KR19980068131A - Home position return method of OLB machine - Google Patents
Home position return method of OLB machine Download PDFInfo
- Publication number
- KR19980068131A KR19980068131A KR1019970004583A KR19970004583A KR19980068131A KR 19980068131 A KR19980068131 A KR 19980068131A KR 1019970004583 A KR1019970004583 A KR 1019970004583A KR 19970004583 A KR19970004583 A KR 19970004583A KR 19980068131 A KR19980068131 A KR 19980068131A
- Authority
- KR
- South Korea
- Prior art keywords
- origin
- machine
- olb
- primary
- motor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Fluid Mechanics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
본 발명은 LCD 패널 상에 IC를 압착 본딩하는 OLB(OUTER LEAD BONDING) 머신의 가압착기에 의한 작업시 원점으로 복귀하는 방법에 관한 것으로서, 원점복귀신호에 의해 모터를 구동시키는 서보 드라이버 구동 단계; 상기 서보 드라이버 구동 단계에서 서보 드라이브가 구동되어 모터가 동작하게 되면 포토 센서를 통해 1차 원점검출을 하는 단계; 상기 1차 원점 검출 단계에서 1차 원점을 검출하면 고속으로 제 1 원점복귀를 실시하는 단계; 및 상기 제 1 원점복귀 실시 단계가 끝나면 구동부를 고정카메라 위치로 이동하여 마크를 인식한 후 위치오차를 보정하는 단계를 구비한 것을 특징으로 하여 종래의 기술에 비해 고속의 원점복귀와 최종적인 원점복귀 정도를 향상시킬 수 있으므로 본딩 정도의 고정도화 및 라인텍트타임(LINE TACT TIME)을 단축시킬 수 있어 생산성을 향상시킬 수 있다.The present invention relates to a method of returning to the home position when a work is performed by a pressure bonding machine of an OLB (OUTER LEAD BONDING) machine for compression bonding an IC on an LCD panel, the method comprising: a servo driver driving step of driving a motor by an origin return signal; Performing primary home detection through a photosensor when the servo drive is driven and the motor operates in the servo driver driving step; Performing a first homing at a high speed when the primary origin is detected in the primary origin detecting step; And a step of correcting a position error after recognizing a mark by moving the driving unit to a fixed camera position after the first homing step is completed, compared to the prior art. Since the accuracy can be improved, the accuracy of the bonding degree can be improved and the line tact time can be shortened, thereby improving productivity.
Description
본 발명은 LCD 패널 상에 IC를 압착 본딩하는 OLB(OUTER LEAD BONDING) 머신에 관한 것으로서, 특히 OLB 머신의 가압착기에 의한 작업시 원점으로 복귀하는 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer lead bonding (OLB) machine for compression bonding an IC on an LCD panel, and more particularly, to a method for returning to the origin during operation by press bonding of an OLB machine.
도 1은 OLB 머신의 ACF 부착기, 가압착기, 본 압착기중 IC를 LCD 패널에 가압착하는 가압착기의 일반적인 구성을 나타낸 도면으로서, X,Y,θ방향의 이동이 가능하고, IC 타발 금형 유니트(20)에서 타발된 IC를 인식 압착위치까지 이송하며, 비젼 인식 후 위치오차 보정을 수행하는 갠트리 로보트(GANTRY ROBOT:10)와, 역시 X,Y,θ방향의 이동이 가능하고, LCD패널(40)의 이송을 수행하면서 고정카메라(50)의 인식 후에 LCD패널(40)의 위치오차 보정을 수행하는 스테이지 로보트(STAGE ROBOT:30)와, X방향으로 이동하면서 IC상의 장착마크(60)와 LCD의 탑재 마크(70)를 인식하기 위한 이동카메라의 이송을 수행하는 비젼 로보트(VISION ROBOT:80))와, 인식보정된 IC를 LCD패널(40)에 가압착하는 헤드 유니트(90)로 이루어짐을 보인다.1 is a view showing a general configuration of an ACF attacher, a presser of an OLB machine, and a presser for press-fitting an IC of the presser to an LCD panel, wherein the X, Y, and θ directions can be moved, and the IC punching mold unit ( 20) Gantry Robot (GANTRY ROBOT: 10) which transfers the punched IC to the recognition crimping position and performs position error correction after vision recognition, and also moves in the X, Y, and θ directions, and the LCD panel 40 Stage Robot (STAGE ROBOT) 30 performing position error correction of the LCD panel 40 after the recognition of the fixed camera 50 while transferring the), and the mounting mark 60 on the IC and the LCD while moving in the X direction. Vision robot (VISION ROBOT: 80) for performing the transfer of the mobile camera for recognizing the mounting mark of the (70), and the head unit 90 for pressing-adjust the recognition-corrected IC to the LCD panel 40 see.
상기와 같은 구성으로 상위 제어기에서 상기 가압착기에 원점복귀 지령을 하여 상기 갠트리 로보트(10) 및 상기 스테이지 로보트(30)의 서보 드라이버를 구동시키면, 서보 드라이버의 구동에 의해 각 모터는 회전 또는 직선으로 각 로보트의 이동을 시작하게 된다. 그리하면 포토 센서부에서는 1차 원점을 검출하고, 상기 제어기에서는 상기 포토 센서부에서 검출된 1차 원점에 대한 정보에 의해 속도 변환에 대한 제어신호를 상기 서보 드라이버에 제공하여 모터를 고속에서 저속으로 회전시키게 되며, 모터의 원점을 검출하여 가압착기를 원점에 복귀시키게 된다.When the servo driver of the gantry robot 10 and the stage robot 30 is driven by the home position return command from the host controller by the host controller in the above configuration, each motor is rotated or linearly driven by the servo driver. Each robot starts to move. Then, the photo sensor unit detects a primary origin, and the controller provides a control signal for speed conversion to the servo driver based on the information about the primary origin detected by the photo sensor unit to provide the motor with a high speed to a low speed. It rotates and detects the origin of the motor and returns the presser to the origin.
그러나 상기와 같은 원점복귀방법에 있어서 모터의 원점검출속도를 빠르게 할 경우에는 이동부의 관성에 의해 원점검출정도가 저하되거나 위치변동이 발생할 수가 있으며, 만일 원점검출속도를 느리게 할 경우에는 원점복귀시간이 길어지며 이동부의 마찰이 상대적으로 클 경우 동일한 모터 원점을 중복검출함으로써 원점복귀에 문제가 발생하게 된다. 또한 모터원점의 기구적 제작 정도만큼 원점복귀시 반복정도의 변화가 생길 수 있으며, 소프트웨어적인 문제로 여러축의 동시 동작이 어렵게 된다.However, in the home position return method as described above, if the home position detection speed of the motor is increased, the home position detection degree may decrease or position change may occur due to the inertia of the moving part.If the home position detection speed is slowed, the home position return time may be reduced. If the friction of the moving part becomes longer and the moving part is relatively large, the same point of origin of the motor is detected by overlapping. In addition, it is possible to change the repeatability when returning to the origin as much as the mechanical production of the motor origin, and it is difficult to simultaneously operate multiple axes due to software problems.
본 발명의 목적은 상기와 같은 문제점을 해결하기 위하여 IC 및 LCD 셀을 이송하는 구동부에 있어서, 포토 센서와 장비에 부착되어 있는 IC 인식용 고정카메라를 사용하여 종래에 비해 상대적으로 고속, 고정도로 원점에 복귀할 수 있는 방법을 제공하는 데 있다.An object of the present invention is to drive the IC and LCD cells to solve the above problems, using a fixed sensor for IC recognition attached to the photo sensor and equipment, relative to the conventional high speed, high accuracy To provide a way to return to.
상기의 목적을 달성하기 위한 본 발명의 원점복귀방법은 LCD 패널 상에 IC를 압착하기 위한 OLB 본딩 머신의 원점복귀방법에 있어서, 원점복귀신호에 의해 모터를 구동시키는 서보 드라이버 구동 단계; 상기 서보 드라이버 구동 단계에서 서보 드라이브가 구동되어 모터가 동작하게 되면 포토 센서를 통해 1차 원점검출을 하는 단계; 상기 1차 원점 검출 단계에서 1차 원점을 검출하면 고속으로 제 1 원점복귀를 실시하는 단계; 및 상기 제 1 원점복귀실시 단계가 끝나면 구동부를 고정카메라 위치로 이동하여 마크를 인식한 후 위치오차를 보정하는 단계를 구비한 것을 특징으로 한다.In the home return method of the present invention for achieving the above object, the home return method of the OLB bonding machine for crimping the IC on the LCD panel, the servo driver driving step of driving the motor by the home return signal; Performing primary home detection through a photosensor when the servo drive is driven and the motor operates in the servo driver driving step; Performing a first homing at a high speed when the primary origin is detected in the primary origin detecting step; And a step of correcting a position error after recognizing a mark by moving the driving unit to the fixed camera position after the first home return step is completed.
도 1 은 일반적인 OLB 머신의 구성을 나타낸 도면.1 is a view showing the configuration of a general OLB machine.
도 2 는 본 발명에 따른 OLB 머신의 원점복귀방법을 설명하기 위한 순서도.Figure 2 is a flow chart for explaining the home position return method of the OLB machine according to the present invention.
이하 첨부한 도면을 참조하여 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 OLB 머신의 원점복귀방법을 설명하기 위한 순서도로서, 도 1에 보인 가압착기의 일반적인 구성을 나타낸 도면을 참조하면, 상위 제어기에서 원점복귀신호를 검출(S1)하면, 가압착기에 원점복귀 지령을 하여 상기 갠트리 로보트(10) 및 상기 스테이지 로보트(30)의 서보 드라이버를 구동으로 모터를 작동(S2)시켜 회전 또는 직선으로 이동을 시작하도록 한다. 그리고 포토 센서부에서 1차 원점을 검출(S3)하여 고속으로 1차적인 원점복귀를 실시(S4)한다. 그 다음 구동부를 고정카메라(50) 위치로 이동한 후에 마크를 인식(S5)하도록 한 후, 위치오차 보정(S6)을 하도록 한다.Figure 2 is a flow chart for explaining the home position return method of the OLB machine according to the present invention, referring to the general configuration of the presser shown in Figure 1, when the home position detection signal (S1) in the host controller, A home position return command is made to the presser to drive the servo driver of the gantry robot 10 and the stage robot 30 to operate the motor (S2) to start the rotation or the movement in a straight line. Then, the photo sensor unit detects the primary origin (S3) and performs primary origin return at high speed (S4). After moving the driving unit to the position of the fixed camera 50, the mark is recognized (S5), and then the position error correction (S6).
이와 같이 포토 센서부를 통해 1차 원점복귀를 실시(S4)하고, 고정카메라로 마크를 인식한 후에 위치오차 보정(S6)을 하도록 하여 원점으로 복귀하는 방법은 종래의 모터원점을 검출하는 방법에 비해 절차상의 간단함과 정확한 위치오차를 보정 할 수 있으므로 빠른 시간내에 원점복귀가 가능하며, 또한 최종적인 원점복귀 정도를 향상시킬 수 있게 된다.As described above, the method of returning to the home position by performing the first home return (S4) through the photo sensor unit and recognizing the mark with the fixed camera and then correcting the position error (S6) is compared with the conventional method of detecting the motor home point. Because of the simple procedure and corrected position error, it is possible to return to the home position within a short time and improve the final return to home position.
본 발명은 상기와 같이 종래의 기술에 비해 고속의 원점복귀와 최종적인 원점복귀 정도를 향상시킬 수 있으므로 본딩 정도의 고정도화 및 라인텍트타임(LINE TACT TIME)을 단축시킬 수 있어 생산성을 향상시킬 수 있다.Since the present invention can improve the high speed zero point return and the final zero point return as compared to the conventional technology as described above, it is possible to improve the productivity by improving the accuracy of the bonding degree and shortening the line tact time. have.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970004583A KR100200219B1 (en) | 1997-02-15 | 1997-02-15 | Method for returning to the starting point in outer lead boding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970004583A KR100200219B1 (en) | 1997-02-15 | 1997-02-15 | Method for returning to the starting point in outer lead boding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980068131A true KR19980068131A (en) | 1998-10-15 |
| KR100200219B1 KR100200219B1 (en) | 1999-06-15 |
Family
ID=19497123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970004583A KR100200219B1 (en) | 1997-02-15 | 1997-02-15 | Method for returning to the starting point in outer lead boding machine |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100200219B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040039868A (en) * | 2002-11-05 | 2004-05-12 | 주식회사 만도 | Flange bolt |
| KR100698035B1 (en) * | 2002-03-23 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | Bonding device for liquid crystal display and method for setting of origin point |
| KR100698036B1 (en) * | 2002-03-23 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | Bonding device for liquid crystal display and method for correcting of movements |
-
1997
- 1997-02-15 KR KR1019970004583A patent/KR100200219B1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100698035B1 (en) * | 2002-03-23 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | Bonding device for liquid crystal display and method for setting of origin point |
| KR100698036B1 (en) * | 2002-03-23 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | Bonding device for liquid crystal display and method for correcting of movements |
| KR20040039868A (en) * | 2002-11-05 | 2004-05-12 | 주식회사 만도 | Flange bolt |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100200219B1 (en) | 1999-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4761596A (en) | Method of detecting and controlling work start point of robot | |
| WO2021103254A1 (en) | Displacement control method, system, servo motor, and storage medium | |
| JP3191563B2 (en) | Automatic correction method for offline teaching data | |
| JP3412465B2 (en) | Mobile robot device | |
| JPH11156764A (en) | Locomotive robot device | |
| KR100200219B1 (en) | Method for returning to the starting point in outer lead boding machine | |
| JP3533066B2 (en) | Work device position correction apparatus and method | |
| JP2786874B2 (en) | Movable position control device | |
| JP2001300875A (en) | Robot system | |
| TWM600667U (en) | Laser marking system | |
| JP5141075B2 (en) | Image processing device | |
| JP2650464B2 (en) | Industrial robot | |
| JP2965362B2 (en) | Electronic component recognition method | |
| CN111098310A (en) | Control method and control system of flexible cooperative robot | |
| WO2022155882A1 (en) | Assembling apparatus, assembling method and computer readable storage medium | |
| JP3156337B2 (en) | Screen printing machine and screen printing method | |
| TWI730664B (en) | Laser marking system and controlling method thereof | |
| JP4843590B2 (en) | Component mounting apparatus, control method, and program | |
| JPS60229109A (en) | Position correcting system using visual camera | |
| JP3961280B2 (en) | POSITIONING CONTROL DEVICE, POSITIONING CONTROL METHOD, AND COMPONENT MOUNTING DEVICE | |
| JP3040232B2 (en) | Mounting position control method for component mounter | |
| JP2003101297A (en) | Method for correcting offset in electronic component mounter | |
| JPH01201993A (en) | Positioning system for heating chip | |
| JPS6288589A (en) | Robot | |
| JP3128163B2 (en) | Wire bonding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20080227 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |