KR200145916Y1 - Wet etching device - Google Patents
Wet etching device Download PDFInfo
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- KR200145916Y1 KR200145916Y1 KR2019970002071U KR19970002071U KR200145916Y1 KR 200145916 Y1 KR200145916 Y1 KR 200145916Y1 KR 2019970002071 U KR2019970002071 U KR 2019970002071U KR 19970002071 U KR19970002071 U KR 19970002071U KR 200145916 Y1 KR200145916 Y1 KR 200145916Y1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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Abstract
순환관을 통하여 처리조 내부로 여러 종류의 케미컬이 혼합된 처리액이 공급되는 습식각처리장치에 있어서, 본 고안은 순환관에 설치되며, 처리액의 혼합비율이 측정되는 혼합비율측정부가 구비된 것이 특징이다.In the wet etching apparatus, in which a treatment liquid mixed with various kinds of chemicals is supplied into a treatment tank through a circulation tube, the present invention is installed in a circulation tube and includes a mixing ratio measuring unit for measuring a mixing ratio of the treatment liquid. Is characteristic.
Description
습식각장비(wet station)인 처리조 내에서 순환되는 처리액(세정액)은 보통 2∼3종류의 약품을 혼합하여 사용하며, 처리액의 일예로 불산(HF)과 초순수(Deionized water)를 또는 수산화암모늄(NaOH)과 초순수를, 과산화수소(H2O2)와 초순수 등을 일정비율로 혼합하여 사용한다.Treatment liquids (cleaning liquids) circulated in a treatment station, which is a wet station, are usually mixed with two or three kinds of chemicals. Ammonium hydroxide (NaOH) and ultrapure water are mixed, and hydrogen peroxide (H 2 O 2 ), ultrapure water and the like are mixed and used at a constant ratio.
여기에서 혼합되는 각각의 약품의 비율에 따라 반도체웨퍼의 식각량, 평탄도(uniformity)등이 달라진다. 제1도는 종래의 습식각처리장치를 개략적으로 설명하기 위한 도면으로, 첨부된 도면을 참조하여 설명하겠다.The amount of etching, uniformity, and the like of the semiconductor wafer vary depending on the ratio of the respective chemicals to be mixed. 1 is a view for schematically explaining a conventional wet etching apparatus, which will be described with reference to the accompanying drawings.
여러 종류의 케미컬이 혼합된 처리액을 순환관으로 통과시키면서 처리조 내부로 공급시키는 종래의 습식각처리장치는 제1도와 같이, 정확한 량이 측정된 각각의 약품은 순환관을 통하여 균등하게 혼합되어 처리조(10) 바닥으로부터 공급된다.In the conventional wet etching apparatus for supplying the treatment liquid mixed with various kinds of chemicals through a circulation pipe, the chemicals are measured and mixed with each other evenly through the circulation pipe as shown in FIG. The tank 10 is fed from the bottom.
이때, 처리액은 처리조 외벽을 타고 흘러넘치면서 순환관 내에서 필터에 의해 필터링되며, 또한 펌프댐퍼를 통과되어 처리조 내로 재순환된다.At this time, the treatment liquid is filtered by a filter in the circulation pipe while flowing over the outer wall of the treatment tank, and is also recycled into the treatment tank through the pump damper.
종래의 일반적인 혼합약품의 비율은 양을 미리 측정하여 혼합하지만, 일단 혼합된 후에는 그 약품이 원하는 비율로 혼합되었는 지는 별도로 측정하는 장치가 없었기 때문에 알 수 없었다.The ratio of the conventional general mixed drug was measured and mixed in advance, but once mixed, it was not known whether the drug was mixed in the desired ratio because there was no device to measure separately.
즉, 처리액에 혼합된 각각의 약품이 일정비율로 섞였눈 자 그렇지 않았는 지를 확인할 수 없었다.That is, it was not possible to confirm whether or not each drug mixed in the treatment liquid was mixed at a certain ratio.
본 고안은 습식각장비인 처리조 내로 공급된 처리액이 일정비율로 혼합되었는 지의 여부를 알 수 있도록 약품의 혼합비율을 측정할 수 있는 습시각처리장치를 제공하는 데 있다.The present invention is to provide a wet-time processing device that can measure the mixing ratio of the chemical to know whether the treatment liquid supplied into the treatment tank of the wet etching equipment is mixed at a constant ratio.
본원 고안의 습식각처리장치는 여러 종류의 약품이 혼합된 처리액이 순환관을 통해 위이퍼 습식각 공정이 진행되는 처리조 내부로 공급되는 습식각저리장치에 관한 것으로, 순환관의 소정부위에 연결된 연결관과, 연결관 일단과 연결된 순수공급관과, 순수 공급관에 설치되되, 연결관을 통해 유입된 처리액의 혼합비율이 감지되는 감지센서와, 순환관에 설치되어 처리조 내로의 처리액 공급을 제어시키시 위한 개폐밸브와, 감지센서에 의해 측정된 처리액의 혼합비율이 데이타로 표시되는 모니터가 구비되며, 연결관은 순환관의 소정부위에 각각 연결된 제1연결관과, 제2연결관과, 제1연결관에 설치되어, 순환관 내의 처리액이 상기 제1연결관 내로의 공급을 제어하기 위한 제2개폐밸브와, 제2연결관에 설치되어, 순환관 내의 처리액이 제1연결관 내로의 공급을 제어기 위한 제3개폐밸브를 구비한 것이 특징이다.The wet etching apparatus of the present invention relates to a wet etching apparatus in which a treatment liquid mixed with various kinds of chemicals is supplied into a treatment tank through which a wiper wet etching process is performed. A connecting sensor connected to the connection pipe, a pure water supply pipe connected to one end of the connection pipe, a detection sensor installed in the pure water supply pipe and detecting a mixing ratio of the processing liquid introduced through the connection pipe, and installed in the circulation pipe to supply the processing liquid into the processing tank. On and off valves for controlling the control, and the monitor to display the mixing ratio of the treatment liquid measured by the sensing sensor as data, the connection pipe is a first connection pipe and a second connection pipe respectively connected to a predetermined portion of the circulation pipe And a second opening / closing valve for controlling the supply of the processing liquid in the circulation pipe to the first connecting pipe, and installed in the second connecting pipe, wherein the processing liquid in the circulation pipe is provided in the first connection pipe. Into connector And a third open / close valve for controlling the supply.
제1도는 종래의 습식각처리장치를 개략적으로 도시한 도면이고,1 is a view schematically showing a conventional wet etching apparatus,
제2도와 제3도는 본 고안의 습식각처리장치를 개략적으로 도시한 도면이다.2 and 3 is a view schematically showing the wet etching apparatus of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10,20 : 처리조 11,21 : 순환관10,20: treatment tank 11,21: circulation pipe
22 : 제1연결관 23 : 제2연결관22: first connector 23: second connector
24 : 순수공급관 25,25-1 : 감지센서24: pure water supply pipe 25,25-1: detection sensor
21-1,22-1,23-1,24-2 : 개폐밸부21-1,22-1,23-1,24-2: Opening and closing bell part
제2도는 본 고안의 습식각처리장치를 개략적으로 도시한 도면이고, 제3도는 본고안의 감지센서를 도시한 도면이다.2 is a view schematically showing a wet etching apparatus of the present invention, and FIG. 3 is a view showing a sensor of the present invention.
여러 약품이 혼합된 처리액이 공급되는 통로인 순환관이 설치된 본 고안의 습식각 처리장치는 제2도와 제3도와 같이 순환관(21)의 소정부위의 상부와 하부에 연결된 제1연결관(22)과 제2연결관(23)과, 제2연결관과 제2연결관에 각각 설치된 제1개폐밸브(22-1), 제2개폐밸브(23-1),와 제1연결관과 제2연결관 사이의 순환관에 설치된 제3개폐밸브(21-1)와, 제1연결관과 제22연결관의 일단과 연결된 제3연결관(24)과, 제3연결관에 설치되며, 순환관에서 제3연결관 내로 공급된 처리액의 혼합비율이 감지되는 감지센서(25)와, 감지센서에 의해 측정된 혼합비율이 데이터로 표시되는 모니터와, 제3연결관의 양끝단에 설치된 제4개폐밸브(24-1)와 제5개폐밸브(24-2)로 구성된다. 이때, 제3연결관의 일측에는 순수탱크가 설치된다.The wet etching apparatus of the present invention, in which a circulation pipe, which is a passage for supplying a treatment liquid mixed with various chemicals, is installed in the first connection pipe connected to upper and lower portions of a predetermined portion of the circulation pipe 21 as shown in FIG. 2 and FIG. 22) and the second connecting pipe (23), the first opening and closing valve 22-1, the second opening and closing valve (23-1) installed in the second connecting pipe and the second connecting pipe and The third opening and closing valve 21-1 installed in the circulation pipe between the second connecting pipe, the third connecting pipe 24 connected to one end of the first connecting pipe and the 22nd connecting pipe, and the third connecting pipe In addition, a sensor for detecting the mixing ratio of the processing liquid supplied from the circulation pipe into the third connecting pipe, a monitor for displaying the mixing ratio measured by the sensor as data, and both ends of the third connecting pipe And a fourth open / close valve 24-1 and a fifth open / close valve 24-2. At this time, the pure water tank is installed on one side of the third connecting pipe.
이와 같이 구성된 본 고안의 습식각처리장치를 통해 처리액의 혼합비율이 측정되는 과정을 살펴보면 다음과 같다.Looking at the process of measuring the mixing ratio of the treatment liquid through the wet etching apparatus of the present invention configured as described above are as follows.
우선, 제2개폐밸브(22-1)와 제3개폐밸브(23-1)를 오픈시키어 제1연결관(22)과 제2연결관(23)내로 처리액이 공급되도록 하며, 제1연결관과 제2연결관 내의 처리액은 제3연결관 내로 유립된다. 이때, 제4개폐밸브(24-1)를 차단하여 순수가 공급되지 못하도록 한다. 그리고, 제3연결관 내의 처리액은 감지센서에 의해 혼합된 약품의 각각의 비율이 감지된다.First, the second opening and closing valve 22-1 and the third opening and closing valve 23-1 are opened so that the treatment liquid is supplied into the first connecting pipe 22 and the second connecting pipe 23, and the first connection is made. The treatment liquid in the tube and the second connecting tube flows into the third connecting tube. At this time, the fourth opening and closing valve 24-1 is blocked to prevent the supply of pure water. Then, the treatment liquid in the third connecting tube is sensed each ratio of the drug mixed by the detection sensor.
이때, 감지센서는 제3도과 같이, 센서부분(25-1)에 처리액이 통과되면서 처리액에 혼합된 약품의 전도성이 측정되어 약품의 비율이 측정된다.In this case, as shown in FIG. 3, as the treatment liquid passes through the sensor part 25-1, the conductivity of the medicine mixed in the treatment liquid is measured, and the ratio of the medicine is measured.
그리고, 모니터를 통해 감지센서에 의해 측정된 처리액의 혼합비율을 인식할 수 있다. 이러한 처리액의 혼합비율 측정작업이 완료되면, 제3연결관에 설치된 제4개폐밸브(24-1)를 오픈시킴에 따라 제3연결관 내로 순수가 유입된다. 제3연결관(24)내로 유입된 순수는 감지센서(25)의 센서부분(25-1)에 잔재된 처리액을 크리닝하면서 센서를 보호하게 된다. 센서부분이 약품에 장기간 노출될 시 수명단축이 되는 원인이 되기 때문에 주기적으로 센서를 크리닝하여야 한다.In addition, the monitor may recognize the mixing ratio of the processing liquid measured by the sensor. When the mixing ratio measurement operation of the treatment liquid is completed, the pure water flows into the third connecting pipe by opening the fourth opening / closing valve 24-1 installed in the third connecting pipe. The pure water introduced into the third connecting tube 24 protects the sensor while cleaning the treatment liquid remaining in the sensor portion 25-1 of the sensor 25. The sensor should be cleaned periodically because long-term exposure to the chemicals will cause a shortened life.
본 고안의 습식각처리장치에서는 혼합약품의 전도성을 측정하여 처리액의 혼합비율을 측정하는 것으로, 혼합약품 비율의 이상유무에 따라 사용을 중단할 수 있고, 또한 약품비율 이상 시에는 필요한 약품만을 추가공급할 수 있으므로 처리액을 버리지 않고 재사용할 수 있다.In the wet etching apparatus of the present invention, by measuring the conductivity of the mixed drug by measuring the conductivity of the mixed drug, the use of the mixed drug may be stopped depending on whether there is an abnormality of the mixed drug ratio. Since it can be supplied, it can be reused without discarding the processing liquid.
그리고 약품의 교체 및 원하는 시간에 약품의 상태를 측정가능하다.It is possible to measure the state of the drug at the time of replacement and the desired drug.
본 고안은 습식각처리장치에 관한 것으로, 특히 습식각처리장비 내로 순환되는 처리액에 각각의 약품의 비율을 측정하기에 적당한 습식각처리장치에 관한 것이다.The present invention relates to a wet etching apparatus, and more particularly to a wet etching apparatus suitable for measuring the ratio of each drug to the treatment liquid circulated into the wet etching apparatus.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970002071U KR200145916Y1 (en) | 1997-02-12 | 1997-02-12 | Wet etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970002071U KR200145916Y1 (en) | 1997-02-12 | 1997-02-12 | Wet etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980057772U KR19980057772U (en) | 1998-10-15 |
| KR200145916Y1 true KR200145916Y1 (en) | 1999-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2019970002071U KR200145916Y1 (en) | 1997-02-12 | 1997-02-12 | Wet etching device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100479300B1 (en) * | 1998-02-05 | 2005-07-07 | 삼성전자주식회사 | Tc Condenser Chemicals |
| KR100441249B1 (en) * | 2001-07-27 | 2004-07-21 | 삼성전자주식회사 | Toc measure apparatus for a semiconductor device fabrication installation and toc measure method for using the apparatus |
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- 1997-02-12 KR KR2019970002071U patent/KR200145916Y1/en not_active IP Right Cessation
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