KR101791872B1 - Unit for supplying liquid and Apparatus for treating substrate with the unit - Google Patents

Unit for supplying liquid and Apparatus for treating substrate with the unit Download PDF

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Publication number
KR101791872B1
KR101791872B1 KR1020150188465A KR20150188465A KR101791872B1 KR 101791872 B1 KR101791872 B1 KR 101791872B1 KR 1020150188465 A KR1020150188465 A KR 1020150188465A KR 20150188465 A KR20150188465 A KR 20150188465A KR 101791872 B1 KR101791872 B1 KR 101791872B1
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KR
South Korea
Prior art keywords
liquid
line
replenishing
supply
processing
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KR1020150188465A
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Korean (ko)
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KR20170078935A (en
Inventor
이주동
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세메스 주식회사
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Priority to KR1020150188465A priority Critical patent/KR101791872B1/en
Publication of KR20170078935A publication Critical patent/KR20170078935A/en
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Publication of KR101791872B1 publication Critical patent/KR101791872B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides an apparatus for liquid-treating a substrate. The substrate processing apparatus includes a processing tank provided with a plurality of process units and a liquid supply unit for supplying a processing liquid to each of the processing units, wherein the liquid supply unit includes a supply tank in which a process liquid is contained, A main supply line connected to the supply tank, and a plurality of liquid supply units provided to the process units to supply the process liquid to the main supply line, wherein each of the liquid supply units is connected to the main supply line, And a liquid replenishing member that replenishes the supply flow rate of the process liquid to the liquid supply line, the liquid replenishing member being branched from the process units and having a containing space in which the process liquid is contained And a liquid replenishment line connecting the replenishing tank and the liquid supply line. Therefore, even if the supply flow rate of the process liquid is less than the set flow rate, the process liquid can be supplied at the set flow rate through the replenishment of the process liquid of the liquid replenishment member.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid supply unit,

The present invention relates to an apparatus for liquid-treating a substrate.

Various processes such as photo, cleaning, deposition, ashing, etching, and ion implantation are performed to manufacture a semiconductor device. Among these processes, the photolithography, cleaning, ashing, and etching processes are processes for supplying a processing solution onto a substrate to perform a liquid processing.

Generally, the liquid treatment process proceeds in each of a plurality of process units. These processing units are supplied with the processing liquid from the liquid supply unit. The liquid supply unit includes a supply tank 2 and a plurality of liquid supply lines, and the processing units are connected to the supply tank by a liquid supply line.

1 is a cross-sectional view showing a general liquid supply unit. Referring to FIG. 1, a liquid supply line is provided to the main supply line 4 and a plurality of branch lines 6. The branch lines 6 are branched from the main supply line 4 and connected to the respective processing units 8. [ A pump is installed in the main supply line 4, and the pump supplies supply pressure to the main supply line 4 so as to supply the processing solution to each of the processing units 8.

However, as the equipment becomes larger, the number of process units 8 increases, while the supply pressure supplied from the pump has a limit. As a result, the process liquid can not be supplied to each of the process units 8 at a set flow rate, resulting in a failure of the liquid processing process of the substrate.

The present invention intends to provide an apparatus by which a liquid supply unit can supply processing liquid to a plurality of processing units at a set flow rate.

An embodiment of the present invention provides an apparatus for liquid-treating a substrate. The substrate processing apparatus includes a processing tank provided with a plurality of process units and a liquid supply unit for supplying a processing liquid to each of the processing units, wherein the liquid supply unit includes a supply tank in which a process liquid is contained, A main supply line connected to the supply tank, and a plurality of liquid supply units provided to the process units to supply the process liquid to the main supply line, wherein each of the liquid supply units is connected to the main supply line, And a liquid replenishing member that replenishes the supply flow rate of the process liquid to the liquid supply line, the liquid replenishing member being branched from the process units and having a containing space in which the process liquid is contained And a liquid replenishment line connecting the replenishing tank and the liquid supply line.

Wherein the liquid supply unit further includes a measurement member for measuring the supply flow rate in the liquid supply line and a controller for controlling a supplemental valve installed in the liquid replenishment line, The liquid replenishing line can be opened and closed based on the amount of the liquid. The controller can open the liquid replenishment line when the measured amount is lower than the set amount, and to control the replenishment valve to close the liquid replenishment line when the measured amount is equal to the set amount. The controller may open the liquid replenishment line so that the sum of the measured amount and the replenishing amount of the processing liquid supplied through the liquid replenishing line becomes the set amount. Wherein the liquid replenishing member further comprises a pressure member for pressing the accommodation space and a pressure-reducing member for reducing the pressure of the accommodation space, wherein when the measured amount is lower than the set amount in the process progress state, The pressure member is controlled to be supplied to the liquid supply line, and in the process idle state, the decompression member can be controlled so that the process liquid is filled in the containing space through the liquid replenishment line in the liquid supply line. Wherein the supplementary tank includes a housing having the accommodating space therein and having an inlet and an outlet formed on one surface thereof and a separating plate partitioning the accommodating space into two spaces, the pressure member being connected to the inlet, And the pressure-reducing member is connected to the outlet, and the gas filled in the housing can be forcibly evacuated.

The liquid supply unit includes a supply tank for containing the process liquid therein, a nozzle for discharging the process liquid, a liquid supply line for connecting the nozzle and the supply tank, and a liquid replenishment liquid replenishing liquid supply line Wherein the liquid replenishing member includes a replenishing tank having a receiving space in which the treating liquid is received, and a liquid replenishing line connecting the replenishing tank and the liquid supplying line.

Wherein the liquid supply unit further includes a measurement member for measuring the supply flow rate in the liquid supply line and a controller for controlling a supplemental valve installed in the liquid replenishment line, The liquid replenishing line can be opened and closed based on the amount of the liquid. The controller can open the liquid replenishment line when the measured amount is lower than the set amount, and to control the replenishment valve to close the liquid replenishment line when the measured amount is equal to the set amount. Wherein the liquid replenishing member further comprises a pressure member for pressing the accommodation space and a pressure-reducing member for reducing the pressure of the accommodation space, wherein when the measured amount is lower than the set amount in the process progress state, The pressure member is controlled to be supplied to the liquid supply line, and in the process idle state, the decompression member can be controlled so that the process liquid is filled in the containing space through the liquid replenishment line in the liquid supply line. Wherein the liquid replenishing member further includes a branch line branched from the liquid supply line and connected to the replenishing tank, wherein a branch valve is provided, wherein when the measured amount is lower than the set amount in the process progress state, The control valve controls the replenishment valve so that the received processing liquid is supplied to the liquid supply line, and the controller can control the replenishment valve so that the processing liquid is filled in the containing space through the branch line in the process idle state.

According to the embodiment of the present invention, the processing liquid supplied through the liquid supply line can supplement the flow rate of the processing liquid supplied by the liquid replenishing member. Therefore, even if the supply flow rate of the process liquid is less than the set flow rate, the process liquid can be supplied at the set flow rate through the replenishment of the process liquid of the liquid replenishment member.

1 is a cross-sectional view showing a general liquid supply unit.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
3 is a cross-sectional view showing the process unit of Fig.
4 is a view showing the liquid supply unit of Fig.
5 is a cross-sectional view showing the liquid replenishing member of Fig.
Fig. 6 is a cross-sectional view showing a process in which the processing liquid accommodated in the liquid replenishing member of Fig. 5 is replenished with a liquid supply line.
7 is a cross-sectional view showing a process of filling the replenishing tank of FIG. 5 with the process liquid.
8 is a cross-sectional view showing another embodiment of the liquid supply unit of Fig.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 2 to 8. FIG.

2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing apparatus 1 has an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The processing module 20 includes a buffer unit 220, a transfer chamber 240, a processing unit 260, and a liquid supply unit 400. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process units 260 are disposed on each side of the transfer chamber 240. Process units 260 at one side and the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. A plurality of substrate processing units 260 are provided on one side of the transfer chamber 240. Some of the process units 260 are disposed along the longitudinal direction of the transfer chamber 240. Further, some of the processing units 260 are arranged stacked on each other. That is, at one side of the transfer chamber 240, the process units 260 may be arranged in an array of A X B. Where A is the number of process units 260 provided in a row along the first direction 12 and B is the number of process units 260 provided in a row along the third direction 16. When four or six process units 260 are provided on one side of the transfer chamber 240, the process units 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process units 260 may increase or decrease. Unlike the above, the processing unit 260 may be provided only on one side of the transfer chamber 240. In addition, the processing unit 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). ≪ / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process unit 260 and between the process units 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

The process unit 260 performs a process of liquid-treating the substrate W. The process unit 260 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, each of the process units 260 may have the same structure. Optionally, the process units 260 are grouped into a plurality of groups such that the devices 300 in the process units 260 belonging to the same group are identical to one another, 300 may be provided differently from each other.

In this embodiment, the liquid processing process of the substrate is described as a cleaning process. The liquid treatment process is not limited to the cleaning process, and can be applied to a variety of applications such as photography, ashing, and etching.

3 is a cross-sectional view showing the process unit of Fig. 3, the processing unit 260 includes a processing vessel 320, a spin head 340, an elevating unit 360, and a liquid discharging unit 380.

The processing vessel 320 provides a processing space in which the substrate is processed. The processing vessel 320 has a cylindrical shape with an open top. The processing vessel 320 has an inner recovery cylinder 322 and an outer recovery cylinder 326. [ Each of the recovery cylinders 322 and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 340 and the outer recovery cylinder 326 is provided in an annular ring shape surrounding the inner recovery cylinder 326. The inner space 322a of the inner recovery cylinder 322 and the inner recovery cylinder 322 function as a first inlet 322a through which the process liquid flows into the inner recovery cylinder 322. [ The space 326a between the inner recovery cylinder 322 and the outer recovery cylinder 326 functions as a second inlet 326a through which the process liquid flows into the outer recovery cylinder 326. [ According to one example, each inlet 322a, 326a may be positioned at a different height from each other. Collection lines 322b and 326b are connected under the bottom of each of the collection bins 322 and 326. The treatment liquids flowing into the respective recovery cylinders 322 and 326 can be supplied to an external treatment liquid regeneration system (not shown) through the recovery lines 322b and 326b and can be reused.

The spin head 340 supports the substrate W in the process space. The spin head 340 is provided in a substrate support unit 340 that supports and rotates the substrate W during the process. The substrate support unit 340 has a support body 342, support pins 344, a chuck pin 346, and a rotation drive member. The support body 342 has an upper surface and a lower surface that are provided generally in a circular shape. The lower surface has a smaller diameter than the upper surface. The top and bottom surfaces are positioned so that their central axes coincide with each other.

A plurality of support pins 344 are provided. The support pins 344 are spaced apart at a predetermined distance from the edge of the upper surface of the support body 342 and project upwardly from the support body 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 344 support the rear edge of the substrate W such that the substrate W is spaced from the upper surface of the support body 342 by a certain distance.

A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the support body 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the support body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the spin head 340 is rotated. The chuck pin 346 is provided so as to be linearly movable between an outer position and an inner position along the radial direction of the support body 342. The outer position is a distance from the center of the support body 342 relative to the inner position. The chuck pin 346 is positioned at the outer position when the substrate W is loaded or unloaded to the spin head 340 and the chuck pin 346 is positioned at the inner position when the substrate W is being processed. The inner position is the position where the side of the chuck pin 346 and the substrate W are in contact with each other and the outer position is the position where the chuck pin 346 and the substrate W are spaced apart from each other.

The rotation drive member 348, 349 rotates the support body 342. The support body 342 is rotatable about a self-centering axis by a rotation drive member 348, 349. The rotation drive members 348 and 349 include a support shaft 348 and a drive unit 349. [ The support shaft 348 has a cylindrical shape facing the third direction 16. The upper end of the support shaft 348 is fixedly coupled to the bottom surface of the support body 342. According to one example, the support shaft 348 can be fixedly coupled to the bottom center of the support body 342. The driving unit 349 provides a driving force so that the supporting shaft 348 is rotated. The support shaft 348 is rotated by the drive unit 349, and the support body 342 is rotatable together with the support shaft 348.

The elevating unit 360 moves the processing vessel 320 linearly in the vertical direction. As the processing vessel 320 is moved up and down, the relative height of the processing vessel 320 to the spin head 340 is changed. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the processing container 320 and a moving shaft 364 which is moved upward and downward by a driver 366 is fixedly coupled to the bracket 362. The processing vessel 320 is lowered so that the spin head 340 protrudes to the upper portion of the processing vessel 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. When the process is performed, the height of the process container 320 is adjusted so that the process liquid may flow into the predetermined collection container 360 according to the type of the process liquid supplied to the substrate W. Alternatively, the lifting unit 360 can move the spin head 340 in the vertical direction.

The liquid discharge unit 380 supplies the process liquid onto the substrate W. A plurality of liquid discharge units 380 are provided, and each of them can supply different types of processing liquids. The liquid ejection unit 380 includes a moving member 381 and a nozzle 390.

The moving member 381 moves the nozzle 390 to the process position and the standby position. Wherein the process position is a position where the nozzle 390 is opposed to the substrate W supported by the substrate support unit 340 and the standby position defines a position where the nozzle 390 is out of the process position. According to one example, the process position includes a pre-treatment position and a post-treatment position. The pre-processing position is a position where the nozzle 390 supplies the process liquid to the first supply position, and the post-processing position is provided to a position where the nozzle 390 supplies the process liquid to the second supply position. The first supply position may be closer to the center of the substrate W than the second supply position and the second supply position may be a position including the end of the substrate. Optionally, the second feed position may be a region adjacent the end of the substrate.

The shifting member 381 includes a support shaft 386, an arm 382, and a driver 388. The support shaft 386 is located on one side of the processing vessel 320. The support shaft 386 has a rod shape whose longitudinal direction faces the third direction. The support shaft 386 is provided to be rotatable by a driver 388. The arm 382 is coupled to the upper end of the support shaft 386. The arm 382 extends vertically from the support shaft 386. A nozzle 390 is fixedly coupled to an end of the arm 382. As the support shaft 386 is rotated, the nozzle 390 is swingable with the arm 382. The nozzle 390 can be swung and moved to the process and standby positions. Optionally, the arm 382 can be provided to allow forward and backward movement toward its longitudinal direction. The path through which the nozzle 390 is moved when viewed from the top can coincide with the central axis of the substrate W in the process position. For example, the treatment liquid may be a chemical, a rinsing liquid, and an organic solvent. The chemical is discharged from the chemical nozzle, the rinsing liquid is discharged from the rinsing nozzle, and the organic solvent can be discharged from the drying nozzle. The chemical may be an etchant having acid or base properties. The chemical may include sulfuric acid (H 2 SO 4 ), phosphoric acid (P 2 O 5 ), hydrofluoric acid (HF) and ammonium hydroxide (NH 4 OH). Rinsing liquid may be pure water (H 2 0). The organic solvent may be isopropyl alcohol (IPA).

The liquid supply unit 400 supplies the processing liquid to each of the plurality of processing units 260. A plurality of liquid supply units 400 are provided, each of which supplies different kinds of processing liquids. 4 is a view showing the liquid supply unit of Fig. Referring to FIG. 4, the liquid supply unit 400 is a supply tank 410. A main supply line 420, a liquid supply unit 500, and a controller 600. The supply tank 410 is provided in a tank in which the treatment liquid is received. The supply tanks 410 may be provided singly or plurally, and may be connected to each other in parallel if provided as a plurality. The main supply line 420 is connected to the supply tank 410. The processing liquid contained in the supply tank 410 is supplied to the main supply line 420. The main supply line 420 may be provided as a circulating line through which the process liquid is circulated. The main supply line 420 is provided with a pressing member 430. The pressing member 430 presses the main supply line 420 so that the process liquid is supplied to the respective process units 260 at a set flow rate. For example, the pressure member 430 may be a pump 430.

A plurality of liquid supply units 500 are provided. The liquid supply unit 500 connects the main supply line 420 and the process unit 260 to each other. The liquid supply unit 500 may be connected to the process unit 260 one to one. Each of the liquid supplying portions 500 includes a liquid supplying line 510, a measuring member 520, a liquid replenishing member 530, and a controller 600. The liquid supply line 510 is provided as a line which branches from the main supply line 420. The liquid supply line 510 is branched from the main supply line 420 and connected to the nozzle 390 of the processing unit 260. That is, the processing liquid contained in the supply tank 410 is supplied to the processing unit 260 sequentially through the main supply line 420 and the liquid supply line 510. The liquid supply line 510 is provided with a supply valve 512. The supply valve 512 is capable of opening and closing the liquid supply line 510. The measurement member 520 is installed in the liquid supply line 510. The measuring member 520 measures the flow rate of the process liquid supplied from the liquid supply line 510. For example, the measuring member 520 may be a pressure sensor for measuring the supply pressure of the processing liquid.

The liquid replenishing member 530 replenishes the supply flow rate of the process liquid to the liquid supply line 510. The liquid replenishing member 530 replenishes the insufficient treatment liquid when the supply flow rate of the liquid supply line 510 is insufficient relative to the set flow rate. The liquid replenishing member 530 includes a replenishing tank 550, a liquid replenishing line 540, a pressing member 570, and a pressure-reducing member 580.

The replenishing tank 550 receives the processing liquid therein. The processing liquid contained in the replenishing tank 550 is supplied to the liquid supply line 510. Conversely, the processing liquid can be supplied into the replenishing tank 550 through the liquid supply line 510. The replenishment tank 550 includes a housing 552 and a separator plate 560. The housing 552 has a receiving space 553 therein. An inlet 554 and an outlet 556 are formed on one side of the housing 552. The separation plate 560 divides the accommodation space 553 into two spaces. The two spaces partitioned by the separator plate 560 are provided in mutually independent spaces. One of the two spaces is a liquid space 553a in which the gas is received and the other is provided in the gas space 553b in which the processing liquid is received. The inlet 554 and the outlet 556 are formed on the upper surface of the housing 552 and the separating plate 560 is partitioned into the upper space 553b and the lower space 553a by the accommodating space 553. [ can do. The upper space 553b may be the gas space 553b and the lower space 553a may be the liquid space 553a.

The liquid replenishment line 540 connects the housing 552 and the liquid supply line 510 to each other. The liquid replenishment line 540 branches from the liquid supply line 510 and is provided to be connected to the housing 552. The liquid replenishing line 540 may be connected to the lower end of the housing 552. According to one example, the process liquid may be supplied to the liquid supply line 510 inside the housing 552 via the liquid replenishment line 540 or may be supplied to be contained in the housing 552 in the liquid supply line 510 have. The liquid replenishment line 540 may be provided as an inlet / outlet line through which the processing liquid can be supplied in both directions. In the liquid replenishment line 540, a replenishment valve 542 is provided. The replenishment valve 542 is capable of opening and closing the liquid replenishment line 540.

The pressing member 570 pressurizes the liquid space 553a so that the processing liquid accommodated in the liquid space 553a is supplied to the liquid supply line 510. [ The liquid supply line 510 can be replenished with the processing liquid by the pressing member 570. [ The pressing member 570 supplies gas to the gas space 553b. The pressing member 570 includes a gas supply portion connected to the inlet 554 of the housing 552. The gas supply unit supplies gas to the gas space 553b. As the gas is supplied to the gas space 553b, the area of the gas space 553b gradually increases and the area of the liquid space 553a gradually decreases. Accordingly, the processing liquid contained in the liquid space 553a is pressurized and supplied to the liquid supply line 510. [ For example, the gas may be air or an inert gas.

The pressure-reducing member 580 reduces the liquid space 553a so that the process liquid is supplied from the liquid supply line 510 to the liquid space 553a. The liquid space 553a may be filled with the processing liquid by the pressure-reducing member 580. [ The pressure-reducing member 580 forcibly discharges the gas filled in the gas space 553b. The pressure reducing member 580 may be a suction member 580 connected to the outlet 556 of the housing 552.

The controller 600 controls the supply valve 512, the replenishment valve 542, the pressure member 570, and the pressure-reducing member 580. The controller 600 controls the replenishment valve 542 and the pressure member 570 based on the flow rate of the process liquid measured from the measurement member 520 (hereinafter referred to as the measured flow rate). The controller 600 also controls the replenishment tank 542 and the replenishment tank 550 so that when the substrate processing process is idle, that is, when the supply line 510 is closed by the supply valve 512, And controls the pressure reducing member 580. [

Next, a process of replenishing the processing liquid to the liquid supply line 510 or filling the replenishing tank 550 with the processing liquid in the process of supplying the processing liquid to the processing unit 260 using the above-described substrate processing apparatus will be described.

When the liquid processing process of the substrate proceeds, the liquid supply line 510 is opened by the supply valve 512. The process liquid is supplied to the nozzle 390 through the main supply line 420 and the liquid supply line 510. At this time, the measured flow rate is measured by the measuring member 520. When the measured flow rate is equal to the set flow rate, the liquid replenishment line 540 is closed. On the other hand, if the measured flow rate is less than the set flow rate, the liquid replenishment line 540 is opened as shown in FIG. When the liquid replenishing line 540 is opened, the pressing member 570 pressurizes the receiving space 553. Thus, the separation plate 560 is moved upward and downward, and the processing liquid contained in the replenishing tank 550 is supplied to the liquid supply line 510. At this time, the treatment liquid is supplemented so that the sum of the measured flow rate and the supplementary flow rate is provided at the set flow rate.

In the case where the liquid processing process of the substrate is in the damp state, the accommodating space of the replenishing tank 550 is filled with the exhausted processing liquid. 7, the liquid replenishment line 540 is opened, and the pressure-reducing member 580 decompresses the accommodation space 553. Thus, the separator plate 560 is moved upward from below, and the replenishing tank 550 is filled with the processing liquid.

In the above-described embodiment, the processing liquid is described as being replenished to the liquid supply line 510 in the replenishing tank 550 via the liquid replenishing line 540 or supplied to the replenishing tank 550 in the liquid supply line 510 . However, the process liquid may be supplied to the liquid supply line 510 in the replenishment tank 550 via the liquid replenishment line 540, and may be filled in the replenishment tank 550 through another line. Referring to FIG. 8, the liquid supply unit 400 may further include a branch line 590. The branch line 590 may be branched from the liquid supply line 510 and connected to the replenishment tank 550. A branching valve 592 may be provided in the branching line 590. Both the branch valve 592 and the replenishment valve 542 may be closed or only one of them may be opened. According to one example, when the liquid processing process of the substrate proceeds, if the measured flow rate is less than the set flow rate, the replenishment valve 542 is opened to replenish the process liquid. Alternatively, if the liquid treatment process of the substrate is in the dump state, the diverter valve 592 is opened and the replenishing tank 550 can be filled with the treatment liquid through the branch line 590.

260: process unit 410: supply tank
420: main supply line 500: liquid supply unit
510: liquid supply line 530: liquid replenishment member
550: replenishing tank 570: pressure member
580: Pressure reducing member

Claims (11)

A processing unit for processing the substrate and provided with a plurality of processing units;
And a liquid supply unit for supplying a treatment liquid to each of the processing units,
The liquid supply unit includes:
A supply tank in which a treatment liquid is contained;
A main supply line connected to the supply tank;
And a plurality of liquid supply units for supplying the processing liquid to the processing units supplied to the main supply line,
Each of the liquid supply units includes:
A liquid supply line branched from the main supply line and connected to the processing units;
And a liquid replenishing member that replenishes the supply flow rate of the process liquid to the liquid supply line,
The liquid replenishing member
A replenishing tank having a receiving space in which a treatment liquid is contained;
A liquid replenishing line connecting the liquid supply line and the replenishing tank;
A pressing member for pressing the accommodating space;
And a pressure-reducing member for reducing pressure in the accommodation space,
The liquid supply unit includes:
A measuring member for measuring the supply flow rate in the liquid supply line;
And a controller for controlling the supplemental valve provided in the liquid replenishment line so as to open and close the liquid replenishment line based on the measured amount of the treatment liquid measured from the measurement member,
The controller controls the pressure member so that the treatment liquid accommodated in the accommodation space is supplied to the liquid supply line when the measured amount is lower than the set amount in the process progress state,
Wherein said control means controls said pressure reducing member so that the processing liquid is filled in said containing space through said liquid replenishing line in said liquid supplying line. delete The method according to claim 1,
Wherein the controller opens the liquid replenishment line when the measured amount is lower than the set amount and controls the replenishment valve to close the liquid replenishment line when the measured amount is equal to the set amount. The method of claim 3,
Wherein the controller opens the liquid replenishment line such that the sum of the measured amount and the replenishing amount of the processing liquid supplied through the liquid replenishing line becomes the set amount. delete The method according to claim 1,
The replenishing tank,
A housing having the receiving space therein and having an inlet and an outlet formed on one surface thereof;
And a separation plate for partitioning the accommodation space into two spaces,
Wherein the pressure member is connected to the inlet and supplies gas,
Wherein the pressure-reducing member is connected to the outlet, and forcibly discharges the gas filled in the housing. In a unit for supplying a liquid,
A supply tank in which a treatment liquid is contained;
A nozzle for discharging the treatment liquid;
A liquid supply line connecting the nozzle and the supply tank;
A liquid replenishing member for replenishing the supply flow rate of the process liquid to the liquid supply line;
And a measuring member for measuring the supply flow rate in the liquid supply line,
The liquid replenishing member
A replenishing tank having a receiving space in which a treatment liquid is contained;
A liquid replenishing line connecting the liquid supply line and the replenishing tank;
A pressing member for pressing the accommodating space;
And a pressure-reducing member for reducing pressure in the accommodation space,
The unit comprises:
And a controller for controlling the supplemental valve provided in the liquid replenishment line so as to open and close the liquid replenishment line based on the measured amount of the treatment liquid measured from the measurement member,
The controller controls the pressure member so that the treatment liquid accommodated in the accommodation space is supplied to the liquid supply line when the measured amount is lower than the set amount in the process progress state,
And the control means controls the pressure reducing member so that the processing liquid is filled in the accommodating space through the liquid replenishing line in the liquid supplying line in the process idling state. delete 8. The method of claim 7,
The controller opens the liquid replenishment line when the measured amount is lower than the set amount and controls the replenishment valve to close the liquid replenishment line when the measured amount is equal to the set amount.



delete delete
KR1020150188465A 2015-12-29 2015-12-29 Unit for supplying liquid and Apparatus for treating substrate with the unit KR101791872B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347205A (en) * 2002-03-19 2003-12-05 Tokyo Electron Ltd Mechanism and method for supplying treatment liquid
JP2006026546A (en) * 2004-07-16 2006-02-02 Tokyo Electron Ltd Treating liquid supply system
JP2012151197A (en) 2011-01-18 2012-08-09 Tokyo Electron Ltd Liquid chemical supply method and liquid chemical supply system
JP2015192987A (en) * 2014-03-19 2015-11-05 東レ株式会社 Coating equipment, coating method, and method for manufacturing display member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347205A (en) * 2002-03-19 2003-12-05 Tokyo Electron Ltd Mechanism and method for supplying treatment liquid
JP2006026546A (en) * 2004-07-16 2006-02-02 Tokyo Electron Ltd Treating liquid supply system
JP2012151197A (en) 2011-01-18 2012-08-09 Tokyo Electron Ltd Liquid chemical supply method and liquid chemical supply system
JP2015192987A (en) * 2014-03-19 2015-11-05 東レ株式会社 Coating equipment, coating method, and method for manufacturing display member

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