KR101891341B1 - 접합 기판의 가공 방법 그리고 가공 장치 - Google Patents

접합 기판의 가공 방법 그리고 가공 장치 Download PDF

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Publication number
KR101891341B1
KR101891341B1 KR1020130030248A KR20130030248A KR101891341B1 KR 101891341 B1 KR101891341 B1 KR 101891341B1 KR 1020130030248 A KR1020130030248 A KR 1020130030248A KR 20130030248 A KR20130030248 A KR 20130030248A KR 101891341 B1 KR101891341 B1 KR 101891341B1
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KR
South Korea
Prior art keywords
substrate
laser beam
laser
processing
bonded substrate
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KR1020130030248A
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English (en)
Korean (ko)
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KR20140017421A (ko
Inventor
이쿠요시 나카타니
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20140017421A publication Critical patent/KR20140017421A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461—Welding tables

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
KR1020130030248A 2012-07-31 2013-03-21 접합 기판의 가공 방법 그리고 가공 장치 KR101891341B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-170132 2012-07-31
JP2012170132A JP5965239B2 (ja) 2012-07-31 2012-07-31 貼り合わせ基板の加工方法並びに加工装置

Publications (2)

Publication Number Publication Date
KR20140017421A KR20140017421A (ko) 2014-02-11
KR101891341B1 true KR101891341B1 (ko) 2018-08-23

Family

ID=50040808

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130030248A KR101891341B1 (ko) 2012-07-31 2013-03-21 접합 기판의 가공 방법 그리고 가공 장치

Country Status (4)

Country Link
JP (1) JP5965239B2 (zh)
KR (1) KR101891341B1 (zh)
CN (1) CN103567630B (zh)
TW (1) TWI587959B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20210102130A (ko) * 2018-11-10 2021-08-19 토파펙스 옵트로닉스 테크놀로지 컴퍼니 리미티드 레이저 광원 모듈

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JP6184341B2 (ja) * 2014-02-18 2017-08-23 三菱電機株式会社 半導体基板の切断方法
JP2016052672A (ja) * 2014-09-04 2016-04-14 株式会社ディスコ レーザー加工装置
JP6561566B2 (ja) * 2015-04-30 2019-08-21 三星ダイヤモンド工業株式会社 貼り合わせ基板の分割方法及び分割装置
JP6571437B2 (ja) * 2015-07-29 2019-09-04 リンテック株式会社 半導体装置の製造方法
KR102202933B1 (ko) * 2016-03-31 2021-01-14 주식회사 엘지화학 레이저 가공 장치 및 레이저 가공 방법
CN106298451A (zh) * 2016-08-18 2017-01-04 昆山国显光电有限公司 激光晶化方法及装置
CN106425112B (zh) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 一种激光划片的方法及***
CN106410573A (zh) * 2016-11-02 2017-02-15 国神光电科技（上海）有限公司 一种激光器
KR101902991B1 (ko) * 2017-02-20 2018-10-02 (주)큐엠씨 레이저 스크라이빙 장치
JP6980444B2 (ja) * 2017-07-28 2021-12-15 浜松ホトニクス株式会社 積層型素子の製造方法
JP6981800B2 (ja) 2017-07-28 2021-12-17 浜松ホトニクス株式会社 積層型素子の製造方法
JP7223828B2 (ja) * 2017-07-28 2023-02-16 浜松ホトニクス株式会社 積層型素子の製造方法
KR102582734B1 (ko) * 2017-09-27 2023-09-27 주식회사 탑 엔지니어링 기판 절단 장치
KR102176869B1 (ko) * 2018-07-30 2020-11-11 주식회사 탑 엔지니어링 기판 가공 장치 및 기판 가공 방법
CN110064841B (zh) * 2019-04-24 2021-03-30 大族激光科技产业集团股份有限公司 一种激光加工装置、激光开槽方法和激光全切方法
JP7267455B2 (ja) * 2019-06-20 2023-05-01 長江存儲科技有限責任公司 方法及びレーザ・ダイシング・システム
CN113226632A (zh) * 2021-03-31 2021-08-06 长江存储科技有限责任公司 用于切割半导体结构的激光***及其操作方法

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JP2007229758A (ja) * 2006-02-28 2007-09-13 Fukami Seisakusho:Kk レーザ加工装置

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ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
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JP5232375B2 (ja) 2006-10-13 2013-07-10 アイシン精機株式会社 半導体発光素子の分離方法
JP5154838B2 (ja) * 2007-05-31 2013-02-27 株式会社ディスコ レーザー加工装置
JP5775265B2 (ja) * 2009-08-03 2015-09-09 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004337902A (ja) * 2003-05-14 2004-12-02 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2007229758A (ja) * 2006-02-28 2007-09-13 Fukami Seisakusho:Kk レーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210102130A (ko) * 2018-11-10 2021-08-19 토파펙스 옵트로닉스 테크놀로지 컴퍼니 리미티드 레이저 광원 모듈
KR102464159B1 (ko) * 2018-11-10 2022-11-07 토파펙스 인바이런먼트 프로텍션 에너지 컴퍼니 리미티드 레이저 광원 모듈

Also Published As

Publication number Publication date
TW201404512A (zh) 2014-02-01
JP5965239B2 (ja) 2016-08-03
CN103567630A (zh) 2014-02-12
TWI587959B (zh) 2017-06-21
JP2014028388A (ja) 2014-02-13
KR20140017421A (ko) 2014-02-11
CN103567630B (zh) 2017-05-24

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