KR101864220B1 - Manufacturing method of printed circuit board for drone - Google Patents

Manufacturing method of printed circuit board for drone Download PDF

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Publication number
KR101864220B1
KR101864220B1 KR1020170157119A KR20170157119A KR101864220B1 KR 101864220 B1 KR101864220 B1 KR 101864220B1 KR 1020170157119 A KR1020170157119 A KR 1020170157119A KR 20170157119 A KR20170157119 A KR 20170157119A KR 101864220 B1 KR101864220 B1 KR 101864220B1
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South Korea
Prior art keywords
layer
hole
copper foil
copper
plating layer
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KR1020170157119A
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Korean (ko)
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정찬붕
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두두테크 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Abstract

It is an object of the present invention to provide a method for manufacturing a printed circuit board for drums that is high in durability and reliability and meets optimum conditions.
In order to achieve the above object, a method for manufacturing a printed circuit board for a drone according to the present invention includes a first step (S100) of preparing an epoxy layer (100) in which a copper foil (110) A second step S200 of forming a predetermined inner layer circuit by performing an inner layer image process on the first copper layer 110 and a second copper layer forming step S200 on one surface of the epoxy layer 100 having predetermined circuit patterns formed on both surfaces thereof, And a third prepreg layer 200 formed on the other surface of the epoxy layer 100. The first prepreg layer 200 and the third copper foil 310 are laminated on the epoxy layer 100 and the predetermined circuit pattern, A third step S300 of forming a second prepreg layer 300 to be laminated on the epoxy layer 100 and a predetermined circuit pattern on the other side of the through hole A A fourth step (S400) of forming a component hole (B), a first mechanism hole (C), and a second mechanism hole (D) An electroless copper plating layer 400 is formed on the inner surface of the second mechanism hole D and all the regions of the second mechanism hole D except for the holland and the electrolytic copper plating layer 500 is formed on the electroless copper plating layer 400 A fifth step S500 of forming the first copper foil 310 and the second copper foil 310 on the copper electroplating layer 500 and a fifth step S500 of forming the second copper foil 210, the third copper foil 310, the electroless copper plating layer 400, (S600) of forming a predetermined outer layer circuit by performing the process of forming the outer hole of the component hole (B) and the inner surface and the hole of the through hole (A) A seventh step S700 of printing the solder resist ink 600 on the inner surface and the inner surface of the component hole B, the inner surface of the second mechanism hole D, , An eighth step (S800) of forming a marking dam (700) with a marking ink on a region where the solder resist ink (600) is printed between the first mechanism holes (C) A nickel plating layer 800 and a gold plating layer 900 are formed on the region where the resist ink 600 is printed, the region where the marking dam 700 is formed, and the region other than the inner surface of the second mechanism hole D And a ninth step (S900) of forming sequentially.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board for a drone,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board for a drone, and more particularly to a method for manufacturing a printed circuit board for a drone having excellent durability and reliability.

Drone is a flying object flying by the induction of radio wave without boarding a person. The range of application of such a dragon is various such as reconnaissance, photographing, delivery, pesticide spraying, toy.

Such a drones 'flight system has a problem that the drones' weight and malfunction due to jamming, inaccurate shooting recognition of a subject to be photographed during aerial photographing, possibility of collision with another flying object during flight, It is very important to consider the reliability, durability, and precision of the drone at the time of manufacturing the printed circuit board of the drone, because problems such as being easily exposed to external signal jamming operation may occur.

That is, since the dron is a flying object that does not carry a person, durability and reliability of the dron are very important, and a method of manufacturing a printed circuit board for a drone that meets the optimum conditions is required.

SUMMARY OF THE INVENTION The present invention has been proposed in order to satisfy the above-described needs, and an object of the present invention is to provide a method for manufacturing a printed circuit board for drums that is excellent in durability and reliability and meets optimum conditions.

In order to achieve the above object, a method of manufacturing a printed circuit board for a dron according to the present invention includes a first step (S100) of preparing an epoxy layer (100) in which a first copper foil (110) A second step S200 of forming a predetermined inner layer circuit by performing an inner layer image process on the first copper foil 110 and a second step S200 of forming a predetermined circuit pattern on both surfaces of the copper foil 110, A first prepreg layer 200 having a copper foil 210 and another surface impregnated with the epoxy layer 100 and a predetermined circuit pattern and a third prepreg layer 200 formed on the other surface of the epoxy layer 100, A third step (S300) of forming a second prepreg layer (300) on the other side of the epoxy layer (100) and a predetermined circuit pattern by being impregnated with the prepreg layer (310) (S400) of forming a component hole (A), a component hole (B), a first mechanism hole (C), and a second mechanism hole (D) An electroless copper plating layer 400 is formed on the inner surface of the second mechanism hole D and all the regions except the holes of the second mechanism hole D and the electrolytic copper plating layer 400 is formed on the electroless copper plating layer 400 500, 500, 500); and a second step of forming the second copper foil (210), the third copper foil (310), the electroless copper plating layer (400), and the electrolytic copper plating layer (500) A sixth step (S600) of forming a predetermined outer layer circuit by performing an image process on the inner surface of the through hole (A), the inner surface of the through hole (A), the inner surface of the component hole (B) (S700) of printing the solder resist ink (600) on the inner surface and the inner surface of the component hole (C), the inner surface of the second mechanism hole (D) An eighth step (S800) of forming a marking dam (700) with a marking ink on a region where the solder resist ink (600) is printed between the first mechanism hole (C) A nickel plating layer 800 and a gold plating layer 900 are formed on a region where the solder resist ink 600 is printed, a region where the marking dam 700 is formed, and an area other than the inner surface of the second mechanism hole D, (Step S900).

In the method for manufacturing a printed circuit board for a dron according to the present invention, the epoxy layer 100 is formed of a material having a thickness of 4 mm, and a FR- 4 material, having a CTE of 55 ppm / ° C, a glass transition temperature of TG 150 ° C, and a pyrolysis temperature of TD 350 ° C.

In the method of manufacturing a printed circuit board for a drone according to the present invention, the inner layer image process is a process of forming a photoresist (PR) on a first copper foil (110) A lamination process (A1) of laminating a 50 mu m-thick dry film on which a circuit pattern of a predetermined shape is formed on the photoresist by a roller having a roller pressure of 0.5 MPa and a roller speed of 0.8 to 1.5 m / And an exposure apparatus for irradiating light irradiated with a light amount of 50 to 90 mJ / cm 2 by an 8 kW exposure apparatus to form a circuit pattern of a predetermined shape on the photoresist, onto the dry film having a circuit pattern of a predetermined shape (VOL), which is a temperature of 27 ° C to 32 ° C (± 2 ° C), is sprayed at a spray pressure of 0.12Mpa to 0.15Mpa after removing the dry film, The circuit pattern of the shape and the area of the region other than the holland A developing step C1 for removing the photoresist and a developing step C1 for removing the photoresist from 155 g / l to 220 g / l with a temperature of 45 to 55 占 폚 (占 폚) and a specific gravity (20 占 폚) of 1.15 An etching process (D1) in which a copper metal etchant is injected at a pressure of 2.4 kgf / cm < 2 > (+/- 1.0) to remove the first copper foil 110 ) And a 2.1% to 4.5% (VOL) sodium hydroxide peeling solution at a temperature of 45 ° C to 58 ° C (± 2 ° C) were sprayed at a spray pressure of 1.02 MPa to 3.2 MPa, And a stripping step (E1) for removing the photoresist are performed, respectively, to form a predetermined inner layer circuit and a holland.

Further, in the method of manufacturing a printed circuit board for drums according to the present invention, a first micro-etching process is further performed after the second process (S200), wherein the first micro-etching process is performed at a speed of 1.3 m / min to 2.5 m (H 2 SO 4 ), 60 ml / l hydrogen peroxide (H 2 O 2 ) and 40 ml / l of etching solution (Etchant Solution (20 占 폚) of 1.030 to 1.050, a pH of 3.00 or less, an etching rate of 0.5 占 퐉 to 1.0 占 퐉 using a microetching solution having a temperature of 32 占 폚 (占 5 占 폚) As shown in FIG.

In the method of manufacturing a printed circuit board for a drone according to the present invention, the through hole A, the component hole B, the first mechanism hole C, the second mechanism hole D, CNC (Computerized Numerical Control) M / C drilling process with an RPM of 200,000.

Further, in the method for manufacturing a printed circuit board for a drone according to the present invention, a deburring step for removing a burr generated in the drilling process after the fourth step (S400) In the deburring step, a bristle brush having a brush rotation of 1,700 rpm to 2,000 rpm and an oscillation cycle of 280 cpm to 350 cpm on a conveyor moving at a speed of 1.2 m / min to 1.8 m / brush, and the rinse is rinsed in four stages at a high pressure washing pressure of 45 kgf / cm 2 (± 5.0), followed by air cut drying at 95 ° C. to dry the rinse.

In the method for manufacturing a printed circuit board for a drone according to the present invention, after the deburring step, the copper foil 110 and the first prepreg layer 200 or the copper foil 110 and the second prepreg Layer 300 is formed on the interface between the first prepreg layer 200 and the second prepreg layer 300 by means of KMnO 4 generated by frictional heat generated by a drill bit during drilling, And performs the mower process.

In the method for manufacturing a printed circuit board for a dron according to the present invention, the electroless copper plating layer 400 may be formed of copper sulfate, 85 g / l of ethylene sulfate, 160 g / l of ethylenediamine acetic acid (EDTA) (HCHO), 45 g / l of sodium hydroxide (NaOH), 0.12 g / l of polyethylene glycol (PEG) and 83 mg / l of bipyridyl And the plating is performed at a temperature of 40 占 폚 (占 1 占 폚) for 35 minutes to form a thickness of 1.7 占 퐉 to 2.0 占 퐉.

In the method for manufacturing a printed circuit board for a dron according to the present invention, the electrodeposited copper plating layer 500 is formed of 192 g / l of semi-tower sulfuric acid, 85 g / l of copper sulfate, / L of additive, 51 mL / L of leveling agent and 51 mL / L of brightener at a temperature of 23 째 C for 90 minutes at a rate of 2.3 A / dm 2 to 2.9 Lt; RTI ID = 0.0 > A / dm < / RTI >

In the method for manufacturing a printed circuit board for a drone according to the present invention, the outer layer circuit forming step may be performed by polishing a brush with a vibration cycle of 100 cpm to 150 cpm in a conveyor moving at a speed of 1.4 m / min to 1.8 m / min , 5% (VOL) of 95% sulfuric acid (H 2 SO 4 ) and DI water, rinsed 5 times with water, and then air-cut dry at 95 ° C The second copper foil 210 formed by the fifth step S500, the third copper foil 310, the electroless copper plating layer 400, A photoresist PR is closely adhered to the electrodeposited copper plating layer 500 (actually, the upper surface of the electrolytic copper plating layer 500), and a roller temperature of 105 ° C to 135 ° C (± 5 ° C) and a roller of 0.23 MPa to 0.4 MPa The dry film having a thickness of 50 mu m and having a circuit pattern of a predetermined shape formed on the photoresist is brought into close contact with a roller having a pressure and a roller speed of 0.7 m / min to 1.3 m / min A lamination step (B1), and a step of irradiating light irradiated with an amount of light of 50 mJ / cm2 to 90 mJ / cm2 by a 8 kW exposure device so as to form a circuit pattern of a predetermined shape on the photoresist, An exposure step (C1) of irradiating the dry film with a solvent and a sodium carbonate developer at a temperature of 27 ° C to 32 ° C (± 2 ° C) of 0.5% to 1.0% (VOL) at a spray pressure of 0.12 MPa to 0.15 MPa A developing step (D1) of removing photoresist in a region except for the circuit pattern and the holland of a predetermined shape by spraying, a step of developing a resist pattern having a temperature of 45 캜 to 55 캜 (± 2 캜) and a specific gravity of 1.15 賊 0.05 (Copper metal) etchant having a thickness of 155 g / ℓ to 220 g / ℓ is sprayed at a pressure of 2.4 kgf / cm 2 (± 1.0) A third copper foil 310, an electroless copper copper plating layer 400, an electrolytic copper plating layer 500 ) And a spraying liquid of sodium hydroxide at 2.1 to 4.5% (VOL) at a temperature of 45 ° C to 58 ° C (± 2 ° C) at a spray pressure of 1.02 MPa to 3.2 MPa A predetermined circuit pattern and a stripping process (F1) for removing the photoresist remaining on the holland are performed to form a predetermined outer layer circuit pattern.

In the method of manufacturing a printed circuit board for a drone according to the present invention, after the circuit forming step, a gap between a circuit and a circuit, a first JET scraping and a first ultrasonic cleaning but each further performs a step, wherein the polishing is 1 JET 1.0m / min ~ 1.5m / on a conveyor moving at a speed of min 1.2㎏f / ㎠ ~ 1.7㎏f / ㎠ of aluminum oxide spray pressure (Al 2 O carried out by spraying the third (# 400)), and the first ultrasonic cleaning step is the first ultrasonic cleaning step, and performing, 2Zone hot water three (Hot rinse), and washed 4Zone bite throw in 1,200Watt × 4㎑ × 4Zone .

Further, in the method of manufacturing a printed circuit board for a drone according to the present invention, a second micro-etching process is further performed after the first JET scrubbing and the first ultrasonic cleaning process, 2 micro-etching process, and 35% hydrogen peroxide of 1.3m / min ~ 2.5m / on a conveyor moving at a speed of min, 95% sulfuric acid 70㎖ / ℓ (H 2 SO 4 ) and, 60㎖ / ℓ (2 H O 2), and a solution of the corrosion 40㎖ / ℓ (etchant solution) and deionized water (Di Water) 32 ℃ (using a micro etching solution for ± 5 ℃) temperature, specific gravity of 1.030 ~ 1.050, and contained the following 3.00 pH, and an etching rate of 2.2 탆 to 2.5 탆.

Further, in the method for manufacturing a printed circuit board for drums according to the present invention, the printing process for printing with the solder resist ink (600) comprises mixing a base of 210 ± 10 poise and a curing agent of 80 ± 10 poise, The solder resist ink 600 having a specific gravity of 1.35 to 1.40 was repeatedly printed two times at an angle of about 90 占 using a 110 mesh printing silk screen to carry out the printing process at 80 占 폚 for 16 to 22 minutes After primary pre-curing, followed by secondary precuring at 80 ° C for 20 minutes to 25 minutes, exposure to light at a dose of 260 mJ / cm 2 to 320 mJ / cm 2 using an 8 kW exposure machine, A 1.0 wt% sodium carbonate developer at a temperature of 32 DEG C (+/- 1 DEG C) was sprayed at a spray pressure of 2.3 kgf / cm2 to 3.0 kgf / cm2 for 95 seconds to 140 seconds, Followed by post-curing for 90 minutes to dry, The thickness of the solder resist ink 600 at the portions of the first prepreg layer 200 and the second prepreg layer 300 is 30 占 퐉 or more and the solder resist ink 600 at the edge portion is printed. Is printed with a thickness of 20 占 퐉 to 25 占 퐉 or more.

When the marking dam 700 is formed, the mixing ratio of the base and the curing agent is 100: 8, and the mixture is stirred for 10 minutes or more. The marking dam having a thickness of 20 mu m to 25 mu m was printed on a 200 mesh printing silk screen having an ink viscosity of 290 poise and dried at a temperature of 150 DEG C for 20 minutes to 25 minutes and then held for 30 minutes, .

In the method of manufacturing a printed circuit board for drums according to the present invention, after the marking dam 700 is formed, a second JET scraping and / The second JET polishing was carried out in a conveyor moving at a speed of 1.5 m / min to 2.0 m / min, and a second ultrasonic cleaning process was carried out using 45 ml / l 95% sulfuric acid (H 2 SO 4 ) and DI water. After rinsing with water for 4 rinses, aluminum oxide (Al 2 O 3 (# 420 The second ultrasonic cleaning was performed by rinsing in a 1,400 Watt × 4 KHz × 4 Zone with water and then with ultra pure water (4-speed water washing) and drying at 95 ° C. to 98 ° C. (± 1 ° C.) .

In the method of manufacturing a printed circuit board for a dron according to the present invention, the nickel plating layer 800 and the gold plating layer 900 may be formed by mixing 50 g / l of nickel chloride and 100 g / l of aminotrimethylene A mixture of aminotrimethyl phosphonic acid, 110 g / l of nickel sulfate, 55 g / l of ascorbic acid, 55 g / l of boric acid and 0.15 g / A nickel plating solution containing a brightener is electroplated at a temperature of 54 캜 for 12 to 20 minutes at a current density of 0.27 A / dm 2 to 0.47 A / dm 2 to form a nickel plating layer 800 at a thickness of 5 탆 to 7 탆 , And a mixture of 20 g / l of potassium gold cyanide, 120 g / l of tripotassium citrate monohydrate, 65 g / l of citric anhydride, 0.54 g / l of hexamethylene A soft pure gold plating comprising tetramine (Hexamethylene tetramine) and 0.54 g / l of 3-pyridine carboxylic acid The solution is plated at a temperature of 53 캜 and at 4.5 pH for 12 minutes to 14 minutes to form a gold plating layer 900 with a thickness of 0.04 탆 to 0.05 탆.

According to the present invention, there is provided an effect of providing a method for manufacturing a printed circuit board for a drone which has high durability and reliability and meets optimum conditions.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a floor chart showing the entire flow of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention; Fig.
2 is a sectional view showing a first step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
3 is a cross-sectional view showing a second step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
4 is a cross-sectional view showing a third step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
5 is a cross-sectional view showing a fourth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
6 is a cross-sectional view showing a fifth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
7 is a cross-sectional view showing a sixth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
8 is a cross-sectional view showing a seventh step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention;
9 is a sectional view showing an eighth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.
10 is a sectional view showing a ninth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a flowchart showing an overall flow of a method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention; FIG.

1, a method of manufacturing a printed circuit board for a dron according to the present invention includes a first step (S100) of preparing an epoxy layer (100) in which a copper foil (110) is laminated on both sides, A second step S200 of forming a predetermined inner layer circuit by performing an inner layer image process on the first copper layer 210 and a second copper layer 210 on one surface of the epoxy layer 100 having a predetermined circuit pattern formed on both surfaces thereof A third prepreg layer 200 impregnated with the epoxy layer 100 and a predetermined circuit pattern and a third copper foil 310 on one side of the epoxy layer 100 are stacked on the other side, A third step S300 of forming a second prepreg layer 300 to be laminated on the layer 100 and a predetermined circuit pattern, a through hole A penetrating the upper and lower surfaces, A fourth step S400 of forming a first mechanism hole C and a second mechanism hole D on the inner surface of the first mechanism hole D and the second mechanism hole D, hall A fifth step (S500) of forming an electroless copper plating layer (400) on all areas except the first copper layer (400) and forming an electrolytic copper plating layer (500) on the electroless copper plating layer (400) A sixth step S600 of forming a predetermined outer layer circuit by performing an outer layer image process on the third copper foil 310, the electroless copper plating layer 400 and the copper electroplating layer 500, The inner surface of the component hole B, the inner surface of the component hole B, the inner surface of the component hole B, the inner surface of the component hole B, the inner surface of the component hole B and the inner surface of the second component hole D, A seventh step S700 of printing the ink 600 with the marking ink on the area where the solder resist ink 600 between the component hole B and the first mechanism hole C is printed, And the area where the marking dam 800 is formed and the area other than the inner surface of the second mechanism hole D are formed in the area where the solder resist ink 600 is printed, In addition, And a ninth step (S900) of forming the layer 800 and a gold plated layer 900 in order.

This will be described with reference to the respective drawings.

2 is a cross-sectional view showing a first step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

Referring to FIG. 2, an epoxy layer 100 in which a copper foil 110 is laminated on both sides is prepared (S100).

When the raw material is cut, the epoxy layer 100 is formed of a material having a thickness of 4 mm, and the material is FR-4 having a thickness of 20 oz (70 탆) on the upper and lower surfaces thereof. The material has a CTE of 55 ppm / , The glass transition temperature is TG 150 ° C, and the thermal decomposition temperature is TD 350 ° C.

3 is a cross-sectional view showing a second step of a method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

Referring to FIG. 3, an inner layer image process is performed on the first copper foil 110 to form a predetermined inner layer circuit (S200).

Here, since the thickness of Cu in the inner layer circuit and the like is 70 占 퐉, 50 占 퐉 is used for the inner layer image dry film in order to increase the precision of the circuit and to keep the upper limit width of the circuit within ± 15%.

This inner layer image process is as follows.

The lamination step A1 is a step of laminating a photoresist PR on the first copper foil 110 to form a laminate having a roller temperature of 95 to 135 占 폚, a roller pressure of 0.25 to 0.5 Mpa, min, a dry film having a thickness of 50 mu m having a circuit pattern of a predetermined shape formed on the photoresist is laminated.

Exposure step B1 is a step of irradiating light irradiated with a light quantity of 50 to 90 mJ / cm 2 with an 8 kW exposure device to form a circuit pattern of a predetermined shape on the photoresist, do.

The developing process C1 is a process in which a sodium carbonate developer of 0.6% to 1.0% (VOL) at a temperature of 27 ° C to 32 ° C (± 2 ° C) is sprayed at a spray pressure of 0.12Mpa to 0.15Mpa Thereby removing the photoresist in the region excluding the circuit pattern and the holland of the predetermined shape.

The etching process D1 is performed at a temperature of 45 ° C to 55 ° C (± 2 ° C) and a copper metal (CuO) content of 155g / l to 220g / l with a specific gravity (20 ° C) of 1.15 ) Etchant is sprayed at a pressure of 2.4 kgf / cm 2 (± 1.0) to remove the circuit pattern of the predetermined shape and the first copper foil 110 in the region excluding the holland.

Stripping step E1 is a step of spraying a sodium hydroxide peeling liquid of 2.1% to 4.5% (VOL) at a temperature of 45 ° C to 58 ° C (± 2 ° C) at a spray pressure of 1.02 MPa to 3.2 MPa, And removing the photoresist remaining on the holland, thereby forming a predetermined inner-layer circuit.

Next, AOI (inspection for reliability verification) is performed on the formed inner layer.

In the reliability test, it is required that the width and the thickness of the inner layer circuit such as the deviation of the circuit, the defects (open, short) of the circuit, and the precision are required. In order to verify circuit shortage and circuit shrinkage, open circuit and short circuit defect are treated with 100% defective.

Next, in the method of manufacturing a printed circuit board for drums according to the present invention, a first micro-etching process is further performed after the second step (S200).

A key element in performing the first micro-etching process is to remove the Cu residues and the like on the epoxy surface and the side surface of the circuit between the circuit and the circuit during the formation of the inner-layer circuit, perform a first micro- By forming the roughness, it is possible to eliminate a fear that noise is generated in the printed circuit board for drone according to the present invention. In addition, the adhesion can be maximized during the oxide process and the laminating process in the next process. A working method of the first micro-etching process is as follows.

That is, in the first micro-etching process, 85 ml / l of 95% sulfuric acid (H 2 SO 4 ) and 60 ml / l of hydrogen peroxide (H 2 O 2) and, 40㎖ / corrosion solution for ℓ (etchant solution) and deionized water (Water Di) specific gravity of 1.030 ~ 1.050 and 32 ℃ (± 5 ℃) using a micro etching solution for the temperature at which contain (20 ℃) , A pH of 3.00 or less, and an etching rate of 0.5 mu m to 1.0 mu m.

Next, an oxide process for enhancing the adhesion between the surface on which the inner layer circuit is formed and the prepreg and the copper foil is performed by oxidizing the Cu surface of the inner layer as a whole after forming the inner layer circuit and the hole land. .

4 is a cross-sectional view illustrating a third step of the method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

Referring to FIG. 4, a lamination process is carried out by combining an inner layer constituted of a circuit, a hole and the like, a prepreg and a 20z (70 mu m) copper foil.

That is, a second copper foil 210 is provided on one surface of the epoxy layer 100 having a predetermined circuit pattern formed on both surfaces thereof, and the other surface is covered with an epoxy layer 100 and a first prepreg A third copper foil 310 on one side of the leg layer 200 and the epoxy layer 100 and an epoxy layer 100 on the other side and a second prepreg layer 300 (S300).

5 is a cross-sectional view illustrating a fourth step of the method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

5, a through hole A, a component hole B, a first mechanism hole C, and a second mechanism hole D are formed (S400) through the upper and lower surfaces, respectively.

That is, the drilling process is performed after the completion of the pressing process. Since the reliability and durability of the printed circuit board according to the present invention are particularly required, the copper foil (Cu) in the inner layer and the copper foil (Cu) ㎛, and special working conditions are required.

Drill working conditions are CNC Drill M / C.

RPM = 200,000 CNC Drilling is carried out with M / C, eliminating the occurrence of burrs that can occur during the drilling process, and preventing the parts hole (B), through hole (A) and mechanism holes (C, D) Processing. For the purpose of the drilling process, the component hole (B) and the through hole (A) are formed in the inner layer and the outer layer so as to serve as conductors between the inner layer and the outer layer.

That is, when forming the through hole A, the component hole B, the first mechanism hole C, and the second mechanism hole D, CNC (Computerized Numerical Control) M / C drilling process.

After the drilling process, a deburring process is performed.

The deburring step is performed to remove burrs that may occur during the drilling process. Particularly, in the printed circuit board for drone according to the present invention, since the copper foil (Cu) of the outer layer uses 20z , It is important to remove the burr completely.

That is, a deburring process is performed to remove burrs generated during the drilling process, and the process conditions of the deburring process are as follows.

In the deburring process, a bristle brush having a brush rotation of 1,700 rpm to 2,000 rpm and an oscillation cycle of 280 cpm to 350 cpm on a conveyor moving at a speed of 1.2 m / min to 1.8 m / ). The rinse was rinsed in four stages with a high-pressure washing pressure of 45 kgf / cm 2 (± 5.0), followed by drying by air cut drying at 95 ° C.

After the deburring process, a desmear process is performed.

The desmearing process is a process of removing the adhesion material of the epoxy resin due to the rotational friction heat between the Cu layer of the inner layer and the epoxy resin (prepreg) layer by a chemical substance of KMnO 4 during drilling.

That is, after the deburring step, the interface between the copper foil 110 and the first prepreg layer 200 or between the copper foil 110 and the second prepreg layer 300 is caused by frictional heat due to a drill bit during drilling The remover of the first prepreg layer 200 or the second prepreg layer 300 is removed by KMnO 4 .

6 is a cross-sectional view illustrating a fifth step of the method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

6, an electroless copper plating layer 400 is formed on the inner surface of the second mechanism hole D and all the regions except the holes of the second mechanism hole D, and the electroless copper plating layer 400 is formed And an electrolytic copper plating layer 500 is formed (S500).

That is, after the desmearing step, each hole, that is, the parts and the through hole A, the mechanism holes C and D, and the electroless copper plating of the conductor in the hole of the non- To conduct holes of the conductor. The working conditions of the electroless copper plating are as follows.

The electroless copper plating layer 400 is formed of copper sulfate, copper sulfate of 160 g / l, ethylenediamine acetic acid (EDTA), 32 mg / l of formaldehyde (HCHO), 45 g / l of sodium hydroxide (+/- 1 < 0 > C) for 35 minutes with a plating solution containing sodium hydroxide (NaOH), 0.12 g / l polyethylene glycol (PEG) and 83 mg / l bipyridyl And a thickness of 1.7 탆 to 2.0 탆.

By maintaining the thickness of the electroless copper plating at 1.7 탆 to 2.0 탆, the thickness of the electroless copper plating in the hole is uniformly maintained, the generation of micro voids is prevented, and the adhesion of the electroless copper plating is improved, Thereby improving the reliability and durability of the printed circuit board.

Next, after the electroless copper plating step, an electroplating process for performing Cu plating on the component hole B, the through hole A, the mechanism holes C and D and the copper outer layer is performed.

This electroplating process is a process in which the reliability and durability of the printed circuit board for drone of the present invention are directly related to each other, and the plating thickness of the inner and outer layers is most important. The plating thickness in the hole should be maintained at 25 탆 to 30 탆, and the outer layer should be maintained at 25 탆 to 30 탆. Therefore, since the thickness of the base copper of the outer layer is 70 占 퐉 and the thickness of the electric copper plating is 25 占 퐉 to 30 占 퐉, the thickness of the outer layer copper foil of the outer layer is 95 占 퐉 to 100 占 퐉.

The electroplating work process of the printed circuit board for a drone is as follows.

The electrodeposited copper plating layer 500 was formed by mixing 192 g / l of semi-tower sulfuric acid, 85 g / l copper sulfate, 20 ml / l of additive, The electroplating was carried out at a current density of 2.3 A / dm 2 to 2.9 A / dm 2 at a temperature of 23 캜 for 90 minutes at a current density of 25 탆 to 30 탆 .

7 is a cross-sectional view showing a sixth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

7, an outer layer image process is performed on the second copper foil 210, the third copper foil 310, the electroless copper copper plating layer 400, and the copper electroplating layer 500 to form a predetermined outer layer circuit The inner surface and the hole of the through hole A and the inner surface and the hole of the component hole B and the inner surface and the hole of the first mechanism hole C and the second mechanism hole D And the area other than the outer layer circuit is printed with the solder resist ink 600 (S600).

The printed circuit board for a dron according to the present invention is characterized in that Cu (copper foil) of 20z (70 占 퐉) is used for the inner layer and the outer layer. Particularly, width and spacing of circuits of the outer layer, The width and the spacing of the electrodes should be maintained. This is because an important element of various functions for controlling each functional system of the printed circuit board for the drone requires its inherent functions and performance.

Particularly, in order to maintain the width and the interval of the circuit and the pad area of the land and the component mounting area, a dry film having a thickness of 50 μm is selected as the dry film.

The reason why the dry film having a thickness of 50 탆 is selected is to keep the limit of the reduction width with respect to the upper and lower widths of the circuit and the area of the pad and the land on the component mounting area within ± 15%. Another reason for selecting a dry film having a thickness of 50 占 퐉 is that the penetration of the etchant into the hole causes a reduction in the thickness of the plating due to the erosion of the thickness of the plating inside the hole or a reliability due to the loss of the hole due to the short- This is to prevent loss of function.

The process conditions of the outer layer circuit forming process are as follows.

95% sulfuric acid and washed with water three arithmetic process (A1) is, 1.4m / min ~ 1.8m / oscillation cycle is polished with 100cpm ~ 150cpm the brush on the conveyor moving at a speed of min and, 5% (VOL) (H 2 SO 4 ) and DI water, rinsed with water for 5 times, and then subjected to air cut drying at 95 ° C.

The lamination step B1 is a step in which the second copper foil 210, the third copper foil 310, the electroless copper copper plating layer 400 and the electrolytic copper plating layer 500 are formed by the fifth step S500 A photoresist PR is closely adhered to the surface of the copper plating layer 500 (actually the upper surface of the copper electroplating layer 500), and a roller temperature of 105 占 폚 to 135 占 폚 (占 5 占 폚), a roller pressure of 0.23 MPa to 0.4 MPa, / min to 1.3 m / min, a dry film having a thickness of 50 mu m and a circuit pattern of a predetermined shape formed on the photoresist is closely contacted with the roller.

Exposure step C1 is a step of irradiating light irradiated with a light quantity of 50 mJ / cm2 to 90 mJ / cm2 with an 8 kW exposure device so as to form a circuit pattern of a predetermined shape on the photoresist, Dry film is irradiated.

In the developing step D1, a sodium carbonate developer of 0.5% to 1.0% (VOL) at a temperature of 27 ° C to 32 ° C (± 2 ° C) is sprayed at a spray pressure of 0.12 MPa to 0.15 MPa, The photoresist in the regions other than the pattern and the holland is removed.

The etching process (E1) is a process of etching a copper metal etching solution (155 g / l to 220 g / l) having a temperature of 45 ° C to 55 ° C (± 2 ° C) and a specific gravity The second copper foil 210 and the third copper foil 310 formed by the fifth step S500 of the region except for the circuit pattern and the holland of the predetermined shape are injected at a pressure of 2.4 kgf / The electroless copper plating layer 400, and the copper electroplating layer 500 are removed.

In the stripping step F1, a sodium hydroxide peeling liquid at a temperature of 45 to 58 占 폚 (占 2 占 폚) of 2.1% to 4.5% (VOL) is sprayed at a spray pressure of 1.02 MPa to 3.2 MPa, The photoresist remaining on the circuit pattern of the photoresist is removed.

Next, AOI (Inspection for Reliability Verification) is performed on the formed outer layer.

In the reliability test, variations in the width and spacing of the outer layer circuit, the hole, the through hole (A), the component hole (B), the pad width and interval in the component mounting area, Verification of reliability such as reduction width, verification of defects such as open circuit, short circuit, etc. in the circuit, the land, the pad at the component mounting site, and the like. Defects such as circuit open and short are treated with 100% defective and discarded.

After the formation of the outer layer circuit, Al 2 O 3 is used in the space between the circuit and the circuit, the area of the hall, and the like, and the residue of Cu or dry The residue of the film and the like are removed and the surface roughness and roughness are artificially formed on the surfaces of the circuit and the holland so as to improve the adhesion of the ink during the PSR printing process.

In addition, the first ultrasonic cleaning (Ultra Sonic Cleaning) is performed to block the possibility of noise that may occur due to the generation of minute current due to residues such as Cu in the circuit and circuit, and in the hall portion. The Al 2 O 3 used during the JET polishing process may remain in the circuit and between the circuit, the hall portion, and the pad of the component mounting portion, so that ultrasonic cleaning is performed to remove Al 2 O 3 residues.

That is, after the circuit forming step, the first JET polishing (JET scrubbing) and the first ultrasonic cleaning (first ultrasonic cleaning) are further performed on the space between the circuit and the circuit, and in the hall portion.

At this time, the first JET polishing was carried out by using aluminum oxide (Al 2 O 3 (# 400)) at a spray pressure of 1.2 kgf / cm 2 to 1.7 kgf / cm 2 on a conveyor moving at a speed of 1.0 m / min to 1.5 m / And the first ultrasonic cleaning process is performed by performing a second ultrasonic cleaning process in 1,200 Watt × 4 KHz × 4 Zone, performing 2Zone hot water rinsing, and washing with a 4Zone mattress.

After performing the first JET polishing and the first ultrasonic cleaning process, a second microetching process is performed. After the circuit forming step and the etching step, and after the second JET polishing and the second ultrasonic cleaning step, residues of Cu and the like are removed from all parts such as between the circuit and the circuit, the holland part and the pad at the mounting part, And the second micro-etching is performed on the surface of the upper portion, the upper portion of the holland, and the like to form a fine roughness (roughness). This is to remove fine residues such as Cu and the like, to prevent the occurrence of microscopic noise, and to maximize the adhesion of ink during the printing process.

The second micro-etching process is as follows. A second microetching step is performed after the first JET scrubbing and the first ultrasonic cleaning step and the second microetching step is performed at a speed of 1.3 m / min to 2.5 m / min (H 2 SO 4 ), 60 mL / L of 35% hydrogen peroxide (H 2 O 2 ), and 40 mL / L of etchant solution in a conveyor moving at a speed of 70 mL / Etching with a specific gravity of 1.030 to 1.050, a pH of 3.00 or less, and an etching rate of 2.2 to 2.5 占 퐉 using a micro-etchant at 32 占 폚 (占 5 占 폚) containing ultrapure water .

8 is a cross-sectional view illustrating a seventh step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

8, the inner surface and the hole of the through hole A, the inner surface and the hole of the component hole B, the inner surface and the hole of the first mechanism hole C, And an area other than the outer layer circuit is printed with the solder resist ink 600 (S700).

After the second micro-etching step, solder resist ink (PSR ink), which is a nonconductive component, is applied to both sides of the surface of the printed circuit board for drones according to the present invention between circuit and circuit, . This prevents solder resist ink from being printed during the process of soldering parts and prevents solder resist ink from interfering with noise between the circuit and the circuit and between the hole and the hole. At this time, in consideration of the characteristics of the printed circuit board for a drone according to the present invention, the ink thickness should be printed with the following thickness.

The ink thickness of the epoxy portion is 30 占 퐉 or more, the thickness of the edge portion is 20 占 퐉 to 25 占 퐉 or more, and the ink thickness of the upper portion of the circuit is 20 占 퐉 to 23 占 퐉 or more. Further, at the time of printing, the printing screen is repeatedly printed twice at about 90 degrees in 110mesh. These printing process conditions are as follows.

The printing process for printing with the solder resist ink 600 includes a solder resist ink 600 having a specific gravity of 210 ± 10 poise and an ink viscosity of 150 ± 10 poise mixed with a curing agent of 80 ± 10 poise and having a specific gravity of 1.35 to 1.40, Was pre-cured at 80 DEG C for 16 to 22 minutes, followed by 20 minutes at 80 DEG C, followed by repeating the printing process two times around the 90 DEG angle using a 110 mesh printing silk screen. After performing the secondary precuring for ~25 minutes, exposure was carried out using an 8 kW exposer at a light quantity of 260 mJ / cm 2 to 320 mJ / cm 2 and a 1.0 wt% sodium carbonate developer at a temperature of 32 ° C (± 1 ° C) Spraying is performed at a spray pressure of 2.3 kgf / cm 2 to 3.0 kgf / cm 2 for 95 seconds to 140 seconds, followed by post-curing at 150 ° C for 75 minutes to 90 minutes to dry , The first prepreg layer (200) and the second prepreg layer (300) The thickness of the solder resist ink 600 is printed at 30 占 퐉 or more and the thickness of the solder resist ink 600 at the edge portion is printed at 20 占 퐉 to 25 占 퐉 or more.

9 is a sectional view showing an eighth step of the method for manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

9, a marking dam 700 is formed with a marking ink on the area where the solder resist ink 600 is printed between the component hole B and the first mechanism hole C (S800 )do.

Characters, symbols, special marks, etc. are printed on the printed circuit board for drone according to the present invention. The reason why the mark printing is performed at the interval between the pads and the pads of the component mounting part, which is an especially important part, is to obtain a blocking effect on the noise generation between the pads and the pads of the memory function. At this time, the thickness of the marking printing should be maintained at an ink thickness of 20 mu m to 25 mu m.

The process conditions for forming the marking dam 700 are as follows.

When the marking dam 700 is formed, the mixing ratio of the base and the curing agent is 100: 8, and the mixture is agitated for 10 minutes or longer to have an ink viscosity of 250 poise to 290 poise. The marking dam is printed, dried at a temperature of 150 ° C for 20 minutes to 25 minutes, and then held for 30 minutes.

There are obstacles to adhesion between nickel and gold plating that may occur due to the presence of oxidized portions in the holland, component holes, through holes, pads, and the upper surface of the pad while performing printing and marking processes, In order to remove residues and the like, in order to remove the residues and the like with Al 2 O 3 and to increase the adhesion of the nickel plating and gold plating to the portion where the solder resist is not applied during the printing process, the acid rinse Thereby performing a second ultrasonic cleaning process.

These process conditions are as follows.

After the marking dam 700 is formed, a second JET scouring and a second ultrasonic cleaning process are further performed on the portions to which the solder resist ink 600 is not applied, Polishing was carried out on a conveyor moving at a speed of 1.5 m / min to 2.0 m / min with an Acid Rinse containing 45 ml / l of 95% sulfuric acid (H 2 SO 4 ) and DI water (Al 2 O 3 (# 420)) was sprayed at a pressure of 1.2 kgf / cm 2 to 2.0 kgf / cm 2 after rinsing with water for 4 seconds, and the second ultrasonic cleaning was performed at 1,400 Watt × 4 kHz × After rinsing three times with water in 4Zone, rinse with ultrapure water (4-step water) and dry at 95 ℃ ~ 98 ℃ (± 1 ℃).

10 is a sectional view showing a ninth step of a method of manufacturing a printed circuit board for a drone according to an embodiment of the present invention.

9, the nickel plating layer 800 and the gold plating layer 800 are formed in regions other than the areas where the solder resist ink 600 is printed, the areas where the marking dam 800 is formed, and the inner surfaces of the second mechanism holes D, (900) sequentially (S900).

The printed circuit board for a drone according to the present invention is a printed circuit board that provides a system for each use of a dron and controls a system having each function. The printed circuit board for reliability and functionality Should be maintained continuously. Therefore, the purity of the raw materials such as nickel plating and gold plating is important above all, so that the functional guarantee of the printed circuit board is continuously maintained by using the raw material of high purity without the impurities of the raw material. The process conditions of nickel plating and gold plating are as follows.

The nickel plating layer 800 and the gold plating layer 900 were formed by mixing 50 g / l of Nickel Chloride, 100 g / l of aminotrimethylen phosphonic acid and 110 g / l of nickel sulfate ), A nickel plating solution containing 55 g / l of ascorbic acid, 55 g / l of boric acid and 0.15 g / l of a brightener was added at a temperature of 54 ° C to 0.27 A / A nickel plating layer 800 having a thickness of 5 to 7 탆 was formed by electroplating at a current density of 0.47 A / dm 2 for 12 minutes to 20 minutes. Then, 20 g / l of potassium gold cyanide, A mixture of 120 g / l of tripotassium citrate monohydrate, 65 g / l of citric anhydride, 0.54 g / l of hexamethylene tetramine and 0.54 g / l of 3-pyridinecarboxylic acid ( 3-pyridine carboxylic acid was plated at a temperature of 53 캜 for 12 minutes to 14 minutes at 4.5 pH to prepare a soft pure gold plating solution containing 0.04 탆 to 0.05 탆 And unto form a gold plating layer 900. The

After that, CNC Router M / C is applied according to the specifications and the maximum allowable tolerance limit is ± 0.5mm. However, the range of tolerance according to the special specification is ± 0.4mm.

An auto bare board test for verifying the electrical reliability of the printed circuit board for a drone according to the present invention was carried out so that the circuit and the circuit, the hole land, the hole and the hole, the pad and the pad, And the working conditions are as follows.

The test voltage is 250 volts, the continuity resistance is 50 ohms, and the insulation resistance is 20 mega ohms.

Next, since the printed circuit board for a dron according to the present invention has a warp caused by being mounted on a certain molded article or case after completion of assembling the parts, it is difficult to mount the molded article on the molded case or the case. Twist calibration is performed, and the working conditions are as follows.

The baking temperature (Baking temp) is 125 ° C., the time is 2 hours or more, the stack is 20 pcs unit (thickness = 1.2 mm standard), 20 pcs The weight of the calibrated material at the top is 150 kg material fixture / ㎡.

After that, the external dimensions, inspection and appearance defect according to each specification shall be visually inspected and checked for dimensions and packaged and shipped.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: Epoxy layer
110: Copper foil
200: first prepreg layer
210: second copper
300: second prepreg layer
310: Third copper
400: Electroless copper plated layer
500: Electrolytic copper plating layer
600: solder resist ink
700: Marking dam
800: Nickel plated layer
900: Gold plated layer
A: Through hole
B: Component hole
C: first mechanism hole
D: Second mechanism hole

Claims (16)

A first step (S100) of preparing an epoxy layer (100) in which a first copper foil (110) is laminated on both sides,
A second step (S200) of forming a predetermined inner layer circuit by performing an inner layer image process on the first copper foil 110,
A second copper foil 210 is provided on one surface of the epoxy layer 100 on which a predetermined circuit pattern is formed on both sides and a second copper foil 210 is provided on the other surface of the epoxy layer 100, A second prepreg layer 310 having a third copper foil 310 on one side and the other side impregnated with the epoxy layer 100 and a predetermined circuit pattern on the other side of the leg layer 200 and the epoxy layer 100, A third step (S300) of forming the first and second electrodes 300,
A fourth step (S400) of forming a through hole (A) passing through the upper and lower surfaces, a component hole (B), a first mechanism hole (C) and a second mechanism hole (D)
An electroless copper plating layer 400 is formed on the inner surface of the second mechanism hole D and all the regions except the Holland of the second mechanism hole D and the electrolytic copper plating layer 400 is formed on the electroless copper plating layer 400, A fifth step S500 of forming a second electrode 500,
The second copper foil 210, the third copper foil 310, the electroless copper copper plating layer 400 and the electrolytic copper plating layer 500 to form a predetermined outer layer circuit 6, step S600,
The inner surface and the hole of the through hole A and the inner surface and the hole of the component hole B and the inner surface and the hole of the first mechanism hole C and the inner surface of the second mechanism hole D, A seventh step (S700) of printing an area other than the outer layer circuit with the solder resist ink (600)
An eighth step S800 of forming a marking dam 700 with marking ink on the area where the solder resist ink 600 is printed between the component hole B and the first mechanism hole C )Wow,
A nickel plating layer 800 and a gold plating layer 900 are formed on the region where the solder resist ink 600 is printed, the region where the marking dam 700 is formed, and the region other than the inner surface of the second mechanism hole D, And a ninth step (S900) for sequentially forming the plurality of printed circuit boards. The method according to claim 1,
The epoxy layer 100 is formed of FR-4 material having a thickness of 20 탆 (70 탆) on the upper and lower surfaces thereof and having a thermal expansion coefficient of 55 ppm / 캜. The glass transition temperature Is a TG of 150 DEG C and a thermal decomposition temperature of TD is 350 DEG C. The method according to claim 1,
Wherein the inner layer image process comprises:
A photoresist PR is laminated on the first copper foil 110 and a roller having a roller temperature of 95 to 135 DEG C, a roller pressure of 0.25 to 0.5 MPa, and a roller speed of 0.8 to 1.5 m / A lamination step (A1) of laminating a 50 mu m-thick dry film on which a circuit pattern of a predetermined shape is formed on the photoresist,
Exposure step (irradiation step) of irradiating light to be irradiated with a light amount of 50 to 90 mJ / cm 2 by an 8 kW exposure device to form a circuit pattern of a predetermined shape on the photoresist, onto the dry film having a circuit pattern of a predetermined shape B1,
After removing the dry film, a sodium carbonate developer of 0.6% to 1.0% (VOL) at a temperature of 27 ° C to 32 ° C (± 2 ° C) was sprayed at a spray pressure of 0.12Mpa to 0.15Mpa, A developing step (C1) of removing the photoresist of the removed region,
A copper metal etchant of 155g / l to 220g / l having a temperature of 45 ° C to 55 ° C (± 2 ° C) and a specific gravity (20 ° C) of 1.15 (± 0.05) 1.0) to etch the first copper foil 110 in an area excluding the circuit patterns and the holes of the predetermined shape,
A sodium hydroxide peeling solution of 2.1% to 4.5% (VOL) at a temperature of 45 to 58 占 폚 (占 2 占 폚) was sprayed at a spray pressure of 1.02 MPa to 3.2 MPa to form a circuit pattern of a predetermined shape, And a stripping step (E1) for removing the resist, respectively, to form a predetermined inner layer circuit. The method according to claim 1,
After the second step (S200), a first micro-etching process is further performed,
In the first microetching step, 85 ml / l of 95% sulfuric acid (H 2 SO 4 ) and 60 ml / l of hydrogen peroxide (H 2 ) were introduced into a conveyor moving at a speed of 1.3 m / min to 2.5 m / O 2), and a solution of the corrosion 40㎖ / ℓ (etchant solution) and deionized water (Di Water) 32 ℃ contained the (± 5 ℃) using a micro etching solution at a temperature in the proportion of 1.030 ~ 1.050 (20 ℃) and , A pH of 3.00 or less, and an etching rate of 0.5 mu m to 1.0 mu m. The method according to claim 1,
When forming the through hole A, the component hole B, the first mechanism hole C and the second mechanism hole D, CNC (Computerized Numerical Control) M having an RPM of 200,000 / C A method for manufacturing a printed circuit board for a drone performed by a drilling process. 6. The method of claim 5,
After the fourth step S400,
Further comprising performing a deburring process to remove burrs generated during the drilling process,
In the deburring step, a bristle brush having a brush rotation of 1,700 rpm to 2,000 rpm and an oscillation cycle of 280 cpm to 350 cpm on a conveyor moving at a speed of 1.2 m / min to 1.8 m / brush, and the rinsing is rinsed in four stages at a high pressure washing pressure of 45 kgf / cm2 (占 .5), followed by air cut drying at 95 占 폚 to dry the printed circuit board for a drone. The method according to claim 6,
After performing the deburring step,
The first prepreg layer 200 or the interface between the copper foil 110 and the second prepreg layer 300 is formed on the interface between the copper foil 110 and the first prepreg layer 200 or the first prepreg layer 300, And removing the prepreg layer (200) or residues of the second prepreg layer (300) with KMnO 4 . The method according to claim 1,
The electroless copper plating layer 400 was prepared by mixing 85 g / l of copper sulfate, 160 g / l of ethylenediamine acetic acid (EDTA), 32 mg / l of formaldehyde (HCHO), 45 g / Plating was carried out for 35 minutes at a temperature of 40 占 폚 (占 1 占 폚) with a plating solution containing sodium (NaOH), 0.12 g / l of polyethylene glycol (PEG) and 83 mg / l of bipyridyl So as to have a thickness of 1.7 탆 to 2.0 탆. The method according to claim 1,
The electrolytic copper plating layer 500 was prepared by mixing 192 g / l of semi-column sulfuric acid, 85 g / l of copper sulfate, 20 ml / l of additive and 51 ml / And a brightener at a current density of 2.3 A / dm 2 to 2.9 A / dm 2 at a temperature of 23 캜 for 90 minutes to form a plating solution having a thickness of 25 탆 to 30 탆 And the thickness of the printed circuit board for a drone is set to be equal to or less than the thickness of the printed circuit board. The method according to claim 1,
Wherein the outer layer circuit forming step comprises:
Polished with a brush with a vibration cycle of 100 cpm to 150 cpm on a conveyor moving at a speed of 1.4 m / min to 1.8 m / min, 95% sulfuric acid (H 2 SO 4 ) and DI water (5% (A1) which is washed with Acid Rinse containing water, rinsed 5 times with water, followed by air cut drying at 95 ° C,
The second copper foil 210, the third copper foil 310, the electroless copper copper plating layer 400 and the electrolytic copper plating layer 500 (actually, the electrolytic copper plating layer 500 The roller pressure of 0.23 MPa to 0.4 MPa and the roller pressure of 0.7 m / min to 1.3 m / min, A lamination step (B1) of bringing a dry film having a thickness of 50 mu m in which a circuit pattern of a predetermined shape is formed on the photoresist with a roller having a speed,
(Exposure) in which light irradiated with a light quantity of 50 mJ / cm 2 to 90 mJ / cm 2 is irradiated to the dry film having a circuit pattern of a predetermined shape by an 8 kW exposure device so that a circuit pattern of a predetermined shape is formed on the photoresist, The step (C1)
A sodium carbonate developer of 0.5% to 1.0% (VOL) at a temperature of 27 ° C to 32 ° C (± 2 ° C) was sprayed at a spray pressure of 0.12 MPa to 0.15 MPa to prepare a circuit pattern of a predetermined shape and a photoresist A developing step (D1)
A copper metal etchant having a temperature of 45 to 55 占 폚 (占 2 占 폚) and a copper metal etchant having a specific gravity of 1.15 占 0 (20 占 폚) of 155g /? To 220g / The second copper foil 210, the third copper foil 310, the electroless copper plating layer 400, and the second copper foil 310 formed by the fifth step S500 of the region excluding the circuit pattern and the holland of the predetermined shape, An etching step E1 for removing the electroplated copper plating layer 500,
A sodium hydroxide peeling liquid of 2.1 to 4.5% (VOL) at a temperature of 45 to 58 占 폚 (占 2 占 폚) is sprayed at a spray pressure of 1.02 MPa to 3.2 MPa to form a circuit pattern of a predetermined shape and a photo And a stripping step (F1) for removing the resist, respectively, to form a predetermined outer layer circuit pattern. 11. The method of claim 10,
After the circuit forming step, a first JET scrubbing and a first ultrasonic cleaning process are further performed on the space between the circuit and the circuit,
In the first JET polishing, aluminum oxide (Al 2 O 3 (# 400)) was sprayed at a spray pressure of 1.2 kgf / cm 2 to 1.7 kgf / cm 2 on a conveyor moving at a speed of 1.0 m / min to 1.5 m / Spraying,
Wherein the first ultrasonic cleaning step performs a first ultrasonic cleaning process in 1,200 Watt 占 4 KHz 占 4 Zone, and performs a 2 rinse hot rinse process and a 4Zone cleaning process. 12. The method of claim 11,
A second micro-etching process is performed after the first JET scrubbing and the first ultrasonic cleaning process,
In the second microetching step, 70 ml / l of 95% sulfuric acid (H 2 SO 4 ) and 60 ml / l of 35% hydrogen peroxide (H 2 SO 4 ) in a conveyor moving at a speed of 1.3 m / min to 2.5 m / H 2 O 2 ), 40 mL / L of etchant solution, and DI water at 32 ° C. (± 5 ° C.), and a specific gravity of 1.030 to 1.050 and a specific gravity of 3.00 Wherein the etching is performed under the condition that the etching rate is in the range of 2.2 탆 to 2.5 탆. The method according to claim 1,
In the printing process of printing with the solder resist ink 600,
A solder resist ink 600 having an ink viscosity of 150 +/- 10 poise and a specific gravity of 1.35 ~ 1.40 was mixed with a hot-melt adhesive of 210 +/- 10 poise and a hardener of 80 +/- 10 poise, After the preliminary curing for 16 to 22 minutes at 80 DEG C followed by the second preconditioning for 20 to 25 minutes at 80 DEG C, 8 Exposure with a light quantity of 260 mJ / cm 2 to 320 mJ / cm 2 using a kW exposure machine and a 1.0 wt% sodium carbonate developer at a temperature of 32 ° C (± 1 ° C) were carried out at 2.3 kgf / / Cm < 2 >, followed by post-curing at 150 DEG C for 75 minutes to 90 minutes to dry the first prepreg layer 200 and the second prepreg layer 200, The thickness of the solder resist ink 600 at the portion of the second prepreg layer 300 is 30 占 퐉 or more Chain, and the edge (Edge) The thickness of the solder resist ink (600) of the site is 20㎛ ~ method of manufacturing a printed circuit board drone for printing over 25㎛. The method according to claim 1,
When the marking dam 700 is formed,
The mixing ratio of the base and the curing agent was 100: 8 and stirred for 10 minutes or longer to print the marking dam having a thickness of 20 to 25 탆 with a printing silk screen having an ink viscosity of 250 poise to 290 poise, Wherein the drying time is 20 minutes to 25 minutes and the holding time is 30 minutes. 15. The method of claim 14,
After the marking dam 700 is formed, a second JET scrubbing and a second ultrasonic cleaning process are further performed on the portions where the solder resist ink 600 is not applied,
Wherein the polishing JET 2 is 1.5m / min ~ 2.0m / on a conveyor moving at a speed of min, 95% of 45㎖ / ℓ of sulfuric acid (H 2 SO 4) and deionized water (DI water) arithmetic three (Acid containing Rinse), rinsed with water for 4 times, and sprayed with aluminum oxide (Al 2 O 3 (# 420)) at a pressure of 1.2 kgf / cm 2 to 2.0 kgf /
The second ultrasonic cleaning is carried out by rinsing in 1,400 Watt × 4 KHz × 4 Zone with water after 3 rinsing with water and drying with 95 ° C. to 98 ° C. (± 1 ° C.) ≪ / RTI > The method according to claim 1,
The nickel plating layer 800 and the gold plating layer 900 may be formed by,
A mixture of 50 g / l of Nickel Chloride, 100 g / l of aminotrimethylen phosphonic acid, 110 g / l of nickel sulfate and 55 g / l of ascorbic acid ), 55 g / l of boric acid and 0.15 g / l of a brightener at a current density of 0.27 A / dm 2 to 0.47 A / dm 2 at a temperature of 54 캜 for 12 to 20 Min to form a nickel plating layer 800 having a thickness of 5 mu m to 7 mu m,
A mixture of 20 g / l of potassium gold cyanide, 120 g / l of tripotassium citrate monohydrate, 65 g / l of citric anhydride and 0.54 g / l of hexamethylenetetramine Hexamethylene tetramine) and 0.54 g / l of 3-pyridine carboxylic acid were plated at a temperature of 53 캜 for 12 minutes to 14 minutes at a temperature of 53 캜 for 0.04 And a gold plating layer (900) is formed to a thickness of 탆 to 0.05 탆.
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Publication number Priority date Publication date Assignee Title
JPH0818228A (en) * 1994-06-27 1996-01-19 Yamamoto Seisakusho:Kk Manufacture of multi-layer printed board
KR20020078889A (en) * 2001-04-11 2002-10-19 김치호 Method to manufacture PCB for actuator in automobile
KR101565965B1 (en) * 2015-02-16 2015-11-16 월성전자(주) Manufacturing method of printed circuit board for heating fine line camera molule
KR101666476B1 (en) * 2015-08-17 2016-10-25 두두테크 주식회사 A manufacturing method of multi printed circuit board electronic control lining for vehicle
KR101733059B1 (en) * 2016-08-09 2017-05-08 두두테크 주식회사 Method of manufacturing engine control unit printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818228A (en) * 1994-06-27 1996-01-19 Yamamoto Seisakusho:Kk Manufacture of multi-layer printed board
KR20020078889A (en) * 2001-04-11 2002-10-19 김치호 Method to manufacture PCB for actuator in automobile
KR101565965B1 (en) * 2015-02-16 2015-11-16 월성전자(주) Manufacturing method of printed circuit board for heating fine line camera molule
KR101666476B1 (en) * 2015-08-17 2016-10-25 두두테크 주식회사 A manufacturing method of multi printed circuit board electronic control lining for vehicle
KR101733059B1 (en) * 2016-08-09 2017-05-08 두두테크 주식회사 Method of manufacturing engine control unit printed circuit board

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