JP2014043363A - Reinforced glass member working method - Google Patents

Reinforced glass member working method Download PDF

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JP2014043363A
JP2014043363A JP2012185644A JP2012185644A JP2014043363A JP 2014043363 A JP2014043363 A JP 2014043363A JP 2012185644 A JP2012185644 A JP 2012185644A JP 2012185644 A JP2012185644 A JP 2012185644A JP 2014043363 A JP2014043363 A JP 2014043363A
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layer
glass member
tempered glass
tempered
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Hideki Shimoi
英樹 下井
Keisuke Araki
佳祐 荒木
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Hamamatsu Photonics KK
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Abstract

PROBLEM TO BE SOLVED: To provide a reinforced glass member working method capable of working a reinforced glass member easily while suppressing the breakage due to the compression stress of a reinforced layer.SOLUTION: In this reinforced glass member working method, a glass layer 10 is exposed by peeling reinforced layers 11 and 12 along a working-scheduled line 5 so that the exposed glass layer 10 can be worked (e.g., cut) by using the conventional tool cutting or laser scribing method. According to this reinforced glass member working method, therefore, a reinforced glass member 1 can be easily worked while suppressing the breakage which is caused by the compression stress of the reinforced layers 11 and 12.

Description

本発明は、ガラス層の上に形成された強化層を有する強化ガラス部材を加工するための強化ガラス部材加工方法に関する。   The present invention relates to a tempered glass member processing method for processing a tempered glass member having a tempered layer formed on a glass layer.

ガラス部材を加工するための従来の技術として、例えば、特許文献１に記載のガラス基板面取り方法が知られている。このガラス基板面取方法では、ガラス基板の稜線部付近に局所的にレーザ光を照射することにより、局所的熱膨張に伴う熱応力によってクラックを生じさせる。そして、ガラス基板の稜線部に沿ってレーザ光を走査することにより、稜線部に沿ってクラックを成長させ、ガラス基板から稜線部を剥離する。   As a conventional technique for processing a glass member, for example, a glass substrate chamfering method described in Patent Document 1 is known. In this glass substrate chamfering method, a laser beam is locally irradiated in the vicinity of the ridge line portion of the glass substrate, thereby generating a crack due to thermal stress accompanying local thermal expansion. And a laser beam is scanned along the ridgeline part of a glass substrate, a crack is grown along a ridgeline part, and a ridgeline part is peeled from a glass substrate.

特開平９−２２５６６５号公報Japanese Patent Laid-Open No. 9-225665

ところで、現在、例えばスマートフォンといった携帯端末やディスプレイ等への強化ガラス部材の利用が期待されている。それに伴って、現在、強化ガラス部材の加工の要求が高まっている。強化ガラス部材は、通常のガラスからなるガラス層と、そのガラス層の上に形成され圧縮応力を保持する強化層とを有している。このため、強化ガラス部材は、従来の工具切削等により強化層を切削して加工しようとすると、強化層の圧縮応力によって破損が生じるおそれがあり、加工が困難であった。   By the way, at present, the use of tempered glass members for mobile terminals such as smartphones and displays is expected. In connection with it, the request | requirement of the process of a tempered glass member is increasing now. The tempered glass member has a glass layer made of ordinary glass and a tempered layer that is formed on the glass layer and holds compressive stress. For this reason, when trying to process the tempered glass member by cutting the tempered layer by conventional tool cutting or the like, the tempered glass member may be damaged due to the compressive stress of the tempered layer, which makes it difficult to process.

本発明は、そのような事情に鑑みてなされたものであり、強化層の圧縮応力に起因した破損を抑制しつつ容易に強化ガラス部材を加工可能な強化ガラス部材加工方法を提供することを課題とする。   This invention is made | formed in view of such a situation, and it is a subject to provide the tempered glass member processing method which can process a tempered glass member easily, suppressing the damage resulting from the compressive stress of a reinforced layer. And

本発明者らは、上記課題を解決するために鋭意研究を重ねた結果、加工対象物にレーザ光を照射することによりその加工対象物の一部分を剥離する技術が、強化ガラスに対して適用可能であることを見出した。本発明は、本発明者らがそのような知見に基づいて更なる研究を重ねた結果になされたものである。   As a result of intensive studies to solve the above problems, the present inventors can apply a technique for peeling a part of the processing object by irradiating the processing object with laser light to tempered glass. I found out. The present invention has been made as a result of further studies by the present inventors based on such findings.

すなわち、本発明に係る強化ガラス部材加工方法は、ガラス層とガラス層の上に形成され表面を含む第１強化層とを有し、加工予定ラインが設定された強化ガラス部材を用意する第１工程と、加工予定ラインに沿って第１強化層にレーザ光を照射することにより、加工予定ラインに沿って部分的にガラス層から第１強化層を剥離し、加工予定ラインに沿って表面側にガラス層を露出する第２工程と、を備えることを特徴とする。   That is, the tempered glass member processing method according to the present invention is a first method of preparing a tempered glass member having a glass layer and a first tempered layer formed on the glass layer and including the surface, and having a planned processing line set. By irradiating the first reinforcing layer with the laser beam along the process and the planned processing line, the first reinforcing layer is partially peeled from the glass layer along the planned processing line, and the surface side along the planned processing line. And a second step of exposing the glass layer.

この強化ガラス部材加工方法においては、まず、ガラス層の上に形成せれた第１強化層を有する強化ガラス部材を用意する。そして、加工予定ラインに沿って第１強化層にレーザ光を照射することにより、加工予定ラインに沿って第１強化層を剥離してガラス層を露出させる。このように、加工予定ラインに沿って第１強化層を剥離してガラス層を露出させれば、露出したガラス層に対して従来の工具切削やレーザスクライブ等を用いて加工を行うことが可能となる。よって、この強化ガラス部材加工方法によれば、強化層の圧縮応力に起因した破損を抑制しつつ容易に強化ガラス部材の加工が可能となる。   In this tempered glass member processing method, first, a tempered glass member having a first tempered layer formed on a glass layer is prepared. Then, by irradiating the first reinforcing layer with the laser beam along the planned processing line, the first reinforcing layer is peeled along the planned processing line to expose the glass layer. In this way, if the first reinforcing layer is peeled along the planned processing line to expose the glass layer, the exposed glass layer can be processed using conventional tool cutting, laser scribing, or the like. It becomes. Therefore, according to this method for processing a tempered glass member, it is possible to easily process the tempered glass member while suppressing breakage due to the compressive stress of the tempered layer.

本発明に係る強化ガラス部材加工方法においては、強化ガラス部材は、ガラス層の上に形成され裏面を含む第２強化層を有し、加工予定ラインに沿って第２強化層にレーザ光を照射することにより、加工予定ラインに沿って部分的にガラス層から第２強化層を剥離し、加工予定ラインに沿って裏面側にガラス層を露出する第３工程をさらに備えることができる。このように、表面及び裏面に強化層が形成されている場合には、それぞれの強化層を部分的に剥離してガラス層を露出させることが効果的である。   In the tempered glass member processing method according to the present invention, the tempered glass member has a second tempered layer formed on the glass layer and including the back surface, and irradiates the second tempered layer with laser light along the planned processing line. By doing, it can further comprise the 3rd process which exfoliates a 2nd reinforcement layer from a glass layer partially along a process schedule line, and exposes a glass layer to the back side along a process schedule line. Thus, when the reinforcement layer is formed in the surface and the back surface, it is effective to peel each reinforcement layer partially and to expose a glass layer.

本発明に係る強化ガラス部材加工方法においては、加工予定ラインは、強化ガラス部材の一端から他端まで延在しており、加工予定ラインに沿って露出したガラス層を加工して強化ガラス部材を切断する第４工程をさらに備えることができる。この場合、破損を抑制しつつ強化ガラス部材を切断することができる。   In the tempered glass member processing method according to the present invention, the planned processing line extends from one end of the tempered glass member to the other end, and the tempered glass member is processed by processing the glass layer exposed along the planned processing line. A fourth step of cutting may further be provided. In this case, the tempered glass member can be cut while suppressing breakage.

本発明に係る強化ガラス部材加工方法においては、加工予定ラインに沿って露出したガラス層を切削することにより強化ガラス部材に溝又は貫通孔を形成する第５工程をさらに備えることができる。この場合、破損を抑制しつつ強化ガラス部材に溝又は貫通孔を形成することができる。   The tempered glass member processing method according to the present invention may further include a fifth step of forming a groove or a through hole in the tempered glass member by cutting the glass layer exposed along the planned processing line. In this case, a groove or a through hole can be formed in the tempered glass member while preventing breakage.

本発明によれば、強化層の圧縮応力に起因した破損を抑制しつつ容易に強化ガラス部材を加工可能な強化ガラス部材加工方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the tempered glass member processing method which can process a tempered glass member easily can be provided, suppressing the damage resulting from the compressive stress of a reinforced layer.

加工対象物としての強化ガラス部材の斜視図である。It is a perspective view of the tempered glass member as a processing target object. 本実施形態に係る強化ガラス部材加工方法の強化層を剥離する工程を説明するための図である。It is a figure for demonstrating the process of peeling the reinforcement | strengthening layer of the tempered glass member processing method which concerns on this embodiment. 本実施形態に係る強化ガラス部材加工方法の強化層を剥離する工程を説明するための図である。It is a figure for demonstrating the process of peeling the reinforcement | strengthening layer of the tempered glass member processing method which concerns on this embodiment. 本実施形態に係る強化ガラス部材加工方法の強化層を剥離する工程を説明するための図である。It is a figure for demonstrating the process of peeling the reinforcement | strengthening layer of the tempered glass member processing method which concerns on this embodiment. 本実施形態に係る強化ガラス部材加工方法の強化ガラス部材を切断する工程を説明するための図である。It is a figure for demonstrating the process of cut | disconnecting the tempered glass member of the tempered glass member processing method which concerns on this embodiment. 本実施形態に係る強化ガラス部材加工方法の変形例を説明するための図である。It is a figure for demonstrating the modification of the tempered glass member processing method which concerns on this embodiment. 本実施形態に係る強化ガラス部材加工方法の変形例を説明するための図である。It is a figure for demonstrating the modification of the tempered glass member processing method which concerns on this embodiment.

以下、本発明の一実施形態に係る強化ガラス部材加工方法ついて、図面を参照して詳細に説明する。なお、各図において、同一又は相当部分には同一の符号を付し、重複する説明を省略する。   Hereinafter, a tempered glass member processing method according to an embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

本実施形態に係る強化ガラス部材加工方法では、まず、図１に示されるように、加工対象物としての強化ガラス部材１を用意する（第１工程）。強化ガラス部材１は、矩形板状を呈しており、表面３及び裏面４を有している。強化ガラス部材１には、加工予定ライン５が設定されている。加工予定ライン５は、ここでは、強化ガラス部材１の一端から他端まで直線状に延在する仮想線であるが、強化ガラス部材１の加工の態様に応じて任意の形状に設定することができる。また、加工予定ライン５は、仮想線に限らず、強化ガラス部材１の表面３や裏面４等に実際に引かれた線であってもよい。   In the tempered glass member processing method according to the present embodiment, first, as shown in FIG. 1, a tempered glass member 1 as a processing object is prepared (first step). The tempered glass member 1 has a rectangular plate shape and has a front surface 3 and a back surface 4. The tempered glass member 1 is provided with a scheduled processing line 5. Here, the planned processing line 5 is a virtual line extending linearly from one end of the tempered glass member 1 to the other end, but may be set to an arbitrary shape according to the processing mode of the tempered glass member 1. it can. Further, the planned processing line 5 is not limited to a virtual line, and may be a line actually drawn on the front surface 3 or the back surface 4 of the tempered glass member 1.

強化ガラス部材１は、通常のガラスからなるガラス層（母材ガラス）１０と、ガラス層１０の上に形成された強化層（第１強化層）１１及び強化層（第２強化層）１２とを有している。強化層１１及び強化層１２は、圧縮応力を保持している。強化層１１は、強化ガラス部材１の表面３を含む。強化層１２は、強化ガラス部材１の裏面４を含む。したがって、強化層１１と強化層１２とは、ガラス層１０を挟んで互いに対向している。強化層１１及び強化層１２の厚さは、それぞれ、例えば５０μｍ程度である。なお、強化ガラス部材１においては、その側面を含むようにガラス層１０の上に強化層が形成されていてもよい。   The tempered glass member 1 includes a glass layer (base glass) 10 made of ordinary glass, a reinforced layer (first reinforced layer) 11 and a reinforced layer (second reinforced layer) 12 formed on the glass layer 10. have. The reinforcing layer 11 and the reinforcing layer 12 retain compressive stress. The reinforcing layer 11 includes the surface 3 of the tempered glass member 1. The reinforcing layer 12 includes the back surface 4 of the tempered glass member 1. Therefore, the reinforcing layer 11 and the reinforcing layer 12 are opposed to each other with the glass layer 10 interposed therebetween. Each of the reinforcing layer 11 and the reinforcing layer 12 has a thickness of about 50 μm, for example. In the tempered glass member 1, the tempered layer may be formed on the glass layer 10 so that the side surface may be included.

このような強化ガラス部材１は、例えば、通常のガラス部材をカリウム溶液に浸けこんで、外表面のナトリウムイオンとカリウムイオンとを置換することにより、その外表面に圧縮応力層（強化層）を形成することよって製造することができる（化学強化法）。   Such a tempered glass member 1 is formed by, for example, immersing a normal glass member in a potassium solution to replace sodium ions and potassium ions on the outer surface, thereby providing a compressive stress layer (strengthening layer) on the outer surface. It can be manufactured by forming (chemical strengthening method).

続く工程では、図２及び図３に示されるように、加工予定ライン５に沿って強化層１１にレーザ光Ｌ１を照射することにより、加工予定ライン５に沿って部分的にガラス層１０から強化層１１を剥離（除去）し、加工予定ライン５に沿って表面３側にガラス層１０を露出させる（第２工程）。この工程について詳細に説明する。   In the subsequent process, as shown in FIGS. 2 and 3, the reinforcing layer 11 is irradiated with the laser light L <b> 1 along the planned processing line 5, thereby partially strengthening from the glass layer 10 along the planned processing line 5. The layer 11 is peeled (removed), and the glass layer 10 is exposed on the surface 3 side along the planned processing line 5 (second step). This process will be described in detail.

この工程では、図２に示されるように、強化ガラス部材１の表面３をレーザ光Ｌ１の入射面とする。そして、レーザ光Ｌ１のビームスポットＳＰを、表面３（強化層１１）に位置させつつ強化ガラス部材１の一端から他端にわたって加工予定ライン５に沿って相対移動させる（すなわち、強化層１１に対して矢印Ａ方向にレーザ光Ｌ１を走査する）。これにより、図２の（ｂ）に示されるように、レーザ光Ｌ１のビームスポットＳＰの移動に伴って、加工予定ライン５に沿って部分的にガラス層１０から強化層１１（及びガラス層１０の一部）がめくり上がるようにして剥離される。   In this step, as shown in FIG. 2, the surface 3 of the tempered glass member 1 is used as the incident surface of the laser light L1. Then, the beam spot SP of the laser beam L1 is relatively moved along the processing line 5 from one end of the tempered glass member 1 to the other end while being positioned on the surface 3 (the reinforced layer 11) (that is, with respect to the reinforced layer 11). The laser beam L1 is scanned in the direction of arrow A). As a result, as shown in FIG. 2B, the glass layer 10 and the reinforcing layer 11 (and the glass layer 10) partially along the planned processing line 5 as the beam spot SP of the laser beam L <b> 1 moves. Is peeled off as part of

強化層１１の剥離は、レーザ光Ｌ１の照射で強化ガラス部材１が加熱され、その加熱によって生じるせん断力に応じてビームスポットＳＰの移動方向（レーザ光Ｌ１の走査方向）に連続的に強化ガラス部材１に亀裂が生じ、その後に、強化ガラス部材１の表面３が自然空冷により収縮することによって生じるものと考えられる。このような強化層１１の剥離により、図３に示されるように、強化ガラス部材１の一端から他端にわたって加工予定ライン５に沿うように表面３に溝１３が形成され、表面３側にガラス層１０が露出する。なお、図３の（ｂ）は、図３の（ａ）のIII−III線に沿っての強化ガラス部材の断面図である。   The tempered layer 11 is peeled by heating the tempered glass member 1 by irradiation with the laser beam L1, and continuously tempering glass in the moving direction of the beam spot SP (scanning direction of the laser beam L1) according to the shearing force generated by the heating. It is considered that a crack is generated in the member 1 and then the surface 3 of the tempered glass member 1 is contracted by natural air cooling. As shown in FIG. 3, the peeling of the reinforced layer 11 forms a groove 13 on the surface 3 along the planned processing line 5 from one end to the other end of the tempered glass member 1, and glass on the surface 3 side. Layer 10 is exposed. FIG. 3B is a cross-sectional view of the tempered glass member taken along the line III-III in FIG.

続く工程では、上記工程と同様にして、加工予定ライン５に沿って強化層１２にレーザ光Ｌ１を照射することにより、加工予定ライン５に沿って部分的にガラス層１０から強化層１２（及びガラス層１０の一部）を剥離し、加工予定ライン５に沿って裏面４側にガラス層１０を露出させる（第３工程）。これにより、図４に示されるように、強化ガラス部材１の一端から他端にわたって加工予定ライン５に沿うように裏面４に溝１４が形成され、裏面４側にもガラス層１０が露出する。   In the subsequent step, the reinforcing layer 12 is irradiated with the laser beam L1 along the planned processing line 5 in the same manner as the above-described step, so that the reinforcing layer 12 (and the glass layer 10 partially extends along the planned processing line 5). A part of the glass layer 10) is peeled off, and the glass layer 10 is exposed on the back surface 4 side along the planned processing line 5 (third step). Accordingly, as shown in FIG. 4, a groove 14 is formed on the back surface 4 along the planned processing line 5 from one end to the other end of the tempered glass member 1, and the glass layer 10 is exposed also on the back surface 4 side.

なお、図４の（ｂ）は、図４の（ａ）のIV−IV線に沿っての強化ガラス部材の断面図である。また、表面３側及び裏面４側におけるガラス層１０の露出位置（すなわち、溝１３及び溝１４の位置）は、強化ガラス部材１の厚さ方向（すなわち、表面３及び裏面４に垂直な方向）について互いに対応した位置となる。また、レーザ光Ｌ１の光源としては、例えばＣＯ２レーザを用いることができる。レーザ光Ｌ１の照射条件は、強化ガラス部材１の厚さ方向について、溝１３及び溝１４がガラス層１０に達するように設定される。 4B is a cross-sectional view of the tempered glass member taken along the line IV-IV in FIG. Further, the exposed position of the glass layer 10 on the front surface 3 side and the back surface 4 side (that is, the position of the groove 13 and the groove 14) is the thickness direction of the tempered glass member 1 (that is, the direction perpendicular to the front surface 3 and the back surface 4). Are positions corresponding to each other. Moreover, as a light source of the laser beam L1, for example, a CO 2 laser can be used. The irradiation condition of the laser beam L1 is set so that the groove 13 and the groove 14 reach the glass layer 10 in the thickness direction of the tempered glass member 1.

続く工程では、加工予定ライン５に沿って露出したガラス層１０に所定の加工を施し、加工予定ライン５に沿って強化ガラス部材１を切断する（第４工程）。この工程においては、すでに加工予定ライン５に沿ってガラス層１０が露出しているので、従来のガラスを切断するための任意の技術（例えば工具切削やレーザスクライブ等）を適用することができるが、本実施形態においては、次のようにして強化ガラス部材１を切断する。   In the subsequent process, the glass layer 10 exposed along the planned processing line 5 is subjected to predetermined processing, and the tempered glass member 1 is cut along the planned processing line 5 (fourth process). In this step, since the glass layer 10 has already been exposed along the planned processing line 5, any conventional technique for cutting glass (for example, tool cutting or laser scribing) can be applied. In this embodiment, the tempered glass member 1 is cut as follows.

すなわち、この工程においては、図５の（ａ）に示されるように、強化ガラス部材１にレーザ光Ｌ２を照射して、強化ガラス部材１の内部に改質領域７を形成する。より具体的には、ガラス層１０の露出した部分（溝１３又は溝１４の内面部分）をレーザ光Ｌ２の入射部とし、ガラス層１０の内部にレーザ光Ｌ２の集光点Ｐを位置させる。そして、強化ガラス部材１の一端から他端にわたって加工予定ライン５に沿うようにレーザ光Ｌ２の集光点Ｐを相対移動させることにより、加工予定ライン５に沿って改質領域７を形成する。その後、改質領域７から生じた割れ８を溝１３及び溝１４まで伸展させることにより、図５の（ｂ）に示されるように強化ガラス部材１を切断する。   That is, in this step, as shown in FIG. 5A, the tempered glass member 1 is irradiated with the laser light L <b> 2 to form the modified region 7 inside the tempered glass member 1. More specifically, the exposed portion of the glass layer 10 (the inner surface portion of the groove 13 or the groove 14) is used as an incident portion of the laser light L2, and the condensing point P of the laser light L2 is positioned inside the glass layer 10. Then, the modified region 7 is formed along the planned processing line 5 by relatively moving the condensing point P of the laser light L2 along the planned processing line 5 from one end to the other end of the tempered glass member 1. Thereafter, the tempered glass member 1 is cut as shown in FIG. 5B by extending the crack 8 generated from the modified region 7 to the groove 13 and the groove 14.

なお、このとき形成される改質領域７は、溶融処理領域（一旦溶融後に再固化した領域、溶融状態にある領域、及び溶融状態から再固化する途中の状態にある領域の少なくとも一つを含む領域を意味する）やクラック領域等を含む。また、レーザ光Ｌ２がパルスレーザ光である場合には、改質領域７は、１パルスのショット（つまり１パルスのレーザ照射：レーザショット）によって形成される改質スポットの集合として構成される。また、改質領域７は、改質スポットから延びる複数の亀裂を含む場合がある。   The reformed region 7 formed at this time includes at least one of a melting treatment region (a region that has been re-solidified after melting, a region that is in a molten state, and a region that is in the middle of being re-solidified from a molten state). Means a region) and a crack region. When the laser beam L2 is a pulsed laser beam, the modified region 7 is configured as a set of modified spots formed by one pulse shot (that is, one pulse laser irradiation: laser shot). The modified region 7 may include a plurality of cracks extending from the modified spot.

以上説明したように、本実施形態に係る強化ガラス部材加工方法においては、まず、ガラス層１０の上に形成された強化層１１，１２を有する強化ガラス部材１を用意する。そして、加工予定ライン５に沿って強化層１１，１２にレーザ光Ｌ１を照射することにより、加工予定ライン５に沿って強化層１１，１２（及びガラス層１０の一部）を剥離してガラス層１０を露出させる。   As described above, in the tempered glass member processing method according to the present embodiment, first, the tempered glass member 1 having the tempered layers 11 and 12 formed on the glass layer 10 is prepared. The reinforcing layers 11 and 12 (and a part of the glass layer 10) are peeled off along the planned processing line 5 by irradiating the reinforcing layers 11 and 12 with the laser beam L1 along the planned processing line 5. Layer 10 is exposed.

このように、加工予定ライン５に沿って強化層１１，１２を剥離してガラス層１０を露出させれば、露出したガラス層１０に対して従来の工具切削やレーザスクライブ、或いは上述したレーザ加工方法等を用いて加工（ここでは切断）を行うことができる。よって、この強化ガラス部材加工方法によれば、強化層１１の圧縮応力に起因した破損を抑制しつつ容易に強化ガラス部材１を切断することができる。   As described above, if the reinforcing layers 11 and 12 are peeled along the planned processing line 5 to expose the glass layer 10, the conventional glass cutting or laser scribing with respect to the exposed glass layer 10, or the laser processing described above. Processing (here, cutting) can be performed using a method or the like. Therefore, according to this tempered glass member processing method, the tempered glass member 1 can be easily cut while suppressing breakage due to the compressive stress of the reinforced layer 11.

以上の実施形態は、本発明に係る強化ガラス部材加工方法の一実施形態を説明したものである。したがって、本発明に係る強化ガラス部材加工方法は、上述したものに限定されない。本発明に係る強化ガラス部材加工方法は、特許請求の範囲に記した各請求項の要旨を変更しない範囲において、上述したものを任意に変更することができる。   The above embodiment demonstrates one Embodiment of the tempered glass member processing method which concerns on this invention. Therefore, the tempered glass member processing method according to the present invention is not limited to the above-described method. In the method for processing a tempered glass member according to the present invention, the above-described method can be arbitrarily changed without changing the gist of each claim described in the claims.

例えば、上記実施形態においては、強化ガラス部材１を切断する場合について説明したが、本発明に係る強化ガラス部材加工方法はこれに限定されず、強化ガラス部材１に溝や貫通孔を形成する場合についても適用することができる。その場合には、図６の（ａ）に示されるように、まず、強化ガラス部材１に対して、溝形成や貫通孔形成のための加工領域ＡＲを設定する。   For example, in the said embodiment, although the case where the tempered glass member 1 was cut | disconnected was demonstrated, the tempered glass member processing method which concerns on this invention is not limited to this, When forming a groove | channel and a through-hole in the tempered glass member 1 Can also be applied. In that case, as shown in FIG. 6A, first, a processing area AR for groove formation and through-hole formation is set for the tempered glass member 1.

ここでは、加工領域ＡＲは、強化ガラス部材１の外周部から所定距離内側に位置し、矩形状を呈している。加工領域ＡＲの位置・形状については、所望する加工の態様に応じて任意に設定することができる。また、ここでは、加工予定ライン５は、加工予定ライン５に沿ってレーザ光Ｌ１を照射したときに、レーザ光Ｌ１のビームスポットＳＰが加工領域ＡＲの全体に及ぶように、加工領域ＡＲ内において蛇行するように設定されている。   Here, the processing area AR is located inside a predetermined distance from the outer peripheral portion of the tempered glass member 1 and has a rectangular shape. The position and shape of the machining area AR can be arbitrarily set according to the desired machining mode. Further, here, the planned processing line 5 is within the processing area AR so that the beam spot SP of the laser beam L1 extends over the entire processing area AR when the laser light L1 is irradiated along the processing planned line 5. It is set to meander.

続いて、上記実施形態で説明したように、加工予定ライン５に沿って強化層１１にレーザ光Ｌ１を照射することにより、加工予定ライン５に沿って部分的に強化層１１（及びガラス層１０の一部）を剥離する。これにより、図６の（ｂ）に示されるように加工領域ＡＲに対応した形状に溝１５が形成され、ガラス層１０が露出する。   Subsequently, as described in the above embodiment, the reinforcing layer 11 is irradiated along the planned processing line 5 with the laser beam L1, so that the reinforcing layer 11 (and the glass layer 10) partially along the planned processing line 5. Part). Thereby, as shown in FIG. 6B, the groove 15 is formed in a shape corresponding to the processing region AR, and the glass layer 10 is exposed.

その後は、加工予定ライン５に沿って（すなわち、加工領域ＡＲに対応した形状で）露出したガラス層１０を切削することにより、図７の（ａ）に示されるように、表面３側に開放された溝１６を強化ガラス部材１に形成する、或いは、図７の（ｂ）に示されるように、表面３と裏面４とを連通する貫通孔１７を強化ガラス部材１に形成する（第５工程）。この工程では、すでに加工領域ＡＲに応じた形状でガラス層１０が露出しているので、例えば工具切削やレーザスクライブ等の任意の従来の技術を利用することができる。   Thereafter, the exposed glass layer 10 is cut along the planned processing line 5 (that is, in a shape corresponding to the processing region AR), so that it is opened to the surface 3 side as shown in FIG. The formed groove 16 is formed in the tempered glass member 1 or, as shown in FIG. 7B, a through-hole 17 that communicates the front surface 3 and the back surface 4 is formed in the tempered glass member 1 (fifth). Process). In this step, since the glass layer 10 is already exposed in a shape corresponding to the processing area AR, for example, any conventional technique such as tool cutting or laser scribing can be used.

なお、強化ガラス部材１に貫通孔１７を形成する場合には、加工予定ライン５に沿って強化層１２にレーザ光Ｌ１を照射し、加工予定ライン５に沿って部分的に強化層１２（及びガラス層１０の一部）を剥離して、加工領域ＡＲに対応した形状でガラス層１０を露出させておくことが望ましい。   When the through hole 17 is formed in the tempered glass member 1, the reinforced layer 12 is irradiated with the laser beam L <b> 1 along the planned processing line 5, and the reinforced layer 12 (and It is desirable to peel off a part of the glass layer 10 to expose the glass layer 10 in a shape corresponding to the processing area AR.

以上のように、レーザ光Ｌ１の照射によって強化層１１（及び強化層１２）を剥離してガラス層１０を露出させれば、従来の工具切削やレーザスクライブ等によってガラス層１０を切削することが可能となるので、強化層の圧縮応力に起因した破損を抑制しつつ容易に強化ガラス部材に溝１６や貫通孔１７を形成することができる。   As described above, if the glass layer 10 is exposed by peeling the reinforcing layer 11 (and the reinforcing layer 12) by irradiation with the laser beam L1, the glass layer 10 can be cut by conventional tool cutting, laser scribing, or the like. Therefore, the grooves 16 and the through holes 17 can be easily formed in the tempered glass member while suppressing breakage due to the compressive stress of the reinforced layer.

なお、上記実施形態においては、強化ガラス部材１は、ガラス層１０の両側に強化層（強化層１１，１２）が形成されているものとしたが、強化ガラス部材１は、ガラス層１０の一方の側のみに強化層が形成されているものであってもよい。また、強化ガラス部材１は、矩形板状に限らず、任意の形状のものを利用することができる。   In the above embodiment, the tempered glass member 1 has the tempered layers (strengthened layers 11 and 12) formed on both sides of the glass layer 10, but the tempered glass member 1 is one of the glass layers 10. The reinforcing layer may be formed only on the side. Moreover, the tempered glass member 1 is not limited to a rectangular plate shape, and any shape can be used.

１…強化ガラス部材、３…表面、４…裏面、５…加工予定ライン、１０…ガラス層、１１…強化層、１２…強化層、１６…溝、１７…貫通孔、Ｌ１…レーザ光。   DESCRIPTION OF SYMBOLS 1 ... Tempered glass member, 3 ... Front surface, 4 ... Back surface, 5 ... Planned process line, 10 ... Glass layer, 11 ... Strengthening layer, 12 ... Strengthening layer, 16 ... Groove, 17 ... Through-hole, L1 ... Laser beam.

Claims (4)

ガラス層と前記ガラス層の上に形成され表面を含む第１強化層とを有し、加工予定ラインが設定された強化ガラス部材を用意する第１工程と、
前記加工予定ラインに沿って前記第１強化層にレーザ光を照射することにより、前記加工予定ラインに沿って部分的に前記ガラス層から前記第１強化層を剥離し、前記加工予定ラインに沿って前記表面側に前記ガラス層を露出する第２工程と、
を備えることを特徴とする強化ガラス部材加工方法。 A first step of preparing a tempered glass member having a glass layer and a first tempered layer formed on the glass layer and including a surface;
By irradiating the first reinforcing layer with the laser beam along the planned processing line, the first reinforcing layer is partially peeled from the glass layer along the planned processing line, and along the processing planned line. A second step of exposing the glass layer on the surface side,
A tempered glass member processing method comprising: 前記強化ガラス部材は、前記ガラス層の上に形成され裏面を含む第２強化層を有し、
前記加工予定ラインに沿って前記第２強化層にレーザ光を照射することにより、前記加工予定ラインに沿って部分的に前記ガラス層から前記第２強化層を剥離し、前記加工予定ラインに沿って前記裏面側に前記ガラス層を露出する第３工程をさらに備える、ことを特徴とする請求項１に記載の強化ガラス部材加工方法。 The tempered glass member has a second tempered layer formed on the glass layer and including a back surface,
By irradiating the second reinforcing layer with the laser beam along the planned processing line, the second reinforcing layer is partially peeled from the glass layer along the planned processing line, and along the planned processing line. The tempered glass member processing method according to claim 1, further comprising a third step of exposing the glass layer on the back surface side. 前記加工予定ラインは、前記強化ガラス部材の一端から他端まで延在しており、
前記加工予定ラインに沿って露出した前記ガラス層を加工して前記強化ガラス部材を切断する第４工程をさらに備える、ことを特徴とする請求項１又は２に記載の強化ガラス部材加工方法。 The processing planned line extends from one end of the tempered glass member to the other end,
The tempered glass member processing method according to claim 1, further comprising a fourth step of processing the glass layer exposed along the planned processing line and cutting the tempered glass member. 前記加工予定ラインに沿って露出した前記ガラス層を切削することにより前記強化ガラス部材に溝又は貫通孔を形成する第５工程をさらに備える、ことを特徴とする請求項１又は２に記載の強化ガラス部材加工方法。   The reinforcement | strengthening of Claim 1 or 2 further equipped with the 5th process of forming a groove | channel or a through-hole in the said tempered glass member by cutting the said glass layer exposed along the said process plan line. Glass member processing method.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628449B1 (en) * 2014-01-22 2014-11-19 有限会社アリューズ Tempered glass processing method and tempered glass processing apparatus
KR102216294B1 (en) * 2020-07-22 2021-02-18 주식회사 아이티아이 Method and equipment of cutting ceramic
KR102216298B1 (en) * 2020-04-28 2021-02-18 주식회사 아이티아이 Method and equipment of cutting ceramic
WO2021181766A1 (en) * 2020-03-11 2021-09-16 日東電工株式会社 Method for dividing composite material
WO2021221378A1 (en) * 2020-04-28 2021-11-04 주식회사 아이티아이 Ceramic cutting method and equipment
WO2023211796A1 (en) * 2022-04-28 2023-11-02 Meta Platforms Technologies, Llc Glass-film lamination and cutting method to mitigate orange peel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003088989A (en) * 2001-09-13 2003-03-25 Japan Science & Technology Corp Method for breaking and cutting with laser beam, method for manufacturing lens or lens mold using the method for breaking and cutting and lens and lens mold formed with the method for manufacturing
WO2009050938A1 (en) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
JP2011102230A (en) * 2009-10-13 2011-05-26 Canon Inc Method of notching brittle material, method of making member having notch, and method of making display device
JP2011241108A (en) * 2010-05-17 2011-12-01 Disco Corp Method for dividing glass plate
JP2012031018A (en) * 2010-07-30 2012-02-16 Asahi Glass Co Ltd Tempered glass substrate, method for grooving tempered glass substrate, and method for cutting tempered glass substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003088989A (en) * 2001-09-13 2003-03-25 Japan Science & Technology Corp Method for breaking and cutting with laser beam, method for manufacturing lens or lens mold using the method for breaking and cutting and lens and lens mold formed with the method for manufacturing
WO2009050938A1 (en) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
US20100320179A1 (en) * 2007-10-16 2010-12-23 Hideki Morita Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same
JP2011102230A (en) * 2009-10-13 2011-05-26 Canon Inc Method of notching brittle material, method of making member having notch, and method of making display device
JP2011241108A (en) * 2010-05-17 2011-12-01 Disco Corp Method for dividing glass plate
JP2012031018A (en) * 2010-07-30 2012-02-16 Asahi Glass Co Ltd Tempered glass substrate, method for grooving tempered glass substrate, and method for cutting tempered glass substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628449B1 (en) * 2014-01-22 2014-11-19 有限会社アリューズ Tempered glass processing method and tempered glass processing apparatus
WO2021181766A1 (en) * 2020-03-11 2021-09-16 日東電工株式会社 Method for dividing composite material
KR102216298B1 (en) * 2020-04-28 2021-02-18 주식회사 아이티아이 Method and equipment of cutting ceramic
WO2021221378A1 (en) * 2020-04-28 2021-11-04 주식회사 아이티아이 Ceramic cutting method and equipment
KR102216294B1 (en) * 2020-07-22 2021-02-18 주식회사 아이티아이 Method and equipment of cutting ceramic
WO2023211796A1 (en) * 2022-04-28 2023-11-02 Meta Platforms Technologies, Llc Glass-film lamination and cutting method to mitigate orange peel

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