KR102260540B1 - 폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. - Google Patents
폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. Download PDFInfo
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- KR102260540B1 KR102260540B1 KR1020190000242A KR20190000242A KR102260540B1 KR 102260540 B1 KR102260540 B1 KR 102260540B1 KR 1020190000242 A KR1020190000242 A KR 1020190000242A KR 20190000242 A KR20190000242 A KR 20190000242A KR 102260540 B1 KR102260540 B1 KR 102260540B1
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- polyamic acid
- dianhydride
- bis
- solvent
- combinations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190000242A KR102260540B1 (ko) | 2019-01-02 | 2019-01-02 | 폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. |
PCT/KR2019/014970 WO2020141710A1 (ko) | 2019-01-02 | 2019-11-06 | 폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. |
JP2021538708A JP7317122B2 (ja) | 2019-01-02 | 2019-11-06 | ポリアミド酸組成物の製造方法、ポリアミド酸組成物、これを用いたポリイミドフィルムの製造方法及びその製造方法によって製造されたポリイミドフィルム |
CN201980086432.XA CN113795536A (zh) | 2019-01-02 | 2019-11-06 | 聚酰胺酸组合物及其制备方法、聚酰亚胺膜的制备方法及由此制备的聚酰亚胺膜 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190000242A KR102260540B1 (ko) | 2019-01-02 | 2019-01-02 | 폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. |
Publications (2)
Publication Number | Publication Date |
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KR20200084481A KR20200084481A (ko) | 2020-07-13 |
KR102260540B1 true KR102260540B1 (ko) | 2021-06-08 |
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KR1020190000242A KR102260540B1 (ko) | 2019-01-02 | 2019-01-02 | 폴리아믹산 조성물의 제조방법, 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 그 제조방법을 통해 제조된 폴리이미드 필름. |
Country Status (4)
Country | Link |
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JP (1) | JP7317122B2 (ja) |
KR (1) | KR102260540B1 (ja) |
CN (1) | CN113795536A (ja) |
WO (1) | WO2020141710A1 (ja) |
Families Citing this family (1)
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WO2023120862A1 (ko) * | 2021-12-22 | 2023-06-29 | 주식회사 엘지화학 | 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006249116A (ja) | 2005-03-08 | 2006-09-21 | Fuji Photo Film Co Ltd | ポリイミドおよびそれを用いた光学フィルム |
JP4786859B2 (ja) | 2000-08-09 | 2011-10-05 | 三井化学株式会社 | ポリイミド樹脂よりなる光学部材 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS59157319A (ja) * | 1983-02-22 | 1984-09-06 | Agency Of Ind Science & Technol | 高弾性率の全芳香族ポリイミド成型物の製造法 |
KR100319299B1 (ko) | 1999-04-14 | 2002-01-05 | 윤종용 | 광통신용 폴리이미드 |
KR101704010B1 (ko) | 2015-08-27 | 2017-02-07 | 부산대학교 산학협력단 | 신규한 디아민 화합물, 이를 이용한 폴리아믹산 및 폴리이미드 |
CN105399950B (zh) | 2015-12-18 | 2018-03-09 | 吉林大学 | 一种含氰基的聚酰亚胺树脂及其在制备覆铜箔方面的应用 |
KR102430647B1 (ko) * | 2015-12-24 | 2022-08-09 | 주식회사 두산 | 신규 구조의 디아민 모노머를 적용한 폴리아믹산 용액 및 이를 포함하는 폴리이미드 필름 |
KR102580455B1 (ko) * | 2015-12-31 | 2023-09-20 | 주식회사 동진쎄미켐 | 폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법 |
KR20180093203A (ko) * | 2017-02-10 | 2018-08-21 | 삼성디스플레이 주식회사 | 폴리아믹산, 폴리이미드 필름 및 폴리이미드 필름의 제조 방법 |
KR101912738B1 (ko) * | 2017-05-23 | 2018-10-30 | 주식회사 대림코퍼레이션 | 광 특성 및 위상 지연 특성이 우수한 고투명성을 갖는 폴리이미드 전구체 수지 조성물, 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름 |
CN107936247B (zh) | 2017-11-24 | 2020-04-17 | 山东省科学院新材料研究所 | 一种难溶盐与聚酰亚胺气凝胶复合光催化剂及其制备方法 |
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2019
- 2019-01-02 KR KR1020190000242A patent/KR102260540B1/ko active IP Right Grant
- 2019-11-06 CN CN201980086432.XA patent/CN113795536A/zh active Pending
- 2019-11-06 JP JP2021538708A patent/JP7317122B2/ja active Active
- 2019-11-06 WO PCT/KR2019/014970 patent/WO2020141710A1/ko active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4786859B2 (ja) | 2000-08-09 | 2011-10-05 | 三井化学株式会社 | ポリイミド樹脂よりなる光学部材 |
JP2006249116A (ja) | 2005-03-08 | 2006-09-21 | Fuji Photo Film Co Ltd | ポリイミドおよびそれを用いた光学フィルム |
Also Published As
Publication number | Publication date |
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KR20200084481A (ko) | 2020-07-13 |
JP2022516281A (ja) | 2022-02-25 |
CN113795536A (zh) | 2021-12-14 |
JP7317122B2 (ja) | 2023-07-28 |
WO2020141710A1 (ko) | 2020-07-09 |
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