KR101830247B1 - The manufacturing method of curved type board and the circuit board using the same - Google Patents

The manufacturing method of curved type board and the circuit board using the same Download PDF

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Publication number
KR101830247B1
KR101830247B1 KR1020160014738A KR20160014738A KR101830247B1 KR 101830247 B1 KR101830247 B1 KR 101830247B1 KR 1020160014738 A KR1020160014738 A KR 1020160014738A KR 20160014738 A KR20160014738 A KR 20160014738A KR 101830247 B1 KR101830247 B1 KR 101830247B1
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South Korea
Prior art keywords
board
sheet member
curved
thermosetting resin
circuit
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KR1020160014738A
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Korean (ko)
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KR20170093394A (en
Inventor
한석주
박철진
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한솔테크닉스(주)
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Priority to KR1020160014738A priority Critical patent/KR101830247B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Abstract

The present invention relates to a curved board manufacturing method and a circuit board using the curved board manufacturing method. The present invention relates to a curved board manufacturing method for manufacturing a curved board that maintains a curvature of a predetermined curvature, ; 70 ° C) or more, or a reinforcing sheet made of at least one thermosetting resin is laminated on a sheet member of a prepreg material, and the sheet is pressure-molded at a predetermined temperature (for example, 70 ° C) or higher through a mold part. The present invention provides a curved board that maintains the curvature of a predetermined curvature while providing a curved circuit board (PCB) while forming a circuit forming portion on one or both sides of the curved board, Even if the curable resin in the curved type board to be retained flows out from the pressure molding, It is one to prevent the type of board that is the bending deformation.

Figure R1020160014738

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved board manufacturing method and a circuit board using the curved board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved type board and a circuit board. More particularly, the present invention relates to a curved type board and a circuit board. More particularly, the present invention relates to a curved type board and a circuit board, Type board that can be used as a circuit board (PCB) while maintaining the flexibility of a predetermined curvature, and a circuit board using the same.

Generally, a multilayer circuit board is strongly desired due to miniaturization and high density of electronic devices. Such a circuit board is disclosed in Japanese Patent Application Laid-Open No. 10-2007-0087981 (published on August 29, 2007), Registered Patent No. 10-0737057 (Publication Date 2007.07.06).

However, the above-described circuit board has a flexible characteristic, and the circuit board can not keep the flexibility of a certain curvature constant.

That is, although the above-mentioned circuit boards can bend due to their flexible characteristics, their bending state is not kept constant.

Accordingly, the applicant of the present application filed a patent application in Korean Patent Registration No. 10-1460475 (Notification 2014.11.10, hereinafter referred to as Prior Art 1) obtained through transfer of rights, as well as Patent Registration No. 10-1554304 (Public Notice No. 2015.09.18, 2), a curved rigid substrate which maintains a predetermined curvature flexibility is disclosed. The present invention is an improvement of the prior arts 1 and 2.

The present invention relates to a curved board which maintains a curvature of a predetermined curvature and which is formed by pressing a sheet member of a prepreg material through a mold part at a predetermined temperature (for example, 70 ° C or more) Type board, and a curved circuit board (PCB) can be supplied while forming a circuit forming part on one side or both sides of the curved type board, and a circuit board using the same. .

Another object of the present invention is to provide a laminated structure of a reinforcing sheet made of at least one thermosetting resin on a sheet member of a prepreg material and then press-molding the reinforcing sheet at a predetermined temperature (e.g., 70 DEG C) Type board to maintain the curvature of the curved type board in the curved type board, and to prevent the curved type board from being deformed when the curled type resin in the curved type board holding the curved type board is released from the pressure forming, and to provide a circuit board using the curved type board.

The method for manufacturing a curved board of the present invention for achieving the above object comprises the steps of: (a) injecting a sheet member impregnated with a material that maintains a solid state at room temperature into a mold; (b) a step of deforming the solid material impregnated in the sheet member into a liquid state by press-molding the sheet member put into the mold part at a predetermined temperature or higher in the step (a); And (c) cooling the sheet member when the material impregnated from the step (b) is deformed into a liquid phase, thereby extracting a curved board (A) having a certain curvature flexibility from the mold part; .

According to another aspect of the present invention, a curved board manufacturing method of the present invention comprises the steps of: (d) attaching a reinforcing sheet to a sheet member impregnated with a material that maintains a solid state at room temperature; (a) injecting the sheet member having the reinforcing sheet attached thereto into the mold section from the step (d); (b) a step of deforming the solid material impregnated in the sheet member into a liquid state by press-molding the sheet member having the reinforcing sheet attached thereto in the step (a) at a predetermined temperature or higher; ; And (c) cooling the sheet member, to which the reinforcing sheet is attached, when the material impregnated from the step (b) is deformed into a liquid state, thereby extracting a curved board having a certain curvature flexibility from the mold part ; .

In addition, the reinforcing sheet is deformed into a liquid state through the press-forming of the solid material impregnated in the sheet member, and flows out to the outside of the sheet member to change the covering ratio, so that the flexibility with respect to the board is not kept constant So as to prevent deformation.

In addition, the sheet member is a prepreg impregnated with a thermosetting resin material in a fiber-glass.

Further, the reinforcing sheet is a sheet made of a thermosetting resin.

Further, the reinforcing sheet is a sheet made of a thermoplastic resin.

Also, the thermoplastic resin may be polyethylene terephthalate or polyimide.

In addition, a circuit board constituting a circuit pattern is formed by forming a circuit forming portion on one side or both sides of the curved board.

In addition, when the circuit forming portion is formed on both sides of the curved board, a through hole is formed in the board, and the through hole is filled with a conductive paste for connecting the circuit forming portions formed on both sides of the board.

Further, the circuit forming portion is a foil sheet of a metal material.

Further, the sheet member is configured to have a lattice structure, wherein the lattice structure is configured to have an interval within a range of 0.3 to 0.7 mm so as to reinforce the maintenance of a predetermined curvature flexibility with respect to the board.

As described above, the present invention can be applied to a curved board which maintains a curvature of a certain curvature by press-molding a sheet member of a prepreg material at a predetermined temperature (for example, 70 ° C or higher) through a mold, A reinforcing sheet made of at least one thermosetting resin is laminated on a member and press-molded at a temperature higher than a predetermined temperature (e.g., 70 deg. C) through a mold part, thereby completing a curved board maintaining a certain curvature flexibility , A curved circuit board (PCB) can be supplied while forming a circuit forming part on one side or both sides of the curved type board, and even if a curing resin in a curved type board which maintains a certain curvature bending property flows out from the pressure forming It is possible to anticipate the effect of preventing the curvature of the curved board from being deformed to be.

1 is a schematic perspective view showing the structure of a curved board according to a first embodiment of the present invention;
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a board,
3 is a schematic cross-sectional view showing a structure of a circuit board using a curved board according to a second embodiment of the present invention.
4 is a process diagram showing a state in which a board having a reinforcing sheet attached thereto is press-formed in a curved shape according to a third embodiment of the present invention.
5 is a schematic cross-sectional view showing the structure of a circuit board using a curved board according to a fourth embodiment of the present invention as a fourth embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification.

In this specification, the terms "comprises" or "having ", and the like, specify that the presence of stated features, integers, steps, operations, elements, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

In addition, the embodiments described herein will be described with reference to cross-sectional views and / or plan views, which are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but may include variations in shapes that are created or required according to the manufacturing process. For example, the area shown at right angles may be rounded or may have a shape with a certain curvature. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of regions of the apparatus and are not intended to limit the scope of the invention.

Like reference numerals refer to like elements throughout the specification. Accordingly, although the same reference numerals or similar reference numerals are not mentioned or described in the drawings, they may be described with reference to other drawings. Further, even if the reference numerals are not shown, they can be described with reference to other drawings.

Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view showing the structure of a curved board according to a first embodiment of the present invention, and FIG. 2 is a process diagram showing a state in which a board is press-formed into a curved shape according to a first embodiment of the present invention .

1 and 2, the curved board A according to the embodiment of the present invention proceeds to the steps (a) to (c).

In the step (a), the sheet member 10 impregnated with a material which maintains a solid state at room temperature is injected into the lower mold 102 of the mold section 100.

That is, the sheet member 10 has a lattice structure as a prepreg impregnated with a material of a thermosetting resin in a fiber-glass, and the lattice structure has a curvature of a certain curvature (A) And the spacing is in the range of 0.3 to 0.7 mm so as to reinforce the holding. The thermosetting resin maintains a solid state at room temperature at the time of curing.

Here, the spacing of the lattice structures is made narrow as described above because the bendability of the curved board A can be further improved.

In the step (b), the sheet member 10 injected into the lower mold 102 of the mold unit 100 may be transferred to the lower mold 102 through the upper mold 101 of the mold unit 100 at a predetermined temperature 70 deg. C) or higher to deform the thermosetting resin as a solid material impregnated in the sheet member 10 into a liquid state.

That is, since the thermosetting resin as a material impregnated in the sheet member 10 has a temperature range from a softening point (70 ° C) to a melting point (85 ° C) and a minimum melt viscosity 1000 (Pa · s) The thermosetting resin impregnated in the sheet member 10 can be changed into a liquid state by press molding the sheet member 10 charged into the lower mold 102 at a temperature of 70 ° C or higher.

In the step (c), when the material impregnated from the step (b) is deformed into a liquid state, the sheet member 10 is cooled and the upper mold 101 and the lower mold 102 constituting the mold part 100 And a step of extracting the curved board A in which the curvature of a predetermined curvature is maintained.

At this time, the upper mold 101 and the lower mold 101 forming the mold 100 have a curved surface or an angled surface formed by bending, so that the upper mold 101 is press-formed to form the curved board A When extracting, the board (A) to be press-molded through the mold part (100) is formed into a three-dimensional structure having a curved shape, a curvature of a certain curvature, or a right angle surface with bending.

3, the circuit board (PCB) can be formed as a circuit board (PCB), and the circuit board (PCB) It is possible to have flexibility of curvature.

That is, the circuit forming portions 30 and 30 'made of a foil sheet of a metal material are laminated on one side or both sides of the curved board A, and then the board A, The board A and the circuit forming portions 30 and 30 'can be bonded to each other by compressing the compressed board A and cooling the compressed board A.

Next, when circuit patterns are formed by selectively etching the circuit forming portions 30 and 30 'bonded to one or both surfaces of the board A, a curved three-dimensional circuit board having a predetermined curvature flexibility, (PCB) can be obtained.

When the circuit forming portions 30 and 30 'are formed on both sides of the board A, a through hole A1 is formed in the board A and a through hole A1 is formed in the through hole A1. The conductive paste 31 is filled by a printing method or the like so as to electrically connect the circuit forming portions 30 and 30 'formed on both sides of the board A with each other.

4 is a third embodiment of the present invention showing a manufacturing process of a curved board A ', which is a process of (a) to (c) of the first embodiment of the present invention, And the same parts as in the first embodiment of the present invention are denoted by the same reference numerals.

In the step (d), the reinforcing sheet 20 is further attached to the sheet member 10 impregnated with the thermosetting resin, which is a solid material at room temperature.

That is, the sheet member 10 has a lattice structure as a prepreg in which a material of a thermosetting resin is impregnated into a fiber-glass, and the lattice structure has a certain curvature Wherein the thermosetting resin is kept in a solid state at room temperature when cured.

At this time, the solid sheet material impregnated in the sheet member 10 is deformed into a liquid state through press molding, and the reinforcing sheet 20 flows out to the outside of the sheet member 10, The reinforcing sheet 20 is a sheet made of a thermosetting resin or a thermoplastic resin, and the sheet of the thermoplastic resin is made of polyethylene terephthalate (PET) ) Or polyimide.

For example, the thermosetting resin has a viscosity. When the sheet member 10 containing such a thermosetting resin is press-molded into the mold section 100 composed of the upper mold 101 and the lower mold 102, the thermosetting resin is lost Problems can arise.

Accordingly, the compatibility ratio of the thermosetting resin material impregnated into the sheet member 10 due to the loss of the thermosetting resin can not be maintained at the setting ratio of the board A ' A reinforcing sheet 20 made of a thermosetting resin or a thermoplastic resin is laminated on one surface of the sheet member 10 so that the reinforcing sheet 20 can be stuck to the sheet member 10, The flexibility of the board A 'due to the loss of the thermosetting resin impregnated into the board A' can be compensated.

The step (a) described above with reference to the same notation as in the first embodiment of the present invention is a step in which the sheet member 10 to which the reinforcing sheet 20 is attached from the step (d) Into the lower mold (102) of the mold (100).

The step (b) described below with reference to the same notation as in the first embodiment of the present invention is a step of forming the reinforcing sheet 10 in the lower mold 102 of the mold part 100 in the step (a) The sheet member 10 to which the sheet member 20 is attached is pressed and formed into the upper die 101 of the mold section 100 at a temperature of 70 ° C or higher, It transforms the material into a liquid state.

The step (c), which will be described in the same notation as in the first embodiment of the present invention, is a step in which the reinforcing sheet 20 is deformed when the material impregnated from the step (b) The curved board A 'having a predetermined curvature can be extracted from the mold part 100 by cooling the sheet member 10 with the curved board A' attached thereto.

On the other hand, as a fourth embodiment of the present invention, a curved board A 'including a reinforced sheet 20 extracted as in the third embodiment of the present invention is mounted on a circuit board (PCB) The circuit board PCB 'may have a three-dimensional structure having a predetermined curvature and flexibility.

That is, after circuit forming portions 30 and 30 'made of a foil sheet of a metal material are laminated on one side or both sides of the curved board A', the circuit forming portions 30 and 30 ' When the board A 'is compressed and the compressed board A' is cooled, adhesion between the board A 'and the circuit forming parts 30 and 30' can be performed.

Next, when the circuit pattern is formed by selectively etching the circuit forming portions 30 and 30 'bonded to one or both surfaces of the board A', the reinforcing sheet 20 is applied, A curved three-dimensional circuit board (PCB ') can be obtained.

When the circuit forming portions 30 and 30 'are formed on both sides of the board A', the foil sheet of the metallic material is attached to the other surface to which the reinforcing sheet 20 is attached, The through holes A1 are formed in the board A 'and the circuit forming portions 30 and 30' formed on both sides of the board A 'are electrically connected to the through holes A1. The conductive paste 31 is filled using a printing method or the like.

While the present invention has been described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that such changes and modifications are within the scope of the claims.

10; Sheet member 20; Reinforced sheet
30,30 '; A circuit forming section 100; Mold part
101; Topography 102; Bottom
A, A '; Curved board PCB, PCB '; Circuit board

Claims (12)

(a) a lattice structure impregnated with a solid state thermosetting resin having a temperature range from a softening point (70 ° C) to a melting point (85 ° C) and a minimum melting point of 1000 (Pa · s) in a fiber- Into a mold section;
(b) a step of deforming the solid state thermosetting resin impregnated in the sheet member into a liquid state by press-molding the sheet member put into the mold part in the step (a) at a temperature not lower than a softening point (70 캜); And
(c) cooling the sheet member when the thermosetting resin impregnated from the step (b) is deformed into a liquid phase, thereby extracting a curved board (A) having a certain curvature flexibility from the mold part; The method according to claim 1, (d) a lattice structure impregnated with a solid state thermosetting resin having a temperature range from a softening point (70 ° C) to a melting point (85 ° C) and a minimum melting point of 1000 (Pa · s) in a fiber- A step of attaching a reinforcing sheet made of a thermosetting resin to the sheet member of the sheet member so as to compensate the resin coverage ratio due to the loss of the thermosetting resin;
(a) injecting the sheet member having the reinforcing sheet attached thereto into the mold section from the step (d);
(b) The sheet member having the reinforcing sheet attached thereto in the step (a) is press-molded at a temperature not lower than the softening point (70 캜), and the solid thermosetting resin impregnated in the sheet member is in a liquid state ; And
(c) cooling the sheet member on which the reinforcing sheet is adhered when the solid thermosetting resin impregnated in the sheet member is deformed into a liquid state from the step (b), so that the bending of a certain curvature is maintained A step of extracting a curved board; The method according to claim 1, delete delete 3. The method according to claim 1 or 2,
Wherein the grid structure of the sheet member is configured to have an interval within a range of 0.3 to 0.7 mm so as to reinforce the flexibility maintenance of a predetermined curvature with respect to the board. delete delete delete A circuit board according to claim 1, wherein a circuit pattern is formed by laminating a circuit forming portion on one side or both sides of a curved board manufactured according to claim 1. A circuit board comprising a circuit-forming portion laminated on one surface or both surfaces of a curved board having a reinforcing sheet attached thereto according to Claim 2. 11. The method according to claim 9 or 10,
Wherein when the circuit forming portion is formed on both sides of the curved board, a through hole is formed in the board, and the through hole is filled with a conductive paste for connecting the circuit forming portion formed on both sides of the board. Circuit board. The circuit board according to claim 9 or 10, wherein the circuit forming portion is a foil sheet of a metal material.
KR1020160014738A 2016-02-05 2016-02-05 The manufacturing method of curved type board and the circuit board using the same KR101830247B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129039A (en) * 2005-11-02 2007-05-24 Nippon Pillar Packing Co Ltd Fluorine resin printed circuit board and manufacturing method thereof
KR101554304B1 (en) * 2015-04-20 2015-09-18 한솔테크닉스(주) Curved type rigid board and a Three-dimension antenna manufacturing method of using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129039A (en) * 2005-11-02 2007-05-24 Nippon Pillar Packing Co Ltd Fluorine resin printed circuit board and manufacturing method thereof
KR101554304B1 (en) * 2015-04-20 2015-09-18 한솔테크닉스(주) Curved type rigid board and a Three-dimension antenna manufacturing method of using the same

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