KR102296468B1 - Aluminum -Magnesium Ondol board and Dry heating system comprising the same - Google Patents

Aluminum -Magnesium Ondol board and Dry heating system comprising the same Download PDF

Info

Publication number
KR102296468B1
KR102296468B1 KR1020200133163A KR20200133163A KR102296468B1 KR 102296468 B1 KR102296468 B1 KR 102296468B1 KR 1020200133163 A KR1020200133163 A KR 1020200133163A KR 20200133163 A KR20200133163 A KR 20200133163A KR 102296468 B1 KR102296468 B1 KR 102296468B1
Authority
KR
South Korea
Prior art keywords
magnesium
board
aluminum
ondol
layer
Prior art date
Application number
KR1020200133163A
Other languages
Korean (ko)
Inventor
권덕창
Original Assignee
권덕창
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 권덕창 filed Critical 권덕창
Priority to KR1020200133163A priority Critical patent/KR102296468B1/en
Application granted granted Critical
Publication of KR102296468B1 publication Critical patent/KR102296468B1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02161—Floor elements with grooved main surface
    • E04F15/02166—Floor elements with grooved main surface wherein the grooves are filled with inserts
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/006—Parts of a building integrally forming part of heating systems, e.g. a wall as a heat storing mass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/20—Heat consumers
    • F24D2220/2081—Floor or wall heating panels

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Civil Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Thermal Sciences (AREA)
  • Floor Finish (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

The present invention relates to an ondol board having an aluminum plate and dry heating comprising the same. According to the present invention, heat from a heating pipe is quickly transferred under a magnesium board with increased strength, and at the same time, moisture or leaking moisture generated from the heating pipe is blocked from being transferred to the magnesium board. The aluminum-magnesium ondol board of the present invention comprises an aluminum plate (10) and the magnesium board (20).

Description

알루미늄-마그네슘 온돌보드 및 이를 포함하는 건식 난방{Aluminum -Magnesium Ondol board and Dry heating system comprising the same} Aluminum-Magnesium Ondol board and Dry heating system comprising the same

본 발명은 알루미늄-마그네슘 온돌보드 및 이를 포함하는 건식난방에 관한 것으로, 보다 상세하게는, 강도를 높인 마그네슘보드 아래에 난방배관의 열을 신속히 전달함과 동시에 난방배관에서 발생되는 습기나 누수된 수분을 마그네슘보드로 전달되는 것을 차단하는 알루미늄판을 구비한 온돌보드 및 이를 포함하는 건식난방에 관한 것이다.The present invention relates to an aluminum-magnesium ondol board and dry heating comprising the same, and more particularly, to quickly transfer heat from a heating pipe under a magnesium board with increased strength, and at the same time, moisture or leaking moisture generated in the heating pipe It relates to an ondol board having an aluminum plate that blocks the transfer to a magnesium board, and dry heating including the same.

일반적으로 바닥난방을 시공하는 방법으로 습식난방(온돌)과 건식난방(온돌) 구분된다. In general, the method of installing floor heating is divided into wet heating (ondol) and dry heating (ondol).

습식난방(온돌)은 바닥에 단열판을 깔고 그 위에 온수파이프를 설치한 후 시멘트몰탈 혹은 황토로 미장(美粧)을 하는 방법이며, 콘크리트 모르타르의 양생 시간이 길어 시공이 늦고, 다른 건축부재에 누수로 인한 피해와 하자보수에 어려움이 많다. Wet heating (ondol) is a method in which an insulation board is laid on the floor, a hot water pipe is installed on it, and then plastered with cement mortar or loess. There are many difficulties in repairing damages and defects.

도 1과 같이, 건식난방(온돌)은 바닥상측으로 스치로폼 단열재(1)를 설치한 후 상기 단열재의 상측에 금속재질의 방열판(2)을 깔아준 후 방열판에 형성된 배관홈(3)을 이용하여 온수파이프(4)가 설치되고, 상기 방열판의 상측으로 축열판(5)과 바닥 마감재(6)가 설치된다.As shown in Figure 1, dry heating (ondol) is performed by installing a Styrofoam insulating material (1) on the upper side of the floor, laying a metal heat sink (2) on the upper side of the insulating material, and then using a pipe groove (3) formed in the heat sink A hot water pipe (4) is installed, and a heat storage plate (5) and a floor finishing material (6) are installed above the heat sink.

기존 방열판(2)은 알루미늄 등의 금속판에 배관홈(3)을 형성시켜야 하므로 공정이 번거롭고 제조단가가 상승된다. 또한, 기존 방열판은 좌우측에 결합구조로 이루어지기 때문에 단열재(1)의 측면에서 끼워주며 단열재(1) 상에 배관홈(3)을 일치시키며 결합하는 방식을 채택할 수밖에 없어서, 작업이 상당히 불편하다.In the conventional heat sink 2, since the pipe groove 3 must be formed in a metal plate such as aluminum, the process is cumbersome and the manufacturing cost is increased. In addition, since the existing heat sink has a coupling structure on the left and right sides, it has no choice but to adopt a method of fitting it from the side of the insulator 1 and matching the pipe groove 3 on the insulator 1, so the operation is quite inconvenient. .

또한, 기존 축열판(5)은 황토나 마그네슘보드를 이용하여 판재 형태로 제작한 후 방열판(2) 상부에 깔아주는데, 외부 충격이 지속적으로 가해지는 경우, 배관홈(3)의 상부에 위치하는 마그네슘보드(b)와 방열판 판상 위에 위치하는 마그네슘보드(a)에는 충격이 불균일하게 전달되며, 배관홈(3) 상부에 위치하는 마그네슘보드(b)에 외부 충격이 집중되는 경향이 있어 축열판(마그네슘보드)이 파손되기가 쉽다는 문제점이 있다. In addition, the existing heat storage plate 5 is manufactured in the form of a plate using loess or magnesium board and then laid on the top of the heat sink 2. The impact is unevenly transmitted to the magnesium board (b) and the magnesium board (a) positioned on the heat sink plate, and external impact tends to be concentrated on the magnesium board (b) positioned above the pipe groove (3). Magnesium board) has a problem that it is easy to break.

또한, 기존 측열판 하부에 온수파이프가 위치하므로 온수 파이프로 인한 습기나 누수로 인해 마그네슘보드의 내구성이 취약해지는 문제점이 있다. In addition, since the hot water pipe is located under the existing heat sink, there is a problem in that the durability of the magnesium board is weakened due to moisture or leakage due to the hot water pipe.

본 발명은 공정을 단순화시키고 비용을 절감할 수 있는 건식온돌 난방 시스템을 제공하는 것이다.An object of the present invention is to provide a dry underfloor heating system capable of simplifying a process and reducing costs.

본 발명은 외부 충격에 의해 마그네슘보드가 파손되거나 습기 등으로 내구성이 취약해지는 것을 방지할 수 있는 보드를 제공하는 것이다.An object of the present invention is to provide a board capable of preventing the magnesium board from being damaged by an external impact or from weakening the durability due to moisture or the like.

본 발명은 열전도나 전자파 차폐 효율을 높인 건식난방(온돌)용 보드를 제공하는 것이다.An object of the present invention is to provide a board for dry heating (ondol) with improved heat conduction or electromagnetic wave shielding efficiency.

본 발명은 the present invention

난방배관(1) 상부에 위치하는 알루미늄판(10) ;Heating pipe (1) located above the aluminum plate (10);

상기 알루미늄판(20) 상부에 접합된 마그네슘보드(20)를 포함하는 알루미늄-마그네슘 온돌보드에 관련된다. It relates to an aluminum-magnesium ondol board including a magnesium board 20 bonded to an upper portion of the aluminum plate 20 .

다른 양상에서, 본 발명은 In another aspect, the present invention provides

난방 배관(1)을 상부에 인입할 수 있는 배관홈(31)이 형성된 단열재층(30) ;Insulation material layer 30 in which the piping groove 31 that can lead the heating pipe 1 to the upper part is formed;

상기 단열재층의 상부에 위치하는 상기 마그네슘-알루미늄 온돌보드(100) ; 및The magnesium-aluminum ondol board 100 positioned on the top of the insulation layer; and

상기 마그네슘-알루미늄 온돌보드(100) 상에 위치하는 마감재층(40)을 포함하는 건식난방 바닥에 관련된다.It relates to a dry heating floor including a finishing material layer 40 positioned on the magnesium-aluminum ondol board 100 .

본 발명의 알루미늄-마그네슘 온돌보드는 알루미늄판 상부에 마그네슘보드가 접착되어 있어 난방배관의 열을 알루미늄판을 통해 마그네슘보드로 신속히 전달할 수 있는 반면, 배관에서 발생되는 전자파를 알루미늄판으로 차단할 수 있다.The aluminum-magnesium ondol board of the present invention has a magnesium board attached to the top of the aluminum plate, so that heat from the heating pipe can be quickly transferred to the magnesium board through the aluminum plate, while electromagnetic waves generated from the pipe can be blocked with the aluminum plate.

또한, 본 발명의 알루미늄-마그네슘 온돌보드는 알루미늄판에 배관홈을 형성시킬 필요가 없으며, 일체화된 알루미늄-마그네슘보드를 단열재 상단에 적층(및 고정)하여 시공이 가능하므로 공정이 편리하고 보드 부품 제조단가도 줄일 수 있다.In addition, the aluminum-magnesium ondol board of the present invention does not need to form a pipe groove in the aluminum plate, and can be constructed by laminating (and fixing) the integrated aluminum-magnesium board on top of the insulating material, so the process is convenient and board parts are manufactured The cost can also be reduced.

또한, 본 발명의 알루미늄-마그네슘 온돌 보드는 마그네슘 하부에 알루미늄판이 일체로 접합되어 있어 외부 충격이 가해지더라도 알루미늄판으로 충격을 분산시킬 수 있으므로 배관홈(3)의 상부에 위치하는 마그네슘 보드(b)에 충격력이 집중되는 것을 방지할 수 있고, 또한, 마그네슘보드로 습기나 수분이 스며드는 것을 원천적으로 방지할 수 있으므로, 본 발명의 알루미늄-마그네슘 온돌 보드는 마그네슘보드의 단점인 내구성의 문제점을 알루미늄판의 접합으로 해결할 수 있다.In addition, in the aluminum-magnesium ondol board of the present invention, since the aluminum plate is integrally bonded to the lower part of magnesium, the impact can be dispersed with the aluminum plate even when an external impact is applied. Since it is possible to prevent the concentration of impact force on the magnesium board and fundamentally prevent the penetration of moisture or moisture into the magnesium board, the aluminum-magnesium ondol board of the present invention solves the problem of durability, which is a disadvantage of the magnesium board, of the aluminum plate. This can be solved by bonding.

본 발명의 알루미늄-마그네슘 온돌보드는 마그네슘 메인 보드 상하부에 유리섬유 직포 및 부직포를 적층하여 휨 강도를 높였다.The aluminum-magnesium ondol board of the present invention has increased flexural strength by laminating glass fiber woven and non-woven fabrics on the upper and lower parts of the magnesium main board.

도 1은 기존 건식 난방 시스템의 단면도이다.
도 2와 도3은 본 발명의 알루미늄-마그네슘보드의 단면도이다.
도 4는 본 발명의 건식 난방 시스템의 개념도이다.1 is a cross-sectional view of a conventional dry heating system.
2 and 3 are cross-sectional views of the aluminum-magnesium board of the present invention.
4 is a conceptual diagram of a dry heating system of the present invention.

이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 구현예 및 실시예를 상세히 설명한다. Hereinafter, embodiments and embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily carry out the present invention.

본원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terminology used herein is only used to describe specific embodiments, and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, element, or combination thereof described in the specification exists, but is one or more other features or It should be understood that the existence or addition of numbers, steps, acts, elements, or combinations thereof, is not precluded in advance.

도 2와 도3은 본 발명의 알루미늄-마그네슘보드의 단면도이고, 도 4는 본 발명의 건식 난방 시스템의 개념도이다.2 and 3 are cross-sectional views of the aluminum-magnesium board of the present invention, and FIG. 4 is a conceptual diagram of the dry heating system of the present invention.

도 2와 도 3을 참고하면, 본 발명의 알루미늄-마그네슘보드(100)는 알루미늄판(10) 및 마그네슘보드(20)를 포함한다.2 and 3 , the aluminum-magnesium board 100 of the present invention includes an aluminum plate 10 and a magnesium board 20 .

상기 알루미늄판(10)은 난방배관의 상부에 위치하여 배관의 열을 상기 마그네슘보드에 전달한다.The aluminum plate 10 is located on the upper portion of the heating pipe to transfer the heat of the pipe to the magnesium board.

상기 알루미늄판은 배관홈이 형성되지 않은 평판의 알루미늄판을 사용한다. As the aluminum plate, a flat aluminum plate in which a pipe groove is not formed is used.

상기 알루미늄판은 다수의 미세 요철 돌기가 형성된 엠보싱 알루미늄판일 수 있다.The aluminum plate may be an embossed aluminum plate in which a plurality of fine concavo-convex projections are formed.

상기 알루미늄판은 두께가 0.2~5mm일 수 있으며, 바람직하게는 0.2~2mm, 더욱 바람직하게는 0.2~1mm일 수 있다. The aluminum plate may have a thickness of 0.2 to 5 mm, preferably 0.2 to 2 mm, and more preferably 0.2 to 1 mm.

상기 알루미늄판은 경량재이며, 비강도 및 비강성이 높고, 도전성 재료로 안정된 전자파 차폐능을 가진다. 또한, 상기 알루미늄판은 표면이 치밀하고 공기 중에서 단단한 산화물 보호 피막을 형성하기 때문에 상부에 접착되는 마그네슘보드의 부식이나 수분 침투를 방지할 수 있다.The aluminum plate is a lightweight material, has high specific strength and specific rigidity, and has a stable electromagnetic wave shielding ability as a conductive material. In addition, since the aluminum plate has a dense surface and forms a hard oxide protective film in the air, it is possible to prevent corrosion or moisture penetration of the magnesium board adhered thereon.

상기 마그네슘 보드(20)는 산화마그네슘, 염화마그네슘, 펄라이트 및 유리섬유를 포함하여 휨강도가 20Mpa 이상일 수 있다.The magnesium board 20 may include magnesium oxide, magnesium chloride, pearlite, and glass fiber and have a flexural strength of 20 Mpa or more.

도 3을 참고하면, 상기 마그네슘보드(20)는 마그네슘 메인 보드(21), 상기 마그네슘 메인 보드 상면과 하면에 부착된 유리섬유 부직포층(22), 상기 유리섬유 부직포층 상면과 하면에 각각 부착된 일반 부직포층(23) 및 상기 일반 부직포층 상면 및 하면에 각각 형성된 표면층(24) 및 하부층(25)을 포함할 수 있다.Referring to FIG. 3 , the magnesium board 20 is a magnesium main board 21, a glass fiber nonwoven fabric layer 22 attached to the upper and lower surfaces of the magnesium main board, and the upper and lower surfaces of the glass fiber nonwoven fabric layer. It may include a general nonwoven layer 23 and a surface layer 24 and a lower layer 25 respectively formed on the upper and lower surfaces of the general nonwoven layer.

상기 마그네슘 메인보드(21)는 산화마그네슘 55~60중량%, 염화마그네슘 10~25중량%, 펄라이트 10~25중량%를 포함할 수 있다.The magnesium main board 21 may include 55 to 60% by weight of magnesium oxide, 10 to 25% by weight of magnesium chloride, and 10 to 25% by weight of perlite.

상기 마그네슘 메인보드(21)는 산화마그네슘 함량을 높여 강도를 높였다. 즉, 상기 마그네슘 메인보드(21)는 산화마그네슘 함량이 55중량% 미만이면 바닥재가 요구하는 충격강도를 제공할 수 없다. The magnesium main board 21 has increased strength by increasing the content of magnesium oxide. That is, the magnesium main board 21 cannot provide the impact strength required by the flooring material when the magnesium oxide content is less than 55% by weight.

상기 유리섬유 부직포층(22)은 상기 메인보드 상 하부에서 마그네슘보드의 강도를 높일 수 있다. 상기 유리섬유 부직포층(22)은 상하부에서 각각 하나 이상, 바람직하게는 하나 또는 두 개씩 배치될 수 있다.The glass fiber nonwoven fabric layer 22 may increase the strength of the magnesium board on the upper and lower parts of the main board. One or more glass fiber nonwoven fabric layers 22 may be disposed at the upper and lower portions, preferably one or two.

상기 일반 부직포층은 공지된 부직포, 예를 들면, 폴리프로필렌 부직포 등일 수 있다. The general nonwoven fabric layer may be a known nonwoven fabric, for example, polypropylene nonwoven fabric.

상기 마그네슘보드(20)는 산화마그네슘 55~60중량%, 염화마그네슘 10~25중량%, 펄라이트 10~25중량%를 물을 섞어 혼합하여 메인보드 혼합층을 형성한 후. 혼합층의 상면과 하면에 유리섬유 부직포, 일반 부직포를 침합하여 소정 형상으로 성형가공 및 건조하여 제조될 수 있다.The magnesium board 20 is 55 to 60% by weight of magnesium oxide, 10 to 25% by weight of magnesium chloride, and 10 to 25% by weight of perlite after mixing with water to form a main board mixed layer. Glass fiber nonwoven fabric and general nonwoven fabric are impregnated on the upper and lower surfaces of the mixed layer, and may be manufactured by molding and drying into a predetermined shape.

상기 마그네슘 표면층(24) 및 하부층(25)은 산화마그네슘 20~30중량%, 염화마그네슘 5~15중량%, 탄산칼슘 40~50중량% 및 펄라이트 5~15 중량%에 물을 혼합한 혼합물을 상기 마그네슘보드의 일반 부직포망(24)에 각각 얇게 도포한 후 건조하여 형성할 수 있다. The magnesium surface layer 24 and the lower layer 25 are a mixture of 20 to 30% by weight of magnesium oxide, 5 to 15% by weight of magnesium chloride, 40 to 50% by weight of calcium carbonate, and 5 to 15% by weight of perlite. It can be formed by thinly coating each of the general non-woven fabric networks 24 of the magnesium board and then drying them.

상기 마그네슘보드는 마그네슘 메인 보드에서 산화마그네슘 함량을 높이고, 상하부에 하나 이상의 유리섬유 부직포 및 하나 이상의 부직포를 각각 적층하여 20MPa 이상의 휨 강도를 제공할 수 있다. The magnesium board may provide a flexural strength of 20 MPa or more by increasing the magnesium oxide content in the magnesium main board, and stacking one or more glass fiber nonwoven fabrics and one or more nonwoven fabrics on the upper and lower parts, respectively.

앞에서 상술한 바와 같이, 본 발명의 알루미늄-마그네슘 온돌 보드는 열전도도가 높고 전자파 차폐성능이 높은 알루미늄판을 마그네슘보드 하면에 접착시켜 신속한 열전달과 전자파 차폐성능을 제공할 수 있다.As described above, the aluminum-magnesium ondol board of the present invention can provide rapid heat transfer and electromagnetic wave shielding performance by bonding an aluminum plate with high thermal conductivity and high electromagnetic wave shielding performance to the lower surface of the magnesium board.

본 발명의 알루미늄-마그네슘 온돌 보드는 알루미늄판에 배관홈을 형성시킬 필요가 없다는 점에서 공정이 편리하고 보드 부품 제조단가도 줄일 수 있으며, 마그네슘 하부에 평판인 알루미늄판이 일체로 접합되어 있어 외부 충격이 가해지더라도 알루미늄판으로 충격을 분산시킬 수 있으므로 마그네슘 보드의 내구성을 높일 수 있다.The aluminum-magnesium ondol board of the present invention is convenient in that there is no need to form a pipe groove in the aluminum plate, and the manufacturing cost of board parts can be reduced. Even if applied, the impact can be dispersed with the aluminum plate, so the durability of the magnesium board can be increased.

도 1과 같이, 배관홈(3)의 상부에 위치하는 마그네슘 보드(b)에 충격력이 집중되는 것을 방지할 수 있고, 또한, 마그네슘보드로 습기나 수분이 스며드는 것을 원천적으로 방지할 수 있으므로, 본 발명의 알루미늄-마그네슘 온돌 보드는 마그네슘보드의 단점인 내구성의 문제점을 알루미늄판의 접합으로 해결할 수 있다.As shown in Figure 1, it is possible to prevent the impact force from being concentrated on the magnesium board (b) located on the upper part of the pipe groove (3), and also to prevent moisture or moisture from permeating into the magnesium board at the source, so this The aluminum-magnesium ondol board of the present invention can solve the problem of durability, which is a disadvantage of the magnesium board, by bonding the aluminum plate.

도 4를 참고하면, 본 발명의 건식 난방 바닥은 단열재층(30), 상기 마그네슘-알루미늄 온돌보드(100) 및 마감재층(40)을 포함한다.Referring to FIG. 4 , the dry heating floor of the present invention includes an insulating material layer 30 , the magnesium-aluminum ondol board 100 , and a finishing material layer 40 .

상기 단열재층(30)은 난방 배관(1)이 상부에 인입되는 배관홈(31)이 형성된다.The heat insulating material layer 30 is formed with a pipe groove 31 through which the heating pipe 1 is introduced.

상기 단열재층은 공지된 스치로폼 단열재, 압출폴리스티렌(XPS) 단열재 등일 수 있다.The insulation layer may be a well-known Styrofoam insulation material, an extruded polystyrene (XPS) insulation material, or the like.

상기 마그네슘-알루미늄 온돌보드(100)는 상기 단열재층(30)의 상부에 위치한다.The magnesium-aluminum ondol board 100 is positioned on the insulating material layer 30 .

상기 마감재층은 상기 마그네슘-알루미늄 온돌보드(100) 상에 위치하여 실내 바닥면을 구성하는 층으로서, 목재, 합성수지재, 대리석재 등 다양한 소재로 이루어질 수 있다.The finishing material layer is located on the magnesium-aluminum ondol board 100 and constitutes an indoor floor surface, and may be made of various materials such as wood, synthetic resin material, marble material, and the like.

지금까지 본 발명의 구체적인 실시예들을 살펴보았다. 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 본 발명이 본질적인 특성에 벗어나지 않는 범위에서 변형된 형태로 구현될 수 있음을 이해할 수 있을 것이다. 본 발명의 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.So far, specific embodiments of the present invention have been described. Those of ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in a modified form without departing from the essential characteristics. The scope of the present invention is indicated in the claims rather than the foregoing description, and all differences within the scope equivalent thereto should be construed as being included in the present invention.

10 : 알루미늄판 20 : 마그네숨보드
30 : 단열재충 40 : 마감재층
100 : 알루미늄-마그네슘 보드10: aluminum plate 20: magnesium board
30: insulation material 40: finishing material layer
100: aluminum-magnesium board

Claims (7)

난방배관(1) 상부에 위치하는 알루미늄판(10) ;
상기 알루미늄판(20) 상부에 접합된 마그네슘보드(20)를 포함하고,
상기 마그네슘보드(20)는
마그네슘 메인 보드(21),
상기 마그네슘 메인 보드 상면과 하면에 부착된 유리섬유 부직포층(22);
상기 유리섬유 부직포층 상면과 하면에 각각 부착된 일반 부직포층(23); 및
상기 일반 부직포층 상면과 하면에 형성된 마그네슘 표면층(24) 및 하부층(25)을 포함하는 것을 특징으로 하는 알루미늄-마그네슘 온돌 보드.Heating pipe (1) located above the aluminum plate (10);
and a magnesium board 20 bonded to the upper part of the aluminum plate 20,
The magnesium board 20 is
magnesium main board (21),
Glass fiber non-woven fabric layer 22 attached to the upper and lower surfaces of the magnesium main board;
a general nonwoven layer 23 attached to the upper and lower surfaces of the glass fiber nonwoven layer, respectively; and
Aluminum-magnesium ondol board, characterized in that it comprises a magnesium surface layer (24) and a lower layer (25) formed on the upper and lower surfaces of the general nonwoven layer. 제 1항에 있어서, 상기 알루미늄판(10)은 다수의 요철 돌기가 형성되며 두께가 0.2mm~5mm이고, 상기 난방배관의 열을 상기 마그네슘보드층으로 전달하는 것을 특징으로 하는 알루미늄-마그네슘 온돌 보드.The aluminum-magnesium ondol board according to claim 1, wherein the aluminum plate (10) has a plurality of concave and convex protrusions, has a thickness of 0.2 mm to 5 mm, and transfers heat from the heating pipe to the magnesium board layer. . 제 1항에 있어서, 상기 마그네슘 보드(20)는 산화마그네슘, 염화마그네슘, 펄라이트 및 유리섬유를 포함하여 휨강도가 20MPa 이상인 것을 특징으로 하는 알루미늄-마그네슘 온돌 보드.The aluminum-magnesium ondol board according to claim 1, wherein the magnesium board 20 includes magnesium oxide, magnesium chloride, perlite and glass fiber and has a flexural strength of 20 MPa or more. 삭제delete 제 1항에 있어서, 상기 마그네슘 메인보드(21)는
산화마그네슘 55~60중량% ;
염화마그네슘 10~25중량%
펄라이트 10~25중량%를 포함하는 것을 특징으로 하는 알루미늄-마그네슘 온돌 보드.According to claim 1, wherein the magnesium main board (21)
55 to 60% by weight of magnesium oxide;
Magnesium chloride 10-25 wt%
Aluminum-magnesium ondol board, characterized in that it contains 10 to 25% by weight of perlite. 제 1항에 있어서, 상기 마그네슘 표면층 및 하부층은
산화마그네슘 20~30중량% ;
염화마그네슘 5~15중량% ;
탄산칼슘 40~50중량% ; 및
펄라이트 5~15중량%를 포함하는 것을 특징으로 하는 알루미늄-마그네슘 온돌 보드.The method of claim 1, wherein the magnesium surface layer and the lower layer
Magnesium oxide 20 to 30% by weight;
5 to 15% by weight of magnesium chloride;
Calcium carbonate 40-50 wt%; and
Aluminum-magnesium ondol board, characterized in that it contains 5 to 15% by weight of perlite. 난방 배관(1)을 상부에 인입할 수 있는 배관홈(31)이 형성된 단열재층(30) ;
상기 단열재층의 상부에 위치하는 상기 제 1항 내지 제 3항, 제 5항 및제 6항 중 어느 한 항에 따른 마그네슘-알루미늄 온돌보드(100) ; 및
상기 마그네슘-알루미늄 온돌보드(100) 상에 위치하는 마감재층(40)을 포함하는 건식 난방 바닥.
Insulation material layer 30 in which the piping groove 31 that can lead the heating pipe 1 to the upper part is formed;
The magnesium-aluminum ondol board 100 according to any one of claims 1 to 3, 5 and 6, which is located on the insulating layer; and
Dry heating floor comprising a finishing material layer (40) positioned on the magnesium-aluminum ondol board (100).
KR1020200133163A 2020-10-15 2020-10-15 Aluminum -Magnesium Ondol board and Dry heating system comprising the same KR102296468B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200133163A KR102296468B1 (en) 2020-10-15 2020-10-15 Aluminum -Magnesium Ondol board and Dry heating system comprising the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200133163A KR102296468B1 (en) 2020-10-15 2020-10-15 Aluminum -Magnesium Ondol board and Dry heating system comprising the same

Publications (1)

Publication Number Publication Date
KR102296468B1 true KR102296468B1 (en) 2021-09-01

Family

ID=77779723

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200133163A KR102296468B1 (en) 2020-10-15 2020-10-15 Aluminum -Magnesium Ondol board and Dry heating system comprising the same

Country Status (1)

Country Link
KR (1) KR102296468B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316031A (en) * 1993-03-08 1994-11-15 Takiron Co Ltd Quasi-noncombustible panel
KR200351874Y1 (en) * 2004-02-17 2004-06-01 박병서 A fabricated hot-water heating system.
KR200413481Y1 (en) * 2006-01-06 2006-04-07 엄창석 Heating Piping Pannel Having Many Through-Hole And Korean floor heater system using the same
KR20170135053A (en) * 2016-05-30 2017-12-08 이기원 Magnesium board and method of forming the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316031A (en) * 1993-03-08 1994-11-15 Takiron Co Ltd Quasi-noncombustible panel
KR200351874Y1 (en) * 2004-02-17 2004-06-01 박병서 A fabricated hot-water heating system.
KR200413481Y1 (en) * 2006-01-06 2006-04-07 엄창석 Heating Piping Pannel Having Many Through-Hole And Korean floor heater system using the same
KR20170135053A (en) * 2016-05-30 2017-12-08 이기원 Magnesium board and method of forming the same

Similar Documents

Publication Publication Date Title
CN108252486A (en) Modular floor heating component
TWM629363U (en) Structure of floor sound insulation layer cushion
KR102296468B1 (en) Aluminum -Magnesium Ondol board and Dry heating system comprising the same
TWI782843B (en) The structure of floor sound insulation layer cushion
KR100329917B1 (en) An apartment house floor system taking multilayer impact noise barrier
KR100472088B1 (en) Prefabricated heating panel and fabricating method thereof
KR200496285Y1 (en) Dry heating system comprising Insulation and Sound Absorption Panel for Preventing Floor Noise
TWM635777U (en) Sound insulation mat multi-layer structure
KR100475210B1 (en) A sound-proof floors
KR100450351B1 (en) Noise less device of a building
JP2004249646A (en) Waterproofing/heat insulating sheet
JPS5933638Y2 (en) insulation composite board
JPS634740Y2 (en)
CN214841087U (en) Ground heating pipeline mounting structure
KR200231438Y1 (en) An improved floor system for interception of impact noise transfer through the wall in apartment house
CN211523698U (en) Floating floor
KR200364624Y1 (en) Structure of heat panel
KR200268219Y1 (en) Soundproofing materials being provided with floor
KR102362746B1 (en) Dry bathroom structure with insulation
CN214739046U (en) Connecting structure of energy-saving wood structure building wall and floor slab
CN216974042U (en) Floor heating plate with novel decorative surface layer structure
KR100555179B1 (en) Panel to intercept noise and vibration between the floor and ceiling
KR200224536Y1 (en) For reducing the apartment bottom noise by non-woven fabrics and polyurethane foam
KR200197447Y1 (en) Ondol heating floor structure
KR200368383Y1 (en) Ondol flooring material for floor heating construction

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant