KR102207322B1 - Molded release film for heat press process during printed circuit board manufacturing process - Google Patents

Molded release film for heat press process during printed circuit board manufacturing process Download PDF

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KR102207322B1
KR102207322B1 KR1020200078962A KR20200078962A KR102207322B1 KR 102207322 B1 KR102207322 B1 KR 102207322B1 KR 1020200078962 A KR1020200078962 A KR 1020200078962A KR 20200078962 A KR20200078962 A KR 20200078962A KR 102207322 B1 KR102207322 B1 KR 102207322B1
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circuit board
printed circuit
film
release film
heat press
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KR1020200078962A
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Korean (ko)
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양문일
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양문일
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention relates to a molding release film for a heat press process of a printed circuit board of a new configuration, that can reduce product defects by preventing a printed circuit board from being contaminated due to a gas generated from a PVC film used as a molding layer during a heat press process of laminating a coverlay on the printed circuit board and manufacture high-quality printed circuit board products by making the coverlay adhere well to the surface of the printed circuit board without separation. According to the present invention, the molding release film for a heat press process of a printed circuit board comprises: paper (10); a PVC film (20) laminated on the paper (10); a nylon film (30) laminated on the PVC film (20); and a release film (40) laminated on the nylon film (30).

Description

인쇄회로기판의 열프레스공정용 성형이형필름 {Molded release film for heat press process during printed circuit board manufacturing process}Molded release film for heat press process during printed circuit board manufacturing process

본 발명은 인쇄회로기판의 열프레스공정용 성형이형필름에 관한 것으로서, 인쇄회로기판 표면에 커버레이를 부착시켜 열프레스시 PVC Conformer Film으로 발생되는 가스가 인쇄회로기판을 오염시키는 것을 방지하고, 커버레이를 연성인쇄회로기판에 밀착시켜서, 표면에 있는 회로에서 들뜨지 않고 잘부착 되도록하여 고품질의 인쇄회로기판 제품을 제조할 수 있는 새로운 구성의 인쇄회로기판 열프레스공정용 성형이형필름에 관한 것이다. The present invention relates to a molded release film for a heat press process of a printed circuit board, and a coverlay is attached to the surface of the printed circuit board to prevent the gas generated by the PVC conformer film from contaminating the printed circuit board during heat press, and cover The present invention relates to a molded release film for a heat press process of a printed circuit board with a new configuration capable of manufacturing a high-quality printed circuit board product by attaching a ray closely to a flexible printed circuit board so that it does not lift and adheres well to the circuit on the surface.

인쇄회로기판(PCB, Printed Circuit Board)은 TV, 휴대폰 등의 전자 제품에 다양하게 사용되고 있다. 이러한 PCB 중에서도 플렉시블(Flexible)한 특성을 갖는 연성회로기판(FPCB)이 개발되어, 광범위하게 사용되고 있다. 연성회로기판의 외측에는 금속회로패턴을 보호하기 위해 통상 폴리이미드계 소재의 커버레이(cover-lay)가 적층된다. Printed circuit boards (PCBs) are widely used in electronic products such as TVs and mobile phones. Among these PCBs, a flexible circuit board (FPCB) having a flexible characteristic has been developed and is widely used. On the outside of the flexible circuit board, a cover-lay of a polyimide-based material is usually stacked to protect the metal circuit pattern.

이러한 커버레이를 인쇄회로기판에 부착시키는 작업은 접착제가 도포된 커버레이를 인쇄회로기판 표면에 올려놓고 프레스로 가열 및 가압하는 열프레스공정에 의해 이루어지는데, 열프레스 공정시에는 프레스와 커버레이 사이에 이형층과 성형층 등이 적층된 다층 필름을 적층시켜서, 커버레이의 접착제 층이 프레스에 부착되는 것을 방지하고, 아울러 프레스의 압력이 인쇄회로기판 표면에 균일하게 분산되어 커버레이가 인쇄회로기판 표면에 잘 부착되도록 한다. The work of attaching the coverlay to the printed circuit board is performed by a heat press process in which the coverlay coated with the adhesive is placed on the surface of the printed circuit board and heated and pressurized with a press. By laminating a multi-layered film in which a release layer and a molding layer are laminated on the coverlay, the adhesive layer of the coverlay is prevented from adhering to the press, and the pressure of the press is evenly distributed on the surface of the printed circuit board, so that the coverlay is Make sure it adheres well to the surface.

이러한 종래의 다층필름은 도 1에 도시된 바와 같이, 크라프트지(1), PVC필름(2), 이형필름(2) 등이 적층된 구성을 가지는데, PVC필름(2)은 열프레스 공정에서 인쇄회로기판의 커버레이 등의 단차를 균일하게 충진시키는 성형층으로서의 기능을 하며, 크라프트지(1)는 PVC필름(2)과 프레스 사이에 비부착성을 유지시켜, 열프레스공정 후에 PVC필름(2)이 열프레스면에 부착되지 않고 균일한 압력이 전달 되도록 하는 기능을 한다. As shown in FIG. 1, such a conventional multilayer film has a configuration in which kraft paper (1), PVC film (2), release film (2), etc. are stacked, and the PVC film 2 is in a heat press process. It functions as a molding layer that evenly fills the steps such as the coverlay of the printed circuit board, and the kraft paper (1) maintains non-adhesion between the PVC film (2) and the press, so that the PVC film ( 2) It does not adhere to the heat press surface and functions to deliver a uniform pressure.

그런데 이러한 구성을 가지는 종래의 다층필름을 사용하여 열프레스하는 경우에 열프레스온도가 150℃ 이상으로 상승되면 PVC필름(2)에 함유된 염소(Cl)와 프탈레이트(Phthalate) 성분의 가스가 방출되어 이형필름(3)을 투과하여 인쇄회로기판 표면을 오염시키는 불량을 초래한다. However, in the case of heat pressing using a conventional multilayer film having such a configuration, when the heat press temperature rises to 150℃ or higher, gases of chlorine (Cl) and phthalate (Phthalate) contained in the PVC film 2 are released. It causes a defect that penetrates the release film 3 and contaminates the surface of the printed circuit board.

한편, 이러한 문제점에 대해 이형필름과 PVC필름 사이에 PET필름이 게재된 다층의 성형이형필름이 제안되기도 하였으나, 이 경우에는 PET필름이 PET 고유의 성질상 연성이 적어서 인쇄회로기판 표면의 굴곡진 회로를 따라 추종하여 긴밀하게 변형되지 못하므로 커버레이 들뜸(Delamination) 불량이 초래되었다. On the other hand, for this problem, a multi-layered molded release film in which a PET film was placed between a release film and a PVC film was proposed. However, in this case, the PET film has less ductility due to the inherent properties of PET, so the curved circuit on the printed circuit board surface It follows along and cannot be deformed closely, resulting in defects in coverlay delamination.

대한민국 등록특허 제10-1688977호(2016. 12. 16.)Korean Patent Registration No. 10-1688977 (December 16, 2016) 대한민국 공개특허 제10-2013-0089025호(2013. 08. 09)Republic of Korea Patent Publication No. 10-2013-0089025 (2013. 08. 09) 대한민국 등록특허 제10-1577652호(2015. 12. 09)Korean Patent Registration No. 10-1577652 (2015. 12. 09) 대한민국 등록특허 제10-1594911호(2016. 02. 11)Korean Patent Registration No. 10-1594911 (2016. 02. 11)

본 발명은 상기와 같은 문제점에 착안하여 제안된 것으로서, 인쇄회로기판에 커버레이를 부착시키는 열프레스 공정시, 성형층으로 사용된 PVC필름에서 발생하는 가스에 의한 인쇄회로기판의 표면 오염을 방지하는 기술이다. 이 기술은 제조 공정중의 제품 불량을 감소시키며, 커버레이를 인쇄회로기판 표면에 들뜸현상 없이 잘 부착되도록 함으로써 고품질의 인쇄회로기판 제품을 제조할 수 있는 새로운 구성의 인쇄회로기판 열프레스공정용 성형이형필름을 제공하는 것이다.The present invention has been proposed in light of the above problems, and prevents contamination of the surface of the printed circuit board by gas generated from the PVC film used as the molding layer during the heat press process of attaching the coverlay to the printed circuit board. It's technology. This technology reduces product defects during the manufacturing process and allows the coverlay to adhere well to the surface of the printed circuit board without lifting, thereby producing a high-quality printed circuit board product, forming a new configuration for the printed circuit board heat press process. It is to provide a release film.

본 발명의 특징에 따르면, 종이(10); 상기 종이(10) 위에 적층되는 PVC필름(20); 상기 PVC필름(20) 위에 적층되는 나일론필름(30); 및 상기 나일론필름(30) 위에 적층되는 이형필름(40);을 포함하는 것을 특징으로 하는 인쇄회로기판의 열프레스공정용 성형이형필름이 제공된다.According to a feature of the present invention, paper 10; PVC film 20 laminated on the paper 10; A nylon film 30 laminated on the PVC film 20; And a release film 40 laminated on the nylon film 30. A mold release film for a heat press process of a printed circuit board is provided.

본 발명의 다른 특징에 따르면, 상기 나일론필름(30)은 나일론12로 이루어지고, 상기 이형필름(40)은 폴리프로필렌(PP)으로 이루어진다. According to another feature of the present invention, the nylon film 30 is made of nylon 12, and the release film 40 is made of polypropylene (PP).

이상과 같은 구성을 가지는 본 발명은 PVC필름과 이형필름 사이에 나일론필름이 개재되어, 나일론필름이 열프레스 작업시에 PVC필름에서 발생되는 가스가 이형필름을 통과하는 것을 방지한다. 따라서 열프레스 작업 중에 PVC필름에서 발생되는 가스에 의해 인쇄회로기판 표면이 오염되어 불량이 발생되는 종래의 문제점이 해소된다.In the present invention having the above configuration, a nylon film is interposed between the PVC film and the release film to prevent the gas generated from the PVC film from passing through the release film when the nylon film is hot-pressed. Therefore, the conventional problem of causing defects due to contamination of the printed circuit board surface by gas generated from the PVC film during the heat press operation is solved.

또한, 나일론필름의 특성 중 뛰어난 유연성이 PVC필름과 더불어 성형층으로서의 기능도 하기 때문에 커버레이를 인쇄회로기판의 굴곡진 표면에 들뜸 없이 밀착시킨다. 이에 따라 커버레이가 인쇄회로기판 표면에 효과적으로 잘 부착되어, 커버레이가 인쇄회로기판 표면에서 들뜸 현상(delamination)이 발생되지 않으므로 본 발명을 이용하면 커버레이가 견고하게 잘 부착된 고품질의 인쇄회로기판 제품을 제조할 수 있다. In addition, since the excellent flexibility of the nylon film functions as a molding layer together with the PVC film, the coverlay adheres to the curved surface of the printed circuit board without lifting. Accordingly, the coverlay is effectively adhered to the surface of the printed circuit board, and delamination does not occur on the surface of the printed circuit board. Therefore, the use of the present invention provides a high-quality printed circuit board with the coverlay firmly attached. Products can be manufactured.

도 1은 종래 성형이형필름의 단면도
도 2는 본 발명의 바람직한 실시예의 단면도 1 is a cross-sectional view of a conventional molded release film
2 is a cross-sectional view of a preferred embodiment of the present invention

이하에서, 본 발명을 바람직한 실시예에 따라 구체적으로 설명한다.Hereinafter, the present invention will be described in detail according to a preferred embodiment.

본 발명은 도 2에 도시된 바와 같이, 종이(10), PVC필름(20), 나일론필름(30) 및 이형필름(40)이 순차적으로 적층된 다층구조를 가진다.The present invention has a multilayer structure in which paper 10, PVC film 20, nylon film 30 and release film 40 are sequentially stacked, as shown in FIG. 2.

상기 종이(10)는 열프레스 공정시에 프레스와 상기 PVC필름(20) 사이에 비부착성을 유지시키고 열프레스 압력을 전체적으로 균일하게 받도록 하는 것으로서, 크라프트지 등이 사용된다. The paper 10 maintains non-adhesion between the press and the PVC film 20 during the heat press process and uniformly receives the heat press pressure as a whole, and kraft paper or the like is used.

그리고 상기 PVC필름(20)은 앞에서도 언급한 바와 같이, 열프레스 작업시에 열프레스 압력을 인쇄회로기판에 균일하게 분산시키는 유동성을 제공하는 성형층으로서의 기능을 하는데, 커버레이를 인쇄회로기판에 밀착시켜서 커버레이와 인쇄회로기판의 부착성을 향상시킨다. And, as mentioned above, the PVC film 20 functions as a molding layer providing fluidity that uniformly distributes the heat press pressure to the printed circuit board during the heat press operation, and the coverlay is applied to the printed circuit board. By making it close together, it improves the adhesion between the coverlay and the printed circuit board.

한편, 상기 나일론필름(30)은 열프레스 작업시에 PVC필름에서 발생되는 가스가 인쇄회로기판으로 전달되는 것을 차단하는 가스 차단층으로서의 기능을 한다. 나일론은 주지된 바와 같이, 폴리아미드(polyamide)수지의 총칭으로서 아미드결합으로 연결된 사슬모양의 고분자수지이다. 나일론은 가스투과성이 낮은 장점을 가질 뿐만 아니라, 내열성도 우수하며, 특히, 원래 섬유용로 개발된 수지로서 유연성도 좋을 장점을 가지므로 본 발명에서 사용이 바람직하다. On the other hand, the nylon film 30 functions as a gas barrier layer that blocks the transfer of gas generated from the PVC film to the printed circuit board during a heat press operation. As is well known, nylon is a generic term for polyamide resins and is a chain-shaped polymer resin linked by amide bonds. Nylon has an advantage not only of low gas permeability, but also excellent heat resistance. In particular, it is preferably used in the present invention because it has an advantage of good flexibility as a resin originally developed for fiber.

나일론필름(30)은 나일론66(Polyamide66, 용융온도 243℃), 나일론6(Polyamide6, 용융온도 215℃), 나일론12(Polyamide12, 용융온도 195℃) 및 나일론11(Polyamide11)으로 이루어진 군 중에서 어느 하나를 사용하여도 무방하나, 나일론6, 나일론66에 비해 나일론12가 쿠션성이 좋기 때문에 이형필름의 전체적인 쿠션성을 고려할 때 나일론12를 사용하는 것이 바람직하다. Nylon film 30 is any one of the group consisting of nylon 66 (Polyamide66, melting temperature 243°C), nylon 6 (Polyamide6, melting temperature 215°C), nylon 12 (Polyamide12, melting temperature 195°C), and nylon 11 (Polyamide11) Although nylon 12 has better cushioning properties than nylon 6 and nylon 66, it is preferable to use nylon 12 when considering the overall cushioning properties of the release film.

그리고 상기 이형필름(40)은 커버레이 접착제와의 접착을 방지하여 열프레스 공정 후에 원활하게 분리될 수 있도록 한다. 이러한 이형필름(40)으로는 PP(폴리프로필렌수지)필름을 사용하는 것이 바람직하다. 열프레스 작업시에 열프레스압력으로 인해 커버레이의 오픈셀을 통해 커버레이와 인쇄회로기판 사이에 게재된 접착제가 유출되어 이형필름과 접촉될 수도 있는데, PP는 비극성이어서 주로 극성인 에폭시 수지 또는 아크릴계 수지로 제조된 접착제와 반응성이 없기 때문에, 열프레스공정에서 유출된 접착제로 인해 이형필름이 커버레이에 접착되는 문제가 발생되는 것을 방지할 수 있으므로, 이형필름의 소재로 PP가 적당하다. In addition, the release film 40 prevents adhesion to the coverlay adhesive so that it can be smoothly separated after the heat press process. It is preferable to use a PP (polypropylene resin) film as the release film 40. During the heat press operation, the adhesive placed between the coverlay and the printed circuit board may leak through the open cell of the coverlay due to the heat press pressure and may come into contact with the release film.Since PP is non-polar, it is mainly polar epoxy resin or acrylic resin. Since it is not reactive with the adhesive made of resin, it can prevent the problem that the release film adheres to the coverlay due to the adhesive leaked in the heat press process, so PP is suitable as the material of the release film.

이상과 같은 구성을 가지는 본 발명은 PVC필름(20)과 이형필름(40) 사이에 나일론필름(30)이 개재되어, 나일론필름(30)이 열프레스 작업시에 PVC필름(20)에서 발생되는 가스가 이형필름(40)을 통과하여 인쇄회로기판을 오염시키는 것이 방지되므로 제품불량률이 감소되며, 나일론필름(30)이 유연성이 우수하여 PVC필름과 더불어 커버레이를 인쇄회로기판에 밀착시키는 성형층으로서의 기능도 하기 때문에 커버레이를 인쇄회로기판의 표면에 긴밀하게 밀착시켜서 커버레이가 인쇄회로기판에서 들뜨지 않도록 잘 부착시키는 장점을 가진다. In the present invention having the above configuration, the nylon film 30 is interposed between the PVC film 20 and the release film 40, so that the nylon film 30 is generated in the PVC film 20 during the heat press operation. Since gas is prevented from passing through the release film 40 to contaminate the printed circuit board, the product defect rate is reduced, and the nylon film 30 has excellent flexibility, so that the PVC film and the coverlay are in close contact with the printed circuit board. Since it also functions as a function, it has the advantage of closely attaching the coverlay to the surface of the printed circuit board so that the coverlay does not lift off the printed circuit board.

실험예 1 Experimental Example 1

크라프트지, PVC필름, 나일론6필름, 이형필름이 적층된 성형이형필름을 사용하여 155℃에서 50kg/㎠, 80min의 조건으로 폴리이미드필름을 연성인쇄회로기판에 열프레스하여 커버레이로 커버된 연성인쇄회로기판을 만들었다. Using a molded release film in which kraft paper, PVC film, nylon 6 film, and release film are laminated, the polyimide film is thermally pressed on a flexible printed circuit board under conditions of 50kg/㎠, 80min at 155℃ and covered with a coverlay. A printed circuit board was made.

제조된 연성회로기판에서 커버레이와 기판 사이의 들뜸현상이 존재하는지 현미경으로 관찰하였으며, 그 결과는 표 1과 같다.In the fabricated flexible circuit board, it was observed with a microscope whether there was a lifting phenomenon between the coverlay and the substrate, and the results are shown in Table 1.

비교예 1Comparative Example 1

실험예 1과 동일한 방법으로 연성인쇄회로기판을 만들되, 크라프트지, PVC필름, 이형필름이 적층된 이형필름을 사용하여 열프레스하였다. A flexible printed circuit board was prepared in the same manner as in Experimental Example 1, but heat-pressed using a release film in which kraft paper, PVC film, and release film were laminated.

제조된 연성회로기판에서 커버레이와 기판 사이의 들뜸현상이 존재하는 지 현미경으로 관찰하였으며, 그 결과는 표 1과 같다. In the fabricated flexible circuit board, it was observed with a microscope whether there was an excitation phenomenon between the coverlay and the board, and the results are shown in Table 1.

실험예 1Experimental Example 1 비교예 1Comparative Example 1 커버레이 들뜸 현상Coverlay lifting phenomenon 없음none 있음has exist

표 1을 통해 확인할 수 있는 바와 같이, 본 발명에 의한 성형이형필름을 사용한 실험예1은 커버레이 들뜸현상이 없었으며, 종래 이형필름을 사용한 비교예1은 커버레이 들뜸현상이 발생되었다. As can be seen from Table 1, Experimental Example 1 using the molded release film according to the present invention did not have a coverlay lifting phenomenon, and Comparative Example 1 using a conventional release film had a coverlay lifting phenomenon.

이상의 설명은 본 발명의 기술사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 본질적인 특성에서 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경 등이 가능함을 쉽게 알 수 있을 것이다. 즉, 본 발명에 개시된 실시 예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것으로서, 이러한 실시 예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다.The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains, various substitutions, modifications, and changes, etc., within the scope not departing from the essential characteristics of the present invention. It will be easy to see that this is possible. That is, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments.

따라서, 본 발명의 보호 범위는 후술되는 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.Accordingly, the scope of protection of the present invention should be interpreted by the claims to be described later, and all technical thoughts within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

Claims (2)

종이(10);
상기 종이(10) 위에 적층되는 PVC필름(20);
상기 PVC필름(20) 위에 적층되는 나일론필름(30); 및
상기 나일론필름(30) 위에 적층되는 이형필름(40);을 포함하며,
상기 나일론필름(30)은 나일론12로 이루어지고,
상기 이형필름(40)은 폴리프로필렌(PP)으로 이루어진 것을 특징으로 하는 인쇄회로기판 제조공정중의 열프레스공정용 성형이형필름.Paper 10;
A PVC film 20 laminated on the paper 10;
A nylon film 30 laminated on the PVC film 20; And
Includes; a release film 40 laminated on the nylon film 30,
The nylon film 30 is made of nylon 12,
The release film 40 is a molded release film for a heat press process in a printed circuit board manufacturing process, characterized in that made of polypropylene (PP). 삭제delete
KR1020200078962A 2020-06-29 2020-06-29 Molded release film for heat press process during printed circuit board manufacturing process KR102207322B1 (en)

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Citations (9)

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Publication number Priority date Publication date Assignee Title
KR200215516Y1 (en) * 2000-07-07 2001-03-15 이정국 Laminate of release film with heat resistance
KR100708005B1 (en) * 2006-11-24 2007-04-16 주식회사 피앤테크 Release film for flexible printed circuit board lamination process
KR20090018032A (en) * 2006-04-25 2009-02-19 아사히 가라스 가부시키가이샤 Mold release film for semiconductor resin mold
JP2009143978A (en) * 2007-12-11 2009-07-02 Lintec Corp Removable pressure-sensitive adhesive sheet for printing and method for producing the same
KR100969705B1 (en) * 2008-05-30 2010-07-14 전미경 Complex film for manufacturing fpcb and manufacturing method of fpcb using the same
KR20130089025A (en) 2012-02-01 2013-08-09 웅진케미칼 주식회사 Release film for flexible printed circuit board process
KR20150087645A (en) * 2014-01-22 2015-07-30 (주)경성화인켐 Polyolefin sheet for hot-press forming and release buffer film containing the same
KR101594911B1 (en) 2015-11-12 2016-02-17 (주)시우테크 Release film cutting device for FPCB
KR101688977B1 (en) 2014-11-24 2016-12-23 (주)후세메닉스 Laminating equipment of cushion pad for PCB manufacturing

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200215516Y1 (en) * 2000-07-07 2001-03-15 이정국 Laminate of release film with heat resistance
KR20090018032A (en) * 2006-04-25 2009-02-19 아사히 가라스 가부시키가이샤 Mold release film for semiconductor resin mold
KR100708005B1 (en) * 2006-11-24 2007-04-16 주식회사 피앤테크 Release film for flexible printed circuit board lamination process
JP2009143978A (en) * 2007-12-11 2009-07-02 Lintec Corp Removable pressure-sensitive adhesive sheet for printing and method for producing the same
KR100969705B1 (en) * 2008-05-30 2010-07-14 전미경 Complex film for manufacturing fpcb and manufacturing method of fpcb using the same
KR20130089025A (en) 2012-02-01 2013-08-09 웅진케미칼 주식회사 Release film for flexible printed circuit board process
KR20150087645A (en) * 2014-01-22 2015-07-30 (주)경성화인켐 Polyolefin sheet for hot-press forming and release buffer film containing the same
KR101577652B1 (en) 2014-01-22 2015-12-16 임춘삼 Polyolefin sheet for hot-press forming and release buffer film containing the same
KR101688977B1 (en) 2014-11-24 2016-12-23 (주)후세메닉스 Laminating equipment of cushion pad for PCB manufacturing
KR101594911B1 (en) 2015-11-12 2016-02-17 (주)시우테크 Release film cutting device for FPCB

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