KR20010099392A - the Method for Shielding electromagnetic waves using Parylene - Google Patents
the Method for Shielding electromagnetic waves using Parylene Download PDFInfo
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- KR20010099392A KR20010099392A KR1020010059207A KR20010059207A KR20010099392A KR 20010099392 A KR20010099392 A KR 20010099392A KR 1020010059207 A KR1020010059207 A KR 1020010059207A KR 20010059207 A KR20010059207 A KR 20010059207A KR 20010099392 A KR20010099392 A KR 20010099392A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Abstract
본 발명은 전기기기나 전자기기등과 같은 차폐대상물 외부에 파릴렌박막과, 금속박막을 차례로 증착하여 전자파를 차폐하도록 한 파릴렌을 이용한 전자파차폐방법에 관한 것으로, 이 방법은 전기적으로 차폐하고자 하는 차폐대상물의 기능을 수행하는데 필요한 제조과정을 거쳐 제조하는 차폐대상물제조단계; 고체상태의 파릴렌을 1차적으로 가열하여 기화시키는 1차가열단계; 상기 기화상태의 파릴렌을 2차적으로 가열하여 열분해시키는 2차가열단계; 상기 2차가열된 파릴렌을 냉각시키면서 상기 차폐대상물 표면에 증착시키는 파릴렌증착단계; 상기 증착된 파릴렌박막 표면위에 차폐용 금속박막을 증착시키는 금속증착단계를 포함하는 것을 특징으로 한다.The present invention relates to a method for shielding electromagnetic waves using parylene to shield electromagnetic waves by sequentially depositing a parylene thin film and a metal thin film on the outside of a shielding object such as an electric device or an electronic device. A shielding object manufacturing step manufactured through a manufacturing process required to perform a function of the shielding object; Primary heating step of vaporizing the primary parylene in the solid state by heating; A secondary heating step of thermally decomposing the vaporized parylene by secondary heating; A parylene deposition step of depositing the secondary heated parylene on the surface of the shielding object while cooling the parylene; It characterized in that it comprises a metal deposition step of depositing a shielding metal thin film on the deposited parylene thin film surface.
Description
본 발명은 전자파차폐방법에 관한 것으로, 더 상세하게는 전기기기나 전자기기등과 같은 차폐대상물 외부에 파릴렌박막과, 금속박막을 차례로 증착하여 전자파를 차폐하도록 한 파릴렌을 이용한 전자파차폐방법에 관한 것이다.The present invention relates to a method for shielding electromagnetic waves, and more particularly, to a method for shielding electromagnetic waves by using parylene to shield electromagnetic waves by sequentially depositing a parylene thin film and a metal thin film on the outside of a shielding object such as an electric device or an electronic device. It is about.
최근, 전자산업의 비약적인 발전에 힘입어서 각종 전자기기가 가정과 사무실 뿐만 아니라, 건축현장의 관리사무실에서도 쉽게 발견할 수가 있을 정도로 인간의 삶에 깊숙이 침투해 있는 실정이다.Recently, thanks to the rapid development of the electronics industry, various electronic devices have penetrated deeply into human life so that they can be easily found not only in homes and offices, but also in management offices of construction sites.
그런데, 상술한 전자기기에서는 소정의 전자파가 발생되어 인간의 건강상태를 해치는 요소로 작용함으로써, 세계 각국은 이에 대한 대비책을 준비하고 있을 뿐만 아니라, 기술의 진보에 비례하여 전자파의 허용가능한 기준치가 서서히 강화되고 있다.However, in the above-mentioned electronic devices, predetermined electromagnetic waves are generated to act as a factor that harms human health, and thus, countries around the world are preparing for countermeasures, and the allowable reference value of electromagnetic waves gradually decreases in proportion to the progress of technology. It is strengthening.
더욱이, 이러한 전자파 장애는 전기 및 전자기기에서 발생되는 잡음의 상호간섭에 의해 전자기기 상호간에 간섭이나 장애를 일으켜, 정보를 변질시키거나 기기를 오작동시키는 등의 문제를 일으킬 가능성이 있기 때문에 병원등에서는 휴대폰과 같은 휴대용 전자기기의 사용을 금지하고 있다.In addition, since such electromagnetic interference may cause interference or interference between electronic devices by mutual interference of noises generated by electricity and electronic devices, it may cause problems such as altering information or malfunctioning devices. It prohibits the use of portable electronic devices such as mobile phones.
그런데, 상술한 전자파장애를 근본적으로 제거하기 위해서는 잡음을 완전히 제거할 경우에만 가능하지만, 현재까지의 기술수준으로는 완벽히 잡음을 제거하는 것은 불가능한 것으로 알려져 있다.By the way, in order to fundamentally remove the above-mentioned electromagnetic interference, it is possible only to completely remove the noise, but it is known that it is impossible to completely remove the noise at the state of the art.
그래서, 전자기기의 잡음 레벨(Noise Level)을 낮추기 위한 현재의 방법은 최적화된 회로설계를 통해서 전자파발생을 억제하는 방법과, 노이즈필터를 이용하여 잡음을 줄이는 방법과, 금속성케이스를 이용하여 전자파의 외부누출을 줄이는 방법이 제안되고, 사용되고 있다.Therefore, current methods for reducing the noise level of electronic devices include a method of suppressing electromagnetic wave generation through an optimized circuit design, a method of reducing noise using a noise filter, and a metal case of electromagnetic waves. A method of reducing external leakage has been proposed and used.
본 발명은 상술한 종래의 문제점을 개선하기 위한 것으로서, 기기의 동작수행에 의해 발생되는 전자파의 외부유출을 방지함과 동시에, 외부로부터 유입된 전자파로 인해 기기의 오동작을 방지하기 위한 파릴렌을 이용한 전자파차폐방법을 제공하는데 그 목적이 있다.The present invention is to improve the above-mentioned problems, using a parylene to prevent the malfunction of the device due to electromagnetic waves introduced from the outside while preventing the external leakage of electromagnetic waves generated by the operation of the device. Its purpose is to provide an electromagnetic shielding method.
도 1은 본 발명에 따른 전자파차폐방법을 설명하기 위해 차폐된 차폐대상물의 단면을 도시한 단면도.1 is a cross-sectional view showing a cross-section of the shielded shielding object to explain the electromagnetic shielding method according to the present invention.
도 2는 본 발명에 따른 전자파차폐방법을 나타낸 순서도.2 is a flow chart showing an electromagnetic shielding method according to the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
10 : 차폐대상물 12 : 파릴렌박막10: shielding object 12: parylene thin film
14 : 금속박막14: metal thin film
상기 목적을 달성하기 위한 본 발명의 특징은 차폐대상물의 외부표면에 투명한 파릴렌박막을 증착하여 전기적절연성을 확보하고, 상기 파릴렌박막 위에 금속박막을 증착함으로써 내부로부터의 전자파유출을 방지함과 동시에 외부로부터의 전자파유입을 방지하도록 한 파릴렌을 이용한 전자파차폐방법을 제공하는 것이다.A feature of the present invention for achieving the above object is to secure an electrical insulation by depositing a transparent parylene thin film on the outer surface of the shielding object, while preventing the leakage of electromagnetic waves from the inside by depositing a metal thin film on the parylene thin film It is to provide an electromagnetic wave shielding method using parylene to prevent the influx of electromagnetic waves from the outside.
이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명하도록 한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명에 따른 전자파차폐방법을 설명하기 위해 차폐된 차폐대상물의 단면을 도시한 단면도로서, 본 발명의 전자파차폐방법은 절연기능을 수행하기 위해 전기적 차폐(Electrical Shielding)의 대상인 차폐대상물(10) 표면상에 파릴렌(Parylene)박막(12)을 증착하고, 차폐기능을 수행하기 위해 상기 파릴렌박막(12) 표면상에 금속박막(14)을 증착하는 것이다.1 is a cross-sectional view showing a cross-section of a shielded shielding object to explain the electromagnetic shielding method according to the present invention, the electromagnetic shielding method of the present invention is a shielding object that is the target of electrical shielding (Electrical Shielding) to perform the insulating function ( 10) to deposit a parylene thin film 12 on the surface, and to deposit a metal thin film 14 on the surface of the parylene thin film 12 to perform a shielding function.
여기서, 상기 차폐대상물(10)은 전자기기 또는 전자기기에 부속된 전자부품 중 제조업체의 설계룰에 따라 선택적으로 실시될 수 있다.Here, the shielding object 10 may be selectively implemented according to the design rules of the manufacturer of the electronic device or electronic components attached to the electronic device.
예를 들어서, 소정량의 전자파를 발생하는 텔레비젼 전체를 차폐하고자 한다면, 상기 차폐대상물(10)은 텔레비전의 외부케이스가 되고, 텔레비전 내부에 부속된 전자부품 특히, 전자파를 가장 많이 발생하는 전자부품 예컨대, 고압발생부 만을 차폐하고자 한다면, 상기 차폐대상물(10)은 고압발생부가 된다.For example, if it is desired to shield the entire television generating a predetermined amount of electromagnetic waves, the shielding object 10 becomes an outer case of the television, and the electronic components attached to the inside of the television, in particular the electronic components that generate the most electromagnetic waves, for example In order to shield only the high pressure generating unit, the shielding object 10 becomes a high pressure generating unit.
이러한 전자파차폐방법을 좀더 상세히 살펴보도록 한다.Let's look at the electromagnetic shielding method in more detail.
도 2는 본 발명에 따른 전자파차폐방법을 나타낸 순서도로서, 기능을 수행하는데 필요한 과정을 거쳐 차폐대상물을 제조하는 차폐대상물제조단계(S110)를 진행한 다음, 파릴렌물질을 150℃의 온도와 1.0 Torr의 압력으로 1차가열하여 기화시키는 1차가열단계(S120)를 수행한다.2 is a flowchart showing a method for shielding electromagnetic waves according to the present invention, the process for producing a shielding object (S110) to produce a shielding object through a process necessary to perform a function, and then the parylene material at a temperature of 150 ℃ and 1.0 Carry out a primary heating step (S120) to vaporize the primary heating to a pressure of Torr.
이어서, 1차가열된 파릴렌물질을 680℃ 이하의 온도와 0.5 Torr 이상의 압력으로 2차가열하여 열분해시키는 2차가열단계(S130)를 진행한 다음, 2차가열된 파릴렌물질을 냉각시키면서 상기 차폐대상물 외부표면에 증착시키는 파릴렌증착단계(S140)를 수행한다.Subsequently, the secondary heating step (S130) of thermally decomposing the primary heated parylene material at a temperature of 680 ° C. or lower and a pressure of 0.5 Torr or more is thermally decomposed, and then cooling the secondary parylene material while cooling the secondary parylene material. A parylene deposition step (S140) for depositing on the outer surface of the shielding object is performed.
계속해서, 상기 파릴렌박막 표면 위에 금속박막을 증착시키는 금속증착단계(S150)를 진행한다. 이때, 상기 금속박막의 증착방법은 전자빔을 이용한 물리기상증착(Physical Vapor Deposition)법으로 수행되는데, 이를 설명하면 다음과 같다.Subsequently, a metal deposition step (S150) of depositing a metal thin film on the parylene thin film surface is performed. In this case, the deposition method of the metal thin film is performed by a physical vapor deposition method using an electron beam, which will be described below.
먼저, 상온에서 증착챔버의 상태를 10-7Torr 이상의 고진공(高眞空)상태로 조성하고, 텅스텐필라멘트에 1만볼트 정도의 고압을 인가하여 전자총을 쏘면 자기력에 의해 전자총에서 나온 전자들이 소오스물질 즉, 코팅재료인 금속물질들과 충돌하여 고온화되고, 이로인해 기화된 금속입자들이 피코팅체 즉, 파릴렌이 증착된 차폐대상물 외부에 증착된다. 이때, 상기 금속물질의 종류는 제조업체의 설계룰에 따라 변동가능하다.First, the deposition chamber is formed at a high vacuum of 10 -7 Torr or higher at room temperature, and a high-tension of 10,000 volts is applied to the tungsten filament to shoot the electron gun. In this case, the coating material collides with the metal materials and becomes hot, thereby vaporizing the metal particles. The vaporized metal particles are deposited on the outside of the shielded object on which the parylene is deposited. At this time, the type of the metal material can be changed according to the manufacturer's design rules.
따라서, 파릴렌박막을 통해서 전자기기나 전자부품의 외부 절연성이 강화되고, 금속박막을 통해서 내부에서 발생된 전자파가 외부로 유출되지 않고, 외부로부터 전자파가 유입되지 않게 되어 거의 완벽한 차폐가 구현된다.Accordingly, the external insulation of the electronic device or the electronic component is strengthened through the parylene thin film, and electromagnetic waves generated therein are not leaked to the outside through the metal thin film, and electromagnetic waves are not introduced from the outside, thereby achieving almost perfect shielding.
여기서, 상기 금속박막의 재질로는 구리, 알루미늄, 은과 같이 도전성이 양호한 금속으로 구현하는 것이 바람직하고, 본 발명의 전자파차폐방법은 PCB와 같은 전자부품 단위로 실시되면 더욱더 바람직한 차폐효과를 가져올 수가 있지만, 케이스 단위로 실시되어도 기존보다 획기적으로 향상된 차폐효과를 제공한다.Here, the material of the metal thin film is preferably implemented by a metal having good conductivity such as copper, aluminum, and silver, and the electromagnetic shielding method of the present invention may bring about a more preferable shielding effect when carried out in an electronic component unit such as a PCB. However, even if performed in case units provides a significantly improved shielding effect than conventional.
상술한 바와 같이 개시된 본 실시예의 바람직한 양태에 따르면 다음과 같은 장점이 있다.According to a preferred embodiment of the present embodiment disclosed as described above has the following advantages.
첫째, 증착된 금속막으로 인해서 기기의 동작중에 발생되는 전자파의 외부유출을 차단하고, 외부로부터 유입가능한 전자파의 내부유입을 완벽하게 차단할 수 있는 장점이 있다.First, due to the deposited metal film, it is possible to block external leakage of electromagnetic waves generated during operation of the device and to completely block internal inflow of electromagnetic waves that can be introduced from the outside.
둘째, 증착된 금속막을 통해서 기기의 동작중에 발생되는 열을 대기로 발산시킬 수 있기 때문에 소정의 방열기능을 제공해주는 장점이 있다.Second, since the heat generated during the operation of the device through the deposited metal film to the atmosphere there is an advantage that provides a predetermined heat dissipation function.
셋째, 증착된 파릴렌박막으로 인해서 전기적 절연효과를 제공해주기 때문에 외부로부터의 이물질이나 수분으로 인한 전기적 불안정상태를 미연에 예방해주는 장점이 있다.Third, due to the deposited parylene thin film provides an electrical insulation effect to prevent the electrical instability caused by foreign matter or moisture from the outside in advance.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10144670A (en) * | 1996-11-08 | 1998-05-29 | Texas Instr Inc <Ti> | Integrated circuit insulator and method |
| KR19980703037A (en) * | 1995-03-21 | 1998-09-05 | 에르링 블롬메, 클라스 노린 | Laminates for Sealing Capsules |
| EP0897257A2 (en) * | 1997-06-20 | 1999-02-17 | Nova Tran Limited | Electromagnetic shielding |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980703037A (en) * | 1995-03-21 | 1998-09-05 | 에르링 블롬메, 클라스 노린 | Laminates for Sealing Capsules |
| JPH10144670A (en) * | 1996-11-08 | 1998-05-29 | Texas Instr Inc <Ti> | Integrated circuit insulator and method |
| EP0897257A2 (en) * | 1997-06-20 | 1999-02-17 | Nova Tran Limited | Electromagnetic shielding |
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