KR101714201B1 - Ultra Lightweight Thermally Conductive Plastic and Method of Manufacturing The Same - Google Patents

Ultra Lightweight Thermally Conductive Plastic and Method of Manufacturing The Same Download PDF

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Publication number
KR101714201B1
KR101714201B1 KR1020150121860A KR20150121860A KR101714201B1 KR 101714201 B1 KR101714201 B1 KR 101714201B1 KR 1020150121860 A KR1020150121860 A KR 1020150121860A KR 20150121860 A KR20150121860 A KR 20150121860A KR 101714201 B1 KR101714201 B1 KR 101714201B1
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South Korea
Prior art keywords
thermosetting resin
filler
conductive plastic
polymer
carbon
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KR1020150121860A
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Korean (ko)
Inventor
김경복
이한샘
김병욱
추인창
송경화
곽진우
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현대자동차주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/14—Insulating conductors or cables by extrusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Abstract

The ultra lightweight conductive plastic of the present invention is characterized in that the polymer beads coated with the electrically conductive filler on the porous polymer beads or the hollow polymer beads and the electrically conductive filler coated on the surface thereof are made of the composite powder, and the composite powder is mixed with the thermosetting resin non- Resin mixing method to be manufactured as a composite material, thereby maintaining the functional aspects of composite materials such as electromagnetic interference of electric and electronic devices and prevention of malfunction due to static electricity, and in particular, a composite material having a low density due to hollow / porous microstructure Lightweight conductive plastic having weight minimized is used, so that the effect of reducing vehicle fuel consumption is minimized.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultra lightweight conductive plastic,

TECHNICAL FIELD The present invention relates to a conductive plastic, and more particularly, to an ultra-light conductive plastic in which a conductive ceramic plate-like piece or thermally conductive ceramic powder is uniformly dispersed and adsorbed on the surface of a thermoplastic hollow / porous polymer bead .

Recently, in the field of automobiles, the supply of electric and electronic devices inside the vehicle is rapidly increasing due to the trend of electronicization through the integration of electronic communication devices.

As a result, noise caused by electronic components is increasingly affected by electromagnetic interference and static electricity, and various approaches are being taken to prevent such noise.

As an example of various material approaches, an electrically conductive filler is added to give an electrical property to an insulator plastic, and the density of the material is maintained at about 1.5 to 2 g / cm 3, thereby replacing the material of electrical and electronic parts Composite materials.

Korean Patent Laid-Open Publication No. 10-2013-0041554 (Apr. 25, 2013)

However, a composite material with a density of 1.5 to 2 g / cm3 increases the weight of the vehicle by increasing the weight of electrical and electronic equipment due to the addition of additional parts, and the increase of the vehicle increase increases the fuel efficiency, I can not help making it difficult.

In view of the above, the present invention provides a functional composite material which is manufactured from a composite powder after coating and then is made into a composite material by a non-mixing or mixing method of a thermosetting resin to prevent electromagnetic interference and malfunction due to static electricity in electric and electronic devices The present invention provides an ultra lightweight conductive plastic which is used as an ultra lightweight conductive plastic having a low density and weight minimized due to a hollow / porous microstructure, thereby minimizing the effect of reducing vehicle fuel consumption.

According to an aspect of the present invention, there is provided a method of manufacturing an ultra-light conductive plastic, comprising: coating an electrically conductive filler on a porous polymer bead or a hollow polymer bead; The polymer beads coated on the surface with the electrically conductive filler are made into a composite powder; Wherein the composite powder is formed into a composite material by molding the composite powder in any one of a thermosetting resin non-mixing method and a thermosetting resin mixing method.

In a preferred embodiment, the porous polymer beads and the hollow polymer beads have a porosity of 10% to 70% or a porosity of 10% to 90%. The electrically conductive filler is a carbon-based filler or a non-carbon-based filler. The carbon-based filler is any one of carbon nanotube, carbon black, graphite, graphene, and carbon fiber, and the non-carbon based filler is any one of metal nanowires, metal tubes, and metal particles.

In a preferred embodiment, the coating is either a surface charge method, a surface adsorption method of nanoparticles, or a chemical bond induction method.

As a preferred embodiment, the thermosetting resin non-mixing type molding is performed by compression molding the composite powder only, and the compression molding is performed under the pressure and temperature at which the porous polymer beads or the hollow polymer beads are deformed.

In a preferred embodiment, the thermosetting resin mixed type molding is a curing method in which the composite powder and a thermosetting resin mixture in which a conductive filler is dispersed in a thermosetting resin are used to cure the composite material, the composite powder and the thermosetting resin, A compression molding in which the bead or the hollow polymer bead is produced at a pressure and at a temperature at which the composite is produced. The thermosetting resin is an epoxy or a silicone-based polymer.

In order to accomplish the above object, the present invention provides an ultra lightweight conductive plastic, wherein the polymer beads coated with the electrically conductive filler on the porous polymer beads or the hollow polymer beads are made of the composite powder, The composite powder is formed of a thermosetting resin non-mixing method or a thermosetting resin mixing method and is made of a composite material. The composite powder can be used as a hollow / The weight is minimized at a low density due to the porous microstructure.

The ultralight conductive plastic of the present invention realizes the following advantages and effects.

First, conductive plastics can also be made with the use of small amounts of conductive fillers. Second, a low density conductive plastic due to the hollow / porous microstructure of the conductive plastic can be manufactured. Third, even if the conductive plastic is applied to electric parts of a vehicle or other parts requiring conductivity, the weight of the final parts can be greatly reduced, and ultimately, fuel efficiency can be improved. Fourth, conductive plastic can replace high-density composite materials applied to electric and electronic devices, which can enhance the vehicle mounting of electronic and communication devices even under enforced environmental regulations.

FIG. 1 is a flow chart of a method for manufacturing an ultra lightweight conductive plastic according to the present invention, FIG. 2 is an example in which an electrically conductive filler according to the present invention is coated on a surface of a porous polymer bead or a hollow polymer bead, Fig. 4 is an example of a composite made by curing using a coated bead, an electrically conductive filler and a thermosetting resin mixture according to the present invention, and Fig. The ultra-light conductive plastic according to the present invention is manufactured at a low density due to the hollow / porous microstructure.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which illustrate exemplary embodiments of the present invention. The present invention is not limited to these embodiments.

1 shows a procedure of a method for manufacturing an ultra-light conductive plastic according to this embodiment. Each of the following molding steps is assumed to be carried out by a coating apparatus applied to each step, and a process using a molding die and an injection mold.

Step S10 is a step of selecting a polymer bead.

In this case, the polymer bead is a commercially available porous polymer bead or a hollow polymer bead. However, when selecting the porous polymer beads or the hollow polymer beads, the range of porosity of the polymer beads is selected in consideration of being made of a lightweight thermally conductive composite material. For example, polymer particles having a porosity of polymer beads of less than about 10% are not desirable from the viewpoint of weight reduction when composites are produced through actual molding processes, while polymer particles having a porosity of polymer beads of at least about 70% The pores may collapse due to an external force such as molding pressure. Therefore, it is preferable to select a porous polymer bead or a hollow polymer bead having a porosity of the polymer bead of about 10 to 70%. However, in the coating process other than general compression / injection molding, since the external force generated in the actual molding process is relatively low, it is possible to select polymer beads having a porosity of 90%.

S20 is a step of selecting an electrically conductive filler.

In this case, the electrically conductive filler uses a carbon-based filler or a non-carbon-based filler. For example, the carbon-based filler may be a carbon nanotube / carbon black / graphite / graphene / carbon fiber, and the non-carbon based filler may be a metal nanowire, a metal tube, a metal particle, or the like.

S30 is a step of coating the surface of the polymer bead with the electrically conductive filler.

In this case, a carbon-based filler or a non-carbon-based filler is coated on the porous polymer beads or the hollow polymer beads having a porosity of about 10 to 70% or 90%, and the coating process includes a surface charge method, And a chemical coupling induction method. Therefore, the coating process is carried out with a coating apparatus or equipment suitable for each method. Particularly, as a method of coating the thermally conductive particles on the surface of the polymer beads by chemical bonding, the surface treatment of the thermally conductive particles is indispensable, so that the development of the conductive characteristics may be deteriorated. Therefore, the application of the chemical coupling induction method is taken into consideration.

Particularly, when the coating method such as the present invention is applied to the production of thermally conductive particles, all of the following problems that may occur when applying the method of preparing thermally conductive particles modified by surface treatment of thermally conductive particles are solved.

First, the heat transfer mechanism is basically a heat transfer through the direct contact between the thermally conductive fillers. If the surface of the thermally conductive particles is modified, the modified surface will generate heat resistance, thereby eliminating the problem of reducing the inherent heat transfer characteristics of the filler do. In the case of pretreating the thermally conductive particles, the pretreatment is carried out using a solvent such as hydrazine and ammonia. Such a solvent remains in a small amount even after the heat treatment, so that the physical properties of the final composite material (especially the retention of the composite microstructure having a hollow structure) The problem that may adversely affect the user is solved.

On the other hand, FIG. 2 shows an example of a porous polymer bead 1-1 coated with an electrically conductive filler 10, and a hollow polymer bead 1-2 coated with an electrically conductive filler 10.

Referring again to FIG. 1, step S40 is a step in which the composite powder is produced. In this case, the composite powder is a polymer bead having a surface coated with an electrically conductive filler, and a powder production apparatus such as a pulverizer or a mixer is used. For example, the composite powder is a porous polymer bead or a hollow polymer bead coated with a carbon-based filler or a non-carbon-based filler.

S50 is a step in which the composite powder is molded. In this case, the composite powder molding method can be divided into a non-mixing method of the thermosetting resin of S50-1 and a mixing method of the thermosetting resin of the S50-2.

S60 is a step in which a composite material is manufactured by compression molding using only coated beads by applying a thermosetting resin non-mixed molding method. In this case, the compression molding process is carried out by compressing the coated thermoplastic beads at an appropriate pressure and temperature, and keeping the beads deformed until filled. For this purpose, a press or a mold device can be used.

The result of the compression molding process of S60 is then completed with the composite material of S90.

Composites made by compression molding using only coated beads are illustrated in FIG. The first type ultralight conductive plastic 100-1 is an example in which a composite powder of the porous polymer bead 1-1 coated with the electrically conductive filler 10 is produced by compression molding and the second type ultralight conductive plastic 100- 2 is an example in which a composite powder of hollow polymer beads 1-2 coated with an electrically conductive filler 10 is produced by compression molding. It can be seen that both the first type ultralight conductive plastic 100-1 and the second type ultralight conductive plastic 100-2 are filled with the polymer beads 1-1 and 1-2 by deformation.

Referring again to Fig. 1, the method of mixing the thermosetting resin mixed system of S50-2 is divided into the curing of S70 and the compression molding of S80.

S70 is a step of preparing a cured composite material of a coated bead and a thermosetting resin mixture in a thermosetting resin mixed molding method. In this case, the thermosetting resin mixture is formed of a thermosetting polymer (epoxy, silicone polymer) in which a large amount of conductive filler is dispersed. Therefore, the curing process of S70 is carried out by mixing the thermoplastic bead particles coated with the thermosetting resin mixture and then maintaining the mixture at a constant temperature for a predetermined time. Temperature control equipment can be used for this purpose.

S80 is a step in which a composite material is produced by compression molding of a coated bead and a thermosetting resin in a thermosetting resin mixed molding method. In this case, the thermosetting resin is a thermosetting polymer (epoxy, silicone-based polymer). Therefore, the compression molding process of S80 is carried out by mixing a small amount of a thermosetting resin to a coated bead to prepare a mixture, compressing the mixture at an appropriate pressure and temperature, and keeping the bead deformed until filled. For this purpose, a press or a mold device can be used.

Particularly, when the thermosetting resin mixing method is applied to the production of the thermally conductive hollow type molecular sieve as in the present invention, it may occur when a method of dispersing the thermally conductive hollow type molecular sieve having a thickness of several tens to several hundred nanometers into the polymer resin is applied All of the following problems are resolved.

First, in order to disperse the particles in the polymer resin, an external force such as a mechanical force should be applied. However, it is considered that the mechanical property of the above-mentioned mouthpiece does not have enough rigidity enough to overcome the external force. Therefore, when the hollow composite material is manufactured, deformation of the structure of the thermally conductive hollow type particle itself is caused and the problem of difficulty in manifesting sufficient conductivity is solved. Secondly, in the case of preparing the polymer-thermally conductive composite particle coated with the thermally conductive particles on the surface of the polymer fine particles, when the thermally conductive particles are not uniformly coated and even a small amount of the uncoated portion is present, In the step of dispersing the hollow hollow particles in the polymer resin, the polymer resin has a high possibility of penetrating into the hollow particles, thereby making it impossible to manufacture a hollow composite material.

The results of the curing step of S70 and the compression molding step of S80 are then completed with the composite material of S90.

A composite made from a coated bead and a large amount of electrically conductive filler and a hardened or coated bead of a thermosetting resin and a compression molded thermosetting resin is illustrated in FIG. The third type ultralight conductive plastic 100-3 is obtained by mixing the composite powder of the porous polymer beads 1-1 coated with the electrically conductive filler 10 with the thermosetting resin mixture 20 (thermosetting resin and electrically conductive filler) The fourth type ultralight conductive plastic 100-4 is an example in which the conductive polymer is mixed with the conductive polymer beads 20-1 and cured or compression molded and the fourth type ultralight conductive plastic 100-4 is an example of a composite of the hollow polymer beads 1-2 coated with the electrically conductive filler 10. [ Is an example in which the powder is mixed with the thermosetting resin mixture 20 (thermosetting resin and electrically conductive filler) or the thermosetting resin 20-1 to be hardened or compression molded. It can be seen that both the third type ultralight conductive plastic 100-3 and the fourth type ultralight conductive plastic 100-4 are filled with the polymer beads 1-1 and 1-2.

As described above, the ultra-light conductive plastic according to the present embodiment is characterized in that the polymer beads coated with the electrically conductive filler on the porous polymer beads or the hollow polymer beads and the electrically conductive filler coated on the surface thereof are made of the composite powder, It is possible to maintain the functional aspect of the composite material, which is formed of a thermosetting resin non-mixing system or a thermosetting resin mixing system and is manufactured as a composite material, thereby preventing electromagnetic interference and malfunction due to static electricity of the electric and electronic apparatuses. As a result of being used as an ultra-light conductive plastic which is minimized in weight at a low density due to its microstructure, the effect of reducing vehicle fuel consumption is also minimized.

1-1: Porous polymer beads 1-2: Hollow polymer beads
10: electrically conductive filler
20: Thermosetting resin
100-1: First type ultralight conductive plastic
100-2: Type 2 ultra-light conductive plastic
100-3: Type 3 ultra-light conductive plastic
100-4: Type 4 ultra-light conductive plastic

Claims (13)

(A) coating an electrically conductive filler on a porous polymer bead or a hollow polymer bead having a porosity of 10% to 70% by a chemical bond induction method;
(B) preparing a polymer bead having a surface coated with an electrically conductive filler as a composite powder;
(C) the composite powder is formed into a composite material by being molded with either a thermosetting resin non-mixing method or a thermosetting resin mixing method;
Lt; / RTI >
Wherein the filler is modified through surface treatment of the filler before being coated by the chemical bond induction method.
delete delete The method of manufacturing an ultra-lightweight conductive plastic according to claim 1, wherein the electrically conductive filler is a carbon-based filler or a non-carbon-based filler.
5. The method of manufacturing an ultra-lightweight conductive plastic according to claim 4, wherein the carbon-based filler is any one of carbon nanotube, carbon black, graphite, graphene, and carbon fiber.
5. The method of manufacturing an ultra-lightweight conductive plastic according to claim 4, wherein the non-carbon based filler is any one of metal nanowires, metal tubes, and metal particles.
delete delete The method of claim 1, wherein the thermosetting resin non-mixing type molding is performed by compression molding only the composite powder, and the compression molding is performed under the pressure and temperature at which the porous polymer beads or the hollow polymer beads are deformed Wherein said method comprises the steps of:
The method according to claim 1, wherein the thermosetting resin mixed type molding is a curing method in which the composite powder and a thermosetting resin mixture in which a conductive filler is dispersed in a thermosetting resin are used, Wherein the bead or the hollow polymer bead is divided into compression molding in which the composite material is produced under a pressure and a temperature at which deformation occurs.
The method of manufacturing an ultra-lightweight conductive plastic according to claim 10, wherein the thermosetting resin is a thermosetting polymer.
12. The method of claim 11, wherein the thermosetting polymer is an epoxy or a silicone polymer.
An ultra lightweight conductive plastic produced by the method of any one of claims 1, 4, 5, 6, 9, 10, 11, and 12.
KR1020150121860A 2015-08-28 2015-08-28 Ultra Lightweight Thermally Conductive Plastic and Method of Manufacturing The Same KR101714201B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200141315A (en) 2019-06-10 2020-12-18 한국생산기술연구원 Method for preparing a composite cured product in which a hollow filler is mixed
KR20220080286A (en) 2020-12-07 2022-06-14 한국생산기술연구원 Composite cured product in which a hollow filler and milled filler is mixed and method for preparing the composite

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005521782A (en) * 2002-04-01 2005-07-21 ワールド・プロパティーズ・インコーポレイテッド Conductive polymer foam and elastomer, and methods for producing the same
KR20060070213A (en) * 2004-12-20 2006-06-23 현대자동차주식회사 Electroconductive composites and method for preparing the same
KR20130041554A (en) 2011-10-17 2013-04-25 한국과학기술연구원 Thermally conductive materials based on thermally conductive hollow particles and fabrication method thereof
JP2014118489A (en) * 2012-12-17 2014-06-30 Nitto Denko Corp Polyetherimide porous body and method for producing the same
JP2014150242A (en) * 2013-01-31 2014-08-21 Laird Technologies Inc Electrically conductive porous material assemblies and methods of making the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005521782A (en) * 2002-04-01 2005-07-21 ワールド・プロパティーズ・インコーポレイテッド Conductive polymer foam and elastomer, and methods for producing the same
KR20060070213A (en) * 2004-12-20 2006-06-23 현대자동차주식회사 Electroconductive composites and method for preparing the same
KR20130041554A (en) 2011-10-17 2013-04-25 한국과학기술연구원 Thermally conductive materials based on thermally conductive hollow particles and fabrication method thereof
JP2014118489A (en) * 2012-12-17 2014-06-30 Nitto Denko Corp Polyetherimide porous body and method for producing the same
JP2014150242A (en) * 2013-01-31 2014-08-21 Laird Technologies Inc Electrically conductive porous material assemblies and methods of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200141315A (en) 2019-06-10 2020-12-18 한국생산기술연구원 Method for preparing a composite cured product in which a hollow filler is mixed
KR20220080286A (en) 2020-12-07 2022-06-14 한국생산기술연구원 Composite cured product in which a hollow filler and milled filler is mixed and method for preparing the composite

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