KR102092320B1 - 부품 흡착 헤드 - Google Patents

부품 흡착 헤드 Download PDF

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Publication number
KR102092320B1
KR102092320B1 KR1020140173249A KR20140173249A KR102092320B1 KR 102092320 B1 KR102092320 B1 KR 102092320B1 KR 1020140173249 A KR1020140173249 A KR 1020140173249A KR 20140173249 A KR20140173249 A KR 20140173249A KR 102092320 B1 KR102092320 B1 KR 102092320B1
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KR
South Korea
Prior art keywords
nozzle
timing
landing
component
adsorption
Prior art date
Application number
KR1020140173249A
Other languages
English (en)
Korean (ko)
Other versions
KR20160038668A (ko
Inventor
타쿠야 츠츠미
타니자키 마사히로
스스무 키타다
오사무 스기오
마사키 노리유키
히데마사 코레에다
테츠오 후지하라
Original Assignee
한화정밀기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한화정밀기계 주식회사 filed Critical 한화정밀기계 주식회사
Publication of KR20160038668A publication Critical patent/KR20160038668A/ko
Application granted granted Critical
Publication of KR102092320B1 publication Critical patent/KR102092320B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Automatic Assembly (AREA)
KR1020140173249A 2014-09-30 2014-12-04 부품 흡착 헤드 KR102092320B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014201123A JP6574953B2 (ja) 2014-09-30 2014-09-30 部品吸着ヘッド
JPJP-P-2014-201123 2014-09-30

Publications (2)

Publication Number Publication Date
KR20160038668A KR20160038668A (ko) 2016-04-07
KR102092320B1 true KR102092320B1 (ko) 2020-03-23

Family

ID=55610072

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140173249A KR102092320B1 (ko) 2014-09-30 2014-12-04 부품 흡착 헤드

Country Status (3)

Country Link
JP (1) JP6574953B2 (ja)
KR (1) KR102092320B1 (ja)
CN (1) CN105472962B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190215997A1 (en) * 2016-09-08 2019-07-11 Sharp Kabushiki Kaisha Optical component mounting device and method for manufacturing sensor device
JP7193062B2 (ja) * 2018-08-01 2022-12-20 Thk株式会社 アクチュエータのセンシング装置及びアクチュエータの制御システム
CN113051753B (zh) * 2021-03-22 2023-02-24 南方电网科学研究院有限责任公司 模块化多电平换流器***子模块的可靠性计算方法和***

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179391A (ja) 2001-12-10 2003-06-27 Yamagata Casio Co Ltd 部品搭載装置
JP2009016498A (ja) * 2007-07-03 2009-01-22 Yamaha Motor Co Ltd 部品吸着方法および表面実装機
JP2009040564A (ja) * 2007-08-09 2009-02-26 Fujitsu Ltd 部品供給装置及びその方法
JP2009231303A (ja) 2008-03-19 2009-10-08 Yamaha Motor Co Ltd ヘッド駆動制御方法および表面実装装置
WO2014080473A1 (ja) 2012-11-21 2014-05-30 富士機械製造株式会社 電子回路部品装着ヘッド

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299191A (ja) * 1987-05-29 1988-12-06 Hitachi Ltd 厚膜回路描画装置
JPH05175691A (ja) * 1991-12-24 1993-07-13 Matsushita Electric Ind Co Ltd 部品吸着高さ検出装置
JPH06224598A (ja) * 1993-01-22 1994-08-12 Juki Corp チップ部品搭載装置の搭載位置の高さ検出方法
JP3543044B2 (ja) * 1996-03-15 2004-07-14 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JPH1027996A (ja) * 1996-07-10 1998-01-27 Matsushita Electric Ind Co Ltd 電子部品装着装置
CN1303860C (zh) * 2002-04-01 2007-03-07 富士机械制造株式会社 对基板作业***
JP4039222B2 (ja) * 2002-12-03 2008-01-30 松下電器産業株式会社 電子部品実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179391A (ja) 2001-12-10 2003-06-27 Yamagata Casio Co Ltd 部品搭載装置
JP2009016498A (ja) * 2007-07-03 2009-01-22 Yamaha Motor Co Ltd 部品吸着方法および表面実装機
JP2009040564A (ja) * 2007-08-09 2009-02-26 Fujitsu Ltd 部品供給装置及びその方法
JP2009231303A (ja) 2008-03-19 2009-10-08 Yamaha Motor Co Ltd ヘッド駆動制御方法および表面実装装置
WO2014080473A1 (ja) 2012-11-21 2014-05-30 富士機械製造株式会社 電子回路部品装着ヘッド

Also Published As

Publication number Publication date
KR20160038668A (ko) 2016-04-07
CN105472962B (zh) 2020-06-19
JP2016072462A (ja) 2016-05-09
CN105472962A (zh) 2016-04-06
JP6574953B2 (ja) 2019-09-18

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