자스크랩이 이동하면서 기판의 부품에 손상을 주지 않고 땜납과 동을 연삭하며 가이드롤러(4)가 위에서 또한 적당한 힘으로 눌러줌으로 해서 기판의 부품에는 손상을 주지 안으며 폐 전자스크랩을 이동시켜 줌으로 폐전자스크랩의 붙어 있는 땜납과 동을 적절히 연삭하도록 도움을 주는 장치이다. 집진기(3)에서는 연삭을 통해 미세분말이 된 금속과 수지를 포집하는 장치이다. 포집된 분말은 비중선별기(5)에서는 비중에 의해 금속과 수지가 선별되며 선별된 금속은 금속회수 농축기(7)에서 동과 납으로 선별되어 농축된다. 수지선별세정기(8)에서는 포집된 수지를 세척 전조를 하여 재활용 할수 있는장치이다.In the device according to the present invention, the grinding roller 1 is the main core, and the roller is rotated at high speed through the driving motor 2, and the waste electronic scrap is moved by the guide roller 4 without damaging the components of the substrate. Grind the solder and copper and press the guide roller 4 with the appropriate force from above to damage the components of the board without moving the scrap electronic scrap so that the solder and copper of the scrap electronic scrap can be properly ground. It is a device that helps. In the dust collector 3, it is a device which collects the metal and resin which became fine powder by grinding. The collected powder is selected from metal and resin by specific gravity in the specific gravity sorter (5), and the selected metal is selected and concentrated by copper and lead in the metal recovery concentrator (7). In the resin sorting washing machine (8) is a device that can be recycled by washing the collected resin.
폐 전자스크랩의 재활용에 있어서 연삭롤러(1)를 사용하여 부품이 부착되어 있지 않은 배면을 갈아내며 이때 연삭롤러(1)의 경도를 적절한 수준으로 유지하여 고속으로 회전시킴으로서 부품의 리드에는 손상을 주지 않으며 1차적으로 땜납만을 분말상태로 기판에서 분리해내며 분리된 납 분말은 집진기(3)로 흡인되며, 계속해서 다음의 연삭롤러(1)에 의해서 동과 프린트기판의 수지가 분말상태로 나오게되며, 기판에 부착된 부품은 기판에서 탈리되어 부착되어있는 부품들은 부품회수장치(6)을 통하여 따로이 배출된다. 또 집진기(3)로 포집된 금속을 함유한 분말은 비중선별기(5)에의하여 금속과 합성수지로 분리되며 선별된 금속은 재차 금속농축기(7)에의하여 농축하게된다.In the recycling of waste electronic scraps, the grinding roller (1) is used to grind the back surface where the parts are not attached. At this time, the hardness of the grinding roller (1) is maintained at an appropriate level and rotated at high speed, thereby preventing damage to the leads of the parts. Firstly, only solder is separated from the substrate in a powder state, and the separated lead powder is sucked into the dust collector (3), and the resin of the copper and the printed circuit board comes out in the powder state by the next grinding roller (1). The components attached to the substrate are detached from the substrate and the components attached to the substrate are separately discharged through the component recovery device 6. In addition, the powder containing the metal collected by the dust collector (3) is separated into a metal and a synthetic resin by the specific gravity separator (5), and the selected metal is concentrated again by the metal concentrator (7).
이러한 일련의 수단을 통하여 폐 전자스크랩으로부터 전자부품과 땜납, 동등을 적절히 회수 농축하며 이때 발생된 수지 성분들도 별도로 분리할 수 있게된다. 따라서 기존의 폐 전자스크랩을 재활용하는 수단에 비하여 공해의 발생이 없으며 유가물들을 안전하고 고순도로 농축 회수가 가능한 시스템이라 할 수 있다.Through such a series of means, it is possible to properly recover and concentrate electronic components, solder, and equivalents from the waste electronic scrap, and separate resin components generated at this time. Therefore, there is no pollution compared to the means for recycling the old waste electronic scrap, and it can be said that the system can recover the valuables safely and with high purity.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000079404A KR20020050046A (en) | 2000-12-20 | 2000-12-20 | Reuse system of PCB's scrap by brushing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000079404A KR20020050046A (en) | 2000-12-20 | 2000-12-20 | Reuse system of PCB's scrap by brushing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20020050046A true KR20020050046A (en) | 2002-06-26 |
Family
ID=27683985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000079404A KR20020050046A (en) | 2000-12-20 | 2000-12-20 | Reuse system of PCB's scrap by brushing |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20020050046A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100737634B1 (en) * | 2006-07-31 | 2007-07-10 | 호서대학교 산학협력단 | Emi shielding coating composition |
| KR102560731B1 (en) | 2022-10-17 | 2023-07-28 | 기흥플랜트주식회사 | Automated cutting system with scrap collection |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326894A (en) * | 1994-05-31 | 1995-12-12 | Sanyo Electric Co Ltd | Automatic electronic parts mounting device |
| JPH08148823A (en) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | Method for recovering valuable material from printed board and its equipment |
| US5676318A (en) * | 1994-03-09 | 1997-10-14 | Nec Corporation | Method of recovering valuable substances from printed circuit board |
| KR19980068107A (en) * | 1997-02-14 | 1998-10-15 | 구자홍 | Printed Circuit Board Recycling Method And Device |
-
2000
- 2000-12-20 KR KR1020000079404A patent/KR20020050046A/en not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5676318A (en) * | 1994-03-09 | 1997-10-14 | Nec Corporation | Method of recovering valuable substances from printed circuit board |
| JPH07326894A (en) * | 1994-05-31 | 1995-12-12 | Sanyo Electric Co Ltd | Automatic electronic parts mounting device |
| JPH08148823A (en) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | Method for recovering valuable material from printed board and its equipment |
| KR19980068107A (en) * | 1997-02-14 | 1998-10-15 | 구자홍 | Printed Circuit Board Recycling Method And Device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100737634B1 (en) * | 2006-07-31 | 2007-07-10 | 호서대학교 산학협력단 | Emi shielding coating composition |
| KR102560731B1 (en) | 2022-10-17 | 2023-07-28 | 기흥플랜트주식회사 | Automated cutting system with scrap collection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |