KR102545393B1 - 제1 보호막 형성용 시트 - Google Patents

제1 보호막 형성용 시트 Download PDF

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Publication number
KR102545393B1
KR102545393B1 KR1020187013196A KR20187013196A KR102545393B1 KR 102545393 B1 KR102545393 B1 KR 102545393B1 KR 1020187013196 A KR1020187013196 A KR 1020187013196A KR 20187013196 A KR20187013196 A KR 20187013196A KR 102545393 B1 KR102545393 B1 KR 102545393B1
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KR
South Korea
Prior art keywords
meth
acrylate
resin layer
forming
group
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KR1020187013196A
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English (en)
Korean (ko)
Other versions
KR20180079340A (ko
Inventor
마사노리 야마기시
아키노리 사토
Original Assignee
린텍 가부시키가이샤
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Publication of KR20180079340A publication Critical patent/KR20180079340A/ko
Application granted granted Critical
Publication of KR102545393B1 publication Critical patent/KR102545393B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
KR1020187013196A 2015-11-04 2016-11-02 제1 보호막 형성용 시트 KR102545393B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015217110 2015-11-04
JPJP-P-2015-217110 2015-11-04
PCT/JP2016/082543 WO2017078052A1 (ja) 2015-11-04 2016-11-02 第１保護膜形成用シート

Publications (2)

Publication Number Publication Date
KR20180079340A KR20180079340A (ko) 2018-07-10
KR102545393B1 true KR102545393B1 (ko) 2023-06-19

Family

ID=58661960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187013196A KR102545393B1 (ko) 2015-11-04 2016-11-02 제1 보호막 형성용 시트

Country Status (7)

Country Link
JP (1) JP6230761B2 (ja)
KR (1) KR102545393B1 (ja)
CN (1) CN108140585B (ja)
PH (1) PH12018500851A1 (ja)
SG (1) SG11201803250TA (ja)
TW (1) TWI704996B (ja)
WO (1) WO2017078052A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019013589A1 (ko) * 2017-07-13 2019-01-17 두성산업 주식회사 반도체 고정용 자성 테이프
TWI786209B (zh) * 2017-10-27 2022-12-11 日商琳得科股份有限公司 保護膜形成用複合片及半導體晶片的製造方法
KR102594248B1 (ko) * 2017-11-17 2023-10-25 린텍 가부시키가이샤 제1 보호막이 형성된 반도체 칩, 제1 보호막이 형성된 반도체 칩의 제조 방법, 및 반도체 칩 제1 보호막 적층체의 평가 방법
CN112789334B (zh) * 2018-10-02 2023-04-07 琳得科株式会社 层叠体及固化密封体的制造方法
JP7266953B2 (ja) * 2019-08-07 2023-05-01 株式会社ディスコ 保護部材形成方法及び保護部材形成装置
JP7323734B1 (ja) * 2022-01-12 2023-08-08 リンテック株式会社 第１保護膜形成用シート、半導体装置の製造方法、及びシートの使用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169482A (ja) 2011-02-15 2012-09-06 Nitto Denko Corp 保護層形成用フィルム
JP2012169484A (ja) * 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
JP2014129537A (ja) * 2014-01-29 2014-07-10 Lintec Corp チップ用保護膜形成用シートおよび保護膜付半導体チップの製造方法
WO2014157426A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 保護膜形成用複合シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4170839B2 (ja) 2003-07-11 2008-10-22 日東電工株式会社 積層シート
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP2012074623A (ja) * 2010-09-29 2012-04-12 Sekisui Chem Co Ltd 半導体加工用接着フィルム及び半導体チップ実装体の製造方法
KR101919547B1 (ko) * 2011-12-26 2018-11-16 린텍 코포레이션 보호막 형성층을 갖는 다이싱 시트 및 칩의 제조 방법
JP5242830B1 (ja) * 2012-07-06 2013-07-24 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法
CN104837942B (zh) * 2012-12-14 2017-04-26 琳得科株式会社 保护膜形成用膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169482A (ja) 2011-02-15 2012-09-06 Nitto Denko Corp 保護層形成用フィルム
JP2012169484A (ja) * 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
WO2014157426A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 保護膜形成用複合シート
JP2014129537A (ja) * 2014-01-29 2014-07-10 Lintec Corp チップ用保護膜形成用シートおよび保護膜付半導体チップの製造方法

Also Published As

Publication number Publication date
KR20180079340A (ko) 2018-07-10
WO2017078052A1 (ja) 2017-05-11
JPWO2017078052A1 (ja) 2017-12-07
JP6230761B2 (ja) 2017-11-15
CN108140585A (zh) 2018-06-08
PH12018500851B1 (en) 2018-11-05
TW201738089A (zh) 2017-11-01
PH12018500851A1 (en) 2018-11-05
SG11201803250TA (en) 2018-05-30
TWI704996B (zh) 2020-09-21
CN108140585B (zh) 2021-06-08

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