KR102216294B1 - Method and equipment of cutting ceramic - Google Patents

Method and equipment of cutting ceramic Download PDF

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Publication number
KR102216294B1
KR102216294B1 KR1020200091290A KR20200091290A KR102216294B1 KR 102216294 B1 KR102216294 B1 KR 102216294B1 KR 1020200091290 A KR1020200091290 A KR 1020200091290A KR 20200091290 A KR20200091290 A KR 20200091290A KR 102216294 B1 KR102216294 B1 KR 102216294B1
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South Korea
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ceramic
coolant
cutting
pattern
irradiated
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KR1020200091290A
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Korean (ko)
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이정준
류지연
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주식회사 아이티아이
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Priority to KR1020200091290A priority Critical patent/KR102216294B1/en
Application granted granted Critical
Publication of KR102216294B1 publication Critical patent/KR102216294B1/en
Priority to PCT/KR2021/005025 priority patent/WO2021221378A1/en
Priority to CN202180030522.4A priority patent/CN115461179A/en
Priority to EP21795815.6A priority patent/EP4144472A4/en
Priority to JP2022566498A priority patent/JP2023525241A/en
Priority to US17/921,832 priority patent/US20230173614A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B23K15/085—Boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0006—Electron-beam welding or cutting specially adapted for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention relates to a method and equipment for cutting ceramic. The equipment for cutting ceramic comprises: a beam emission unit to emit a beam of a wavelength absorbed into a pattern formed on the upper surface of ceramic and partially absorbed into the ceramic; and a coolant spray unit to spray a coolant to the ceramic to which the beam is emitted. A portion or the entirety of the pattern is removed by simultaneously heating and cooling the ceramic. The stress caused while an upper layer or the entirety of the ceramic is recrystallized or the stress caused by thermal expansion and contraction of the upper layer or the entirety of the ceramic is used to reduce heat damage to cut the ceramic. The ceramic is simultaneously heated and cooled to be recrystallized or is heated until melted and is then cooled to apply thermal stress to the inside, and the ceramic can be cut through an additional separation process without loss of a ceramic material.

Description

세라믹 절단법 및 장비{Method and equipment of cutting ceramic}Ceramic cutting method and equipment {Method and equipment of cutting ceramic}

본 발명은 세라믹 절단법 및 장비에 관한 것으로, 더욱 상세하게는 패턴이 있는 세라믹을 패턴과 세라믹 내부에 흡수되는 파장의 빔을 사용해서 절단하는 세라빅의 절단법 및 장비에 관한 것이다. The present invention relates to a ceramic cutting method and equipment, and more particularly, to a ceramic cutting method and equipment for cutting a ceramic with a pattern using a pattern and a beam having a wavelength absorbed inside the ceramic.

세라믹(ceramic)은 금속(metal)과 비금속(non-metal) 혹은 준금속(metalloid)들이 열처리에 의해 서로 결합하여 결정질을 만드는 소결 과정(sintering process)을 거친 뒤, 형성된 결정질들이 모여 3차원적 망구조를 형성한 고체 물질을 뜻한다.Ceramic is a three-dimensional network after a sintering process in which metal and non-metal or metalloids are bonded to each other by heat treatment to form crystals. It refers to a solid substance that has formed a structure.

최근에는 주로 점토(粘土), 고령토(高嶺土), 장석(長石), 규석(硅石) 등과 같은 천연원료를 사용하여 제조하는 세라믹 구소재와 달리, 탄화규소(炭化硅素), 질화규소(窒化硅素), 알루미나(alumina), 지르코니아(zirconia), 바륨티타네이트(barium titanate) 등과 같은 고순도의 합성원료를 사용하여 제조하는 세라믹 신소재가 각광받고 있으며, 전기, 자기, 기계, 화학, 광학, 바이오 등 광범위한 영역에서 활용되고 있다. In recent years, unlike old ceramic materials, which are mainly manufactured using natural raw materials such as clay, kaolin, feldspar, silica, etc., silicon carbide, silicon nitride, New ceramic materials manufactured using high-purity synthetic raw materials such as alumina, zirconia, and barium titanate are in the spotlight. It is being utilized.

이러한 세라믹 재료(이하 '세라믹'이라 함)을 레이저나 고출력 빔을 이용해서 가열하고, 용융 또는 기화시켜서 재료의 일부를 제거하여 절단하는 방법이 이용되고 있다. A method of heating such a ceramic material (hereinafter referred to as'ceramic') using a laser or a high-power beam, melting or evaporating, and removing a part of the material, has been used.

그러나, 종래기술에 따른 절단 방법은 재료의 열손상이 크고, 분진이 발생하며, 절단강도가 저하됨에 따라, 실제로 적용이 어려웠다. However, the cutting method according to the prior art is difficult to apply in practice as the heat damage of the material is large, dust is generated, and the cutting strength is lowered.

이에 따라, 열 손상을 줄이기 위해서 단순하게 재료 표면을 공기나 액체로 냉각하는 방식을 적용하기도 하였으나, 기본적으로 재료를 용융 및 기화시켜서 재료의 일부를 제거하여 절단하는 과정에서 발생하는 분진과 열 손상이 많아서 양산 적용이 어려운 문제점이 있었다. Accordingly, in order to reduce thermal damage, a method of simply cooling the surface of the material with air or liquid was applied, but dust and heat damage generated in the process of cutting by removing a part of the material by melting and vaporizing the material basically There were many problems, making it difficult to apply mass production.

대한민국 특허 등록번호 제10-1119289호(2012.03.15.)Korean Patent Registration No. 10-1119289 (2012.03.15.) 일본 공개특허공보 특개2013-112532호(2013.06.10.)Japanese Unexamined Patent Application Publication No. 2013-112532 (2013.06.10.)

본 발명의 목적은 세라믹을 가열과 동시에 냉각해서 재 결정화하거나 용융이 되기 전까지 가열하고 냉각해서 내부에 열 응력을 가하고 이때 세라믹 재료의 손실이 없이 추가적인 분리공정을 통해서 절단할 수 있는 세라믹 절단법 및 장비를 제공하는 것이다. An object of the present invention is a ceramic cutting method and equipment capable of cutting ceramic through an additional separation process without loss of ceramic material by heating and cooling the ceramic by cooling it simultaneously with heating to recrystallize it, or by heating and cooling it before melting. Is to provide.

상기한 바와 같은 목적을 달성하기 위하여, 본 발명에 따른 세라믹 절단장비는 세라믹의 상면에 형성된 패턴에 흡수되고, 세라믹에 일부가 흡수되는 파장의 빔을 조사하는 빔 조사부, 빔이 조사된 세라믹에 냉각제를 분사하는 냉각제 분사부 및 빔과 냉각제에 의한 가열 및 냉각에 의해 세라믹에 형성된 응력라인에 힘이나 충격을 제공하여 분리하는 분리부를 포함하고, 세라믹을 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시키고, 응력라인에 추가로 힘이나 충격을 제공해서 열손상을 감소하면서 세라믹을 절단하는 것을 특징으로 한다.In order to achieve the above object, the ceramic cutting equipment according to the present invention is absorbed by a pattern formed on the upper surface of the ceramic, and a beam irradiation unit irradiating a beam of a wavelength at which a part of the ceramic is absorbed, and a coolant on the irradiated ceramic It includes a coolant spraying unit that injects the beam and a separation unit that provides force or impact to the stress line formed in the ceramic by heating and cooling the beam and the coolant to separate it, and removes part or all of the pattern by cooling the ceramic at the same time as heating. And, it is characterized in that the upper layer or all of the ceramic generates stress by recrystallization or thermal expansion and contraction, and provides additional force or impact to the stress line, thereby cutting the ceramic while reducing thermal damage.

또한, 상기한 바와 같은 목적을 달성하기 위하여, 본 발명에 따른 세라믹 절단법은 (a) 빔 조사부에서 세라믹의 상면에 형성된 패턴에 흡수되고, 세라믹에 일부가 흡수되는 파장의 빛을 조사하는 단계, (b) 냉각제 분사부에서 빔이 조사된 세라믹에 냉각제를 분사하는 단계 및 (c) 빔과 냉각제에 의한 가열 및 냉각에 의해 세라믹에 형성된 응력라인이에 분리부를 이용해서 힘이나 충격을 제공하여 절단하는 단계를 포함하고, 세라믹을 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시키고, 응력라인에 추가로 힘이나 충격을 제공해서 열손상을 감소하면서 세라믹을 절단하는 것을 특징으로 한다.In addition, in order to achieve the above object, the ceramic cutting method according to the present invention comprises the steps of: (a) irradiating light of a wavelength at which the beam is absorbed by a pattern formed on the upper surface of the ceramic and partially absorbed by the ceramic, (b) Injecting coolant from the coolant injection unit to the ceramic irradiated with the beam, and (c) cutting by applying force or impact to the stress line formed in the ceramic by heating and cooling by the beam and the coolant using the separation unit. Including the step of heating and cooling the ceramic to remove part or all of the pattern, the upper layer or all of the ceramic generates stress by recrystallization or thermal expansion and contraction, and additional force or impact is applied to the stress line. It is characterized in that the ceramic is cut while reducing heat damage by providing.

상술한 바와 같이, 본 발명에 따른 세라믹 절단법 및 장비에 의하면, 세라믹을 가열과 동시에 냉각해서 재 결정화하거나 용융이 되기 전까지 가열하고 냉각해서 내부에 열 응력을 가하고 이때 세라믹 재료의 손실이 없이 추가적인 분리공정을 통해서 절단할 수 있는 효과를 가진다. As described above, according to the ceramic cutting method and equipment according to the present invention, the ceramic is heated and cooled at the same time to recrystallize, or heated and cooled before melting to apply thermal stress to the inside, and at this time, additional separation without loss of the ceramic material. It has the effect of cutting through the process.

따라서 본 발명에 의하면, 절단 가공 전에 가공면에 이물질이 달라붙는 것을 억제하기 위해 수용성 보호막(HogoMax)을 도포할 필요가 없어, 작업성 및 효율을 향상시킬 수 있으며, 세라믹이 적용된 디바이스의 신뢰성을 높일 수 있는 효과를 가진다.Therefore, according to the present invention, it is not necessary to apply a water-soluble protective film (HogoMax) to suppress the adhesion of foreign substances to the processed surface before cutting processing, thereby improving workability and efficiency, and increasing the reliability of the ceramic-applied device. It has the effect of being able to.

도 1은 본 발명의 바람직한 실시 예에 따른 세라믹 절단장비의 블록 구성도,
도 2는 도 1에 도시된 세라믹 절단장비를 이용해서 세라믹을 절단하는 원리를 설명하는 도면,
도 3은 응력라인에 힘이나 충격을 제공해서 절단하는 과정을 보인 도면,
도 4는 본 발명의 바람직한 실시 예에 따른 세라믹 절단법을 단계별로 설명하는 공정도,
도 5와 도 6은 세라믹의 평면도와 절단된 상태를 보인 단면도. 1 is a block diagram of a ceramic cutting equipment according to a preferred embodiment of the present invention,
FIG. 2 is a diagram explaining the principle of cutting ceramic using the ceramic cutting equipment shown in FIG. 1;
3 is a diagram showing a process of cutting by providing force or impact to the stress line;
4 is a process chart illustrating step by step a ceramic cutting method according to a preferred embodiment of the present invention,
5 and 6 are a plan view of a ceramic and a cross-sectional view showing a cut state.

이하 본 발명의 바람직한 실시 예에 따른 세라믹 절단법 및 장비를 첨부된 도면을 참조하여 상세하게 설명한다. Hereinafter, a ceramic cutting method and equipment according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 바람직한 실시 예에 따른 세라믹 절단장비의 블록 구성도이고, 도 2는 빔과 냉각제를 이용해서 세라믹을 절단하는 원리를 설명하는 도면이며, 도 3은 응력라인에 힘이나 충격을 제공해서 절단하는 과정을 보인 도면이다.1 is a block diagram of a ceramic cutting equipment according to a preferred embodiment of the present invention, FIG. 2 is a diagram illustrating a principle of cutting ceramic using a beam and a coolant, and FIG. 3 is a force or impact on a stress line. It is a diagram showing the process of providing and cutting.

본 발명의 바람직한 실시 예에 따른 세라믹 절단장비(10)는 도 1 내지 도 3에 도시된 바와 같이, 상부에 패턴(12)이 형성된 세라믹(11)을 절단하기 위해, 패턴(12)에 흡수되고, 세라믹(11)에 일부가 흡수되는 파장의 빔(B)을 조사하는 빔 조사부(20), 빔이 조사된 세라믹(11)에 냉각제(C)를 분사하는 냉각제 분사부(30) 및 빔과 냉각제에 의한 가열 및 냉각에 의해 응력라인(L)이 형성된 세라믹(11)을 상하 반전시킨 상태에서 응력라인(L)에 힘이나 충격을 제공하는 분리부(50)를 포함하고, 세라믹(11)을 가열과 동시에 냉각해서 패턴(12)의 일부 또는 전부를 제거하며, 세라믹(11)의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시키고, 응력라인(L)에 추가로 힘이나 충격을 제공해서 열손상을 감소시켜 절단한다.The ceramic cutting equipment 10 according to a preferred embodiment of the present invention is absorbed by the pattern 12 to cut the ceramic 11 having the pattern 12 formed thereon, as shown in FIGS. 1 to 3. , A beam irradiation unit 20 for irradiating a beam B of a wavelength partially absorbed by the ceramic 11, a coolant injection unit 30 for injecting a coolant C onto the ceramic 11 irradiated with the beam, and the beam Including a separating unit 50 for providing force or impact to the stress line L in a state in which the ceramic 11 on which the stress line L is formed by heating and cooling by a coolant is vertically inverted, and the ceramic 11 Is heated and cooled to remove part or all of the pattern 12, and the upper layer or all of the ceramic 11 generates stress due to recrystallization or thermal expansion and contraction, and additional force is applied to the stress line (L). Cuts by providing impact to reduce thermal damage.

그리고 세라믹 절단장비(10)는 각 장치의 구동을 제어하는 제어부(40)를 더 포함할 수 있다. In addition, the ceramic cutting equipment 10 may further include a control unit 40 that controls driving of each device.

제어부(40)는 빔 조사부(20)에서 조사되는 빔의 강도에 비례해서 냉각제 분사부(30)에서 분사되는 냉각제의 분사량을 조절하도록 제어신호를 발생할 수 있다. The control unit 40 may generate a control signal to adjust the injection amount of the coolant injected from the coolant injection unit 30 in proportion to the intensity of the beam irradiated by the beam irradiation unit 20.

빔 조사부(20)는 패턴(12)과 세라믹(11)을 동시에 절단하기 위해, 미리 설정된 파장 및 세기를 갖는 빔을 발생하는 빔 발생기(21), 빔 발생기(21)에서 발생한 빔을 집속해서 세라믹(11)을 향해 조사하는 렌즈부(22) 및 빔을 절단하고자 하는 방향을 따라 이동시키도록 렌즈부(22)를 구동하는 구동부(23)를 포함할 수 있다. In order to cut the pattern 12 and the ceramic 11 at the same time, the beam irradiation unit 20 focuses the beam generated by the beam generator 21 and the beam generator 21 for generating a beam having a preset wavelength and intensity to cut ceramic. It may include a lens unit 22 for irradiating toward (11) and a driving unit 23 for driving the lens unit 22 to move the beam along a direction to be cut.

빔 조사부(20)에서 조사되는 빔은 약 0.1㎛ 내지 약 11㎛ 파장과 약 0.1mw/cm2, 즉 1Х101mW/mm2 이상의 에너지 밀도를 출력으로 가지며, 약 1㎜/s 내지 약 10m/s의 속도로 진행할 수 있다. The beam irradiated by the beam irradiation unit 20 has a wavelength of about 0.1 µm to about 11 µm and an energy density of about 0.1 mw/cm 2 , that is, 1 Х10 1 mW/mm 2 or more, and has an output of about 1 mm/s to about 10 m/s. It can proceed at the speed of s.

즉, 본 실시 예에서 빔 조사부(20)는 세라믹(11)을 가열해서 재결정화하거나 용융이 되기 전까지 가열하도록 빔의 출력을 설정하고, 설정된 출력으로 빔을 조사한다. That is, in the present embodiment, the beam irradiation unit 20 sets the output of the beam so as to heat the ceramic 11 to recrystallize it or heat it before melting, and irradiates the beam with the set output.

따라서 본 발명은 빔에 의해 가열된 세라믹의 열손상이나 손실을 방지하거나, 최소화할 수 있다. Accordingly, the present invention can prevent or minimize heat damage or loss of the ceramic heated by the beam.

냉각제 분사부(30)는 냉각제를 분사하는 분사노즐(31)과 분사노즐(31)을 통해 분사되는 냉각제의 유량을 조절하는 유량 조절기(32)를 포함할 수 있다. The coolant injection unit 30 may include an injection nozzle 31 for injecting a coolant and a flow controller 32 for controlling a flow rate of the coolant injected through the injection nozzle 31.

분사노즐(31)은 빔이 조사된 세라믹을 냉각하기 위한 냉각제와 유체를 혼합해서 미리 설정된 압력으로 냉각제를 분사할 수 있다. The injection nozzle 31 may inject the coolant at a preset pressure by mixing a fluid with a coolant for cooling the ceramic irradiated with the beam.

예를 들어, 상기 냉각제는 물과 공기를 혼합해서 미리 설정된 압력으로 빔이 조사되는 조사영역을 향해 분사될 수 있다. For example, the coolant may be sprayed toward the irradiation area to which the beam is irradiated at a preset pressure by mixing water and air.

따라서 냉각제가 분사되는 냉각영역은 빔을 패턴(12)과 세라믹(11)을 향해 투과시킬 수 있다. Accordingly, the cooling area in which the coolant is injected may transmit the beam toward the pattern 12 and the ceramic 11.

이러한 상기 냉각영역은 빔이 조사되는 조사영역 전체를 냉각하거나, 상기 조사영역의 일부분을 냉각하도록 형성될 수 있다.The cooling region may be formed to cool the entire irradiation region to which the beam is irradiated, or to cool a part of the irradiation region.

따라서 세라믹(11) 내부로 빔이 흡수되는 깊이는 세라믹(11)에 빔이 흡수되는 흡수 두께에 따라 조절될 수 있다.Accordingly, the depth at which the beam is absorbed into the ceramic 11 may be adjusted according to the absorption thickness at which the beam is absorbed by the ceramic 11.

분리부(50)는 빔과 냉각제에 의해 가열 및 냉각되면서 세라믹(11) 내부에 형성되는 응력라인(L)에 힘이나 충격을 제공해서 분리하는 기능을 한다. The separating unit 50 functions to separate by providing a force or impact to the stress line L formed inside the ceramic 11 while being heated and cooled by the beam and the coolant.

예를 들어, 분리부(50)는 도 3에 도시된 바와 같이, 세라믹(11)에 형성된 응력라인(L)에 대응되도록 길게 연장 형성되는 분리롤러나 분리바로 마련될 수 있다. For example, as shown in FIG. 3, the separating part 50 may be provided as a separating roller or separating bar that is elongated to correspond to the stress line L formed in the ceramic 11.

상기 분리롤러나 분리바는 제어부(40)에 제어신호에 따라 구동되는 구동모듈(도면 미도시)에 의해 하강해서 세라믹(11)에 형성된 응력라인(L)에 힘이나 충격을 제공할 수 있다. 그리고 상기 분리롤러나 분리바는 응력라인(L)에 효과적으로 힘이나 충격을 제공할 수 있도록, 중앙부가 하방을 향해 볼록한 곡면 형상으로 형성될 수 있다. The separating roller or the separating bar may be lowered by a driving module (not shown) driven according to a control signal to the control unit 40 to provide a force or impact to the stress line L formed in the ceramic 11. In addition, the separating roller or the separating bar may be formed in a curved shape in which the central portion is convex downward so as to effectively provide force or impact to the stress line (L).

물론, 본 발명은 반드시 이에 한정되는 것은 아니며, 세라믹의 응력라인 하부에 상방을 향해 리브를 돌출 형성하거나, 세라믹의 하부에 부착되는 반도체 공정 필름에 열을 가해서 팽창시켜 응력라인을 중심으로 세라믹을 분리해서 절단하도록 변경될 수도 있다. 또한, 본 발명은 별도의 레이저나 초음파를 이용해서 응력라인에 힘이나 충격을 가해 분리할 수도 있다.Of course, the present invention is not necessarily limited to this, and the ribs are formed protruding upward under the stress line of the ceramic, or by applying heat to the semiconductor process film attached to the lower part of the ceramic and expanding the ceramic to separate the ceramic around the stress line. It can also be changed to cut. In addition, the present invention can be separated by applying a force or impact to the stress line using a separate laser or ultrasonic waves.

한편, 실험 결과에 따르면, 응력라인이 형성된 세라믹의 상부에서 힘이나 충격을 가하는 경우에 비해, 세라믹을 상하 반전시킨 후 상부에서 힘이나 충격을 가하는 경우에 절단 성능이 향상됨을 확인할 수 있었다.On the other hand, according to the experimental results, it was confirmed that the cutting performance was improved when a force or impact was applied from the top after the ceramic was inverted up and down compared to the case where a force or impact was applied from the top of the ceramic on which the stress line was formed.

다음, 도 4를 참조하여 본 발명의 바람직한 실시 예에 따른 세리믹 절단법을 상세하게 설명한다. Next, a ceramic cutting method according to a preferred embodiment of the present invention will be described in detail with reference to FIG. 4.

도 4는 본 발명의 바람직한 실시 예에 따른 세라믹 절단법을 단계별로 설명하는 공정도이다. 4 is a process diagram illustrating step-by-step a ceramic cutting method according to a preferred embodiment of the present invention.

도 4의 S10단계에서 빔 조사부(20)는 미리 설정된 출력으로 빔을 발생해서 세라믹(11)을 향해 조사한다. In step S10 of FIG. 4, the beam irradiation unit 20 generates a beam with a preset output and irradiates it toward the ceramic 11.

이때, 조사되는 빔은 패턴에 흡수되고, 세라믹에 일부가 흡수되는 파장을 가지며, 세라믹(11)을 가열해서 재결정화하거나 용융이 되기 전까지 가열할 수 있는 출력을 가진다.At this time, the irradiated beam is absorbed by the pattern, has a wavelength at which a part of the ceramic is absorbed, and has an output capable of heating the ceramic 11 until it is recrystallized or melted.

따라서 본 발명은 빔에 의해 가열된 세라믹이 용융 또는 기화하면서 발생하는 열손상이나 손실을 방지할 수 있다. Accordingly, the present invention can prevent heat damage or loss that occurs when the ceramic heated by the beam melts or vaporizes.

S12단계에서 냉각제 분사부(30)는 빔이 조사된 세라믹(11)에 냉각제를 분사한다.In step S12, the coolant injection unit 30 injects the coolant onto the ceramic 11 irradiated with the beam.

이에 따라, 본 발명은 세라믹을 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시켜 세라믹에 응력라인을 형성할 수 있다. Accordingly, in the present invention, a part or all of the pattern is removed by heating and cooling the ceramic at the same time, and a stress line may be formed in the ceramic by generating stress in the upper layer or all of the ceramic by recrystallization or thermal expansion and contraction.

한편, S14단계에서 제어부(40)는 빔 조사부(20)에서 조사되는 빔의 강도에 비례해서 냉각제 분사부(30)에서 분사되는 냉각제의 분사량을 조절하도록 제어신호를 발생한다. 그러면, 유량 조절기(32)는 제어부(40)의 제어신호에 따라 분사노즐(31)을 통해 분사되는 냉각제의 유량을 조절한다.On the other hand, in step S14, the control unit 40 generates a control signal to adjust the injection amount of the coolant injected from the coolant injection unit 30 in proportion to the intensity of the beam irradiated by the beam irradiation unit 20. Then, the flow rate controller 32 adjusts the flow rate of the coolant injected through the injection nozzle 31 according to the control signal from the control unit 40.

S16단계에서 분리부(50)는 제어부(40)의 제어신호에 따른 구동모듈의 구동에 의해 하강 동작해서 상하 반전된 세라믹(11)에 형성된 응력라인(L)에 힘이나 충격을 제공해서 응력라인(L)을 중심으로 세라믹(11)을 분리해서 절단한다.In step S16, the separating unit 50 moves downward by driving the driving module according to the control signal of the control unit 40 to provide force or impact to the stress line L formed in the ceramic 11 that is vertically inverted. Separate and cut the ceramic 11 centering on (L).

예를 들어, 도 5와 도 6은 세라믹의 평면도와 절단된 상태를 보인 단면도이다. For example, FIGS. 5 and 6 are cross-sectional views showing a plan view and a cut state of a ceramic.

도 5 및 도 6에는 약 15㎛의 패턴이 형성되고, 약 50㎛의 두께를 갖는 세라믹에 응력라인이 형성된 평면과, 절단된 절단면이 예시되어 있다. 5 and 6 illustrate a plane in which a pattern of about 15 μm is formed, a stress line is formed in a ceramic having a thickness of about 50 μm, and a cut-out surface.

본 발명은 도 5 및 도 6에 도시된 바와 같이, 패턴이 형성된 세라믹, 즉 절단 대상물을 열손상 및 손실 없이 절단할 수 있음을 확인할 수 있다. In the present invention, as shown in FIGS. 5 and 6, it can be seen that the patterned ceramic, that is, the object to be cut, can be cut without thermal damage and loss.

이와 같이, 본 발명은 패턴이 형성된 세라믹에 빔을 조사하고 냉각제를 분사해서 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화되면서 발생하는 응력 또는 세라믹의 상부층 또는 전부가 열팽창과 수축에 의해 발생하는 응력을 이용해서 열손상을 감소시켜 절단할 수 있다. As described above, in the present invention, a beam is irradiated on a ceramic on which a pattern is formed, and a coolant is sprayed to heat and cool to remove part or all of the pattern, and stress generated when the upper or all of the ceramic is recrystallized or the upper layer of the ceramic or All of them can be cut by reducing thermal damage by using the stress generated by thermal expansion and contraction.

이상 본 발명자에 의해서 이루어진 발명을 상기 실시 예에 따라 구체적으로 설명하였지만, 본 발명은 상기 실시 예에 한정되는 것은 아니고, 그 요지를 이탈하지 않는 범위에서 여러 가지로 변경 가능한 것은 물론이다.Although the invention made by the present inventor has been described in detail according to the above embodiment, the invention is not limited to the above embodiment, and it goes without saying that the invention can be changed in various ways without departing from the gist.

상기의 실시 예에서는 패턴을 제거한 후 세라믹을 절단하는 것으로 설명하였으나, 본 발명은 반드시 이에 한정되는 것은 아니다. In the above embodiment, it has been described that the ceramic is cut after removing the pattern, but the present invention is not limited thereto.

그리고 본 발명은 절단 가공 전에 가공면에 이물질이 달라붙는 것을 억제하기 위해 수용성 보호막(HogoMax)을 도포할 필요가 없어, 작업성 및 효율을 향상시킬 수 있으며, 세라믹이 적용된 디바이스의 신뢰성을 높일 수 있다.In addition, in the present invention, there is no need to apply a water-soluble protective film (HogoMax) to suppress the adhesion of foreign substances to the processed surface before cutting processing, thereby improving workability and efficiency, and increasing the reliability of a ceramic-applied device. .

본 발명은 패턴이 형성된 세라믹을 가열과 동시에 냉각해서 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창 및 수축하면서 발생하는 응력을 이용해서 절단하는 세라믹 절단법 및 장비 기술에 적용된다.The present invention is applied to a ceramic cutting method and equipment technology in which a patterned ceramic is heated and cooled at the same time, and the upper layer or all of the ceramic is recrystallized or thermally expanded and contracted using stress generated.

10: 세라믹 절단장비
11: 세라믹 12: 패턴
V: 빔 C: 냉각제
L: 응력라인
20: 빔 조사부 21: 빔 발생기
22: 렌즈부 23: 구동부
30: 냉각제 분사부
31: 분사노즐 32: 유량 조절기
40: 제어부
50: 분리부10: Ceramic cutting equipment
11: ceramic 12: pattern
V: beam C: coolant
L: stress line
20: beam irradiation unit 21: beam generator
22: lens unit 23: driving unit
30: coolant injection unit
31: injection nozzle 32: flow regulator
40: control unit
50: separation unit

Claims (4)

상면에 패턴이 형성된 세라믹 절단장비에서,
패턴에 흡수되고, 세라믹에 일부가 흡수되는 파장의 빔을 조사하는 빔 조사부,
빔이 조사된 세라믹에 냉각제를 분사하는 분사노즐과, 상기 빔 조사부에서 조사되는 빔의 출력에 비례해서 상기 냉각제의 분사량을 조절하는 유량 조절기를 포함하는 냉각제 분사부 및
빔과 냉각제에 의한 가열 및 냉각에 의해 세라믹에 형성된 응력라인에 힘이나 충격을 제공하여 분리하는 분리부를 포함하고,
상기 냉각제가 분사되는 냉각영역은 상기 빔을 투과시키며, 상기 빔이 조사되는 조사영역 전체를 냉각하거나, 상기 조사영역의 일부분을 냉각하도록 형성되고,
세라믹을 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시키고, 응력라인에 추가로 힘이나 충격을 제공해서 열손상을 감소하면서 세라믹을 절단하는 것을 특징으로 하는 세라믹 절단장비.In a ceramic cutting machine with a pattern formed on the upper surface,
A beam irradiation unit that irradiates a beam of a wavelength absorbed by the pattern and partially absorbed by the ceramic,
A coolant injection unit including an injection nozzle for injecting a coolant onto the ceramic irradiated with a beam, and a flow controller for adjusting the injection amount of the coolant in proportion to the output of the beam irradiated from the beam irradiation unit, and
It includes a separating unit that provides a force or impact to the stress line formed in the ceramic by heating and cooling by the beam and a coolant to separate,
The cooling area into which the coolant is injected is formed to transmit the beam and cool the entire irradiation area to which the beam is irradiated, or to cool a part of the irradiation area,
The ceramic is heated and cooled to remove part or all of the pattern, and the upper layer or all of the ceramic generates stress by recrystallization or thermal expansion and contraction, and additional force or impact is provided to the stress line to reduce thermal damage. Ceramic cutting equipment, characterized in that while cutting the ceramic. 제1항에 있어서,
상기 빔의 파장은 100nm 내지 11㎛로 설정되고,
상기 빔의 에너지 밀도는 1Х101 mW/mm2 이상으로 설정되는 것을 특징으로 하는 세라믹 절단장비.The method of claim 1,
The wavelength of the beam is set to 100nm to 11㎛,
Ceramic cutting equipment, characterized in that the energy density of the beam is set to 1Х10 1 mW/mm 2 or more. 상면에 패턴이 형성된 세라믹 절단법에서,
(a) 빔 조사부에서 패턴에 흡수되고, 세라믹에 일부가 흡수되는 파장의 빛을 조사하는 단계,
(b) 냉각제 분사부에서 빔이 조사된 세라믹에 냉각제를 분사하는 단계,
(c) 빔과 냉각제에 의한 가열 및 냉각에 의해 세라믹에 형성된 응력라인에 분리부를 이용해서 힘이나 충격을 제공하여 절단하는 단계 및
(d) 유량 조절기를 이용해서 상기 빔 조사부에서 조사되는 빔의 출력에 비례해서 상기 냉각제의 분사량을 조절하는 단계를 포함하고,
상기 냉각제가 분사되는 냉각영역은 상기 빔을 투과시키며, 상기 빔이 조사되는 조사영역 전체를 냉각하거나, 상기 조사영역의 일부분을 냉각하도록 형성되고,
세라믹을 가열과 동시에 냉각해서 패턴의 일부 또는 전부를 제거하며, 세라믹의 상부층 또는 전부가 재결정화 또는 열팽창과 수축에 의해 응력을 발생시키고, 응력라인에 추가로 힘이나 충격을 제공해서 열손상을 감소하면서 세라믹을 절단하는 것을 특징으로 하는 세라믹 절단법.In the ceramic cutting method in which a pattern is formed on the upper surface,
(a) irradiating light having a wavelength that is absorbed by the pattern and partially absorbed by the ceramic in the beam irradiation unit,
(b) injecting a coolant onto the ceramic irradiated with the beam from the coolant injection unit,
(c) cutting by applying force or impact to the stress line formed in the ceramic by heating and cooling by the beam and the coolant, and
(d) adjusting the injection amount of the coolant in proportion to the output of the beam irradiated by the beam irradiation unit using a flow controller,
The cooling area into which the coolant is injected is formed to transmit the beam and cool the entire irradiation area to which the beam is irradiated, or to cool a part of the irradiation area,
The ceramic is heated and cooled to remove part or all of the pattern, and the upper layer or all of the ceramic generates stress by recrystallization or thermal expansion and contraction, and additional force or impact is provided to the stress line to reduce thermal damage. Ceramic cutting method, characterized in that while cutting the ceramic. 제3항에 있어서,
상기 빔의 파장은 100nm 내지 11㎛로 설정되고,
상기 빔의 에너지 밀도는 1Х101(mW/mm2) 이상으로 설정되는 것을 특징으로 하는 세라믹 절단법.
The method of claim 3,
The wavelength of the beam is set to 100nm to 11㎛,
Ceramic cutting method, characterized in that the energy density of the beam is set to 1Х10 1 (mW/mm 2 ) or more.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021221378A1 (en) * 2020-04-28 2021-11-04 주식회사 아이티아이 Ceramic cutting method and equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100881466B1 (en) * 2004-12-28 2009-02-06 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for cutting brittle material substrate and substrate cutting system
KR101119289B1 (en) 2003-07-18 2012-03-15 하마마츠 포토닉스 가부시키가이샤 Cutting method
JP2013112532A (en) 2011-11-25 2013-06-10 Mitsuboshi Diamond Industrial Co Ltd Scribing method of brittle material substrate
JP2014043363A (en) * 2012-08-24 2014-03-13 Hamamatsu Photonics Kk Reinforced glass member working method
KR20180040361A (en) * 2016-10-12 2018-04-20 주식회사 이오테크닉스 Processing apparatus and processing method using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119289B1 (en) 2003-07-18 2012-03-15 하마마츠 포토닉스 가부시키가이샤 Cutting method
KR100881466B1 (en) * 2004-12-28 2009-02-06 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for cutting brittle material substrate and substrate cutting system
JP2013112532A (en) 2011-11-25 2013-06-10 Mitsuboshi Diamond Industrial Co Ltd Scribing method of brittle material substrate
JP2014043363A (en) * 2012-08-24 2014-03-13 Hamamatsu Photonics Kk Reinforced glass member working method
KR20180040361A (en) * 2016-10-12 2018-04-20 주식회사 이오테크닉스 Processing apparatus and processing method using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021221378A1 (en) * 2020-04-28 2021-11-04 주식회사 아이티아이 Ceramic cutting method and equipment

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