KR20010086023A - 플라스틱 표면을 금속 처리하는 방법 - Google Patents

플라스틱 표면을 금속 처리하는 방법 Download PDF

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Publication number
KR20010086023A
KR20010086023A KR1020017006001A KR20017006001A KR20010086023A KR 20010086023 A KR20010086023 A KR 20010086023A KR 1020017006001 A KR1020017006001 A KR 1020017006001A KR 20017006001 A KR20017006001 A KR 20017006001A KR 20010086023 A KR20010086023 A KR 20010086023A
Authority
KR
South Korea
Prior art keywords
solution
etching
plastic surface
treatment
metal
Prior art date
Application number
KR1020017006001A
Other languages
English (en)
Korean (ko)
Inventor
나루스케비시우스레오나스
로조브스키스그리고리유스
빈케비시우스죠나스
바라나우스카스미콜라스
모비우스안드레아스
피에스페터
Original Assignee
리차드 피. 뮐러
엔쏜-오엠아이 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from LT98-161A external-priority patent/LT4713B/lt
Priority claimed from DE1999104665 external-priority patent/DE19904665A1/de
Application filed by 리차드 피. 뮐러, 엔쏜-오엠아이 인코포레이티드 filed Critical 리차드 피. 뮐러
Priority claimed from PCT/US1999/026066 external-priority patent/WO2000029646A1/en
Publication of KR20010086023A publication Critical patent/KR20010086023A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
KR1020017006001A 1998-11-13 1999-11-05 플라스틱 표면을 금속 처리하는 방법 KR20010086023A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
LT98-161 1998-11-13
LT98-161A LT4713B (lt) 1998-11-13 1998-11-13 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
DE19904665.4 1999-02-04
DE1999104665 DE19904665A1 (de) 1999-02-04 1999-02-04 Verfahren zur Metallisierung einer Kunststoffoberfläche
EP99115967A EP1001052B1 (de) 1998-11-13 1999-08-13 Verfahren zur Metallisierung einer Kunststoffoberfläche
EP99115967.4 1999-08-13
PCT/US1999/026066 WO2000029646A1 (en) 1998-11-13 1999-11-05 Process for metallizing a plastic surface

Publications (1)

Publication Number Publication Date
KR20010086023A true KR20010086023A (ko) 2001-09-07

Family

ID=26051688

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017006001A KR20010086023A (ko) 1998-11-13 1999-11-05 플라스틱 표면을 금속 처리하는 방법

Country Status (5)

Country Link
EP (1) EP1001052B1 (de)
KR (1) KR20010086023A (de)
AT (1) ATE266107T1 (de)
DE (1) DE59909392D1 (de)
ES (1) ES2224507T3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170077274A (ko) * 2013-10-22 2017-07-05 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
PL2025708T3 (pl) * 2007-08-10 2010-03-31 Enthone Roztwór trawiący do powierzchni tworzyw sztucznych nie zawierający chromu
CN101255585B (zh) * 2007-12-05 2010-06-09 天津大学 碳纤维增强环氧树脂复合材料的新型表面金属化方法
EP2639332A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639334A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2767614A1 (de) 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Verfahren zum Abscheiden einer ersten Metallschicht auf nicht leitfähigen Polymeren
EP3126547B1 (de) 2014-04-01 2020-03-04 ATOTECH Deutschland GmbH Zusammensetzung und verfahren zur metallisierung von nichtleitenden kunststoffoberflächen
EP3034650B1 (de) 2014-12-16 2017-06-21 ATOTECH Deutschland GmbH Plattierungsbadzusammensetzungen zur stromlosen Abscheidung von Metallen und Metalllegierungen
DE102015204912A1 (de) * 2015-03-18 2016-09-22 Coventya Gmbh Verfahren zur selektiven Metallisierung von Butadien-haltigen Kunststoffbereichen in einem Bauteil und Kit zur Durchführung des Verfahrens
EP3181726A1 (de) 2015-12-18 2017-06-21 ATOTECH Deutschland GmbH Ätzlösung zur behandlung nichtleitenden kunststoffoberflächen und verfahren zum ätzen nichtleitender kunststoffoberflächen
WO2017191260A1 (en) 2016-05-04 2017-11-09 Atotech Deutschland Gmbh Process for depositing a metal or metal alloy on a surface of a substrate including its activation
EP3578683B1 (de) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Stromloses kupfer- oder kupferlegierungsplattierungsbad und verfahren zur plattierung
CA3202609A1 (en) 2020-12-18 2022-06-23 Rafael-Eduard SZAMOCKI Method for etching at least one surface of a plastic substrate
DE202023103135U1 (de) 2023-06-07 2023-06-14 Dr. Hesse GmbH & Cie. KG Oberfläche aus nichtleitendem Kunststoff
DE202023107029U1 (de) 2023-11-28 2024-01-10 Dr. Hesse GmbH & Cie. KG Gegenstand mit einer gebeizten Oberfläche aus einem nichtleitenden Kunststoff

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708214A1 (de) * 1987-03-12 1988-09-22 Schering Ag Verfahren zur haftfesten metallisierung von kunststoffen
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170077274A (ko) * 2013-10-22 2017-07-05 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물

Also Published As

Publication number Publication date
EP1001052A2 (de) 2000-05-17
EP1001052A3 (de) 2002-11-13
ATE266107T1 (de) 2004-05-15
DE59909392D1 (de) 2004-06-09
ES2224507T3 (es) 2005-03-01
EP1001052B1 (de) 2004-05-06

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