KR101851001B1 - Lighting apparatus for an automobile - Google Patents

Lighting apparatus for an automobile Download PDF

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Publication number
KR101851001B1
KR101851001B1 KR1020160002074A KR20160002074A KR101851001B1 KR 101851001 B1 KR101851001 B1 KR 101851001B1 KR 1020160002074 A KR1020160002074 A KR 1020160002074A KR 20160002074 A KR20160002074 A KR 20160002074A KR 101851001 B1 KR101851001 B1 KR 101851001B1
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South Korea
Prior art keywords
substrate
ldm
led
light source
integrated
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KR1020160002074A
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Korean (ko)
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KR20170082832A (en
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강현우
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현대모비스 주식회사
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Priority to KR1020160002074A priority Critical patent/KR101851001B1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

LED기판과 LDM기판이 일체로 형성된 자동차의 조명장치가 제공된다.
이를 위해, 본 발명의 실시예에 의한 자동차의 조명장치는, LED광원이 장착되는 LED기판부와, 상기 LED광원을 제어하는 LDM소자가 장착되는 LDM기판부와, 상기 LED기판부 및 상기 LDM기판부 사이를 연결하는 연결부를 가지는 통합기판과, 상기 LED기판부 및 상기 연결부가 삽입되는 슬롯과 상기 슬롯과 연통되고 상기 LED광원이 노출되는 광원노출홀이 형성된 통합기판 지지부와, 상기 LDM기판부가 일면에 안착되어 결합되는 통합기판 결합부를 가지는 히트싱크를 포함한다.There is provided an automotive lighting apparatus in which an LED substrate and an LDM substrate are integrally formed.
For this purpose, an automotive lighting apparatus according to an embodiment of the present invention includes an LED substrate unit to which an LED light source is mounted, an LDM substrate unit to which an LDM device for controlling the LED light source is mounted, And a light source exposing hole through which the LED light source is exposed and which is in communication with the slot and a slot into which the LED substrate portion and the connection portion are inserted, And a heat sink having an integrated substrate joining portion that is seated and joined to the heat sink.

Description

자동차의 조명장치{LIGHTING APPARATUS FOR AN AUTOMOBILE}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

본 발명은 자동차의 조명장치에 관한 것으로서, 보다 상세하게는 LED(Light Emitting Diode)광원이 장착되는 LED기판과, 상기 LED광원을 제어하는 LDM(Led Driver Module)소자가 장착되는 LDM기판이 일체로 형성된 자동차의 조명장치에 관한 것이다.
[0001] The present invention relates to a lighting apparatus for an automobile, and more particularly to a lighting apparatus for an automobile which comprises an LED substrate on which an LED (Light Emitting Diode) light source is mounted, and an LDM substrate on which an LDM (Led Driver Module) And more particularly to a lighting device for a motor vehicle.

일반적으로 자동차에는 전방에 설치되는 헤드 램프(Head Lamp; 전조등)와, 후미에 설치되는 리어 콤비 램프(Rear Comi Lamp;후미등)와, 안개가 있을 때 점등시키는 포그 램프(Fog Lamp; 안개등) 등 다양한 조명장치가 설치된다.Generally, automobiles are equipped with various lights such as a head lamp installed at the front, a rear comi lamp installed at the rear, and a fog lamp illuminated when there is a mist, The device is installed.

상기 조명장치에 사용되는 광원은 벌브 및 LED가 있으며, 최근에는 광효율이 우수한 LED를 광원을 하는 조명장치의 개발이 활발해지고 있는 추세에 있고, 상기 자동차의 외부에서 볼 때 상기 LED 광원이 직접적으로 보이지 않는 간접조명방식의 조명장치가 개발되고 있다.In recent years, there has been a tendency to develop an illuminating device for emitting a light source of an LED having excellent light efficiency, and the LED light source is seen directly from the outside of the vehicle An indirect lighting type lighting device is being developed.

상기 간접조명방식의 조명장치는 LED 광원이 생성한 빛을 렌즈로 반사하는 리플렉터를 이용하는 방식과, LED 광원이 생성한 빛이 내부를 통과하면서 외부로 전반사되어 발광하는 라이트가이드를 이용하는 방식이 있다.The indirect illumination type illumination device uses a reflector that reflects the light generated by the LED light source to a lens and a light guide that emits light when the light generated by the LED light source passes through the light source.

한편, 상기 LED 광원은 전원을 공급하는 회로가 인쇄된 LED기판에 장착된다. 상기 기판은 PCB(Printed Circuit Board) 및 FPCB(Flexible Printed Circuit Board)로 구비된다.On the other hand, the LED light source is mounted on an LED substrate on which a circuit for supplying power is printed. The substrate may be a PCB (Printed Circuit Board) or an FPCB (Flexible Printed Circuit Board).

또한, 상기 조명장치에는 상기 LED 광원을 제어하는 LDM소자가 장착된 LDM기판이 설치된다.Further, an LDM substrate on which an LDM element for controlling the LED light source is mounted is provided in the illumination device.

그런데, 종래의 상기 조명장치에는 상기 LED기판 및 상기 LDM기판이 별물로 형성되어 설치되기 때문에, 상기 LED광원에서 발생되는 열을 방열하는 히트싱크를 상기 LED기판에 설치하여야 하고, 상기 LDM소자에서 발생되는 전자파를 차단하는 쉴드를 상기 LDM기판에 설치하여야 하는 문제점이 있다.
However, since the LED substrate and the LDM substrate are separately formed in the conventional lighting apparatus, a heat sink for dissipating heat generated from the LED light source must be installed on the LED substrate, A shield for shielding an electromagnetic wave to be applied to the LDM substrate must be provided on the LDM substrate.

본 발명이 해결하려는 과제는, LED기판과 LDM기판이 일체로 형성된 자동차의 조명장치를 제공하는 것이다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a lighting device for an automobile in which an LED substrate and an LDM substrate are integrally formed.

본 발명의 과제는 이상에서 언급한 과제로 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

상기 과제를 달성하기 위하여, 본 발명의 실시예에 의한 자동차의 조명장치는, LED광원이 장착되는 LED기판부와, 상기 LED광원을 제어하는 LDM소자가 장착되는 LDM기판부와, 상기 LED기판부 및 상기 LDM기판부 사이를 연결하는 연결부를 가지는 통합기판과, 상기 LED기판부 및 상기 연결부가 삽입되는 슬롯과 상기 슬롯과 연통되고 상기 LED광원이 노출되는 광원노출홀이 형성된 통합기판 지지부와, 상기 LDM기판부가 일면에 안착되어 결합되는 통합기판 결합부를 가지는 히트싱크를 포함한다.According to an aspect of the present invention, there is provided an automotive lighting apparatus including an LED substrate unit on which an LED light source is mounted, an LDM substrate unit on which an LDM device for controlling the LED light source is mounted, And an integrated substrate support unit having a slot into which the LED substrate unit and the connection unit are inserted and a light source exposure hole through which the LED light source is exposed, And a heat sink having an integrated substrate joining portion on which the LDM substrate portion is seated and coupled.

기타 실시예의 구체적인 사항들은 상세한 설명 및 도면들에 포함되어 있다.
The details of other embodiments are included in the detailed description and drawings.

본 발명의 실시예에 의한 자동차의 조명장치는, LED기판부 및 LDM기판부가 일체로 형성되기 때문에, 조립공수 및 부품수가 줄어들고, 가격이 저렴해지는 효과가 있다.In the automotive lighting apparatus according to the embodiment of the present invention, since the LED substrate portion and the LDM substrate portion are integrally formed, there is an effect that the number of assembling steps and parts is reduced, and the cost is reduced.

본 발명의 효과는 이상에서 언급한 효과로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

도 1은 본 발명의 실시예에 의한 자동차의 조명장치를 나타내는 도면,
도 2는 도 1에 도시된 통합기판을 나타내는 도면,
도 3은 도 1에 도시된 히트싱크에 통합기판이 결합되는 초기 상태를 나타내는 도면,
도 4는 도 3에 도시된 히트싱크를 나타내는 단면도,
도 5 및 도 6은 통합기판을 히트싱크에 조립하는 과정을 나타내는 도면이다.BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a lighting apparatus for a vehicle according to an embodiment of the present invention,
Figure 2 shows the integrated substrate shown in Figure 1,
FIG. 3 is a view showing an initial state in which an integrated substrate is coupled to the heat sink shown in FIG. 1;
4 is a sectional view showing the heat sink shown in Fig. 3,
5 and 6 are views showing a process of assembling the integrated substrate to the heat sink.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예를 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예는 본 발명의 개시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

이하, 본 발명의 실시예에 의한 자동차의 조명장치를 도면들을 참고하여 설명하도록 한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an automotive lighting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

도 1은 본 발명의 실시예에 의한 자동차의 조명장치를 나타내는 도면, 도 2는 도 1에 도시된 통합기판을 나타내는 도면, 도 3은 도 1에 도시된 히트싱크에 통합기판이 결합되는 초기 상태를 나타내는 도면이다.FIG. 1 is a view showing an automotive lighting apparatus according to an embodiment of the present invention, FIG. 2 is a view showing the integrated substrate shown in FIG. 1, and FIG. 3 is an initial state Fig.

도 1 내지 도 3을 참조하면, 본 발명의 실시예에 자동차의 조명장치는, 자동차의 전방에 설치되는 헤드램프 중 로우빔모듈로 사용되는 조명장치로서, 통합기판(10)과, 히트싱크(20)와, 리플렉터(30)를 포함한다.1 to 3, an automotive lighting apparatus according to an embodiment of the present invention is an illuminating apparatus used as a low beam module of a head lamp installed in front of an automobile. The lighting apparatus includes an integrated substrate 10, a heat sink 20, and a reflector 30.

통합기판(10)은, LED기판부(12)와, LDM기판부(14)와, 연결부(16)를 포함한다.The integrated substrate 10 includes an LED substrate portion 12, an LDM substrate portion 14, and a connection portion 16.

LED기판부(12)에는 LED광원(11)이 장착되고, LDM기판부(14)에는 LED광원(11)을 제어하는 LDM소자(13)가 장착된다. 연결부(16)는 LED기판부(12) 및 LDM기판부(14) 사이에 배치되어 LED기판부(12) 및 LDM기판부(14)를 연결한다.An LED light source 11 is mounted on the LED substrate unit 12 and an LDM element 13 for controlling the LED light source 11 is mounted on the LDM substrate unit 14. The connection portion 16 is disposed between the LED substrate portion 12 and the LDM substrate portion 14 to connect the LED substrate portion 12 and the LDM substrate portion 14.

LDM기판부(14)는 LED기판부(12) 및 연결부(16)에 비해 면적이 넓은 사각형상으로 형성된다. 연결부(16)는 LDM기판부(14)의 일측에서 돌출 형성되고 사각형상으로 형성된다. LED기판부(12)는 LDM기판부(14)의 반대편인 연결부(16)의 일측에서 돌출 형성되고 사각형상으로 형성된다.The LDM substrate portion 14 is formed in a rectangular shape having a wider area than the LED substrate portion 12 and the connecting portion 16. The connection portion 16 is protruded from one side of the LDM substrate portion 14 and formed into a rectangular shape. The LED substrate portion 12 is protruded from one side of the connecting portion 16 opposite to the LDM substrate portion 14 and is formed in a rectangular shape.

LED기판부(12) 및 연결부(16) 사이의 양측에는 탄성홈(15)이 형성된다. 탄성홈(15)은 통합기판(10)이 히트싱크(20)에 조립될 때 통합기판(10)이 부러지지 않고 탄성력을 가지도록 한다.Elastic grooves 15 are formed on both sides between the LED substrate portion 12 and the connecting portion 16. The elastic grooves 15 allow the integrated substrate 10 to have an elastic force without breaking when the integrated substrate 10 is assembled to the heat sink 20. [

LDM기판부(14)에는 체결홀(17)이 형성된다. 통합기판(10)은 체결홀(17)을 관통하는 볼트와 같은 체결부재를 통해 히트싱크(20)에 결합된다.A coupling hole 17 is formed in the LDM substrate portion 14. The integrated substrate 10 is coupled to the heat sink 20 through a fastening member such as a bolt through the fastening hole 17.

히트싱크(20)는 열전도율이 우수한 알루미늄 재질로 형성된다. 히트싱크(20)는 복수의 방열핀(21)이 형성된 베이스부(22)와, 베이스부(22)의 일측에 형성되는 통합기판 지지부(24) 및 통합기판 결합부(26)를 포함한다.The heat sink 20 is formed of an aluminum material having a high thermal conductivity. The heat sink 20 includes a base portion 22 on which a plurality of radiating fins 21 are formed and an integrated substrate supporting portion 24 and an integrated substrate engaging portion 26 formed on one side of the base portion 22.

복수의 방열핀(21)은 베이스부(22)의 후방면에 돌출 형성되어, 서로 이격되어 배치된다. 리플렉터(30)는 베이스부(22)의 전방면에 배치된다.The plurality of radiating fins 21 protrude from the rear surface of the base portion 22 and are disposed apart from each other. The reflector 30 is disposed on the front surface of the base portion 22.

통합기판 결합부(26)는 복수의 방열핀(21)과 동일한 방향인 베이스부(22)의 후방으로 돌출 형성되고, 통합기판 지지부(24)는 통합기판 결합부(26)와 반대방향인 베이스부(22)의 전방으로 돌출 형성된다.The integrated substrate bonding portion 26 protrudes toward the rear of the base portion 22 in the same direction as the plurality of the heat dissipation fins 21 and the integrated substrate supporting portion 24 is protruded from the base portion 22 opposite to the integrated substrate bonding portion 26, (22).

통합기판(10)은 전단부인 LED기판부(12)가 통합기판 지지부(24) 내로 삽입되고, 후단부인 LDM기판부(14)는 통합기판 결합부(26)의 일측면에 안착된 후, 체결홀(17)을 관통하는 상기 체결부재에 의해 통합기판 결합부(26)에 체결된다.The LED substrate portion 12 as the front end of the integrated substrate 10 is inserted into the integrated substrate support portion 24 and the LDM substrate portion 14 as the rear end portion is seated on one side of the integrated substrate coupling portion 26, And is fastened to the integrated substrate engaging portion 26 by the fastening member passing through the hole 17.

이와 같이, 통합기판(10)이 히트싱크(20)에 결합된 상태이면, LED광원(11)은 리플렉터(30)의 좌우방향 일측면에 배치된다. 즉, 리플렉터(30)는 측면에서 조사되는 LED광원(11)의 빛을 전방으로 반사한다. 리플렉터(30)의 전방에는 리플렉터(30)가 반사하는 빛을 상기 자동차의 외부로 배광하는 렌즈(미도시)가 배치된다. 리플렉터(30)는 전방면이 후방으로 오목한 형태를 가지고 있으며, 그 오목한 전방면에 빛을 반사할 수 있는 알루미늄 재질이 증착된다.The LED light source 11 is disposed on one lateral side of the reflector 30 when the integrated substrate 10 is coupled to the heat sink 20. [ That is, the reflector 30 reflects the light of the LED light source 11 irradiated from the side toward the front. A lens (not shown) is disposed in front of the reflector 30 to distribute the light reflected by the reflector 30 to the outside of the automobile. The front surface of the reflector 30 is recessed rearward, and an aluminum material capable of reflecting light is deposited on the concave front surface.

아래에서는 통합기판(10)이 조립되기 위한 히트싱크(20)의 통합기판 지지부(24) 및 통합기판 결합부(26)에 대해 상세히 살펴보기로 한다.Hereinafter, the integrated board support 24 and the integrated board connector 26 of the heat sink 20 for assembling the integrated board 10 will be described in detail.

도 4는 도 3에 도시된 히트싱크를 나타내는 단면도이다.4 is a sectional view showing the heat sink shown in Fig.

통합기판 지지부(24)에는 LED기판부(12) 및 연결부(16)가 삽입되는 슬롯(23)이 형성된다. 또한, 통합기판 지지부(24)에는 슬롯(23)과 연통되고 LED광원(11)이 노출되는 광원노출홀(25)이 형성된다. 광원노출홀(25)은 리플렉터(30)의 좌우방향 일측면을 향해 형성되어, LED광원(11)이 리플렉터(30)의 좌우방향 일측면에 배치될 수 있도록 한다. LED기판부(12) 및 연결부(16)가 슬롯(23)으로 삽입된 상태이면, LED기판부(12)는 광원노출홀(25)에 의해 일부가 노출되고, 연결부(16)는 광원노출홀(25)의 후방에 배치된다.The integrated substrate support part 24 is formed with a slot 23 into which the LED substrate part 12 and the connection part 16 are inserted. A light source exposure hole 25 communicating with the slot 23 and exposing the LED light source 11 is formed in the integrated substrate support 24. The light source exposure hole 25 is formed toward one lateral side of the reflector 30 so that the LED light source 11 can be disposed on one lateral side of the reflector 30. The LED substrate portion 12 is partially exposed by the light source exposure hole 25 and the connection portion 16 is exposed through the light source exposure hole 25 when the LED substrate portion 12 and the connection portion 16 are inserted into the slot 23. [ (25).

통합기판 지지부(24)에는 연결부(16)가 위치하는 슬롯(23) 내에, 통합기판 결합부(26)의 LDM기판부(14)가 안착되는 면보다 높은 지지돌기(29)가 형성된다. 지지돌기(29)는 광원노출홀(25)의 후방에 위치된다. 또한, 지지돌기(29)는 LED기판부(12) 및 연결부(16)가 슬롯(23) 내로 삽입된 상태이면, 탄성홈(15)과 대응되는 위치에 배치된다.The integrated substrate supporting part 24 is formed with a support projection 29 that is higher than the surface on which the LDM substrate part 14 of the integrated substrate coupling part 26 is seated in the slot 23 in which the connection part 16 is located. The support protrusion 29 is located behind the light source exposure hole 25. The support protrusions 29 are disposed at positions corresponding to the elastic grooves 15 when the LED substrate portion 12 and the connection portions 16 are inserted into the slots 23. [

통합기판 지지부(24)는, 슬롯(23)을 형성하는 일측면 중 연결부(16)가 위치하는 부분이, 통합기판 결합부(26) 중 LDM기판부(14)가 안착되는 면에 대해 경사진 경사부(27)로 형성된다. 따라서, LED기판부(12) 및 연결부(16)를 슬롯(23) 내로 초기 삽입시에 삽입이 용이해진다.The integrated substrate supporter 24 is formed such that the portion of the one side of the one side of the slot 23 where the connection portion 16 is located is inclined relative to the surface of the integrated substrate engaging portion 26 on which the LDM substrate portion 14 is seated. And the inclined portion 27 is formed. Therefore, insertion of the LED substrate portion 12 and the connecting portion 16 at the time of initial insertion into the slot 23 is facilitated.

또한, 통합기판 지지부(24)는, 슬롯(23)을 형성하는 일측면 중 LED기판부(12)가 위치하는 부분은, 통합기판 결합부(26) 중 LDM기판부(14)가 안착되는 면과 평행한 평행부(28)로 형성된다.The portion of the integrated substrate supporter 24 where the LED substrate portion 12 is located on one side forming the slot 23 is a portion of the integrated substrate supporter 24 on which the LDM substrate portion 14 of the integrated substrate engaging portion 26 is seated And the parallel portion 28 is parallel to the center portion.

통합기판 결합부(26)는 복수의 방열핀(21)보다 후방으로 더 돌출 형성되고, LDM기판부(14)가 일면에 안착될 수 있는 사각형상의 판체로 형성된다.The integrated substrate joining portion 26 is formed as a rectangular plate that is further protruded rearward than the plurality of radiating fins 21 and can be mounted on one surface of the LDM substrate portion 14. [

아래에서는 통합기판(10)을 히트싱크(20)에 조립하는 과정에 대해 설명하기로 한다.Hereinafter, a process of assembling the integrated substrate 10 to the heat sink 20 will be described.

도 5 및 도 6은 통합기판을 히트싱크에 조립하는 과정을 나타내는 도면이다.5 and 6 are views showing a process of assembling the integrated substrate to the heat sink.

도 5 및 도 6을 참조하면, 통합기판 결합부(26)의 일면에 LDM소자 냉각판(40)을 배치시킨다. 통합기판(10)이 히트싱크(20)에 결합된 상태이면, LDM소자 냉각판(40)은 LDM기판부(14) 및 통합기판 결합부(26) 사이에 배치되어, LDM소자(13)에서 발생되는 열을 냉각한다. LDM소자 냉각판(40)은 통합기판 결합부(26)의 형상과 대응되는 형상인 사각 형상으로 형성되고, LDM소자(13) 및 통합기판 결합부(26)에 접촉되어 LDM소자에서 발생되는 열을 방열할 수 있다.Referring to FIGS. 5 and 6, the LDM element cooling plate 40 is disposed on one surface of the integrated substrate joining portion 26. The LDM element cooling plate 40 is disposed between the LDM substrate unit 14 and the integrated substrate joining unit 26 so that the LDM element cooling plate 40 can be separated from the heat sink 20 Cool the generated heat. The LDM element cooling plate 40 is formed in a rectangular shape corresponding to the shape of the integrated substrate engaging portion 26 and is in contact with the LDM element 13 and the integrated substrate engaging portion 26, It is possible to radiate heat.

이후, 통합기판(10)은 선단부인 LED기판부(12) 및 연결부(16)가 통합기판 지지부(24)에 형성된 슬롯(23)의 후방에서부터 슬롯(23) 내로 삽입되어, 통합기판 지지부(24)내에 배치된다.The integrated substrate 10 is inserted into the slot 23 from the rear of the slot 23 formed in the integrated substrate support 24 so that the integrated substrate support 24 .

통합기판(10)은 LED기판부(12) 및 연결부(16)가 슬롯(23) 내로 삽입되면, 후단부인 LDM기판부(14)는 지지돌기(29)로 인해 통합기판 결합부(26)의 일면으로부터 들떠있게 된다. 이러한 상태에서, LDM기판부(14)를 통합기판 결합부(26)를 향하는 A방향으로 누르면, 지지돌기(29)의 전방에 위치하는 LED기판부(12)는 지지돌기(29)를 회전중심으로 하여 LDM기판부(14)를 누르는 방향과 반대방향인 B방향으로 회전되면서 통합기판 지지부(24)에 밀착된다.When the LED substrate portion 12 and the connection portion 16 are inserted into the slot 23, the LDM substrate portion 14 which is the rear end portion of the integrated substrate 10 is supported by the support protrusions 29, It becomes exciting from one side. In this state, when the LDM substrate portion 14 is pressed in the direction A toward the integrated substrate engaging portion 26, the LED substrate portion 12 positioned in front of the support protrusions 29 supports the support protrusions 29, And is in close contact with the integrated substrate supporter 24 while being rotated in the direction B opposite to the direction in which the LDM substrate unit 14 is pressed.

따라서, 통합기판(10)은 LED기판부(12)를 체결부재로 고정할 필요가 없고, LDM기판부(14)만 체결부재를 통해 통합기판 결합부(26)에 결합하여, 히트싱크(20)에 결합될 수 있다.Therefore, the integrated substrate 10 does not need to fix the LED substrate portion 12 with the fastening member. Only the LDM substrate portion 14 is coupled to the integrated substrate coupling portion 26 through the fastening member, ). ≪ / RTI >

본 발명의 실시예에 의한 자동차의 조명장치는, LED기판부(12) 및 LDM기판부(14)가 일체로 형성되기 때문에, 조립공수 및 부품수가 줄어들고, 가격이 저렴해진다.
In the automotive lighting apparatus according to the embodiment of the present invention, since the LED substrate portion 12 and the LDM substrate portion 14 are integrally formed, the number of assembling processes and components is reduced, and the cost is reduced.

본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예는 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구의 범위에 의하여 나타내어지며, 특허청구의 범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.
It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

10: 통합기판 11: LED광원
12: LED기판부 13: LDM소자
14: LDM기판부 15: 탄성홈
16: 연결부 17: 체결홀
20: 히트싱크 21: 방열핀
22: 베이스부 23: 슬롯
24: 통합기판 지지부 25: 광원노출홀
26: 통합기판 결합부 27: 경사부
28: 평행부 29: 지지돌기
30: 리플렉터 40: LDM소자 냉각판10: Integrated substrate 11: LED light source
12: LED substrate part 13: LDM element
14: LDM substrate part 15: elastic groove
16: connection part 17: fastening hole
20: heat sink 21: heat sink pin
22: base portion 23: slot
24: Integrated substrate support 25: Light source exposure hole
26: integrated substrate coupling portion 27: inclined portion
28: parallel portion 29: support projection
30: Reflector 40: LDM element cooling plate

Claims (8)

LED광원이 장착되는 LED기판부와, 상기 LED광원을 제어하는 LDM소자가 장착되는 LDM기판부와, 상기 LED기판부 및 상기 LDM기판부 사이를 연결하는 연결부를 가지는 통합기판; 및
상기 LED기판부 및 상기 연결부가 삽입되는 슬롯과 상기 슬롯과 연통되고 상기 LED광원이 노출되는 광원노출홀이 형성된 통합기판 지지부와, 상기 LDM기판부가 일면에 안착되어 결합되는 통합기판 결합부를 가지는 히트싱크;를 포함하는 자동차의 조명장치.An integrated circuit board having an LED substrate portion on which an LED light source is mounted, an LDM substrate portion on which an LDM element for controlling the LED light source is mounted, and a connection portion connecting the LED substrate portion and the LDM substrate portion; And
And a light source exposing hole through which the LED light source is exposed and which is in communication with the LED substrate portion and the connection portion, and a heat sink having an integrated substrate joining portion in which the LDM substrate portion is seated on one surface, A lighting device for a vehicle. 청구항 1에 있어서,
상기 통합기판은 상기 LED기판부 및 상기 연결부 사이의 양측에 탄성홈이 형성되는 자동차의 조명장치.The method according to claim 1,
Wherein the integrated substrate has elastic grooves formed on both sides between the LED substrate portion and the connection portion. 청구항 1에 있어서,
상기 통합기판은 상기 LDM기판부에 상기 히트싱크와 결합되기 위한 체결홀이 형성되는 자동차의 조명장치.The method according to claim 1,
Wherein the integrated substrate has a coupling hole formed in the LDM substrate portion for coupling with the heat sink. 청구항 1에 있어서,
상기 광원이 생성한 빛을 반사하는 리플렉터를 더 포함하고,
상기 광원은 리플렉터의 좌우방향 일측면에 배치되는 자동차의 조명장치.The method according to claim 1,
And a reflector for reflecting the light generated by the light source,
Wherein the light source is disposed on one lateral side of the reflector. 청구항 1에 있어서,
상기 통합기판 지지부에는 상기 연결부가 위치하는 상기 슬롯 내에, 상기 통합기판 결합부의 상기 LDM기판부가 안착되는 면보다 높은 지지돌기가 형성되는 자동차의 조명장치.The method according to claim 1,
Wherein the integrated substrate support portion has a support protrusion higher than a surface on which the LDM substrate portion of the integrated substrate coupling portion is seated, in the slot in which the connection portion is located. 청구항 1에 있어서,
상기 통합기판 지지부는,
상기 슬롯을 형성하는 일측면 중 상기 연결부가 위치하는 부분이, 상기 통합기판 결합부의 상기 일면에 대해 경사진 경사부로 형성되고,
상기 슬롯을 형성하는 일측면 중 상기 LED기판부가 위치하는 부분은, 상기 통합기판 결합부의 상기 일면과 평행한 평행부로 형성되는 자동차의 조명장치.The method according to claim 1,
Wherein the integrated substrate support portion includes:
Wherein a portion of the one side surface forming the slot is located at an inclined portion that is inclined with respect to the one surface of the integrated substrate coupling portion,
Wherein a portion of the one side of the one side of the slot where the LED substrate is located is formed as a parallel portion parallel to the one surface of the integrated substrate coupling portion. 청구항 1에 있어서,
상기 LDM기판부 및 상기 통합기판 결합부 사이에 배치되어, 상기 LDM소자에서 발생되는 열을 냉각하는 LDM소자 냉각판을 더 포함하는 자동차의 조명장치.The method according to claim 1,
And an LDM element cooling plate disposed between the LDM substrate portion and the integrated substrate coupling portion for cooling the heat generated from the LDM element. 청구항 1에 있어서,
상기 히트싱크는,
서로 이격되어 배치되는 복수의 방열핀이 돌출 형성된 베이스부를 더 포함하고,
상기 통합기판 결합부는 상기 베이스부의 일측에 상기 복수의 방열핀과 동일한방향으로 돌출 형성되고,
상기 통합기판 지지부는 상기 베이스부의 일측에 상기 통합기판 결합부와 반대방향으로 돌출 형성되는 자동차의 조명장치.The method according to claim 1,
The heat sink
Further comprising a base portion having a plurality of radiating fins protruded from each other,
Wherein the integrated substrate coupling part is formed on one side of the base part in such a manner as to protrude in the same direction as the plurality of heat radiation fins,
Wherein the integrated substrate support portion is formed on one side of the base portion so as to protrude in a direction opposite to the integrated substrate connection portion.
KR1020160002074A 2016-01-07 2016-01-07 Lighting apparatus for an automobile KR101851001B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4427539B2 (en) 2006-08-03 2010-03-10 億光電子工業股▲ふん▼有限公司 Replaceable light emitting diode module
JP2013030372A (en) 2011-07-29 2013-02-07 Stanley Electric Co Ltd Headlight for vehicle
JP5658016B2 (en) 2010-12-03 2015-01-21 スタンレー電気株式会社 Vehicle lighting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4427539B2 (en) 2006-08-03 2010-03-10 億光電子工業股▲ふん▼有限公司 Replaceable light emitting diode module
JP5658016B2 (en) 2010-12-03 2015-01-21 スタンレー電気株式会社 Vehicle lighting
JP2013030372A (en) 2011-07-29 2013-02-07 Stanley Electric Co Ltd Headlight for vehicle

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