JPH07326894A - Automatic electronic parts mounting device - Google Patents
Automatic electronic parts mounting deviceInfo
- Publication number
- JPH07326894A JPH07326894A JP6118469A JP11846994A JPH07326894A JP H07326894 A JPH07326894 A JP H07326894A JP 6118469 A JP6118469 A JP 6118469A JP 11846994 A JP11846994 A JP 11846994A JP H07326894 A JPH07326894 A JP H07326894A
- Authority
- JP
- Japan
- Prior art keywords
- component
- recognizing
- light
- image
- diffuser plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、取出ノズルに保持され
た電子部品を部品認識装置で認識してプリント基板に装
着すると共に、部品に当てて反射する光の像により部品
の位置認識を行う反射照明方式の部品の認識の際には部
品の背景となり照射された光が部品を透過した透過像に
より部品の位置認識を行う透過照明方式による部品の認
識の際には部品に光を照射する拡散板を有する電子部品
自動装着装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recognizes an electronic component held by a take-out nozzle by a component recognition device and mounts it on a printed circuit board, and recognizes the position of a component by an image of light reflected upon the component. When recognizing a component in the reflected illumination system, the background of the component is radiated, and the position of the component is recognized by the transmitted image of the light that has passed through the component. When recognizing the component in the transillumination system, the component is illuminated with light. The present invention relates to an electronic component automatic mounting device having a diffusion plate.
【0002】[0002]
【従来の技術】この種電子部品自動装着装置が特開平4
−320906号公報に開示されており、取出ノズルに
保持された電子部品の位置ずれが部品認識装置により認
識されこの認識結果に基づき位置ずれの補正がなされプ
リント基板の所定の位置に部品の装着が行われる。電子
部品の種類によりこの認識の際には部品の上方より光を
照射しその透過像を下方にある認識カメラにより撮像し
て認識処理が行われる場合と、カメラのある下方より部
品のリードに対して光を当てその反射光の像を撮像して
認識処理が行われる場合がある技術が開示されている。
そして、前者の透過照明方式の認識時の照明の場合に
は、取出ノズルの上方に設けられた拡散板に光源より光
が当てられ該拡散板が光を照射するものであり、後者の
反射照明方式の認識時の照明の場合には、該拡散板は明
るく光る部品の像の背景になり暗いことが必要となる。2. Description of the Related Art An electronic component automatic mounting apparatus of this type is disclosed in Japanese Patent Laid-Open No.
Japanese Unexamined Patent Publication No. 320906/1990 discloses that a component recognizing device recognizes a positional deviation of an electronic component held by a take-out nozzle, corrects the positional deviation based on the recognition result, and mounts a component at a predetermined position on a printed circuit board. Done. Depending on the type of electronic component, when this recognition is performed, light is emitted from above the component and the transmitted image is captured by the recognition camera below, and when the recognition process is performed, from below with the camera to the lead of the component. There is disclosed a technique in which the recognition process may be performed by shining light on the reflected light and capturing an image of the reflected light.
Then, in the case of the former illumination at the time of recognition of the transillumination method, light is applied from the light source to the diffuser plate provided above the extraction nozzle, and the diffuser plate irradiates the light. In the case of illumination during system recognition, the diffuser needs to be dark as it is the background of the image of the brightly glowing component.
【0003】[0003]
【発明が解決しようとする課題】しかし、前記従来技術
では反射照明方式の照明及び透過照明方式の照明のいず
れの場合にも同一の拡散板が部品の像の背景になること
から、拡散板の材料の色はどちらの方式にも対応するた
め明るい色と暗い色の中間の色とする必要があり、どち
らの方式にとっても中途半端な認識性能となってしまう
欠点があった。However, in the above-mentioned prior art, the same diffuser plate is the background of the image of the component in both the reflection illumination type illumination and the transmissive illumination type illumination. Since the color of the material is compatible with both methods, it is necessary to have an intermediate color between a bright color and a dark color, and both methods have a drawback that the recognition performance is halfway.
【0004】そこで本発明は、反射照明方式及び透過照
明方式の部品認識のどちらの場合でも良好な像の背景の
明度が得られるようにすることを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to obtain a good background brightness of an image in both of the case of recognizing the parts of the reflection illumination system and the transmission illumination system.
【0005】[0005]
【課題を解決するための手段】このため本発明は、取出
ノズルに保持された電子部品を部品認識装置で認識して
プリント基板に装着すると共に、部品に当てて反射する
光の像により部品の位置認識を行う反射照明方式の部品
の認識の際には部品の背景となり照射された光が部品を
透過した透過像により部品の位置認識を行う透過照明方
式による部品の認識の際には部品に光を照射する拡散板
を有する電子部品自動装着装置において、前記拡散板の
明るさを変える明度変更手段を設けたものである。Therefore, according to the present invention, an electronic component held by a take-out nozzle is recognized by a component recognizing device and mounted on a printed circuit board, and at the same time, an image of the component is reflected by an image of light reflected upon the component. When recognizing a component with the reflected illumination method that performs position recognition, the background of the component is used to recognize the position of the component based on the transmitted image of the light that passes through the component. An electronic component automatic mounting apparatus having a diffuser plate for irradiating light is provided with brightness changing means for changing the brightness of the diffuser plate.
【0006】また本発明は、取出ノズルに保持された電
子部品を部品認識装置で認識してプリント基板に装着す
ると共に、部品に当てて反射する光の像により部品の位
置認識を行う反射照明方式の部品の認識の際には部品の
背景となり照射された光が部品を透過した透過像により
部品の位置認識を行う透過照明方式による部品の認識の
際には部品に光を照射する拡散板を有する電子部品自動
装着装置において、前記拡散板の明るさを反射照明方式
の部品の認識の際には暗く透過方式による部品の認識の
際には明るくするよう変える明度変更手段を設けたもの
である。Further, according to the present invention, the electronic component held by the take-out nozzle is recognized by the component recognizing device and mounted on the printed circuit board, and the position of the component is recognized by the image of the light reflected by the component. When recognizing a part, the background of the part is recognized, and the position of the part is recognized by the transmitted image of the light that has been radiated. The diffuser plate that illuminates the part when recognizing the part by the transillumination method is used. The electronic component automatic mounting device has a brightness changing means for changing the brightness of the diffuser plate so as to be dark when recognizing a component of a reflective illumination system and bright when recognizing a component of a transmissive system. .
【0007】また本発明は、取出ノズルに保持された電
子部品を部品認識装置で認識してプリント基板に装着す
ると共に、部品に当てて反射する光の像により部品の位
置認識を行う反射照明方式の部品の認識の際には部品の
背景となり照射された光が部品を透過した透過像により
部品の位置認識を行う透過照明方式による部品の認識の
際には部品に光を照射する拡散板を有する電子部品自動
装着装置において、前記拡散板に液晶層を設けたもので
ある。Further, the present invention is a reflection illumination system in which an electronic component held by an ejection nozzle is recognized by a component recognition device and mounted on a printed circuit board, and the position of the component is recognized by an image of light reflected by the component. When recognizing a part, the background of the part is recognized, and the position of the part is recognized by the transmitted image of the light that has been radiated. The diffuser plate that illuminates the part when recognizing the part by the transillumination method is used. In the electronic component automatic mounting apparatus having the liquid crystal layer, the diffusion plate is provided.
【0008】[0008]
【作用】請求項1の構成によれば、明度変更手段は部品
認識装置の電子部品の認識のための拡散板の明るさを変
える。請求項2の構成によれば、明度変更手段は部品認
識装置の電子部品の認識のための拡散板の明るさを透過
照明方式の時には明るくし反射照明方式の時には暗くす
る。According to the structure of the first aspect, the brightness changing means changes the brightness of the diffuser plate for recognizing the electronic component of the component recognizing device. According to the structure of claim 2, the brightness changing means makes the brightness of the diffuser plate for recognizing the electronic component of the component recognition device brighter in the transmissive illumination system and darker in the reflective illumination system.
【0009】請求項3の構成によれば、拡散板に設けた
液晶層は拡散板の明度を変更可能とする。According to the third aspect, the liquid crystal layer provided on the diffusion plate can change the brightness of the diffusion plate.
【0010】[0010]
【実施例】以下本発明の一実施例を図に基づき詳述す
る。図2に於て、1はY軸モータ2の回動によりY方向
に移動するYテーブルであり、3はX軸モータ4の回動
によりYテーブル1上でX方向に移動することにより結
果的にXY方向に移動するXYテーブルであり、チップ
状電子部品5(以下、チップ部品あるいは部品とい
う。)が装着されるプリント基板6が図示しない固定手
段に固定されて載置される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, 1 is a Y table that moves in the Y direction by the rotation of the Y-axis motor 2, and 3 is a result that results from moving in the X direction on the Y table 1 by the rotation of the X-axis motor 4. An XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).
【0011】7は供給台であり、チップ部品5を供給す
る部品供給装置8が多数台配設されている。9は供給台
駆動モータであり、ボールネジ10を回動させることに
より、該ボールネジ10が嵌合し供給台7に固定された
図示しないナットを介して、供給台7がリニアガイド1
2に案内されてX方向に移動する。13は間欠回動する
ロータリテーブルであり、該テーブル13の外縁部には
図3に示すように取出ノズルとしての吸着ノズル14を
6本有する装着ヘッド15が間欠ピッチに合わせて等間
隔に配設されている。Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, which rotates the ball screw 10 so that the supply screw 7 is fitted to the linear guide 1 via a nut (not shown) fixed to the supply base 7.
It is guided by 2 and moves in the X direction. Reference numeral 13 denotes a rotary table which rotates intermittently, and mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at the outer edge of the table 13 at equal intervals in accordance with the intermittent pitch. Has been done.
【0012】吸着ノズル14が供給装置8より部品5を
吸着し取出す装着ヘッド15の停止位置(図2中上方の
黒丸の付された位置)が吸着ステーションIであり、該
吸着ステーションIにて装着ヘッド15が下降すること
により吸着ノズル14が部品5を吸着する。IIは部品
5を吸着した装着ヘッド15がロータリテーブル13の
間欠回転により停止する認識ステーションであり、部品
認識装置16により吸着ノズル14に対する部品5の位
置ずれが認識される。The mounting position of the mounting head 15 for picking up the component 5 by the suction nozzle 14 from the supply device 8 (the position marked with a black dot in the upper part of FIG. 2) is the suction station I, and the suction station I is mounted. When the head 15 descends, the suction nozzle 14 sucks the component 5. Reference numeral II denotes a recognition station in which the mounting head 15 that has picked up the component 5 stops due to intermittent rotation of the rotary table 13, and the component recognition device 16 recognizes the displacement of the component 5 with respect to the suction nozzle 14.
【0013】IIIは吸着ノズル14が吸着保持してい
る部品5をプリント基板6に装着するために装着ヘッド
15が停止する装着ステーション(図2中下方の黒丸の
付された位置)であり、装着ヘッド15の下降によりX
Yテーブル3の移動により所定の位置に停止したプリン
ト基板6に部品5は装着される。装着ヘッド15は図1
及び図3に示すように、ロータリテーブル13に対して
吸着ステーションI及び装着ステーションIIIにて上
下動可能になされた取り付け板19に吸着ノズル14が
出入可能に取り付けられた回転体20がロータリテーブ
ル13の回転軸と平行な軸の周りの方向(以下θ方向と
いう。)に回転可能に取り付けられ、該回転体20を回
転させるモータ21がその上方に取り付けられて形成さ
れている。吸着ノズル14は該回転体20を貫通して上
下動可能になされている。Reference numeral III denotes a mounting station (a position marked with a black circle in the lower part of FIG. 2) where the mounting head 15 stops in order to mount the component 5 held by the suction nozzle 14 on the printed circuit board 6. When the head 15 descends, X
The component 5 is mounted on the printed circuit board 6 stopped at a predetermined position by the movement of the Y table 3. The mounting head 15 is shown in FIG.
Further, as shown in FIG. 3, a rotary body 20 is attached to the rotary plate 13 so that the suction nozzles 14 can be moved in and out of a mounting plate 19 which is vertically movable with respect to the rotary table 13 at the suction station I and the mounting station III. A motor 21 that is rotatably mounted in a direction around an axis parallel to the rotation axis (hereinafter referred to as θ direction) and that rotates the rotating body 20 is formed above the motor 21. The suction nozzle 14 penetrates the rotating body 20 and is vertically movable.
【0014】該回転体20には前記部品認識装置16に
より部品5の吸着ノズル14に対する位置ずれを認識す
る場合にカメラに撮像された画面の背景となる拡散板2
2が形成されている。部品認識には部品5をカメラの反
対側即ち部品5の上方より照明して該部品5の投影像に
より認識する透過照明方式の認識と、部品5にカメラ側
より光を照射してその反射像により認識する反射照明方
式の認識がある。図1及び図4において、23は光源で
あり図1に示す透過照明方式の場合該光源23より照射
された光は拡散板22に照射され該拡散板22に反射拡
散された光が部品5を透過して部品認識装置16に受光
されるようになされており、図4に示す反射照明方式の
場合には、部品5に光源23より光か照射され拡散板2
2は背景となるようになされている。The rotating body 20 has a diffuser plate 2 as a background of a screen imaged by a camera when the component recognition device 16 recognizes a displacement of the component 5 with respect to the suction nozzle 14.
2 is formed. For component recognition, recognition of a transillumination system in which the component 5 is illuminated from the opposite side of the camera, that is, above the component 5 and recognized by the projected image of the component 5, and light reflected from the component 5 by irradiating the component 5 with light from the camera side There is a recognition of the reflected illumination method. In FIGS. 1 and 4, reference numeral 23 denotes a light source. In the case of the transmissive illumination system shown in FIG. 1, the light emitted from the light source 23 is applied to the diffuser plate 22 and the light reflected and diffused by the diffuser plate 22 causes the component 5 to pass through. The light is transmitted and received by the component recognition device 16, and in the case of the reflection illumination system shown in FIG.
2 is designed as a background.
【0015】該拡散板22は回転体20の内側に塗布さ
れた白色塗装層24、その上に貼り付けられた明度変更
手段としての液晶層25及びその上に貼り付けられた透
明に近い乳白色の樹脂板26により形成されている。樹
脂板26の材質は例えばポリアセタールである。液晶層
25はガラス板で液晶を挾み封止したパネル状の構造で
あり、上下両側のガラス板夫々の全面にわたって設けら
れた電極間に電圧が加えられるとガラス板に垂直な方向
に透明となり、電位差が無くなると光を通さないように
なるものである。The diffuser plate 22 has a white coating layer 24 applied to the inside of the rotating body 20, a liquid crystal layer 25 as a lightness changing means attached thereon, and a nearly transparent milky white layer attached thereon. It is formed of a resin plate 26. The material of the resin plate 26 is, for example, polyacetal. The liquid crystal layer 25 has a panel-like structure in which liquid crystal is sandwiched between glass plates and becomes transparent in a direction perpendicular to the glass plates when a voltage is applied between electrodes provided over the entire surfaces of the glass plates on the upper and lower sides. When the electric potential difference disappears, the light cannot pass through.
【0016】液晶層25及び樹脂板26は貼り付けるの
ではなくビス締めにより回転体20に取り付けられるよ
うにしてもよい。液晶層25の前記電極の夫々には該液
晶層25を透明及び遮光状態とするために電圧をかける
ためのリード線27が配線されている。白色塗装層24
は光を拡散反射する層であり、図1のように液晶層25
が透明な場合には光源23からの光が反射され液晶層2
5及び樹脂板26を通って部品5に拡散光が照射され透
過照明方式の認識がなされるものであり、また液晶層2
5が遮光状態では光源23からの光は液晶層25に遮ら
れ殆ど反射せず、拡散板22は暗い状態となる。白色塗
装層24、液晶層25及び樹脂板26には吸着ノズル1
4が貫通する穴が開けられている。The liquid crystal layer 25 and the resin plate 26 may be attached to the rotating body 20 by screwing instead of pasting. Each of the electrodes of the liquid crystal layer 25 is provided with a lead wire 27 for applying a voltage to make the liquid crystal layer 25 transparent and shielded. White paint layer 24
Is a layer that diffuses and reflects light, and as shown in FIG.
Is transparent, the light from the light source 23 is reflected and the liquid crystal layer 2
The diffused light is applied to the component 5 through the resin 5 and the resin plate 26 to recognize the transillumination method, and the liquid crystal layer 2
When 5 is in the light-shielded state, the light from the light source 23 is shielded by the liquid crystal layer 25 and hardly reflected, and the diffusion plate 22 is in a dark state. The white coating layer 24, the liquid crystal layer 25 and the resin plate 26 have a suction nozzle 1
There is a hole through which 4 passes.
【0017】リード線27は回転体22が取り付けられ
たモータ21の回転軸29の表面に設けられた電極30
に接続され、取り付け板19の内面にリング状に設けら
れ該電極30が回転体20のどの回転位置でも接触可能
なスリップリング31にはリード線32が接続され、該
リード線32はロータリテーブル13内を配線され、ロ
ータリテーブルの図示しない回転軸に同様な構造で設け
られたスリップリングを介して図5に示すインターフェ
ース34に接続されている。The lead wire 27 is an electrode 30 provided on the surface of the rotating shaft 29 of the motor 21 to which the rotating body 22 is attached.
A lead ring 32 connected to a slip ring 31 which is provided in a ring shape on the inner surface of the mounting plate 19 and which allows the electrode 30 to come into contact with the rotary body 20 at any rotational position. The inside of the rotary table is connected to the interface 34 shown in FIG. 5 via a slip ring having a similar structure to a rotary shaft (not shown) of the rotary table.
【0018】図5に基づき電子部品自動装着装置の制御
ブロックについて詳述する。36は明度変更手段として
のCPUであり、ROM37に記憶されたプログラムに
従ってRAM38に記憶されたデータに基づき、部品装
着に係わる種々の動作を制御する。該CPU36にはイ
ンターフェース34を介して認識装置16、駆動回路3
9等が接続されている。駆動回路39には前記供給台駆
動モータ9及び各ヘッド15のモータ21等が接続され
いる。The control block of the automatic electronic component mounting apparatus will be described in detail with reference to FIG. Reference numeral 36 denotes a CPU as a brightness changing means, which controls various operations relating to component mounting based on the data stored in the RAM 38 in accordance with the program stored in the ROM 37. The recognition device 16 and the drive circuit 3 are connected to the CPU 36 via the interface 34.
9 etc. are connected. The drive circuit 39 is connected to the supply table drive motor 9 and the motor 21 of each head 15.
【0019】前記RAM38には図6に示されるような
NCデータが格納される。NCデータはプリント基板6
の種類毎にRAM38に記憶されるものであるが、装着
の順番を示すステップ毎にリール番号(「R−NO」と
表示してある欄)、Xデータ(「X」と表示してある
欄)、Yデータ(「Y」と表示してある欄)及びθデー
タ(「θ」と表示してある欄)が格納されている。リー
ル番号は供給台7の部品供給装置8の配設位置を示す番
号であり、Xデータ及びYデータはプリント基板6上の
チップ部品5を装着すべきXY位置座標を表し、θデー
タはチップ部品5が装着されるべきθ方向を即ち吸着さ
れたチップ部品5の回動すべき角度量を示す。「C」の
欄の「E」はこのステップでプリント基板6の1枚当り
の部品装着が終了することを示す。NC data as shown in FIG. 6 is stored in the RAM 38. NC data is printed circuit board 6
Although it is stored in the RAM 38 for each type, the reel number (column labeled “R-NO”) and the X data (column labeled “X”) for each step indicating the mounting order. ), Y data (column labeled “Y”) and θ data (column labeled “θ”). The reel number is a number indicating the arrangement position of the component supply device 8 on the supply base 7, the X data and the Y data represent the XY position coordinates where the chip component 5 on the printed circuit board 6 should be mounted, and the θ data is the chip component. 5 shows the θ direction in which the chip component 5 should be mounted, that is, the angle amount by which the sucked chip component 5 should rotate. "E" in the "C" column indicates that component mounting for each printed circuit board 6 is completed in this step.
【0020】また、RAM38には図7に示す配置デー
タ及び図8に示す部品ライブラリデータが記憶される。
図7の配置データは部品供給装置8の供給台7上での配
置位置を示すリール番号毎に当該位置の部品供給装置8
が供給するチップ部品5の種類を示す部品IDが格納さ
れている。図8に示す部品ライブラリデータは部品ID
毎の種々のデータが格納されており、例えば当該部品が
反射照明方式の部品認識をすべきものか、透過照明方式
の部品認識をすべきものか等のデータが格納されてい
る。CPU36はNCデータで読み出したリール番号に
基づき、配置データを介して部品ライブラリデータより
当該部品5についてなすべき事に関するデータを読み出
すものである。The RAM 38 also stores the arrangement data shown in FIG. 7 and the component library data shown in FIG.
The arrangement data of FIG. 7 indicates the arrangement position of the component supply device 8 on the supply base 7 for each reel number and the component supply device 8 at that position.
The component ID indicating the type of the chip component 5 supplied by is stored. The component library data shown in FIG. 8 is a component ID.
Various data are stored for each of them, and for example, data indicating whether the component should be recognized by the reflective illumination method or the transmitted illumination method. The CPU 36 reads out data relating to what should be done with respect to the component 5 from the component library data via the arrangement data based on the reel number read out by the NC data.
【0021】前記光源23もインターフェース34を介
してCPU36に制御され、反射照明方式の部品認識の
場合には部品5の下面に直接光を照射するようにし、透
過照明方式の場合には部品5にはなるべく直接当てず拡
散板26に光を照射するようにしている。以上の構成に
より以下動作について説明する。The light source 23 is also controlled by the CPU 36 via the interface 34 so that the lower surface of the component 5 is directly irradiated with light in the case of the component recognition of the reflection illumination system, and the component 5 is illuminated in the case of the transillumination system. The diffuser plate 26 is irradiated with light without direct contact as much as possible. The operation will be described below with the above configuration.
【0022】先ず、図示しない自動運転の始動キーが押
圧されると自動運転が開始され、プリント基板6がXY
テ−ブル3上に載置され位置決め固定されると、該基板
6のNCデータ(図6)のステップに従って部品5の装
着動作が開始される。即ち、ステップ1のリール番号1
を読み出し、該リール番号の部品供給装置8が吸着ノズ
ル14の吸着位置に停止するようモータ9を回動させ供
給台7を移動させる。ロータリテーブル13の回動によ
り該部品供給装置8の部品種に合ったノズル14がモー
タ21の回転により選択された状態の装着ヘッド15が
吸着ステ−ションIに達すると、装着ヘッド15が図示
しないカムの駆動により下降して、部品供給装置8が供
給するチップ部品5が吸着ノズル14に図3に示すよう
に吸着される。First, when an unillustrated automatic operation start key is pressed, automatic operation is started, and the printed circuit board 6 is moved to XY.
When placed on the table 3 and positioned and fixed, the mounting operation of the component 5 is started according to the step of the NC data (FIG. 6) of the substrate 6. That is, reel number 1 in step 1
Is read, and the motor 9 is rotated so that the component supply device 8 of the reel number stops at the suction position of the suction nozzle 14, and the supply base 7 is moved. When the mounting head 15 in the selected state by the rotation of the motor 21 reaches the suction station I by the rotation of the rotary table 13, the nozzle 14 matching the component type of the component supply device 8 reaches the suction station I, and the mounting head 15 is not shown. As the cam is driven, it descends and the chip component 5 supplied by the component supply device 8 is adsorbed by the adsorption nozzle 14 as shown in FIG.
【0023】次に、ロータリテーブル13の間欠回転に
よりヘッド15は移動し認識ステ−ションIIに達する
と、部品認識装置16が吸着ノズル14に吸着された部
品5の認識を行う。即ち、CPU36はRAM38より
読み出した図6のNCデータのステップ1のリール番号
より図7の配置データを読み込み部品IDがAAAであ
ることを知り、部品IDがAAAの部品ライブラリデー
タを読みこの部品5には透過照明方式の部品認識が適用
されることを判断する。Next, when the head 15 moves and reaches the recognition station II due to the intermittent rotation of the rotary table 13, the component recognition device 16 recognizes the component 5 sucked by the suction nozzle 14. That is, the CPU 36 reads the arrangement data of FIG. 7 from the reel number of step 1 of the NC data of FIG. 6 read from the RAM 38, knows that the component ID is AAA, reads the component library data of the component ID AAA, and reads this component 5 It is determined that the transillumination type component recognition is applied to.
【0024】次に、CPU36はこの判断に従って光源
23を透過照明方式に切替え、さらに、リード線32、
27を介して液晶層25の液晶を透明にして拡散板22
を明るくするよう制御する。次に、部品認識装置16は
部品5を撮像するが、光源23から照射された光は拡散
板22に当るが、樹脂板26及び透明な状態の液晶層2
5を透過して白色塗装層24に当り、反射拡散され、再
度液晶層25及び樹脂板26を透過して部品5に照射さ
れ部品認識装置16のカメラにこの像が撮像される。こ
の撮像された画像は図9に示すように、部品5の部分が
黒くそして背景である拡散板22の部分は十分明るく部
品5の像が明瞭に写し出されたものとなっている。Next, the CPU 36 switches the light source 23 to the transmissive illumination system according to this judgment, and further, the lead wire 32,
The liquid crystal of the liquid crystal layer 25 is made transparent through the diffusion plate 22.
Control to brighten. Next, the component recognition device 16 images the component 5, and the light emitted from the light source 23 strikes the diffusion plate 22, but the resin plate 26 and the liquid crystal layer 2 in a transparent state.
After passing through 5, the white coating layer 24 is reflected, diffused, again transmitted through the liquid crystal layer 25 and the resin plate 26, and irradiated on the component 5, and this image is picked up by the camera of the component recognition device 16. As shown in FIG. 9, the picked-up image is such that the part 5 is black and the background diffuser plate 22 is sufficiently bright so that the image of the part 5 is clearly projected.
【0025】該画像に基づき、部品5の位置ずれ(角度
位置のずれも含む。)が認識処理される。次に、該ヘッ
ド15はロータリテーブル13の回転により認識ステ−
ションIIより移動するが、CPU36は認識装置16
の認識結果により角度ずれがΔθあることが認識された
とすると、NCデータのθデータの90度に該位置ずれ
を加味した角度「90−Δθ」だけ回転軸29を回転さ
せるように駆動回路39に指令を出し部品5は角度位置
ずれが補正されて装着すべきθデータの角度位置に角度
振りされる。Based on the image, the positional deviation of the component 5 (including the angular positional deviation) is recognized. Next, the head 15 is recognized by the rotation of the rotary table 13.
Although moving from the section II, the CPU 36 uses the recognition device 16
If it is recognized from the recognition result that there is an angle deviation of Δθ, the drive circuit 39 is caused to rotate the rotary shaft 29 by an angle “90−Δθ” in which the positional deviation is added to 90 degrees of the θ data of the NC data. The component 5 is issued a command and the angular displacement is corrected, and the component 5 is swung to the angular position of the θ data to be mounted.
【0026】次に、装着ヘッド15が装着ステ−ション
IIIに達すると吸着ステ−ションIと同様に装着ヘッ
ド15は下降し、プリント基板6の(X1,Y1)の座
標位置に90度の装着角度で装着される。該位置に装着
されるためにXYテ−ブル3はX軸モータ4及びY軸モ
ータ2の回動により前記認識装置16の認識結果による
位置ずれ及び吸着ノズル14が「90−Δθ」だけ回動
されていることによる位置ずれを補正した移動量を移動
される。Next, when the mounting head 15 reaches the mounting station III, the mounting head 15 descends in the same manner as in the suction station I, and is mounted at the coordinate position (X1, Y1) of the printed circuit board 6 by 90 degrees. It is installed at an angle. Since the XY table 3 is mounted in the position, the XY table 3 is displaced by the rotation of the X-axis motor 4 and the Y-axis motor 2 due to the recognition result of the recognition device 16, and the suction nozzle 14 is rotated by "90-Δθ". The movement amount is corrected by correcting the positional deviation due to the movement.
【0027】このようにして部品5の吸着動作乃至装着
動作がNCデータのステップの順に各装着ヘッド15毎
に行われていくが、あるステップにおいて、吸着ノズル
14が吸着した部品5の部品IDの部品ライブラリデー
タには反射照明方式であることが格納されていると、C
PU36は当該部品5を保持した装着ヘッド15が認識
ステ−ションIIに達すると光源23を反射照明方式に
合わせ、部品5の下面に直接光を当てるようにさせ、液
晶層25は図4に示すように黒色の遮光状態になされ
る。光源23よりの光の殆どは部品5の下面に照射され
るのであるが、拡散板22に当るものもあり、拡散板2
2に当った光は樹脂板26を透過するが液晶層25を透
過することはできず、該液晶層25の表面で少量反射さ
れるとしても白色塗装層24で反射される光量よりは圧
倒的に少ない量であり、拡散板22により反射され部品
認識装置16に入る光の量は少量に抑えられ暗くされ
る。部品認識装置16により撮像される部品5の画像は
図10に示すように、部品5の像が明るく背景となる拡
散板22の部分は部品5の像のコントラストが取れるよ
う十分に暗いものとなっている。この像により正確な位
置ずれの認識処理が行われる。図10の像においては便
宜上部品5全体が白くなされているが、実際には部品5
より突出している金属製のリード部でもっとも強く反射
され、モールド部分はリード部程は明るくならないが、
リード部の像のコントラストは拡散板22の明度との差
により出てくるものであり拡散板22の明度が暗いこと
が重要である。In this way, the suction operation or the mounting operation of the component 5 is performed for each mounting head 15 in the order of the steps of the NC data. At a certain step, the component ID of the component 5 sucked by the suction nozzle 14 If it is stored in the component library data that the reflection lighting system is stored, C
When the mounting head 15 holding the component 5 reaches the recognition station II, the PU 36 adjusts the light source 23 to the reflective illumination system so that the lower surface of the component 5 is directly illuminated with the liquid crystal layer 25 shown in FIG. As shown in FIG. Most of the light from the light source 23 is applied to the lower surface of the component 5, but there is also light that hits the diffuser plate 22.
The light that hits 2 passes through the resin plate 26 but cannot pass through the liquid crystal layer 25, and even if a small amount is reflected on the surface of the liquid crystal layer 25, it is overwhelmingly larger than the amount of light reflected by the white coating layer 24. The amount of light reflected by the diffuser 22 and entering the component recognition device 16 is suppressed to a small amount and is made dark. As shown in FIG. 10, the image of the component 5 picked up by the component recognition device 16 is sufficiently dark so that the image of the component 5 is bright and the portion of the diffuser plate 22 serving as the background has a contrast of the image of the component 5. ing. Accurate position shift recognition processing is performed based on this image. In the image of FIG. 10, the entire component 5 is shown in white for the sake of convenience.
The most protruding metal lead is reflected most strongly, and the mold part is not as bright as the lead part,
The contrast of the image of the lead portion appears due to the difference from the brightness of the diffusion plate 22, and it is important that the brightness of the diffusion plate 22 is dark.
【0028】尚、本実施例では拡散板22の構造は液晶
層25の上に樹脂板26が重ねられた構造であるが、樹
脂板26を白色塗装層24に直接重ね、その上即ち拡散
板22の表面に液晶を重ねた構造とすることも考えら
れ、または白色塗装層24の上に液晶を重ねただけの構
造とすることも考えられる。このように液晶層を拡散板
の表面に形成しようとする場合にはその上にコーティン
グを施してもよい。In the present embodiment, the structure of the diffusion plate 22 is such that the resin plate 26 is laminated on the liquid crystal layer 25, but the resin plate 26 is directly laminated on the white coating layer 24, that is, the diffusion plate. It is conceivable to have a structure in which liquid crystal is superposed on the surface of 22, or a structure in which liquid crystal is simply superposed on the white coating layer 24. When the liquid crystal layer is to be formed on the surface of the diffusion plate as described above, a coating may be applied thereon.
【0029】[0029]
【発明の効果】以上のように本発明は、拡散板に設けた
液晶層等の明度変更手段により拡散板の明るさを変える
ことができるので、透過照明方式及び反射照明方式の双
方の部品認識時に夫々の方式に合った最適な明度を背景
とした像で部品認識処理を行うことができ、部品認識の
精度を上げることができる。As described above, according to the present invention, the brightness of the diffuser plate can be changed by the brightness changing means such as a liquid crystal layer provided on the diffuser plate. Sometimes, the component recognition processing can be performed with an image with an optimal brightness background suitable for each method, and the component recognition accuracy can be improved.
【図1】装着ヘッドの側面図である。FIG. 1 is a side view of a mounting head.
【図2】本発明を適用せる電子部品自動装着装置の平面
図である。FIG. 2 is a plan view of an electronic component automatic mounting device to which the present invention is applied.
【図3】装着ヘッドの下方から見た斜視図である。FIG. 3 is a perspective view of the mounting head as seen from below.
【図4】装着ヘッドの側面図である。FIG. 4 is a side view of the mounting head.
【図5】本発明を適用せる電子部品自動装着装置の制御
ブロック図である。FIG. 5 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.
【図6】NCデータを示す図である。FIG. 6 is a diagram showing NC data.
【図7】配置データを示す図である。FIG. 7 is a diagram showing arrangement data.
【図8】部品ライブラリデータを示す図である。FIG. 8 is a diagram showing component library data.
【図9】透過照明方式の部品の画像である。FIG. 9 is an image of a transillumination type component.
【図10】反射照明方式の部品の画像である。FIG. 10 is an image of a component of a reflection illumination type.
5 チップ状電子部品(電子部品) 6 プリント基板 14 吸着ノズル(取出ノズル) 16 部品認識装置 22 拡散板 25 液晶層(明度変更手段) 36 CPU(明度変更手段) 5 Chip-shaped Electronic Components (Electronic Components) 6 Printed Circuit Board 14 Adsorption Nozzle (Ejection Nozzle) 16 Component Recognition Device 22 Diffuser 25 Liquid Crystal Layer (Brightness Change Means) 36 CPU (Brightness Change Means)
Claims (3)
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板の明るさを変える明度変更手段を設け
たことを特徴とする電子部品自動装着装置。1. A reflective illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing the position of the component based on an image of light reflected by the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. The automatic mounting apparatus is provided with a brightness changing means for changing the brightness of the diffuser plate.
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板の明るさを反射照明方式の部品の認識
の際には暗く透過方式による部品の認識の際には明るく
するよう変える明度変更手段を設けたことを特徴とする
電子部品自動装着装置。2. A reflection illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing a position of the component based on an image of light reflected by the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. The automatic mounting device is provided with a brightness changing means for changing the brightness of the diffuser plate to be dark when recognizing a component of a reflection illumination system and bright when recognizing a component of a transmissive system. Automatic component mounting device.
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板に液晶層を設けたことを特徴とする電
子部品自動装着装置。3. A reflective illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing a position of the component based on an image of light reflected on the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. In the automatic mounting device, a liquid crystal layer is provided on the diffusion plate, and the electronic component automatic mounting device is characterized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846994A JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846994A JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07326894A true JPH07326894A (en) | 1995-12-12 |
JP3402752B2 JP3402752B2 (en) | 2003-05-06 |
Family
ID=14737449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11846994A Expired - Lifetime JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3402752B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020050046A (en) * | 2000-12-20 | 2002-06-26 | 박종순 | Reuse system of PCB's scrap by brushing |
US6437333B1 (en) | 1999-01-28 | 2002-08-20 | Fuji Machine Mfg. Co., Ltd. | Holding apparatus, transferring apparatus, image taking system, and image taking method |
WO2011161871A1 (en) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method |
-
1994
- 1994-05-31 JP JP11846994A patent/JP3402752B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437333B1 (en) | 1999-01-28 | 2002-08-20 | Fuji Machine Mfg. Co., Ltd. | Holding apparatus, transferring apparatus, image taking system, and image taking method |
KR20020050046A (en) * | 2000-12-20 | 2002-06-26 | 박종순 | Reuse system of PCB's scrap by brushing |
WO2011161871A1 (en) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method |
JP2012008762A (en) * | 2010-06-24 | 2012-01-12 | Panasonic Corp | Component mounting system, image-recognizing data creation device, and image-recognizing data creation method |
Also Published As
Publication number | Publication date |
---|---|
JP3402752B2 (en) | 2003-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100527934C (en) | Method and equipment for inspecting mounting accuracy of component | |
JP2001136000A (en) | Jig for detecting attaching accuracy of attaching apparatus and method for detecting attaching accuracy | |
JP3402752B2 (en) | Electronic component mounting equipment | |
JP4056572B2 (en) | Data creation apparatus and method, and electronic component mounting apparatus | |
JP2008028275A (en) | Illuminator for image recognition of component mounting machine | |
JPH09321494A (en) | Illumination device for surface mounting machine | |
JPH11245369A (en) | Image recognition device and cream solder printer | |
JPH10326807A (en) | Solder ball mount equipment | |
JP3986194B2 (en) | Component recognition apparatus and component recognition method | |
JP3184339B2 (en) | Screen printing device with paste cover | |
KR0183928B1 (en) | Method for illuminating absorptive part of mounter and its apparatus | |
JPH05145295A (en) | Component mounting apparatus | |
JPH10135686A (en) | Data processing device and electronic components mounting apparatus | |
JP4150448B2 (en) | Component recognition apparatus and method | |
JPH0585844B2 (en) | ||
JP2712336B2 (en) | How to mount electronic components | |
JPH10135700A (en) | Data processing device and electronic components mounting apparatus | |
JP3623982B2 (en) | Electronic component automatic placement equipment | |
KR0183654B1 (en) | Apparatus for calibrating print position in screen printer | |
JPH08116200A (en) | Component mounting apparatus | |
KR19980022944A (en) | Electronic Component Mounting Device | |
JP2003165080A (en) | Method and device for teaching positional off-set of component recognition camera | |
JP4263291B2 (en) | Board mark recognition mechanism | |
JP3222982B2 (en) | Component recognition device | |
JP3847070B2 (en) | Electronic component mounting apparatus and electronic component mounting method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090228 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090228 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100228 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110228 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110228 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120229 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130228 Year of fee payment: 10 |