KR102045835B1

KR102045835B1 - The method and system for performing plating and marking on compound material

Info

Publication number: KR102045835B1
Application number: KR1020160029583A
Authority: KR
Inventors: 정유진; 정진미; 신부건; 최권일
Original assignee: 주식회사 엘지화학
Priority date: 2016-03-11
Filing date: 2016-03-11
Publication date: 2019-11-18
Also published as: KR20170106019A

Abstract

As an embodiment of the present invention, a method for simultaneously performing plating and marking on a synthetic material may be provided. According to an embodiment of the present invention, a method for simultaneously performing plating and marking on a composite material includes: dividing a plurality of areas to be irradiated with a laser to the composite material, under predetermined laser irradiation conditions for the divided areas. And irradiating a laser and performing a plating process on the synthetic material irradiated with the laser, and the plurality of regions may include a plating target region and a marking region.

Description

Method and system for simultaneously plating and marking composite materials {THE METHOD AND SYSTEM FOR PERFORMING PLATING AND MARKING ON COMPOUND MATERIAL}

The present invention relates to a method and a system for simultaneously performing plating and marking on a synthetic material, and more particularly, to a specific area when electroless plating is performed after irradiating a laser to a synthetic material including a metal oxide additive. It relates to a method and a system for plating and marking to be carried out at the same time by only plating (e.g., plating area).

LDS, which stands for Laser Direct Structuring, refers to a technology that forms a specific structure by directly processing a synthetic material by selectively irradiating a laser light onto the synthetic material without a mask using a laser. When the metal oxide additive is injected into the synthetic resin and then selectively irradiated with a laser, only the irradiated portion of the metal seed is exposed on the surface of the injection molding, and the principle of forming a conductive pattern through electroless plating is used. It can be used in various industries, such as circuit substrates that can be inserted into mobile phones, and automobile chassis plating.

The LDS technology may be used for various purposes for products or parts in various industrial fields, and the LDS technology may also be used for marking purposes, particularly for displaying information about products. However, if the LDS process is simply performed on the synthetic material according to the existing method, there is a problem that even the unnecessary part of the plating process may be plated. In other words, the plating material and the marking area are distinguished from the composite material, and the laser irradiation conditions are set differently according to the respective divided areas, and then the laser is irradiated so that the plating and marking can be simultaneously performed in a series of processes. There is.

The present invention has been made in order to solve the above-described problems, the composite material by distinguishing the plating area and the marking area for the composite material, and by setting the laser irradiation conditions differently corresponding to each of the divided areas, the synthetic material by irradiating the laser This is to allow plating and marking to be performed simultaneously in a series of processes for processing.

In one embodiment of the present invention, a method and system for simultaneously performing plating and marking on a synthetic material are provided.

According to an embodiment of the present invention, a method for simultaneously performing plating and marking on a composite material includes: dividing a plurality of areas to be irradiated with a laser to the composite material, under predetermined laser irradiation conditions for the divided areas. And irradiating a laser and performing a plating process on the synthetic material irradiated with the laser, and the plurality of regions may include a plating target region and a marking region.

The plurality of regions to be irradiated with the laser according to an embodiment of the present invention may be predetermined according to a processing pattern for the synthetic material or may be determined according to an input applied from a user.

In addition, the laser irradiation conditions include power, frequency, irradiation speed, pulse duration, line energy of the laser to be irradiated, and the line energy of the laser to be irradiated to the plating target area is greater than the line energy of the laser to be irradiated to the marking area. Can be.

According to an embodiment of the present invention, all or part of the metal oxide is exposed in the plating target region by laser irradiation, and plating is performed on the exposed metal oxide in the step of performing a plating treatment on the synthetic material irradiated with laser. Can be.

According to an embodiment of the present invention, a system for simultaneously performing plating and marking on a composite material includes an area divider for dividing a plurality of areas to be irradiated with respect to the composite material, and irradiation of the laser to be divided into areas. Irradiation condition setting unit for setting the condition, Laser irradiation unit for irradiating the laser toward the synthetic material under the laser irradiation condition set by the irradiation condition setting unit, Plating unit for performing the plating process on the synthetic material irradiated with the laser, and area division unit , A irradiation condition setting unit, and a control unit connected to the laser irradiation unit and controlling each operation, the plurality of regions may include a plating target region and a marking region.

The system according to an embodiment of the present invention further includes an external input receiver for receiving an input from a user, wherein the plurality of areas to be irradiated with the laser are predetermined or applied from the user according to a processing pattern for the composite material. It can be determined according to the input.

According to an embodiment of the present invention, all or part of the metal oxide is exposed in the plating target region by laser irradiation, and plating is performed on the exposed metal oxide in the step of performing a plating treatment on the synthetic material irradiated with laser. Can be. According to an embodiment of the present invention, at least one of plating and marking in a series of processes is performed by distinguishing a plating area and a marking area with respect to a synthetic material, setting laser irradiation conditions differently according to each divided area, and then irradiating a laser. Can be performed. In other words, according to an embodiment of the present invention, the structure of the plating area and the marking area may be formed through one laser irradiation in the machining process, and the plating process may be performed only on the plating area.

In addition, according to an embodiment of the present invention, by manipulating the laser irradiation conditions, it is possible to implement various colors of the portion to be marked on the synthetic material.

1 is a schematic diagram of a plating and marking process according to a conventional technique.
2 is a schematic diagram showing a method for simultaneously performing plating and marking on a synthetic material according to an embodiment of the present invention.
3 is a flowchart illustrating a method for simultaneously performing plating and marking on a synthetic material according to an embodiment of the present invention.
4 is a simulation result before and after plating on a synthetic material irradiated with a laser by varying the laser irradiation conditions according to an embodiment of the present invention.
Figure 5 shows the results of the processing of the synthetic material according to the conventional technique and the processing results to which the method according to an embodiment of the present invention is applied, an example of the marking color according to the laser irradiation conditions.
6 is a block diagram of a system for simultaneously performing plating and marking on a composite material according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Terms used herein will be briefly described and the present invention will be described in detail.

The terms used in the present invention have been selected as widely used general terms as possible in consideration of the functions in the present invention, but this may vary according to the intention or precedent of the person skilled in the art, the emergence of new technologies and the like. In addition, in certain cases, there is also a term arbitrarily selected by the applicant, in which case the meaning will be described in detail in the description of the invention. Therefore, the terms used in the present invention should be defined based on the meanings of the terms and the contents throughout the present invention, rather than the names of the simple terms.

When any part of the specification is to "include" any component, this means that it may further include other components, except to exclude other components unless otherwise stated. In addition, the terms "... unit", "module", etc. described in the specification mean a unit for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software. . In addition, when a part of the specification is "connected" to another part, this includes not only "directly connected", but also "connected with other elements in the middle".

"Synthetic material" may also refer to plastics, glass, nonmetals, or combinations thereof.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram of a plating and marking process according to a conventional technique.

According to the conventional technique for performing post-etch plating on the composite material 1, since the laser is driven only under uniform conditions, the plating may be performed on the etched region due to laser irradiation. When the laser is irradiated on the synthetic material 1 under the same laser irradiation conditions as shown in FIG. 1A, and then subjected to an electroless plating process, plating is also performed on an area where plating is not desired (for example, an area for marking). Can be performed. In other words, when the synthetic material is immersed in a solution for electroless plating, plating is performed on all of the etched regions, and thus, additional packaging is required for a region not to be plated by using a sealing member. do. In this case, the cost may increase due to the use of the sealing member.

In order to prevent the plating on the areas where plating is not desired when using this conventional technique, as shown in (a) of FIG. After etching, the plating may be performed, and then the marking may be performed by etching the laser to the area for marking. According to this method, there is a problem that the laser etching efficiency may be reduced by drying the solution for plating and then etching using a laser or due to the material or solution for plating. In addition, since the laser irradiation to the synthetic material 1 is performed irregularly or irregularly, the processing procedure of the synthetic material 1 is complicated and the processing time is inevitably long.

2 is a schematic diagram showing a method for simultaneously performing plating and marking on a synthetic material according to an embodiment of the present invention.

According to an embodiment of the present invention, the plating region z1 and the marking region z2 are divided with respect to the composite material 1, and laser irradiation is performed after setting different laser irradiation conditions corresponding to each of the divided regions. The etching can be performed in a batch. In addition, by performing a plating process on the etched synthetic material (1) it is possible to perform the plating and marking procedures at the same time.

As shown in FIG. 2, etching of the region z1 requiring plating may be performed by irradiating a laser on the synthetic material 1 under a first laser irradiation condition (for example, condition 1). In addition, by irradiating a laser on the synthetic material 1 under a second laser irradiation condition (for example, condition 2), etching may be performed on the region z2 for marking. When the etched synthetic material 1 is subjected to the electroless plating process, plating may be performed only on the plating region, and plating may not be performed on the marking region.

Synthetic material 1 according to an embodiment of the present invention may refer to a material containing a metal oxide additive. In other words, using a method according to an embodiment of the present invention, in some regions where the laser is irradiated (eg, the plating region z1), a seed of the metal is exposed to the surface and subjected to an electroless plating process, thereby removing the seed from the seed. The plating layer can be grown. In addition, the growth of the plating layer can be prevented with respect to the marking region z2.

According to an embodiment of the present invention, all or part of the metal oxide is exposed in the plating target region z1 by laser irradiation, and the metal exposed in the step of performing the plating treatment on the synthetic material 1 irradiated with the laser. Plating on the oxide can be performed.

3 is a flowchart illustrating a method for simultaneously performing plating and marking on a synthetic material according to an embodiment of the present invention.

The method for simultaneously performing plating and marking on the composite material 1 according to an embodiment of the present invention distinguishes a plurality of regions (eg, z1 and z2) to be irradiated with a laser to the composite material 1. Step S100, irradiating a laser under predetermined laser irradiation conditions with respect to the divided regions (S200), and performing a plating process on the synthetic material 1 to which the laser is irradiated (S300), The plurality of regions may include a plating target region z1 and a marking region z2.

The plating target region z1 refers to a region where plating is to be performed, and the plating region z1 refers to a region where a plating layer is generated, and may be, for example, a conductive line of a circuit board included in a mobile phone, an electronic device, or the like. In addition, the marking area z2 may be utilized to indicate information about the circuit board (eg, producer, production date, description of a device mounted on the circuit board, etc.).

In addition, the plurality of regions to be irradiated with the laser according to an embodiment of the present invention may be predetermined according to a processing pattern for the composite material 1 or may be determined according to an input applied from a user. The plurality of regions to be irradiated with respect to the composite material 1 may be divided (determined) according to the position of the composite material. For example, assuming that the direction in which the synthetic material 1 is transported is the lower end of the synthetic material, the plurality of regions to which the laser beam is irradiated for the synthetic material 1 are divided into the upper end, the lower end, the left side, the right side, or the like of the synthetic material 1. It can be divided into. The position of the synthetic material 1 may be determined (ascertained) based on the coordinates given to the synthetic material 1. For example, the coordinates may be provided to have a predetermined interval on the horizontal axis (for example, the x-axis) and the vertical axis (for example, the y-axis) based on the exact center of the composite material 1, in which case each coordinate value The marking region z2 or the plating region z1 may be predetermined. The predetermined spacing may be micrometers or nanometers, but is not necessarily limited thereto. The division of the plurality of regions may be predetermined according to the kind, size of the synthetic material before the processing of the synthetic material 1, or the use of the synthetic material 1 after processing. For example, the marking region z2 may be set in advance such that the marking is performed along the outer line of the synthetic material or in some regions adjacent to the plating region z1.

In addition, the user can designate the position of the marking region z2 or the plating region z1. In other words, the marking region z2 or the plating region z1 may be determined in real time according to a positioning input applied from a user.

In addition, the laser irradiation conditions include power, frequency, irradiation speed, pulse duration, and line energy of the laser to be irradiated, and the line energy of the laser to be irradiated to the plating target region z1 is irradiated to the marking region z2. May be greater than the line energy of. For example, as shown in Table 1 below, etching may be performed on a region requiring plating by irradiating a laser on the synthetic material 1 under a first laser irradiation condition. In addition, etching of the region for marking may be performed by irradiating a laser on the synthetic material 1 under the second laser irradiation condition.

As shown in Table 1, the line energy of the laser to be irradiated to the plating region may be greater than the line energy of the laser to be irradiated to the marking region. Accordingly, the surface may be etched relatively deep in the region of the composite material 1 corresponding to the plating region. In other words, the etching depth for the plating region may be greater than the etching depth for the marking region. As the depth of the surface of the composite material 1 is deeply etched, the tendency of the metal seed to be exposed increases, so that plating layer generation may be good.

4 is a simulation result before and after plating on the synthetic material 1 irradiated with a laser by varying the laser irradiation conditions according to an embodiment of the present invention. As shown in FIG. 4, since the plating region is etched relatively deeply as compared with the marking region, the plating layer may be easily grown. In FIG. 4, the surface layer of high height is represented by a red system, and the surface layer of low height is represented by a cyan system.

Peak-to-pit height values and surface roughness before and after plating may be measured by way of example as shown in Table 2.

5 shows an example of the marking result according to the laser irradiation conditions, the processing result of the synthetic material according to the conventional technique and the processing result to which the method according to an embodiment of the present invention is applied.

Synthetic material 1 may be composed of, for example, PC resin / LDS additive (Cu ₃ P ₂ O ₈ ) 3% / TiO 2 3%. As described above with reference to FIG. 1, according to the conventional technique, plating may be performed in both a region to be plated and a region to be marked (eg, a1 in FIG. 5). In this case, an additional etching process for removing the plating may be required for the marking region, which is inefficient.

As shown in (b) of FIG. 1, the synthetic material processing may be performed step by step in the order of laser etching (eg, etching to the plating area), plating, and laser re-etching (eg, etching to the marking area). As described above, the marking accuracy may be lowered, and the process is overlapped and inefficient in that the laser process must be performed again after plating.

In contrast, according to an embodiment of the present invention, by irradiating a laser with different laser irradiation conditions, the marking area and the plating area may be simultaneously generated (etched), and plating may be performed on the etched synthetic material. Not only can the time required for marking and marking be reduced, but the simplification of the machining procedure can be achieved.

In addition, according to an embodiment of the present invention, the color of the marking area may be variously expressed according to laser irradiation conditions. As shown in (b) of FIG. 5, as the laser is irradiated with a high energy, the color of the marking region may become relatively dark (for example, m4 of FIG. 5), and the metal seed may be exposed to the surface when the energy level is higher than a predetermined energy level. A plating layer may be generated in the plating process. The predetermined energy level may mean a minimum energy level for exposing the seed for plating. These predetermined energy levels may differ depending on the properties of the synthetic material 1.

6 is a block diagram of a system for simultaneously performing plating and marking on a composite material according to an embodiment of the present invention.

The system 1000 for simultaneously performing plating and marking on the composite material 1 according to an exemplary embodiment of the present invention may include a region separator 100 that separates a plurality of regions to be irradiated with a laser to the composite material 1. ), A laser for irradiating the laser toward the synthetic material 1 with the laser irradiation conditions set by the irradiation condition setting unit 200 and the irradiation condition setting unit 200 to set the irradiation conditions of the laser to be irradiated into the divided areas It is connected to the irradiation unit 300, the plating unit 400 and the area separator 100, the irradiation condition setting unit 200, the laser irradiation unit 300 for performing a plating process on the synthetic material irradiated with a laser and each operation The controller 500 may be configured to control the plurality of regions, and the plurality of regions may include a plating target region z1 and a marking region z2.

The area separator 100 according to an embodiment of the present invention may further include an image acquisition unit for acquiring an image of the synthetic material 1. The current position of the synthetic material may be grasped based on the image of the synthetic material 1 acquired through the image acquisition unit. In addition, the area divider 100 may include an optical sensor, and the current position of the composite material 1 may be grasped using the optical sensor.

The system according to an embodiment of the present invention further includes an external input receiver 600 for receiving an input from a user, and the plurality of regions to be irradiated with the laser are predetermined according to a processing pattern for the composite material 1. It may be determined according to the input or the input authorized from the user. The external input receiver 600 may be a computer.

According to an embodiment of the present invention, all or part of the metal oxide is exposed in the plating target region by laser irradiation, and the metal oxide exposed in the step of performing the plating treatment on the synthetic material 1 irradiated with the laser. Plating can be performed.

With regard to the system according to an embodiment of the present invention, the above-described method may be applied. Therefore, in the context of the system, the description of the same content as the above-described method is omitted.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1: synthetic material
Z1: Plating Area or Plating Area
Z2: marking area
100: area separator
200: irradiation condition setting unit
300: laser irradiation unit
400: plating part
500: control unit
600: external input receiver
1000: System for simultaneously plating and marking composite materials

Claims

Distinguishing a plurality of regions including a marking target region and a marking region to be irradiated with a laser to the synthetic material including the metal oxide additive;
Irradiating a laser under predetermined laser irradiation conditions on the divided regions; And
Performing electroless plating on the synthetic material irradiated with the laser to be plated only on the plating target area and not to the marking area;
The predetermined laser irradiation condition irradiates a first laser to the plating target area and simultaneously irradiates a second laser different from the first laser to the marking area, and the line energy of the first laser is a line of the second laser. A method for simultaneously plating and marking a composite material that is greater than energy.

The method of claim 1,
And the plurality of areas to be irradiated with the laser are predetermined according to a processing pattern for the synthetic material or determined according to an input applied from a user.

delete

The method of claim 1,
All or part of the metal oxide is exposed in the plating target region by the laser irradiation,
The plating of the exposed metal oxide is performed in the step of performing a plating treatment on the synthetic material irradiated with the laser, characterized in that the plating and marking on the composite material at the same time.

A region dividing unit for dividing a plurality of regions including a region to be coated and a marking region to be irradiated with a laser with respect to a synthetic material including a metal oxide additive;
An irradiation condition setting unit for setting an irradiation condition of the laser to be irradiated to the divided areas;
A laser irradiation unit for irradiating a laser toward the synthetic material under laser irradiation conditions set by the irradiation condition setting unit;
A plating unit performing electroless plating on the synthetic material irradiated with the laser so as to be plated only in the plating target area and not to the plating area; And
A control unit connected to the area separating unit, an irradiation condition setting unit and a laser irradiation unit and controlling respective operations;
The laser irradiation condition set by the irradiation condition setting unit irradiates a first laser to the plating target area and simultaneously irradiates a second laser different from the first laser to the marking area, and the line energy of the first laser is A system for simultaneously plating and marking a composite material that is greater than the line energy of the second laser.

The method of claim 5,
Further comprising an external input receiving unit for receiving an input from the user,
And the plurality of areas to be irradiated with the laser are predetermined according to a processing pattern for the synthetic material or determined according to an input applied from a user.

delete

The method of claim 5,
All or part of the metal oxide is exposed in the plating target region by the laser irradiation,
And plating the exposed metal oxide in the step of performing a plating treatment on the synthetic material irradiated with the laser.