KR101966997B1 - 가공 방법 - Google Patents

가공 방법 Download PDF

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Publication number
KR101966997B1
KR101966997B1 KR1020130105964A KR20130105964A KR101966997B1 KR 101966997 B1 KR101966997 B1 KR 101966997B1 KR 1020130105964 A KR1020130105964 A KR 1020130105964A KR 20130105964 A KR20130105964 A KR 20130105964A KR 101966997 B1 KR101966997 B1 KR 101966997B1
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KR
South Korea
Prior art keywords
wafer
adhesive sheet
plate
protective member
expanding
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Application number
KR1020130105964A
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English (en)
Korean (ko)
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KR20140038305A (ko
Inventor
도루 다카자와
Original Assignee
가부시기가이샤 디스코
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Publication of KR20140038305A publication Critical patent/KR20140038305A/ko
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Publication of KR101966997B1 publication Critical patent/KR101966997B1/ko

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130105964A 2012-09-20 2013-09-04 가공 방법 KR101966997B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-206913 2012-09-20
JP2012206913A JP5977633B2 (ja) 2012-09-20 2012-09-20 加工方法

Publications (2)

Publication Number Publication Date
KR20140038305A KR20140038305A (ko) 2014-03-28
KR101966997B1 true KR101966997B1 (ko) 2019-04-08

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ID=50318630

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KR1020130105964A KR101966997B1 (ko) 2012-09-20 2013-09-04 가공 방법

Country Status (3)

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JP (1) JP5977633B2 (zh)
KR (1) KR101966997B1 (zh)
CN (1) CN103681492B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6494360B2 (ja) * 2015-03-25 2019-04-03 株式会社ディスコ 拡張装置
JP6671794B2 (ja) * 2016-05-11 2020-03-25 株式会社ディスコ ウェーハの加工方法
JP6710457B2 (ja) * 2016-06-01 2020-06-17 株式会社ディスコ エキスパンドシート、エキスパンドシートの製造方法、及びエキスパンドシートの拡張方法
JP7216504B2 (ja) * 2018-09-03 2023-02-01 株式会社ディスコ エキスパンド方法
JP7345328B2 (ja) 2019-09-13 2023-09-15 株式会社ディスコ 被加工物の加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129606A (ja) * 2009-12-16 2011-06-30 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134955A (ja) * 1984-07-26 1986-02-19 Teikoku Seiki Kk シリコンウエハ−の自動分離方法
JPS6155940A (ja) * 1984-08-27 1986-03-20 Nec Corp 半導体ウエハ−のペレツタイズ装置
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP2006229021A (ja) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
JP4478053B2 (ja) * 2005-03-29 2010-06-09 株式会社ディスコ 半導体ウエーハ処理方法
US7382647B1 (en) * 2007-02-27 2008-06-03 International Business Machines Corporation Rectifying element for a crosspoint based memory array architecture
JP4971869B2 (ja) * 2007-05-11 2012-07-11 株式会社ディスコ 接着フィルム破断装置
JP5133660B2 (ja) * 2007-11-27 2013-01-30 株式会社ディスコ ウエーハの裏面に装着された接着フィルムの破断方法
JP2009272503A (ja) * 2008-05-09 2009-11-19 Disco Abrasive Syst Ltd フィルム状接着剤の破断装置及び破断方法
KR20100052080A (ko) * 2008-11-10 2010-05-19 주식회사 하이닉스반도체 저항성 메모리 소자 및 그 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129606A (ja) * 2009-12-16 2011-06-30 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法

Also Published As

Publication number Publication date
JP2014063812A (ja) 2014-04-10
CN103681492B (zh) 2018-02-16
CN103681492A (zh) 2014-03-26
JP5977633B2 (ja) 2016-08-24
KR20140038305A (ko) 2014-03-28

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