JPH07326894A - Automatic electronic parts mounting device - Google Patents
Automatic electronic parts mounting deviceInfo
- Publication number
- JPH07326894A JPH07326894A JP6118469A JP11846994A JPH07326894A JP H07326894 A JPH07326894 A JP H07326894A JP 6118469 A JP6118469 A JP 6118469A JP 11846994 A JP11846994 A JP 11846994A JP H07326894 A JPH07326894 A JP H07326894A
- Authority
- JP
- Japan
- Prior art keywords
- component
- recognizing
- light
- image
- diffuser plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、取出ノズルに保持され
た電子部品を部品認識装置で認識してプリント基板に装
着すると共に、部品に当てて反射する光の像により部品
の位置認識を行う反射照明方式の部品の認識の際には部
品の背景となり照射された光が部品を透過した透過像に
より部品の位置認識を行う透過照明方式による部品の認
識の際には部品に光を照射する拡散板を有する電子部品
自動装着装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recognizes an electronic component held by a take-out nozzle by a component recognition device and mounts it on a printed circuit board, and recognizes the position of a component by an image of light reflected upon the component. When recognizing a component in the reflected illumination system, the background of the component is radiated, and the position of the component is recognized by the transmitted image of the light that has passed through the component. When recognizing the component in the transillumination system, the component is illuminated with light. The present invention relates to an electronic component automatic mounting device having a diffusion plate.
【０００２】[0002]
【従来の技術】この種電子部品自動装着装置が特開平４
−３２０９０６号公報に開示されており、取出ノズルに
保持された電子部品の位置ずれが部品認識装置により認
識されこの認識結果に基づき位置ずれの補正がなされプ
リント基板の所定の位置に部品の装着が行われる。電子
部品の種類によりこの認識の際には部品の上方より光を
照射しその透過像を下方にある認識カメラにより撮像し
て認識処理が行われる場合と、カメラのある下方より部
品のリードに対して光を当てその反射光の像を撮像して
認識処理が行われる場合がある技術が開示されている。
そして、前者の透過照明方式の認識時の照明の場合に
は、取出ノズルの上方に設けられた拡散板に光源より光
が当てられ該拡散板が光を照射するものであり、後者の
反射照明方式の認識時の照明の場合には、該拡散板は明
るく光る部品の像の背景になり暗いことが必要となる。2. Description of the Related Art An electronic component automatic mounting apparatus of this type is disclosed in Japanese Patent Laid-Open No.
Japanese Unexamined Patent Publication No. 320906/1990 discloses that a component recognizing device recognizes a positional deviation of an electronic component held by a take-out nozzle, corrects the positional deviation based on the recognition result, and mounts a component at a predetermined position on a printed circuit board. Done. Depending on the type of electronic component, when this recognition is performed, light is emitted from above the component and the transmitted image is captured by the recognition camera below, and when the recognition process is performed, from below with the camera to the lead of the component. There is disclosed a technique in which the recognition process may be performed by shining light on the reflected light and capturing an image of the reflected light.
Then, in the case of the former illumination at the time of recognition of the transillumination method, light is applied from the light source to the diffuser plate provided above the extraction nozzle, and the diffuser plate irradiates the light. In the case of illumination during system recognition, the diffuser needs to be dark as it is the background of the image of the brightly glowing component.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前記従来技術
では反射照明方式の照明及び透過照明方式の照明のいず
れの場合にも同一の拡散板が部品の像の背景になること
から、拡散板の材料の色はどちらの方式にも対応するた
め明るい色と暗い色の中間の色とする必要があり、どち
らの方式にとっても中途半端な認識性能となってしまう
欠点があった。However, in the above-mentioned prior art, the same diffuser plate is the background of the image of the component in both the reflection illumination type illumination and the transmissive illumination type illumination. Since the color of the material is compatible with both methods, it is necessary to have an intermediate color between a bright color and a dark color, and both methods have a drawback that the recognition performance is halfway.
【０００４】そこで本発明は、反射照明方式及び透過照
明方式の部品認識のどちらの場合でも良好な像の背景の
明度が得られるようにすることを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to obtain a good background brightness of an image in both of the case of recognizing the parts of the reflection illumination system and the transmission illumination system.
【０００５】[0005]
【課題を解決するための手段】このため本発明は、取出
ノズルに保持された電子部品を部品認識装置で認識して
プリント基板に装着すると共に、部品に当てて反射する
光の像により部品の位置認識を行う反射照明方式の部品
の認識の際には部品の背景となり照射された光が部品を
透過した透過像により部品の位置認識を行う透過照明方
式による部品の認識の際には部品に光を照射する拡散板
を有する電子部品自動装着装置において、前記拡散板の
明るさを変える明度変更手段を設けたものである。Therefore, according to the present invention, an electronic component held by a take-out nozzle is recognized by a component recognizing device and mounted on a printed circuit board, and at the same time, an image of the component is reflected by an image of light reflected upon the component. When recognizing a component with the reflected illumination method that performs position recognition, the background of the component is used to recognize the position of the component based on the transmitted image of the light that passes through the component. An electronic component automatic mounting apparatus having a diffuser plate for irradiating light is provided with brightness changing means for changing the brightness of the diffuser plate.
【０００６】また本発明は、取出ノズルに保持された電
子部品を部品認識装置で認識してプリント基板に装着す
ると共に、部品に当てて反射する光の像により部品の位
置認識を行う反射照明方式の部品の認識の際には部品の
背景となり照射された光が部品を透過した透過像により
部品の位置認識を行う透過照明方式による部品の認識の
際には部品に光を照射する拡散板を有する電子部品自動
装着装置において、前記拡散板の明るさを反射照明方式
の部品の認識の際には暗く透過方式による部品の認識の
際には明るくするよう変える明度変更手段を設けたもの
である。Further, according to the present invention, the electronic component held by the take-out nozzle is recognized by the component recognizing device and mounted on the printed circuit board, and the position of the component is recognized by the image of the light reflected by the component. When recognizing a part, the background of the part is recognized, and the position of the part is recognized by the transmitted image of the light that has been radiated. The diffuser plate that illuminates the part when recognizing the part by the transillumination method is used. The electronic component automatic mounting device has a brightness changing means for changing the brightness of the diffuser plate so as to be dark when recognizing a component of a reflective illumination system and bright when recognizing a component of a transmissive system. .
【０００７】また本発明は、取出ノズルに保持された電
子部品を部品認識装置で認識してプリント基板に装着す
ると共に、部品に当てて反射する光の像により部品の位
置認識を行う反射照明方式の部品の認識の際には部品の
背景となり照射された光が部品を透過した透過像により
部品の位置認識を行う透過照明方式による部品の認識の
際には部品に光を照射する拡散板を有する電子部品自動
装着装置において、前記拡散板に液晶層を設けたもので
ある。Further, the present invention is a reflection illumination system in which an electronic component held by an ejection nozzle is recognized by a component recognition device and mounted on a printed circuit board, and the position of the component is recognized by an image of light reflected by the component. When recognizing a part, the background of the part is recognized, and the position of the part is recognized by the transmitted image of the light that has been radiated. The diffuser plate that illuminates the part when recognizing the part by the transillumination method is used. In the electronic component automatic mounting apparatus having the liquid crystal layer, the diffusion plate is provided.
【０００８】[0008]
【作用】請求項１の構成によれば、明度変更手段は部品
認識装置の電子部品の認識のための拡散板の明るさを変
える。請求項２の構成によれば、明度変更手段は部品認
識装置の電子部品の認識のための拡散板の明るさを透過
照明方式の時には明るくし反射照明方式の時には暗くす
る。According to the structure of the first aspect, the brightness changing means changes the brightness of the diffuser plate for recognizing the electronic component of the component recognizing device. According to the structure of claim 2, the brightness changing means makes the brightness of the diffuser plate for recognizing the electronic component of the component recognition device brighter in the transmissive illumination system and darker in the reflective illumination system.
【０００９】請求項３の構成によれば、拡散板に設けた
液晶層は拡散板の明度を変更可能とする。According to the third aspect, the liquid crystal layer provided on the diffusion plate can change the brightness of the diffusion plate.
【００１０】[0010]
【実施例】以下本発明の一実施例を図に基づき詳述す
る。図２に於て、１はＹ軸モータ２の回動によりＹ方向
に移動するＹテーブルであり、３はＸ軸モータ４の回動
によりＹテーブル１上でＸ方向に移動することにより結
果的にＸＹ方向に移動するＸＹテーブルであり、チップ
状電子部品５（以下、チップ部品あるいは部品とい
う。）が装着されるプリント基板６が図示しない固定手
段に固定されて載置される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, 1 is a Y table that moves in the Y direction by the rotation of the Y-axis motor 2, and 3 is a result that results from moving in the X direction on the Y table 1 by the rotation of the X-axis motor 4. An XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).
【００１１】７は供給台であり、チップ部品５を供給す
る部品供給装置８が多数台配設されている。９は供給台
駆動モータであり、ボールネジ１０を回動させることに
より、該ボールネジ１０が嵌合し供給台７に固定された
図示しないナットを介して、供給台７がリニアガイド１
２に案内されてＸ方向に移動する。１３は間欠回動する
ロータリテーブルであり、該テーブル１３の外縁部には
図３に示すように取出ノズルとしての吸着ノズル１４を
６本有する装着ヘッド１５が間欠ピッチに合わせて等間
隔に配設されている。Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, which rotates the ball screw 10 so that the supply screw 7 is fitted to the linear guide 1 via a nut (not shown) fixed to the supply base 7.
It is guided by 2 and moves in the X direction. Reference numeral 13 denotes a rotary table which rotates intermittently, and mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at the outer edge of the table 13 at equal intervals in accordance with the intermittent pitch. Has been done.
【００１２】吸着ノズル１４が供給装置８より部品５を
吸着し取出す装着ヘッド１５の停止位置（図２中上方の
黒丸の付された位置）が吸着ステーションＩであり、該
吸着ステーションＩにて装着ヘッド１５が下降すること
により吸着ノズル１４が部品５を吸着する。ＩＩは部品
５を吸着した装着ヘッド１５がロータリテーブル１３の
間欠回転により停止する認識ステーションであり、部品
認識装置１６により吸着ノズル１４に対する部品５の位
置ずれが認識される。The mounting position of the mounting head 15 for picking up the component 5 by the suction nozzle 14 from the supply device 8 (the position marked with a black dot in the upper part of FIG. 2) is the suction station I, and the suction station I is mounted. When the head 15 descends, the suction nozzle 14 sucks the component 5. Reference numeral II denotes a recognition station in which the mounting head 15 that has picked up the component 5 stops due to intermittent rotation of the rotary table 13, and the component recognition device 16 recognizes the displacement of the component 5 with respect to the suction nozzle 14.
【００１３】ＩＩＩは吸着ノズル１４が吸着保持してい
る部品５をプリント基板６に装着するために装着ヘッド
１５が停止する装着ステーション（図２中下方の黒丸の
付された位置）であり、装着ヘッド１５の下降によりＸ
Ｙテーブル３の移動により所定の位置に停止したプリン
ト基板６に部品５は装着される。装着ヘッド１５は図１
及び図３に示すように、ロータリテーブル１３に対して
吸着ステーションＩ及び装着ステーションＩＩＩにて上
下動可能になされた取り付け板１９に吸着ノズル１４が
出入可能に取り付けられた回転体２０がロータリテーブ
ル１３の回転軸と平行な軸の周りの方向（以下θ方向と
いう。）に回転可能に取り付けられ、該回転体２０を回
転させるモータ２１がその上方に取り付けられて形成さ
れている。吸着ノズル１４は該回転体２０を貫通して上
下動可能になされている。Reference numeral III denotes a mounting station (a position marked with a black circle in the lower part of FIG. 2) where the mounting head 15 stops in order to mount the component 5 held by the suction nozzle 14 on the printed circuit board 6. When the head 15 descends, X
The component 5 is mounted on the printed circuit board 6 stopped at a predetermined position by the movement of the Y table 3. The mounting head 15 is shown in FIG.
Further, as shown in FIG. 3, a rotary body 20 is attached to the rotary plate 13 so that the suction nozzles 14 can be moved in and out of a mounting plate 19 which is vertically movable with respect to the rotary table 13 at the suction station I and the mounting station III. A motor 21 that is rotatably mounted in a direction around an axis parallel to the rotation axis (hereinafter referred to as θ direction) and that rotates the rotating body 20 is formed above the motor 21. The suction nozzle 14 penetrates the rotating body 20 and is vertically movable.
【００１４】該回転体２０には前記部品認識装置１６に
より部品５の吸着ノズル１４に対する位置ずれを認識す
る場合にカメラに撮像された画面の背景となる拡散板２
２が形成されている。部品認識には部品５をカメラの反
対側即ち部品５の上方より照明して該部品５の投影像に
より認識する透過照明方式の認識と、部品５にカメラ側
より光を照射してその反射像により認識する反射照明方
式の認識がある。図１及び図４において、２３は光源で
あり図１に示す透過照明方式の場合該光源２３より照射
された光は拡散板２２に照射され該拡散板２２に反射拡
散された光が部品５を透過して部品認識装置１６に受光
されるようになされており、図４に示す反射照明方式の
場合には、部品５に光源２３より光か照射され拡散板２
２は背景となるようになされている。The rotating body 20 has a diffuser plate 2 as a background of a screen imaged by a camera when the component recognition device 16 recognizes a displacement of the component 5 with respect to the suction nozzle 14.
2 is formed. For component recognition, recognition of a transillumination system in which the component 5 is illuminated from the opposite side of the camera, that is, above the component 5 and recognized by the projected image of the component 5, and light reflected from the component 5 by irradiating the component 5 with light from the camera side There is a recognition of the reflected illumination method. In FIGS. 1 and 4, reference numeral 23 denotes a light source. In the case of the transmissive illumination system shown in FIG. 1, the light emitted from the light source 23 is applied to the diffuser plate 22 and the light reflected and diffused by the diffuser plate 22 causes the component 5 to pass through. The light is transmitted and received by the component recognition device 16, and in the case of the reflection illumination system shown in FIG.
2 is designed as a background.
【００１５】該拡散板２２は回転体２０の内側に塗布さ
れた白色塗装層２４、その上に貼り付けられた明度変更
手段としての液晶層２５及びその上に貼り付けられた透
明に近い乳白色の樹脂板２６により形成されている。樹
脂板２６の材質は例えばポリアセタールである。液晶層
２５はガラス板で液晶を挾み封止したパネル状の構造で
あり、上下両側のガラス板夫々の全面にわたって設けら
れた電極間に電圧が加えられるとガラス板に垂直な方向
に透明となり、電位差が無くなると光を通さないように
なるものである。The diffuser plate 22 has a white coating layer 24 applied to the inside of the rotating body 20, a liquid crystal layer 25 as a lightness changing means attached thereon, and a nearly transparent milky white layer attached thereon. It is formed of a resin plate 26. The material of the resin plate 26 is, for example, polyacetal. The liquid crystal layer 25 has a panel-like structure in which liquid crystal is sandwiched between glass plates and becomes transparent in a direction perpendicular to the glass plates when a voltage is applied between electrodes provided over the entire surfaces of the glass plates on the upper and lower sides. When the electric potential difference disappears, the light cannot pass through.
【００１６】液晶層２５及び樹脂板２６は貼り付けるの
ではなくビス締めにより回転体２０に取り付けられるよ
うにしてもよい。液晶層２５の前記電極の夫々には該液
晶層２５を透明及び遮光状態とするために電圧をかける
ためのリード線２７が配線されている。白色塗装層２４
は光を拡散反射する層であり、図１のように液晶層２５
が透明な場合には光源２３からの光が反射され液晶層２
５及び樹脂板２６を通って部品５に拡散光が照射され透
過照明方式の認識がなされるものであり、また液晶層２
５が遮光状態では光源２３からの光は液晶層２５に遮ら
れ殆ど反射せず、拡散板２２は暗い状態となる。白色塗
装層２４、液晶層２５及び樹脂板２６には吸着ノズル１
４が貫通する穴が開けられている。The liquid crystal layer 25 and the resin plate 26 may be attached to the rotating body 20 by screwing instead of pasting. Each of the electrodes of the liquid crystal layer 25 is provided with a lead wire 27 for applying a voltage to make the liquid crystal layer 25 transparent and shielded. White paint layer 24
Is a layer that diffuses and reflects light, and as shown in FIG.
Is transparent, the light from the light source 23 is reflected and the liquid crystal layer 2
The diffused light is applied to the component 5 through the resin 5 and the resin plate 26 to recognize the transillumination method, and the liquid crystal layer 2
When 5 is in the light-shielded state, the light from the light source 23 is shielded by the liquid crystal layer 25 and hardly reflected, and the diffusion plate 22 is in a dark state. The white coating layer 24, the liquid crystal layer 25 and the resin plate 26 have a suction nozzle 1
There is a hole through which 4 passes.
【００１７】リード線２７は回転体２２が取り付けられ
たモータ２１の回転軸２９の表面に設けられた電極３０
に接続され、取り付け板１９の内面にリング状に設けら
れ該電極３０が回転体２０のどの回転位置でも接触可能
なスリップリング３１にはリード線３２が接続され、該
リード線３２はロータリテーブル１３内を配線され、ロ
ータリテーブルの図示しない回転軸に同様な構造で設け
られたスリップリングを介して図５に示すインターフェ
ース３４に接続されている。The lead wire 27 is an electrode 30 provided on the surface of the rotating shaft 29 of the motor 21 to which the rotating body 22 is attached.
A lead ring 32 connected to a slip ring 31 which is provided in a ring shape on the inner surface of the mounting plate 19 and which allows the electrode 30 to come into contact with the rotary body 20 at any rotational position. The inside of the rotary table is connected to the interface 34 shown in FIG. 5 via a slip ring having a similar structure to a rotary shaft (not shown) of the rotary table.
【００１８】図５に基づき電子部品自動装着装置の制御
ブロックについて詳述する。３６は明度変更手段として
のＣＰＵであり、ＲＯＭ３７に記憶されたプログラムに
従ってＲＡＭ３８に記憶されたデータに基づき、部品装
着に係わる種々の動作を制御する。該ＣＰＵ３６にはイ
ンターフェース３４を介して認識装置１６、駆動回路３
９等が接続されている。駆動回路３９には前記供給台駆
動モータ９及び各ヘッド１５のモータ２１等が接続され
いる。The control block of the automatic electronic component mounting apparatus will be described in detail with reference to FIG. Reference numeral 36 denotes a CPU as a brightness changing means, which controls various operations relating to component mounting based on the data stored in the RAM 38 in accordance with the program stored in the ROM 37. The recognition device 16 and the drive circuit 3 are connected to the CPU 36 via the interface 34.
9 etc. are connected. The drive circuit 39 is connected to the supply table drive motor 9 and the motor 21 of each head 15.
【００１９】前記ＲＡＭ３８には図６に示されるような
ＮＣデータが格納される。ＮＣデータはプリント基板６
の種類毎にＲＡＭ３８に記憶されるものであるが、装着
の順番を示すステップ毎にリール番号（「Ｒ−ＮＯ」と
表示してある欄）、Ｘデータ（「Ｘ」と表示してある
欄）、Ｙデータ（「Ｙ」と表示してある欄）及びθデー
タ（「θ」と表示してある欄）が格納されている。リー
ル番号は供給台７の部品供給装置８の配設位置を示す番
号であり、Ｘデータ及びＹデータはプリント基板６上の
チップ部品５を装着すべきＸＹ位置座標を表し、θデー
タはチップ部品５が装着されるべきθ方向を即ち吸着さ
れたチップ部品５の回動すべき角度量を示す。「Ｃ」の
欄の「Ｅ」はこのステップでプリント基板６の１枚当り
の部品装着が終了することを示す。NC data as shown in FIG. 6 is stored in the RAM 38. NC data is printed circuit board 6
Although it is stored in the RAM 38 for each type, the reel number (column labeled “R-NO”) and the X data (column labeled “X”) for each step indicating the mounting order. ), Y data (column labeled “Y”) and θ data (column labeled “θ”). The reel number is a number indicating the arrangement position of the component supply device 8 on the supply base 7, the X data and the Y data represent the XY position coordinates where the chip component 5 on the printed circuit board 6 should be mounted, and the θ data is the chip component. 5 shows the θ direction in which the chip component 5 should be mounted, that is, the angle amount by which the sucked chip component 5 should rotate. "E" in the "C" column indicates that component mounting for each printed circuit board 6 is completed in this step.
【００２０】また、ＲＡＭ３８には図７に示す配置デー
タ及び図８に示す部品ライブラリデータが記憶される。
図７の配置データは部品供給装置８の供給台７上での配
置位置を示すリール番号毎に当該位置の部品供給装置８
が供給するチップ部品５の種類を示す部品ＩＤが格納さ
れている。図８に示す部品ライブラリデータは部品ＩＤ
毎の種々のデータが格納されており、例えば当該部品が
反射照明方式の部品認識をすべきものか、透過照明方式
の部品認識をすべきものか等のデータが格納されてい
る。ＣＰＵ３６はＮＣデータで読み出したリール番号に
基づき、配置データを介して部品ライブラリデータより
当該部品５についてなすべき事に関するデータを読み出
すものである。The RAM 38 also stores the arrangement data shown in FIG. 7 and the component library data shown in FIG.
The arrangement data of FIG. 7 indicates the arrangement position of the component supply device 8 on the supply base 7 for each reel number and the component supply device 8 at that position.
The component ID indicating the type of the chip component 5 supplied by is stored. The component library data shown in FIG. 8 is a component ID.
Various data are stored for each of them, and for example, data indicating whether the component should be recognized by the reflective illumination method or the transmitted illumination method. The CPU 36 reads out data relating to what should be done with respect to the component 5 from the component library data via the arrangement data based on the reel number read out by the NC data.
【００２１】前記光源２３もインターフェース３４を介
してＣＰＵ３６に制御され、反射照明方式の部品認識の
場合には部品５の下面に直接光を照射するようにし、透
過照明方式の場合には部品５にはなるべく直接当てず拡
散板２６に光を照射するようにしている。以上の構成に
より以下動作について説明する。The light source 23 is also controlled by the CPU 36 via the interface 34 so that the lower surface of the component 5 is directly irradiated with light in the case of the component recognition of the reflection illumination system, and the component 5 is illuminated in the case of the transillumination system. The diffuser plate 26 is irradiated with light without direct contact as much as possible. The operation will be described below with the above configuration.
【００２２】先ず、図示しない自動運転の始動キーが押
圧されると自動運転が開始され、プリント基板６がＸＹ
テ−ブル３上に載置され位置決め固定されると、該基板
６のＮＣデータ（図６）のステップに従って部品５の装
着動作が開始される。即ち、ステップ１のリール番号１
を読み出し、該リール番号の部品供給装置８が吸着ノズ
ル１４の吸着位置に停止するようモータ９を回動させ供
給台７を移動させる。ロータリテーブル１３の回動によ
り該部品供給装置８の部品種に合ったノズル１４がモー
タ２１の回転により選択された状態の装着ヘッド１５が
吸着ステ−ションＩに達すると、装着ヘッド１５が図示
しないカムの駆動により下降して、部品供給装置８が供
給するチップ部品５が吸着ノズル１４に図３に示すよう
に吸着される。First, when an unillustrated automatic operation start key is pressed, automatic operation is started, and the printed circuit board 6 is moved to XY.
When placed on the table 3 and positioned and fixed, the mounting operation of the component 5 is started according to the step of the NC data (FIG. 6) of the substrate 6. That is, reel number 1 in step 1
Is read, and the motor 9 is rotated so that the component supply device 8 of the reel number stops at the suction position of the suction nozzle 14, and the supply base 7 is moved. When the mounting head 15 in the selected state by the rotation of the motor 21 reaches the suction station I by the rotation of the rotary table 13, the nozzle 14 matching the component type of the component supply device 8 reaches the suction station I, and the mounting head 15 is not shown. As the cam is driven, it descends and the chip component 5 supplied by the component supply device 8 is adsorbed by the adsorption nozzle 14 as shown in FIG.
【００２３】次に、ロータリテーブル１３の間欠回転に
よりヘッド１５は移動し認識ステ−ションＩＩに達する
と、部品認識装置１６が吸着ノズル１４に吸着された部
品５の認識を行う。即ち、ＣＰＵ３６はＲＡＭ３８より
読み出した図６のＮＣデータのステップ１のリール番号
より図７の配置データを読み込み部品ＩＤがＡＡＡであ
ることを知り、部品ＩＤがＡＡＡの部品ライブラリデー
タを読みこの部品５には透過照明方式の部品認識が適用
されることを判断する。Next, when the head 15 moves and reaches the recognition station II due to the intermittent rotation of the rotary table 13, the component recognition device 16 recognizes the component 5 sucked by the suction nozzle 14. That is, the CPU 36 reads the arrangement data of FIG. 7 from the reel number of step 1 of the NC data of FIG. 6 read from the RAM 38, knows that the component ID is AAA, reads the component library data of the component ID AAA, and reads this component 5 It is determined that the transillumination type component recognition is applied to.
【００２４】次に、ＣＰＵ３６はこの判断に従って光源
２３を透過照明方式に切替え、さらに、リード線３２、
２７を介して液晶層２５の液晶を透明にして拡散板２２
を明るくするよう制御する。次に、部品認識装置１６は
部品５を撮像するが、光源２３から照射された光は拡散
板２２に当るが、樹脂板２６及び透明な状態の液晶層２
５を透過して白色塗装層２４に当り、反射拡散され、再
度液晶層２５及び樹脂板２６を透過して部品５に照射さ
れ部品認識装置１６のカメラにこの像が撮像される。こ
の撮像された画像は図９に示すように、部品５の部分が
黒くそして背景である拡散板２２の部分は十分明るく部
品５の像が明瞭に写し出されたものとなっている。Next, the CPU 36 switches the light source 23 to the transmissive illumination system according to this judgment, and further, the lead wire 32,
The liquid crystal of the liquid crystal layer 25 is made transparent through the diffusion plate 22.
Control to brighten. Next, the component recognition device 16 images the component 5, and the light emitted from the light source 23 strikes the diffusion plate 22, but the resin plate 26 and the liquid crystal layer 2 in a transparent state.
After passing through 5, the white coating layer 24 is reflected, diffused, again transmitted through the liquid crystal layer 25 and the resin plate 26, and irradiated on the component 5, and this image is picked up by the camera of the component recognition device 16. As shown in FIG. 9, the picked-up image is such that the part 5 is black and the background diffuser plate 22 is sufficiently bright so that the image of the part 5 is clearly projected.
【００２５】該画像に基づき、部品５の位置ずれ（角度
位置のずれも含む。）が認識処理される。次に、該ヘッ
ド１５はロータリテーブル１３の回転により認識ステ−
ションＩＩより移動するが、ＣＰＵ３６は認識装置１６
の認識結果により角度ずれがΔθあることが認識された
とすると、ＮＣデータのθデータの９０度に該位置ずれ
を加味した角度「９０−Δθ」だけ回転軸２９を回転さ
せるように駆動回路３９に指令を出し部品５は角度位置
ずれが補正されて装着すべきθデータの角度位置に角度
振りされる。Based on the image, the positional deviation of the component 5 (including the angular positional deviation) is recognized. Next, the head 15 is recognized by the rotation of the rotary table 13.
Although moving from the section II, the CPU 36 uses the recognition device 16
If it is recognized from the recognition result that there is an angle deviation of Δθ, the drive circuit 39 is caused to rotate the rotary shaft 29 by an angle “90−Δθ” in which the positional deviation is added to 90 degrees of the θ data of the NC data. The component 5 is issued a command and the angular displacement is corrected, and the component 5 is swung to the angular position of the θ data to be mounted.
【００２６】次に、装着ヘッド１５が装着ステ−ション
ＩＩＩに達すると吸着ステ−ションＩと同様に装着ヘッ
ド１５は下降し、プリント基板６の（Ｘ１，Ｙ１）の座
標位置に９０度の装着角度で装着される。該位置に装着
されるためにＸＹテ−ブル３はＸ軸モータ４及びＹ軸モ
ータ２の回動により前記認識装置１６の認識結果による
位置ずれ及び吸着ノズル１４が「９０−Δθ」だけ回動
されていることによる位置ずれを補正した移動量を移動
される。Next, when the mounting head 15 reaches the mounting station III, the mounting head 15 descends in the same manner as in the suction station I, and is mounted at the coordinate position (X1, Y1) of the printed circuit board 6 by 90 degrees. It is installed at an angle. Since the XY table 3 is mounted in the position, the XY table 3 is displaced by the rotation of the X-axis motor 4 and the Y-axis motor 2 due to the recognition result of the recognition device 16, and the suction nozzle 14 is rotated by "90-Δθ". The movement amount is corrected by correcting the positional deviation due to the movement.
【００２７】このようにして部品５の吸着動作乃至装着
動作がＮＣデータのステップの順に各装着ヘッド１５毎
に行われていくが、あるステップにおいて、吸着ノズル
１４が吸着した部品５の部品ＩＤの部品ライブラリデー
タには反射照明方式であることが格納されていると、Ｃ
ＰＵ３６は当該部品５を保持した装着ヘッド１５が認識
ステ−ションＩＩに達すると光源２３を反射照明方式に
合わせ、部品５の下面に直接光を当てるようにさせ、液
晶層２５は図４に示すように黒色の遮光状態になされ
る。光源２３よりの光の殆どは部品５の下面に照射され
るのであるが、拡散板２２に当るものもあり、拡散板２
２に当った光は樹脂板２６を透過するが液晶層２５を透
過することはできず、該液晶層２５の表面で少量反射さ
れるとしても白色塗装層２４で反射される光量よりは圧
倒的に少ない量であり、拡散板２２により反射され部品
認識装置１６に入る光の量は少量に抑えられ暗くされ
る。部品認識装置１６により撮像される部品５の画像は
図１０に示すように、部品５の像が明るく背景となる拡
散板２２の部分は部品５の像のコントラストが取れるよ
う十分に暗いものとなっている。この像により正確な位
置ずれの認識処理が行われる。図１０の像においては便
宜上部品５全体が白くなされているが、実際には部品５
より突出している金属製のリード部でもっとも強く反射
され、モールド部分はリード部程は明るくならないが、
リード部の像のコントラストは拡散板２２の明度との差
により出てくるものであり拡散板２２の明度が暗いこと
が重要である。In this way, the suction operation or the mounting operation of the component 5 is performed for each mounting head 15 in the order of the steps of the NC data. At a certain step, the component ID of the component 5 sucked by the suction nozzle 14 If it is stored in the component library data that the reflection lighting system is stored, C
When the mounting head 15 holding the component 5 reaches the recognition station II, the PU 36 adjusts the light source 23 to the reflective illumination system so that the lower surface of the component 5 is directly illuminated with the liquid crystal layer 25 shown in FIG. As shown in FIG. Most of the light from the light source 23 is applied to the lower surface of the component 5, but there is also light that hits the diffuser plate 22.
The light that hits 2 passes through the resin plate 26 but cannot pass through the liquid crystal layer 25, and even if a small amount is reflected on the surface of the liquid crystal layer 25, it is overwhelmingly larger than the amount of light reflected by the white coating layer 24. The amount of light reflected by the diffuser 22 and entering the component recognition device 16 is suppressed to a small amount and is made dark. As shown in FIG. 10, the image of the component 5 picked up by the component recognition device 16 is sufficiently dark so that the image of the component 5 is bright and the portion of the diffuser plate 22 serving as the background has a contrast of the image of the component 5. ing. Accurate position shift recognition processing is performed based on this image. In the image of FIG. 10, the entire component 5 is shown in white for the sake of convenience.
The most protruding metal lead is reflected most strongly, and the mold part is not as bright as the lead part,
The contrast of the image of the lead portion appears due to the difference from the brightness of the diffusion plate 22, and it is important that the brightness of the diffusion plate 22 is dark.
【００２８】尚、本実施例では拡散板２２の構造は液晶
層２５の上に樹脂板２６が重ねられた構造であるが、樹
脂板２６を白色塗装層２４に直接重ね、その上即ち拡散
板２２の表面に液晶を重ねた構造とすることも考えら
れ、または白色塗装層２４の上に液晶を重ねただけの構
造とすることも考えられる。このように液晶層を拡散板
の表面に形成しようとする場合にはその上にコーティン
グを施してもよい。In the present embodiment, the structure of the diffusion plate 22 is such that the resin plate 26 is laminated on the liquid crystal layer 25, but the resin plate 26 is directly laminated on the white coating layer 24, that is, the diffusion plate. It is conceivable to have a structure in which liquid crystal is superposed on the surface of 22, or a structure in which liquid crystal is simply superposed on the white coating layer 24. When the liquid crystal layer is to be formed on the surface of the diffusion plate as described above, a coating may be applied thereon.
【００２９】[0029]
【発明の効果】以上のように本発明は、拡散板に設けた
液晶層等の明度変更手段により拡散板の明るさを変える
ことができるので、透過照明方式及び反射照明方式の双
方の部品認識時に夫々の方式に合った最適な明度を背景
とした像で部品認識処理を行うことができ、部品認識の
精度を上げることができる。As described above, according to the present invention, the brightness of the diffuser plate can be changed by the brightness changing means such as a liquid crystal layer provided on the diffuser plate. Sometimes, the component recognition processing can be performed with an image with an optimal brightness background suitable for each method, and the component recognition accuracy can be improved.
【図１】装着ヘッドの側面図である。FIG. 1 is a side view of a mounting head.
【図２】本発明を適用せる電子部品自動装着装置の平面
図である。FIG. 2 is a plan view of an electronic component automatic mounting device to which the present invention is applied.
【図３】装着ヘッドの下方から見た斜視図である。FIG. 3 is a perspective view of the mounting head as seen from below.
【図４】装着ヘッドの側面図である。FIG. 4 is a side view of the mounting head.
【図５】本発明を適用せる電子部品自動装着装置の制御
ブロック図である。FIG. 5 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.
【図６】ＮＣデータを示す図である。FIG. 6 is a diagram showing NC data.
【図７】配置データを示す図である。FIG. 7 is a diagram showing arrangement data.
【図８】部品ライブラリデータを示す図である。FIG. 8 is a diagram showing component library data.
【図９】透過照明方式の部品の画像である。FIG. 9 is an image of a transillumination type component.
【図１０】反射照明方式の部品の画像である。FIG. 10 is an image of a component of a reflection illumination type.
５ チップ状電子部品（電子部品） ６ プリント基板 １４ 吸着ノズル（取出ノズル） １６ 部品認識装置 ２２ 拡散板 ２５ 液晶層（明度変更手段） ３６ ＣＰＵ（明度変更手段） 5 Chip-shaped Electronic Components (Electronic Components) 6 Printed Circuit Board 14 Adsorption Nozzle (Ejection Nozzle) 16 Component Recognition Device 22 Diffuser 25 Liquid Crystal Layer (Brightness Change Means) 36 CPU (Brightness Change Means)
Claims (3)
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板の明るさを変える明度変更手段を設け
たことを特徴とする電子部品自動装着装置。1. A reflective illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing the position of the component based on an image of light reflected by the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. The automatic mounting apparatus is provided with a brightness changing means for changing the brightness of the diffuser plate.
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板の明るさを反射照明方式の部品の認識
の際には暗く透過方式による部品の認識の際には明るく
するよう変える明度変更手段を設けたことを特徴とする
電子部品自動装着装置。2. A reflection illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing a position of the component based on an image of light reflected by the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. The automatic mounting device is provided with a brightness changing means for changing the brightness of the diffuser plate to be dark when recognizing a component of a reflection illumination system and bright when recognizing a component of a transmissive system. Automatic component mounting device.
認識装置で認識してプリント基板に装着すると共に、部
品に当てて反射する光の像により部品の位置認識を行う
反射照明方式の部品の認識の際には部品の背景となり照
射された光が部品を透過した透過像により部品の位置認
識を行う透過照明方式による部品の認識の際には部品に
光を照射する拡散板を有する電子部品自動装着装置にお
いて、前記拡散板に液晶層を設けたことを特徴とする電
子部品自動装着装置。3. A reflective illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing a position of the component based on an image of light reflected on the component. An electronic component that has a diffuser plate that illuminates the component when recognizing the component by the transillumination method that recognizes the position of the component by a transmission image of the light that is the background of the component when recognizing and is transmitted through the component. In the automatic mounting device, a liquid crystal layer is provided on the diffusion plate, and the electronic component automatic mounting device is characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846994A JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846994A JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07326894A true JPH07326894A (en) | 1995-12-12 |
| JP3402752B2 JP3402752B2 (en) | 2003-05-06 |
Family
ID=14737449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11846994A Expired - Lifetime JP3402752B2 (en) | 1994-05-31 | 1994-05-31 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3402752B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020050046A (en) * | 2000-12-20 | 2002-06-26 | 박종순 | Reuse system of PCB's scrap by brushing |
| US6437333B1 (en) | 1999-01-28 | 2002-08-20 | Fuji Machine Mfg. Co., Ltd. | Holding apparatus, transferring apparatus, image taking system, and image taking method |
| WO2011161871A1 (en) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method |
-
1994
- 1994-05-31 JP JP11846994A patent/JP3402752B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6437333B1 (en) | 1999-01-28 | 2002-08-20 | Fuji Machine Mfg. Co., Ltd. | Holding apparatus, transferring apparatus, image taking system, and image taking method |
| KR20020050046A (en) * | 2000-12-20 | 2002-06-26 | 박종순 | Reuse system of PCB's scrap by brushing |
| WO2011161871A1 (en) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | Parts mounting system, image-recognition data creating apparatus, and image-recognition data creating method |
| JP2012008762A (en) * | 2010-06-24 | 2012-01-12 | Panasonic Corp | Component mounting system, image-recognizing data creation device, and image-recognizing data creation method |
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| Publication number | Publication date |
|---|---|
| JP3402752B2 (en) | 2003-05-06 |
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