KR101622399B1 - Led device - Google Patents
Led device Download PDFInfo
- Publication number
- KR101622399B1 KR101622399B1 KR1020090076192A KR20090076192A KR101622399B1 KR 101622399 B1 KR101622399 B1 KR 101622399B1 KR 1020090076192 A KR1020090076192 A KR 1020090076192A KR 20090076192 A KR20090076192 A KR 20090076192A KR 101622399 B1 KR101622399 B1 KR 101622399B1
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- electrode
- led element
- led
- conductive film
- upper electrode
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Abstract
The present invention provides an LED device capable of mounting an LED device without using wire bonding. According to an embodiment of the present invention, there is provided a plasma display panel comprising: a submount substrate having a first upper electrode in a first region of a top surface and a second upper electrode in a second region; A vertical LED element having first and second device electrodes on the upper and lower sides, respectively, and a lower second device electrode bonded to the first upper electrode; And a conductive film disposed in contact with the shape of the vertical LED element and electrically connecting the first device electrode on the LED device and the second upper electrode on the submount substrate do.
LED, Package, Diode, Conductive Film, Transparent Plate.
Description
The present invention relates to an LED (Light Emitting Diode) device, and more particularly, to a package of an LED device.
LED devices have advantages such as high efficiency, high speed response, long life, small size, light weight and energy saving by low power consumption, and they have excellent features such as an environment friendly light source that does not generate carbon monoxide and is anhydrous light source, . In addition, it is possible to freely design line, surface and space with point light source and ultra-small optical device, and it is predicted that sustainable growth will be very broad in the fields of applications such as display, signal, display, lighting, bio, telecommunication, do.
A common method for attaching an LED element to a required device is to connect the electrode of the LED element with the electrode of the device by wire. However, since the size of the LED element is very small, expensive bonding equipment is required for precise wire bonding of the LED element. In addition, when a single device is implemented using a plurality of LED elements, wire bonding must be performed on all the LED elements, which requires a long process time.
The present invention provides an LED device capable of mounting an LED device without using wire bonding.
According to an embodiment of the present invention, there is provided a plasma display panel comprising: a submount substrate having a first upper electrode in a first region of a top surface and a second upper electrode in a second region; A vertical LED element having first and second device electrodes on the upper and lower sides, respectively, and a lower second device electrode bonded to the first upper electrode; And a conductive film disposed in contact with the shape of the vertical LED element and electrically connecting the first device electrode on the LED device and the second upper electrode on the submount substrate do.
According to another embodiment of the present invention, there is provided a plasma display panel comprising: a submount substrate having a first upper electrode in a first region of a top surface and a second upper electrode in a second region; A vertical LED element having first and second device electrodes on the upper and lower sides, respectively, and a lower second device electrode bonded to the first upper electrode; A first solder having a bottom surface in contact with the second upper electrode and having substantially the same height as the vertical LED element; And a conductive film for electrically connecting the first device electrode and the solder.
The present invention allows the LED element to be electrically connected to the device by using a transparent plate having a conductive film, without using a wire bonding process and a silicon filling process when the vertical LED device is to be built in the device. Therefore, expensive wire bonding equipment is not required in the process of manufacturing the LED device. In the previous method, a plurality of LED elements are successively subjected to a wire bonding process, which requires a lot of processing time. However, according to the present invention, a plurality of LED elements are electrically connected to a device in a single wafer level unit . Therefore, the manufacturing process time of the LED device can be reduced, thereby greatly reducing the manufacturing cost.
In addition, since wires are not used in the process of connecting or attaching the LED device to the device, it is possible to improve the illuminance unevenness of the LED device caused by the light emitted from the LED device reflected by the wire or absorbed by the wire.
In addition, in the case of using a phosphor sheet for realizing white light, it is possible to solve the difficult problem of joining caused by the wire when the phosphor sheet is bonded to the LED element.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order to facilitate a person skilled in the art to easily carry out the technical idea of the present invention. do.
1 is a sectional view showing an LED element for explaining the present invention. Particularly, Fig. 1 shows a vertical LED device for high output which is widely used for display and illumination.
1, the LED device comprises a wafer substrate region 1, a P-
As shown in Fig. 1, a
Fig. 2 is a process sectional view showing an LED device including the LED device shown in Fig. 1. Fig.
1 and 2, the LED device includes
The
As described above, the wire bonding process is used to electrically connect the LED device to the vertical LED device package. Therefore, expensive wire bonding equipment is required to manufacture LED devices. In addition, the wire bonding process can not simultaneously perform wire bonding to all the LED devices at the wafer level in a single process, and the wire bonding process can not be performed sequentially for individual LED devices.
Therefore, it takes a long time to process by wire bonding, and the manufacturing cost of the LED device is greatly increased. In addition, light emitted from the
In the present invention, an LED element is bonded to an upper electrode on a submount substrate, a phosphor is formed to realize white light, and a transparent plate having a conductive film such as ITO film or CNT (Carbon Nano tube) is bonded to a conductive film , And an externally applied voltage can be transmitted to the LED element through the conductive film. The submount substrate has an upper electrode and a lower electrode on upper and lower sides, respectively, and electrically connects the upper electrode electrically connected to the pliable electrode of the LED element through the through hole and the lower electrode for electrical connection to the PCB.
3 and 4 are cross-sectional views illustrating an LED device according to a preferred embodiment of the present invention. A manufacturing process of the LED device according to the present embodiment will be described with reference to FIGS. 3 and 4. FIG.
The LED device according to the present embodiment is characterized in that the
The first
As the
The
Methods for electrically connecting the
After the electrode metal is embedded in the upper and lower surfaces of the submount substrate and the through holes are formed on the lower surface of the submount substrate, the electrode metal of a certain portion is removed by a laser or the like so that the
In addition, when the
Continuing on, the
Continuing on, the
The insulating
When the
In addition, if the size of the
In addition, in the electrode connecting step of the
5 is a cross-sectional view showing the conductive film and the transparent plate shown in Fig.
A method of attaching the
The
A cavity is formed in a portion of the submount substrate on which the
5, the width W of the cavity may be sufficiently wide in consideration of an alignment error for joining the
The
6 is a cross-sectional view illustrating an LED device according to a second preferred embodiment of the present invention. The same reference numerals are used for the layers serving as those shown in Figs. 4 and 5.
6, the LED device according to the second embodiment is manufactured in a flat manner without forming a cavity in the
The
7 is a cross-sectional view illustrating an LED device according to a third preferred embodiment of the present invention. The layers serving as those shown in Figs. 4 to 6 have the same reference numerals.
7, the LED device according to the present embodiment is manufactured by bonding a
A feature of the LED device according to the present embodiment is that the
As described above, the LED device according to the present embodiment does not use the previously used wire bonding process by bonding the transparent plate with the conductive film on the submount substrate to which the LED device is bonded. Therefore, expensive wire bonding equipment is not required in the process of manufacturing the LED device. In the previous method, a plurality of LED elements are successively subjected to a wire bonding process, which requires a lot of processing time. However, according to the present embodiment, electrodes of a plurality of LED elements can be electrically connected in a single wafer level unit . Therefore, the processing time of the LED device can be reduced, thereby greatly reducing the manufacturing cost.
In addition, since wires are not used in the process of connecting or attaching the LED device to the device, it is possible to improve the illuminance unevenness of the LED device caused by the light emitted from the LED device reflected by the wire or absorbed by the wire. Further, in the case of using a phosphor sheet to realize white light, it is possible to solve the difficult problem of joining caused by the wire when bonding the phosphor sheet to the LED element.
In order to control the distribution of light emitted from the LED device, the LED device according to the present embodiment may further include a lens disposed above the transparent plate. The lens may be manufactured separately from the transparent plate and attached to the transparent plate, or may be formed by simultaneously forming the lens during the production of the transparent plate. The LED device can be manufactured by collectively processing the submount substrate as well as the transparent plate process with the conductive film in a wafer level and thereafter separating into individual package units. The LED device can be manufactured efficiently.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, I will understand. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a sectional view showing an LED element for explaining the present invention. Fig.
2 is a cross-sectional view showing a package of the LED element shown in Fig.
3 and 4 are cross-sectional views illustrating an LED device according to a preferred embodiment of the present invention.
5 is a cross-sectional view showing the conductive film and the transparent plate shown in Fig.
6 is a sectional view showing an LED device according to a second preferred embodiment of the present invention.
7 is a sectional view showing an LED device according to a third preferred embodiment of the present invention.
Description of the Related Art [0002]
41: conductive film 42: transparent plate
25: LED N electrode 26: LED P electrode
70a, 70b: solder 71: adhesive layer
17a, 17b:
13a: connection for the positive electrode
13b Connection for negative electrode
10: Sub-mount substrate
30a, 30b: phosphor layer 20: LED element
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090076192A KR101622399B1 (en) | 2009-08-18 | 2009-08-18 | Led device |
Applications Claiming Priority (1)
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KR1020090076192A KR101622399B1 (en) | 2009-08-18 | 2009-08-18 | Led device |
Publications (2)
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KR20110018630A KR20110018630A (en) | 2011-02-24 |
KR101622399B1 true KR101622399B1 (en) | 2016-05-18 |
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KR1020090076192A KR101622399B1 (en) | 2009-08-18 | 2009-08-18 | Led device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10236280B2 (en) | 2017-07-12 | 2019-03-19 | Samsung Electronics Co., Ltd. | Light emitting device package and display device using the same |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101118040B1 (en) * | 2010-03-17 | 2012-02-24 | 엘지이노텍 주식회사 | Led package and manufacturing method of the same |
EP2526572B1 (en) | 2010-01-19 | 2019-08-14 | LG Innotek Co., Ltd. | Package and manufacturing method of the same |
KR101118042B1 (en) * | 2010-03-17 | 2012-02-24 | 엘지이노텍 주식회사 | Led package comprising buffer layer and manufacturing method of the same |
KR101328073B1 (en) * | 2012-06-28 | 2013-11-13 | 서종욱 | Lateral light emitting element and light emitting sheet adopting the element |
TWI525863B (en) * | 2013-09-10 | 2016-03-11 | The wafer package structure is packaged using a wafer package structure A module, and a method of manufacturing the wafer package structure | |
CN105845813B (en) * | 2016-04-25 | 2018-10-26 | 陈海英 | A kind of LED light emitting device and LED light source |
KR102566499B1 (en) * | 2016-05-26 | 2023-08-11 | 엘지이노텍 주식회사 | Light emitting device |
KR102602393B1 (en) * | 2018-07-13 | 2023-11-16 | 삼성전자주식회사 | Micro led display and manufacturing method thereof |
Citations (1)
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JP2006324667A (en) * | 2005-05-17 | 2006-11-30 | Lg Electronics Inc | Light emitting device package and method for manufacturing same |
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Patent Citations (1)
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JP2006324667A (en) * | 2005-05-17 | 2006-11-30 | Lg Electronics Inc | Light emitting device package and method for manufacturing same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10236280B2 (en) | 2017-07-12 | 2019-03-19 | Samsung Electronics Co., Ltd. | Light emitting device package and display device using the same |
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KR20110018630A (en) | 2011-02-24 |
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