KR102031916B1 - Micro circuit plating method on laser direct molding injection molding for automotive parts - Google Patents
Micro circuit plating method on laser direct molding injection molding for automotive partsInfo
- Publication number
- KR102031916B1 KR102031916B1 KR1020180004463A KR20180004463A KR102031916B1 KR 102031916 B1 KR102031916 B1 KR 102031916B1 KR 1020180004463 A KR1020180004463 A KR 1020180004463A KR 20180004463 A KR20180004463 A KR 20180004463A KR 102031916 B1 KR102031916 B1 KR 102031916B1
- Authority
- KR
- South Korea
- Prior art keywords
- injection molding
- plating
- metal
- layer
- nickel
- Prior art date
Links
Classifications
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/60—Power-operated mechanisms for wings using electrical actuators
- E05F15/603—Power-operated mechanisms for wings using electrical actuators using rotary electromotors
- E05F15/632—Power-operated mechanisms for wings using electrical actuators using rotary electromotors for horizontally-sliding wings
- E05F15/643—Power-operated mechanisms for wings using electrical actuators using rotary electromotors for horizontally-sliding wings operated by flexible elongated pulling elements, e.g. belts, chains or cables
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2201/00—Constructional elements; Accessories therefore
- E05Y2201/60—Suspension or transmission members; Accessories therefore
- E05Y2201/604—Transmission members
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2201/00—Constructional elements; Accessories therefore
- E05Y2201/60—Suspension or transmission members; Accessories therefore
- E05Y2201/606—Accessories therefore
- E05Y2201/61—Cooperation between suspension or transmission members
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2201/00—Constructional elements; Accessories therefore
- E05Y2201/60—Suspension or transmission members; Accessories therefore
- E05Y2201/622—Suspension or transmission members elements
- E05Y2201/644—Flexible elongated pulling elements; Members cooperating with flexible elongated pulling elements
- E05Y2201/656—Chains
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2600/00—Mounting or coupling arrangements for elements provided for in this subclass
- E05Y2600/10—Adjustable or movable
- E05Y2600/11—Adjustable or movable by automatically acting means
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2600/00—Mounting or coupling arrangements for elements provided for in this subclass
- E05Y2600/10—Adjustable or movable
- E05Y2600/30—Adjustable or movable characterised by the type of motion
- E05Y2600/31—Linear motion
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2900/00—Application of doors, windows, wings or fittings thereof
- E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
- E05Y2900/13—Application of doors, windows, wings or fittings thereof for buildings or parts thereof characterised by the type of wing
- E05Y2900/148—Windows
Abstract
본 발명은 자동차 부품용 레이저 직접 성형 사출물의 미세패턴 상에 금속화를 위한 도금 방법에 관련되며, 그 방법에 있어서 미세패턴 및 사출물의 소재 상에 이물질을 제거하는 탈지공정; 레이저 가공에서 발생한 사출물의 소재 상에 금속 잔유물과 금속 석출을 방지하는 디스머트(Desmut)공정; 레이저 가공에서 사출물의 소재 상에 도출된 금속의 분진을 제거하는 에칭공정; 상기 공정의 사출물 소재를 대상으로 미세패턴에 금속층을 형성하기 위한 팔라듐 촉매 부여공정; 상기 공정의 사출물 소재를 대상으로 미세패턴에 니켈금속층을 입히기 위한 니켈도금공정; 상기 공정의 사출물 소재를 대상으로 미세패턴에 구리도금층을 입히기 위한 구리도금공정; 상기 공정의 사출물 소재를 대상으로 구리도금층의 표면에 니켈층을 형성하기 위한 팔라듐 촉매 부여공정; 상기 공정의 사출물 소재를 대상으로 구리도금층의 산화 방지를 위한 니켈도금공정; 및 방청과 건조공정;을 포함하는 것을 특징으로 한다.
이에 따라 본 발명은, 기존의 레이저 직접 성형(LDS) 도금 공정의 개선 및 추가 공정을 개입시켜 패턴 이외의 사출 성형물 상에 도금의 촉매가 될 수 있는 금속 잔유물과 석출됨을 방지하여 미세회로의 불량률을 절감하고, 유해물질인 무수크롬산을 사용하지 않고도 미세 패턴 형성이 가능하면서 기존 LDS 도금 공정 대비 생산성 향상과 도금 번짐 현상이 적어 도금층의 밀착력을 확보하는 동시에 제품의 신뢰성을 향상시킬 수 있는 효과가 있다.The present invention relates to a plating method for metallization on the micropattern of the laser direct injection molding for automobile parts, the method comprising: a degreasing step of removing foreign matter on the micropattern and the material of the injection molding; Desmut process for preventing metal residues and metal precipitation on the material of the injection molded in the laser processing; An etching process for removing dust of the metal derived on the material of the injection molding in laser processing; A palladium catalyst applying step for forming a metal layer on the fine pattern of the injection molding material of the step; A nickel plating process for coating a nickel metal layer on a fine pattern of the injection molding material of the process; A copper plating process for coating a copper plating layer on a fine pattern of the injection molding material of the process; A palladium catalyst applying step for forming a nickel layer on the surface of the copper plating layer for the injection molding material of the step; Nickel plating process for the oxidation prevention of the copper plating layer for the injection molding material of the process; And rust and drying process; characterized in that it comprises a.
Accordingly, the present invention, through the improvement and addition process of the existing laser direct molding (LDS) plating process to prevent the deposition of metal residues that can be a catalyst of the plating on the injection molding other than the pattern to reduce the defect rate of the microcircuit It is possible to form a fine pattern without using chromic anhydride, which is a harmful substance, and improve productivity and reliability of the plated layer while securing adhesion and plating bleeding phenomenon compared to the existing LDS plating process.
Description
본 발명은 자동차 부품용 레이저 직접 성형 사출물의 미세회로 구현에 관한 것으로, 보다 구체적으로는 기존의 레이저 직접 성형(LDS) 도금 공정의 개선 및 추가 공정을 개입시켜 소재 및 미세 패턴의 분진을 제거하여 미세회로의 불량률을 절감하고, 기존 LDS 도금 공정 대비 도금층의 밀착력과 생산성을 확보하는 동시에 제품의 신뢰성을 향상시킬 수 있는 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법에 관한 것이다.The present invention relates to the implementation of the microcircuit of the laser direct injection molding for automotive parts, and more specifically, to remove the dust of the material and the fine pattern through the improvement and the additional process of the existing laser direct molding (LDS) plating process The present invention relates to a microcircuit plating method on a laser direct injection molding for automotive parts, which can reduce a defect rate of a circuit, secure adhesion and productivity of a plating layer compared to a conventional LDS plating process, and improve product reliability.
최근에는, 각종 전기, 전자기기의 경량화와 소형화로 인하여 부품 소재로 PC(폴리카보네이트, polycarbonate), PPS(폴리페닐렌 술파이드, polyphenylene sulfide), ABS(Acrylonitrile Butadiene Styrene), PC/ABS (polycarbonate/Acrylonitrile Butadiene Styrene), PA (폴리아미드, polyamide), LCP(Liquid Crystal Polymer ), PBT(폴리부틸렌 테레프탈레이트, Polybutylene Terephthalate ), PPE(폴리페닐렌 에테르, Polyphenylene ether), PEI(폴리에테르 이미드, Polyether lmide), PEEK(폴리 에테르 에테르 케톤, Poly ether ether ketone) 등 합성수지가 널리 이용되고 있다. 상기 합성수지는 재질의 중량이 가볍고, 사출성형으로 제품의 형상화가 용이한 장점이 있으며, 생산비용 측면에서 금속보다 저렴한 장점이 있으나, 전기 전도가 필요한 부품의 경우에는 부도체인 합성수지로 제조하기 곤란한 단점이 있다. Recently, due to the light weight and miniaturization of various electric and electronic devices, PC (polycarbonate, polycarbonate), PPS (polyphenylene sulfide), ABS (Acrylonitrile Butadiene Styrene), PC / ABS (polycarbonate / Acrylonitrile Butadiene Styrene), PA (polyamide, polyamide), LCP (Liquid Crystal Polymer), PBT (Polybutylene Terephthalate), PPE (Polyphenylene Ether, Polyphenylene ether), PEI (Polyetherimide, Synthetic resins such as polyether lmide) and PEEK (poly ether ether ketone) are widely used. The synthetic resin is light in weight, has the advantage of easy molding of the product by injection molding, and has the advantage of cheaper than the metal in terms of production cost, but in the case of parts requiring electrical conduction, it is difficult to manufacture a non-conductive synthetic resin have.
따라서 합성수지의 표면을 가공하여 전기 전도가 가능하도록 금속층을 형성하는 다양한 도금방법이 개발되고 있다. 상기 종래의 합성수지 표면에 금속층을 형성하는 도금방법은 유기용제를 이용하여 합성수지 피도금물의 표면을 에칭하는 단계, 촉매금속을 흡착하는 단계와 무전해도금하는 단계를 포함하는 방법이 있다. 또, 다른 방법으로는 중금속이 혼합된 합성수지 피도금물의 표면을 레이저로 에칭하여 혼합된 중금속 성분을 노출시키는 단계, 노출된 중금속 성분을 시드(seed)로 이용하여 무전해 도금을 하는 단계로 이루어진 방법이 있다.Therefore, various plating methods have been developed to form a metal layer to process the surface of the synthetic resin to enable electrical conduction. The plating method of forming a metal layer on the surface of the conventional synthetic resin has a method comprising the step of etching the surface of the synthetic resin plated material using an organic solvent, the step of adsorbing the catalyst metal and electroless plating. In another method, the surface of the synthetic resin coating material mixed with heavy metals is laser-etched to expose the mixed heavy metal components, and electroless plating is performed using the exposed heavy metal components as seeds. There is a way.
이와 관련하여 참조할 수 있는 선행기술문헌으로서, 한국 등록특허공보 제10-1282183호(선행문헌 1), 한국 등록특허공보 제10-1507964호(선행문헌 2) 등을 참조할 수 있다.As a prior art document that can be referred to in this regard, Korean Patent Publication No. 10-1282183 (prior document 1), Korean Patent Publication No. 10-1507964 (prior document 2) and the like can be referred to.
선행문헌 1은 엘디에스 무전해 도금 방법에 있어서, 플라스틱을 포함하는 소재를 사출 성형하는 (가)단계와 사출 성형된 상기 소재에 레이저로 회로 패턴을 가공하는 (나)단계와 레이저로 가공된 회로 패턴에 무전해 도금을 하는 (다)단계를 포함하며, 상기 (가)단계가 완료된 이후에 사출 성형과정에서 상기 소재에 긁힘 등이 발생된 영역을 전처리하는 제1 전처리 단계와 상기 (나)단계에서 상기 회로 패턴 가공 과정에서 발생한 분진 등을 제거하는 제2 전처리 단계를 제안한다.Prior Art 1 discloses an EL electroless plating method comprising the steps of (a) injection molding a material including plastics and (b) processing a circuit pattern with a laser on the injection molded material and a circuit processed with a laser. (C) a step of electroless plating the pattern, the first pretreatment step and the (B) step of pre-treating the area where scratches, etc. occurred in the material in the injection molding process after the step (a) is completed Proposes a second pretreatment step of removing dust generated in the circuit pattern processing.
선행문헌 2는 합성수지 피도금체를 이용한 무전해 동도금에 의한 무선기기용 안테나의 제조방법에 있어서, 비도전성 합성수지 피도금체에 레이저 가공 공정(LDS)을 실시하기 전에 상기 피도금체의 표면에 투명 유기막을 코팅함으로써, 상기 피도금체의 미리 정해진 패턴 및 상기 패턴 상부의 투명 유기막을 제거하여 안테나 회로부를 형성하는 상기 레이저 가공 공정을 실시한 피도금체에 팔라듐 촉매를 실시할 때, 레이저에 의해서 제거되지 않은 피도금체 표면에 노출되는 유기금속 또는 실리콘 성분이 상기 팔라듐 촉매와 반응하는 것을 차단하는 것을 제안한다.Prior Art 2 discloses a method for manufacturing an antenna for a wireless device by electroless copper plating using a synthetic resin plated body, which is transparent to the surface of the plated body before the laser processing step (LDS) is performed on the non-conductive synthetic resin plated body. By coating the organic film, when the palladium catalyst is applied to the plated body subjected to the laser processing step of removing the predetermined pattern of the plated body and the transparent organic film on the pattern to form the antenna circuit portion, it is not removed by the laser. It is proposed to block the reaction of the organometallic or silicon component with the palladium catalyst to be exposed to the surface of the non-plated body.
그러나 상기한 선행문헌들에 의하면 100um이하의 미세회로 패턴에서는 도금층의 번짐 불량으로 인한 미세회로 구현이 어렵고, 패턴금속과 피도금체와의 밀착 불량으로 인한 신뢰성 저하는 물론 초기 도금속도 저하로 인한 생산성 저하 및 비용이 상승되는 문제점을 지니고 있다.However, according to the preceding documents, it is difficult to implement the microcircuit due to the smearing of the plating layer in the microcircuit pattern of less than 100um, the reliability due to the poor adhesion between the pattern metal and the plated body, as well as the productivity due to the initial plating speed decrease. There is a problem of lowering and rising costs.
상기와 같은 종래의 문제점들을 근본적으로 개선하기 위한 본 발명의 목적은, 기존의 레이저 직접 성형(LDS) 도금 공정의 개선 및 추가 공정을 개입시켜 패턴 이외의 사출 성형물 상에 도금의 촉매가 될 수 있는 금속 잔유물과 석출됨을 방지하여 미세회로의 불량률을 절감하고, 유해물질인 무수크롬산을 사용하지 않고도 미세 패턴 형성이 가능하면서 기존 LDS 도금 공정 대비 생산성 향상과 도금 번짐 현상이 적어 도금층의 밀착력을 확보하는 동시에 제품의 신뢰성을 향상시킬 수 있는 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법을 제공하려는데 있다.SUMMARY OF THE INVENTION An object of the present invention for fundamentally improving the conventional problems as described above is to improve the existing laser direct molding (LDS) plating process and to be a catalyst for plating on injection moldings other than patterns through additional processes. It prevents metal residues and precipitation and reduces the defect rate of microcircuits, enables the formation of fine patterns without the use of chromic anhydride, which is a harmful substance, and improves the adhesion and adhesion of the plating layer due to less productivity and less smearing than the existing LDS plating process. The present invention aims to provide a microcircuit plating method on laser direct injection moldings for automotive parts that can improve product reliability.
상기 목적을 달성하기 위한 본 발명은, 자동차 부품용 레이저 직접 성형 플라스틱 사출성형물 혹은 금속 성형물의 미세패턴 상에 금속화를 위한 도금 방법에 있어서: 미세패턴 및 사출물의 소재 상에 이물질을 제거하기 위해 수산화나트륨(NaOH) 혹은 수산화칼륨(KOH) 60∼100g/L을 함유하는 수용액을 사용하여 50∼60℃에서 1∼10분간 침지 후 수세하여 이루어지는 탈지공정; 레이저 가공에서 발생한 사출물의 소재 상에 금속 잔유물과 금속 석출을 방지하기 위해 과황산나트륨 10~50g/L, 인산 20~100g/L을 함유하는 수용액을 사용하여 40∼60℃에서 5∼20분간 침지 후 수세하여 이루어지는 디스머트(Desmut)공정; 레이저 가공에서 사출물의 소재 상에 도출된 금속의 분진을 제거하기 위해 황산(H2SO4) 및 과산화수소(H2O2)를 각 10~50ml/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세하여 이루어지는 에칭공정; 상기 에칭공정의 사출물 소재를 대상으로 미세패턴에 금속층을 형성하기 위한 팔라듐 촉매 부여공정; 상기 팔라듐 촉매 부여공정의 사출물 소재를 대상으로 미세패턴에 니켈금속층을 입히기 위해 니켈염 1~10g/L, 착화제인 구연산염 20~100g/L, 환원제인 차아인산나트륨 5~50g/L을 함유하는 수용액을 사용하여 50~90℃에서 10~60분간 침지 후 수세하여 이루어지는 니켈도금공정; 상기 니켈도금공정의 사출물 소재를 대상으로 미세패턴에 구리도금층을 입히기 위한 구리도금공정; 상기 구리도금공정의 사출물 소재를 대상으로 구리도금층의 표면에 니켈층을 형성하기 위한 팔라듐 촉매 부여공정;상기 팔라듐 촉매 부여공정의 사출물 소재를 대상으로 구리도금층의 산화 방지를 위한 니켈도금공정; 및 방청과 건조공정;을 포함하는 것을 특징으로 한다.The present invention for achieving the above object, in the plating method for metallization on the micro-pattern of the laser direct-molding plastic injection molding or metal molding for automotive parts: a micropattern and hydroxide to remove foreign matter on the material of the injection molding A degreasing step performed by immersion at 50 to 60 ° C. for 1 to 10 minutes using an aqueous solution containing 60 to 100 g / L of sodium (NaOH) or potassium hydroxide (KOH), followed by washing with water; After immersion for 5 to 20 minutes at 40 to 60 ° C using an aqueous solution containing 10 to 50 g / L sodium persulfate and 20 to 100 g / L phosphoric acid in order to prevent metal residues and metal precipitation on the injection molding material generated by laser processing Desmut process performed by washing with water; In laser processing, sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) were immersed at 20 to 40 ° C for 1 to 10 minutes using an aqueous solution containing 10 to 50 ml / L to remove metal dust. An etching step carried out after washing with water; A palladium catalyst applying step for forming a metal layer on a fine pattern of the injection molding material of the etching process; An aqueous solution containing 1 to 10 g / L of nickel salt, 20 to 100 g / L of citrate as a complexing agent, and 5 to 50 g / L of sodium hypophosphite as a reducing agent in order to apply a nickel metal layer to a fine pattern for the injection material of the palladium catalyst applying process. Nickel plating process made by washing with water after immersion for 10 to 60 minutes at 50 ~ 90 ℃ using; A copper plating process for coating a copper plating layer on a fine pattern of the injection molding material of the nickel plating process; Palladium catalyst applying step for forming a nickel layer on the surface of the copper plating layer for the injection material of the copper plating process; Nickel plating process for preventing oxidation of the copper plating layer for the injection material of the palladium catalyst applying process; And rust and drying process; characterized in that it comprises a.
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또한, 본 발명에 따르면, 상기 팔라듐 촉매 부여공정은 염산(HCl) 혹은 황산(H2SO4) 50~200ml/L와 염화팔라듐 0.1~10g/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세하여 이루어지는 것을 특징으로 한다.In addition, according to the present invention, the palladium catalyst applying step is 1-10 at 20 ~ 40 ℃ using an aqueous solution containing 50 ~ 200ml / L hydrochloric acid (HCl) or sulfuric acid (H 2 SO 4) and 0.1 ~ 10g / L palladium chloride It is characterized by being washed with water after immersion for minutes.
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또한, 본 발명에 따르면, 상기 구리도금공정은 구리염 1~10g/L, 착화제인 에틸렌디아민테트라아세트산(EDTA) 10~100g/L, 환원제인 포름알데하이드 5~30ml/L 및 수산화나트륨 5~30g/L을 함유하는 수용액을 사용하여 25~60℃에서 10~240분간 침지 후 수세하여 이루어지는 것을 특징으로 한다.Further, according to the present invention, the copper plating process is copper salt 1 ~ 10g / L, complexing agent ethylenediaminetetraacetic acid (EDTA) 10 ~ 100g / L, reducing agent formaldehyde 5 ~ 30ml / L and sodium hydroxide 5 ~ 30g It is characterized in that it is washed with water after immersion for 10 to 240 minutes at 25 ~ 60 ℃ using an aqueous solution containing / L.
한편, 이에 앞서 본 명세서 및 특허청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.On the other hand, the terms or words used in the present specification and claims are not to be construed as limiting the ordinary or dictionary meanings, the inventors should use the concept of the term in order to explain the invention in the best way. Based on the principle that it can be properly defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all of the technical ideas of the present invention, and various alternatives may be substituted at the time of the present application. It should be understood that there may be equivalents and variations.
이상의 구성 및 작용에서 설명한 바와 같이, 본 발명에 의한 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법은 기존의 레이저 직접 성형(LDS) 도금 공정의 개선 및 추가 공정을 개입시켜 패턴 이외의 사출 성형물 상에 도금의 촉매가 될 수 있는 금속 잔유물과 석출됨을 방지하여 미세회로의 불량률을 절감하고, 유해물질인 무수크롬산을 사용하지 않고도 미세 패턴 형성이 가능하면서 기존 LDS 도금 공정 대비 생산성 향상과 도금 번짐 현상이 적어 도금층의 밀착력을 확보하는 동시에 제품의 신뢰성을 향상시킬 수 있는 효과를 제공한다.As described in the above configuration and operation, the microcircuit plating method of the laser direct injection molding for automobile parts according to the present invention is to improve the existing laser direct molding (LDS) plating process and to add the injection molding phase other than the pattern through the additional process. Reduces the defect rate of microcircuits by preventing metal residues and precipitates that can be catalysts for plating, and enables the formation of fine patterns without using chromic anhydride, which is a hazardous substance, while improving productivity and plating bleeding compared to existing LDS plating processes. Less, it provides the effect of improving the reliability of the product while ensuring the adhesion of the plating layer.
도 1은 본 발명에 따른 제조방법을 순차적으로 나타내는 플로 차트.1 is a flow chart sequentially showing a manufacturing method according to the present invention.
이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세하게 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
본 발명은 자동차 부품용 레이저 직접 성형 사출물의 미세패턴 상에 금속화를 위한 도금 방법에 관하여 제안한다. 사출물을 자동차 부품, 전자부품 등의 플라스틱 사출성형물 혹은 금속 성형물을 대상으로 하지만, 반드시 이에 국한되는 것은 아니다. 한편, 이러한 미세패턴 상에 금속화를 위한 도금 방법은 나노사이즈의 금속을 함유하는 도료를 사용하여 플라스틱 사출성형물 혹은 금속 성형물에 도장처리를 하고 레이저로 미세패턴을 구현하는 전처리 단계이다.The present invention proposes a plating method for metallization on a fine pattern of a laser direct injection molding for automotive parts. The injection molding targets plastic injection moldings or metal moldings such as automobile parts and electronic parts, but is not necessarily limited thereto. Meanwhile, the plating method for metallization on such a micropattern is a pretreatment step of coating a plastic injection molding or a metal molding using a paint containing a nano-sized metal and implementing a micropattern with a laser.
본 발명에 따르면 미세패턴 및 사출물의 소재 상에 이물질을 제거하는 탈지공정을 진행한다. 탈지공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물의 패턴 및 소재상의 이물질을 제거하는 공정으로, 이러한 탈지공정은 수산화나트륨(NaOH) 혹은 수산화칼륨(KOH) 60∼100g/L을 함유하는 수용액을 사용하여 50∼60℃에서 1∼10분간 침지 후 수세를 실시하는 바, 플라스틱 사출성형물 혹은 금속성형물의 패턴 및 소재상의 표면에 이물질, 즉 유지분, 먼지 또는 다른 불순물이 흡착되어 있는 경우 미도금, 도금 얼룩, 밀착 불량 등의 문제가 발생하기 쉬우므로 유기 용제 또는 알카리제의 탈지액을 사용하여 제거하는 공정을 수행한다.According to the present invention, the degreasing process of removing the foreign matter on the fine pattern and the material of the injection molding is performed. The degreasing process removes foreign substances on the injection molding, that is, the pattern and material of the plastic injection molding or the metal molding. The degreasing process uses an aqueous solution containing 60 to 100 g / L of sodium hydroxide (NaOH) or potassium hydroxide (KOH). After immersion for 1 to 10 minutes at 50 to 60 ° C, washing with water is carried out. If foreign substances, ie, oil, dust or other impurities are adsorbed on the surface of the plastic injection molding or the metal molding and on the surface of the material, unplated or plated Problems such as staining and poor adhesion tend to occur, and thus, a process of removing the organic solvent or an alkali degreasing solution is performed.
본 발명에 따르면 레이저 가공에서 발생한 사출물의 소재 상에 금속 잔유물과 금속 석출을 방지하는 디스머트(Desmut)공정을 진행한다. 디스머트(Desmut)공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물이 레이저 가공에서 발생한 소재 상의 분진을 제거하는 공정으로, 이러한 디스머트공정은 과황산나트륨 10~50g/L, 인산 20~100g/L을 함유하는 수용액을 사용하여 40∼60℃에서 5∼20분간 침지 후 수세를 실시하는 바, 디스머트공정을 탈지 공정과 에칭공정 사이에 개입시켜 패턴 이외의 사출성형물 혹은 금속성형물 상에 도금의 촉매가 될 수 있는 금속 잔유물을 제거하면서 금속이 석출되는 것을 방지할 수 있다.According to the present invention, a desmut process is performed to prevent metal residue and metal precipitation on the material of the injection molded product generated by laser processing. Desmut process is to remove the dust on the material from the injection molding, that is, plastic injection molding or metal molding by laser processing. This desmut process is 10-50g / L sodium persulfate and 20-100g / L phosphoric acid. After immersion at 40 to 60 ° C. for 5 to 20 minutes using an aqueous solution containing water, water washing was carried out, and the catalyst of plating was applied to the injection molding or the metal molding other than the pattern by interfering the desmetting process between the degreasing process and the etching process. It is possible to prevent the metal from being deposited while removing possible metal residues.
본 발명에 따르면 레이저 가공에서 사출물의 소재 상에 도출된 금속의 분진을 제거하는 에칭공정을 진행한다. 에칭공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 분진을 제거하는 공정으로, 이러한 에칭공정은 황산(H2SO4) 및 과산화수소(H2O2)를 각 10~50ml/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세를 실시하여 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물이 레이저 가공에서 발생한 소재 상의 분진을 제거한다.According to the present invention, an etching process of removing dust of metals derived from the material of the injection molding is performed. Etching process is to remove the dust on the injection molding, that is, plastic injection molding or metal molding, this etching process is 20 ~ 40 using an aqueous solution containing 10 ~ 50ml / L sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) After immersion at 1 ° C. for 10 minutes, washing with water is performed to remove dust on the material generated by laser processing of the injection molding, that is, the plastic injection molding or the metal molding.
본 발명에 따르면 상기 공정의 사출물 소재를 대상으로 미세패턴에 금속층을 형성하기 위한 팔라듐 촉매 부여공정을 진행한다. 팔라듐 촉매 부여공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 금속층을 형성하는 공정으로, 이러한 팔라듐 촉매 부여공정은 염산(HCl) 혹은 황산(H2SO4) 50~200ml/L와 염화팔라듐 0.1~10g/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세를 실시하여 금속층을 형성한다.According to the present invention, a palladium catalyst applying process for forming a metal layer on a fine pattern is performed on the injection material of the above process. The palladium catalysis is a process of forming a metal layer on an injection molding, that is, a micro-pattern on a plastic injection molding or a metal molding. The palladium catalysis is performed by hydrochloric acid (HCl) or sulfuric acid (H 2 SO 4) 50-200 ml / L and palladium chloride 0.1- Using an aqueous solution containing 10 g / L immersed at 20 ~ 40 ° C for 1 to 10 minutes and then washed with water to form a metal layer.
본 발명에 따르면 상기 공정의 사출물 소재를 대상으로 미세패턴에 니켈금속층을 입히기 위한 니켈도금공정을 진행한다. 니켈도금공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 니켈금속층을 입히기 위한 공정으로, 이러한 니켈도금공정은 니켈염 1~10g/L, 착화제인 구연산염 20~100g/L, 환원제인 차아인산나트륨 5~50g/L을 함유하는 수용액을 사용하여 50~90℃에서 10~60분간 침지 후 수세를 실시하여 사출성형물과 금속 도금 패턴 간의 밀착성을 향상시킬 수 있다.According to the present invention, a nickel plating process for coating a nickel metal layer on a fine pattern is performed on the injection molding material of the above process. Nickel plating process is a process for coating a nickel metal layer on an injection molding, that is, a micro-pattern on a plastic injection molding or a metal molding. This nickel plating process is a nickel salt of 1 ~ 10g / L, a complexing agent citrate 20 ~ 100g / L, a reducing agent tea Aqueous solution containing 5 to 50 g / L sodium phosphite may be immersed at 50 to 90 ° C. for 10 to 60 minutes, and then washed with water to improve adhesion between the injection molded product and the metal plating pattern.
본 발명에 따르면 상기 공정의 사출물 소재를 대상으로 미세패턴에 구리도금층을 입히기 위한 구리도금공정을 진행한다. 구리도금공정은 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 구리도금층을 입히기 위한 공정으로, 이러한 구리도금공정은 구리염 1~10g/L, 착화제인 에틸렌디아민테트라아세트산(EDTA) 10~100g/L, 환원제인 포름알데하이드 5~30ml/L 및 수산화나트륨 5~30g/L을 함유하는 수용액을 사용하여 25~60℃에서 10~240분간 침지 후 수세를 실시하여 구리금속층을 형성한다.According to the present invention, a copper plating process for coating a copper plating layer on a fine pattern is performed on the injection molding material of the above process. The copper plating process is a process for coating a copper plating layer on an injection molding, that is, a fine pattern on a plastic injection molding or a metal molding. The copper plating process is a copper salt of 1 to 10 g / L and a complexing agent of ethylenediaminetetraacetic acid (EDTA) 10 to 100 g. / L, using an aqueous solution containing 5 ~ 30ml / L formaldehyde and 5 ~ 30g / L as a reducing agent and immersed for 10 to 240 minutes at 25 ~ 60 ℃ to form a copper metal layer.
본 발명에 따르면 상기 공정의 사출물 소재를 대상으로 구리도금층의 표면에 니켈층을 형성하기 위한 팔라듐 촉매 부여공정을 진행한다. 팔라듐 촉매 부여공정은 앞선 공정과 동일하게 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 형성된 구리도금층의 표면에 니켈층을 형성하는 공정으로, 이러한 팔라듐 촉매 부여공정은 염산(HCl) 혹은 황산(H2SO4) 50~200ml/L와 염화팔라듐 0.1~10g/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세를 실시하여 구리도금층의 표면에 니켈층을 형성한다.According to the present invention, a palladium catalyst applying process for forming a nickel layer on the surface of the copper plating layer is performed on the injection molding material in the above process. The palladium catalyzing process is a process of forming a nickel layer on the surface of a copper plating layer formed on a fine pattern on an injection molding, a plastic injection molding or a metal molding, in the same manner as in the previous process, and the palladium catalysis is hydrochloric acid (HCl) or sulfuric acid ( H2SO4) using an aqueous solution containing 50 ~ 200ml / L and 0.1 ~ 10g / L of palladium chloride immersed for 1 to 10 minutes at 20 ~ 40 ℃ and then washed with water to form a nickel layer on the surface of the copper plating layer.
본 발명에 따르면 상기 공정의 사출물 소재를 대상으로 구리도금층의 산화 방지를 위한 니켈도금공정을 진행한다. 니켈도금공정은 앞선 공정과 동일하게 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 형성된 구리도금층에 산화를 방지하는 위한 공정으로, 이러한 니켈도금공정은 니켈염 1~10g/L, 착화제인 구연산염 20~100g/L, 환원제인 차아인산나트륨 5~50g/L을 함유하는 수용액을 사용하여 50~90℃에서 10~60분간 침지 후 수세를 실시하여 구리도금층에 산화를 방지한다.According to the present invention, a nickel plating process for preventing oxidation of the copper plating layer is performed on the injection molding material of the above process. Nickel plating process is a process for preventing oxidation in the copper plating layer formed in the fine pattern on the injection molding, that is, plastic injection molding or metal molding, similar to the previous process, this nickel plating process is nickel salt 1 ~ 10g / L, citrate salt complex An aqueous solution containing 20 to 100 g / L and 5 to 50 g / L of sodium hypophosphite as a reducing agent is immersed at 50 to 90 ° C. for 10 to 60 minutes, followed by washing with water to prevent oxidation of the copper plated layer.
마지막으로 본 발명에 따르면 방청과 건조공정을 진행한다. 방청공정은 부식의 초기 단계인 녹 발생을 방지하기 위한 사출물, 즉 플라스틱 사출성형물 혹은 금속성형물 상의 미세패턴에 형성된 도금층들에 코팅을 실시하고, 이후에 건조공정은 온도 50∼120℃에서 30초∼5분간 실시하는 열풍 건조와, 상기와 유사한 조건으로 실시하는 드럼식 건조 중에서 택하여 실시한다.Finally, according to the present invention, the rust prevention and drying process is performed. The antirust process is applied to the coating layers formed on the fine pattern on the injection molding, that is, the plastic injection molding or the metal molding, to prevent rust generation, which is an early stage of corrosion, and then the drying process is performed for 30 seconds at a temperature of 50 to 120 ° C. It performs by selecting from hot air drying performed for 5 minutes and drum type drying performed on the conditions similar to the above.
이와 같이, 본 발명은 기존의 레이저 직접 성형(LDS) 도금 공정의 개선 및 추가 공정을 개입시켜 패턴 이외의 사출 성형물 상에 도금의 촉매가 될 수 있는 금속 잔유물과 석출됨을 방지하여 미세회로의 불량률을 절감하고, 유해물질인 무수크롬산을 사용하지 않고도 미세 패턴 형성이 가능하면서 기존 LDS 도금 공정 대비 생산성 향상과 도금 번짐 현상이 적어 도금층의 밀착력을 확보하는 동시에 제품의 신뢰성을 향상시킬 수 있다.As such, the present invention prevents deposition of metal residues and catalysts which may be catalysts for plating on injection moldings other than patterns through improvements and additions to existing laser direct forming (LDS) plating processes to reduce defect rates of microcircuits. It is possible to form a fine pattern without using chromic anhydride, which is a harmful substance, and improve productivity and reliability of the plated layer due to less productivity and less smearing than the existing LDS plating process.
본 발명은 기재된 실시예에 한정되는 것은 아니고, 본 발명의 사상 및 범위를 벗어나지 않고 다양하게 수정 및 변형할 수 있음은 이 기술의 분야에서 통상의 지식을 가진 자에게 자명하다. 따라서 그러한 변형예 또는 수정예들은 본 발명의 특허청구범위에 속한다 해야 할 것이다.It is apparent to those skilled in the art that the present invention is not limited to the described embodiments, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.
Claims (7)
미세패턴 및 사출물의 소재 상에 이물질을 제거하기 위해 수산화나트륨(NaOH) 혹은 수산화칼륨(KOH) 60∼100g/L을 함유하는 수용액을 사용하여 50∼60℃에서 1∼10분간 침지 후 수세하여 이루어지는 탈지공정;
레이저 가공에서 발생한 사출물의 소재 상에 금속 잔유물과 금속 석출을 방지하기 위해 과황산나트륨 10~50g/L, 인산 20~100g/L을 함유하는 수용액을 사용하여 40∼60℃에서 5∼20분간 침지 후 수세하여 이루어지는 디스머트(Desmut)공정;
레이저 가공에서 사출물의 소재 상에 도출된 금속의 분진을 제거하기 위해 황산(H2SO4) 및 과산화수소(H2O2)를 각 10~50ml/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세하여 이루어지는 에칭공정;
상기 에칭공정의 사출물 소재를 대상으로 미세패턴에 금속층을 형성하기 위한 팔라듐 촉매 부여공정;
상기 팔라듐 촉매 부여공정의 사출물 소재를 대상으로 미세패턴에 니켈금속층을 입히기 위해 니켈염 1~10g/L, 착화제인 구연산염 20~100g/L, 환원제인 차아인산나트륨 5~50g/L을 함유하는 수용액을 사용하여 50~90℃에서 10~60분간 침지 후 수세하여 이루어지는 니켈도금공정;
상기 니켈도금공정의 사출물 소재를 대상으로 미세패턴에 구리도금층을 입히기 위한 구리도금공정;
상기 구리도금공정의 사출물 소재를 대상으로 구리도금층의 표면에 니켈층을 형성하기 위한 팔라듐 촉매 부여공정;
상기 팔라듐 촉매 부여공정의 사출물 소재를 대상으로 구리도금층의 산화 방지를 위한 니켈도금공정; 및
방청과 건조공정;을 포함하는 것을 특징으로 하는 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법.In a plating method for metallization on a fine pattern of a laser direct-molding plastic injection molding or a metal molding for automotive parts:
In order to remove foreign substances on the fine pattern and the material of the injection molding, it is immersed for 1 to 10 minutes at 50 to 60 ° C and washed with water using an aqueous solution containing 60 to 100 g / L of sodium hydroxide (NaOH) or potassium hydroxide (KOH). Degreasing process;
After immersion for 5 to 20 minutes at 40 to 60 ° C using an aqueous solution containing 10 to 50 g / L sodium persulfate and 20 to 100 g / L phosphoric acid to prevent metal residues and metal precipitation on the material of the injection produced by laser processing. Desmut process performed by washing with water;
In laser processing, sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) were immersed at 20 to 40 ° C for 1 to 10 minutes using an aqueous solution containing 10 to 50 ml / L to remove metal dust. An etching step carried out after washing with water;
A palladium catalyst applying step for forming a metal layer on a fine pattern of the injection molding material of the etching process;
An aqueous solution containing 1 to 10 g / L of nickel salt, 20 to 100 g / L of citrate as a complexing agent, and 5 to 50 g / L of sodium hypophosphite as a reducing agent in order to apply a nickel metal layer to a fine pattern for the injection material of the palladium catalyst applying process. Nickel plating process made by washing with water after immersion for 10 to 60 minutes at 50 ~ 90 ℃ using;
A copper plating process for coating a copper plating layer on a fine pattern of the injection molding material of the nickel plating process;
A palladium catalyst imparting step for forming a nickel layer on the surface of the copper plating layer for the injection material of the copper plating process;
A nickel plating process for preventing oxidation of a copper plating layer on the injection material of the palladium catalyst applying process; And
Anti-corrosion and drying process; fine circuit plating method on a laser direct injection molding for automotive parts comprising a.
상기 팔라듐 촉매 부여공정은 염산(HCl) 혹은 황산(H2SO4) 50~200ml/L와 염화팔라듐 0.1~10g/L을 함유하는 수용액을 사용하여 20~40℃에서 1~10분간 침지 후 수세하여 이루어지는 것을 특징으로 하는 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법.The method of claim 1,
The palladium catalyst imparting step is performed by immersion for 1 to 10 minutes at 20 to 40 ° C. using an aqueous solution containing 50 to 200 ml / L of hydrochloric acid (HCl) or sulfuric acid (H 2 SO 4) and 0.1 to 10 g / L of palladium chloride, followed by washing with water. A fine circuit plating method on a laser direct injection molding for an automotive part.
상기 구리도금공정은 구리염 1~10g/L, 착화제인 에틸렌디아민테트라아세트산(EDTA) 10~100g/L, 환원제인 포름알데하이드 5~30ml/L 및 수산화나트륨 5~30g/L을 함유하는 수용액을 사용하여 25~60℃에서 10~240분간 침지 후 수세하여 이루어지는 것을 특징으로 하는 자동차 부품용 레이저 직접 성형 사출물상의 미세 회로 도금방법.The method of claim 1,
The copper plating process comprises an aqueous solution containing 1 to 10 g / L of copper salt, 10 to 100 g / L of ethylenediaminetetraacetic acid (EDTA) as a complexing agent, 5 to 30 ml / L of formaldehyde as a reducing agent, and 5 to 30 g / L of sodium hydroxide. Microcircuit plating method on a laser direct-molded injection molded product for automobile parts, characterized in that it is rinsed after washing for 10 to 240 minutes at 25 ~ 60 ℃ using.
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| KR101282183B1 (en) * | 2013-02-08 | 2013-07-04 | (주) 우진 더블유.티.피. | Laser direct structuring electroless plating method with two-step pre-treatment process and intenna thereof |
| KR101570641B1 (en) * | 2015-05-18 | 2015-11-20 | (주)대영케이티엑스 | Manufacturing method of LDP type vehicle antenna for direct-soldering to PCB |
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| KR101282183B1 (en) * | 2013-02-08 | 2013-07-04 | (주) 우진 더블유.티.피. | Laser direct structuring electroless plating method with two-step pre-treatment process and intenna thereof |
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